JP3001468B2 - Tape for wrapping semiconductor device and taping method thereof - Google Patents
Tape for wrapping semiconductor device and taping method thereofInfo
- Publication number
- JP3001468B2 JP3001468B2 JP9201687A JP20168797A JP3001468B2 JP 3001468 B2 JP3001468 B2 JP 3001468B2 JP 9201687 A JP9201687 A JP 9201687A JP 20168797 A JP20168797 A JP 20168797A JP 3001468 B2 JP3001468 B2 JP 3001468B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- tape
- guard member
- mount
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は半導体装置（製品）
包装用テープおよびそのテーピング方法に関し、特に半
導体装置を有効に保護できるようにした包装用テープお
よびそのテーピング方法に関する。[0001] The present invention relates to a semiconductor device (product).
The present invention relates to a packaging tape and a taping method thereof, and more particularly to a packaging tape and a taping method thereof capable of effectively protecting a semiconductor device.
【０００２】[0002]
【従来の技術】従来の半導体装置（製品）包装用テープ
としては、包装すべき半導体装置を収納するプラスチッ
ク等で形成された凹部のポケットを、台紙テープに配列
させカバ−テ−プをかぶせたエンボスキャリア方式のも
のと、紙等の台紙状テ−プに、保持テ−プまたは接着剤
で半導体装置を固定する粘着テーピング方式とがあっ
た。この粘着テーピング方式のものとして、特開平３―
４３３６７号公報や、特開平３―２８９４７５号公報に
示されるものがあるが、その構造は図４（ａ）〜（ｃ）
の平面図および断面図に示される。この包装用テープ
は、テープ送り穴２と接着部６の穴とを設けた長尺の台
紙テープ１に、接着剤を塗布した保持テープ４を、この
接着剤側を接着部６の穴に張り付けて構成されている。2. Description of the Related Art As a conventional semiconductor device (product) packaging tape, recessed pockets made of plastic or the like for accommodating a semiconductor device to be packaged are arranged on a mounting tape and covered with a cover tape. There are an emboss carrier type and an adhesive taping type in which a semiconductor device is fixed to a mounting tape such as paper with a holding tape or an adhesive. Japanese Patent Application Laid-Open No. 3-
No. 43367 and Japanese Unexamined Patent Publication No. 3-289475, the structures of which are shown in FIGS. 4 (a) to 4 (c).
Are shown in plan and cross-sectional views. In this packaging tape, a holding tape 4 coated with an adhesive is attached to a long mounting tape 1 provided with a tape feed hole 2 and a hole of an adhesive portion 6, and the adhesive side is attached to the hole of the adhesive portion 6. It is configured.
【０００３】この包装用テープは、図５（ａ）（ｂ）に
示されるように、半導体装置３を台紙テープ１上の接着
部６の穴がある部分に貼りつけた台紙テープ１を、リー
ル７に巻き付けて、運搬され保管されている。As shown in FIGS. 5 (a) and 5 (b), this packaging tape comprises a mounting tape 1 in which a semiconductor device 3 is affixed to a portion of a mounting tape 1 having a hole of an adhesive portion 6, and a reel. 7 and transported and stored.
【０００４】[0004]
【発明が解決しようとする課題】上述した従来の技術で
は、半導体装置３を台紙テープ１上に接着させたものを
リール７に巻き付けるため、図７（ｂ）のように、半導
体装置３の上に直接台紙テープ１が重なって半導体装置
３に外力が加わるので、台紙テープ１上に固定した半導
体装置３が脱落したり、その位置がずれたりする問題が
あり、またその外力のために、半導体装置３の外部端子
を変形させてしまうという問題もあった。In the prior art described above, the semiconductor device 3 bonded to the mounting tape 1 is wound around a reel 7, so that the semiconductor device 3 is mounted on the semiconductor device 3 as shown in FIG. Since the mounting tape 1 directly overlaps the semiconductor device 3 and an external force is applied to the semiconductor device 3, there is a problem that the semiconductor device 3 fixed on the mounting tape 1 is dropped or its position is shifted. There is also a problem that the external terminals of the device 3 are deformed.
【０００５】本発明の目的は、これらの問題を解決し、
安定に半導体装置を保持し、供給することのできる半導
体装置包装用紙テープおよびそのテーピング方法を提供
することにある。[0005] It is an object of the present invention to solve these problems,
An object of the present invention is to provide a semiconductor device packaging paper tape capable of stably holding and supplying a semiconductor device and a taping method thereof.
【０００６】[0006]
【課題を解決するための手段】本発明の構成は、半導体
装置を台紙テープの接着部分に貼り付けて配列させ、こ
の配列部に両側に送り穴を有する半導体装置包装用テー
プにおいて、前記半導体装置の配列部の両側で前記送り
穴の内側に、前記半導体装置の厚さより厚くかつ収縮性
のある素材からなるガード部材を、前記台紙テープに貼
り付けて配設し、前記台紙テープを巻いた時、この台紙
テープの外力から前記半導体装置を保護するようにした
こと特徴とする。According to the present invention, there is provided a semiconductor device packaging tape having a semiconductor device attached to an adhesive portion of a mounting tape and arranged, and a perforated hole formed on both sides of the semiconductor device. on both sides on the inside of the perforation in the array portion, the thickness KuKatsu shrinkable than the thickness of the semiconductor device
A guard member made of a material, bonded to said base sheet tape
The semiconductor device is protected by an external force of the mounting tape when the mounting tape is wound.
【０００７】本発明において、ガード部材の収縮性のあ
る素材が、発泡性ゴム、または硬質紙を加工して細い帯
をジャバラ状にしたものからなることができる。In the present invention, the shrinkable material of the guard member can be made of foamed rubber or a hard paper processed into a thin band and bellows.
【０００８】また本発明の半導体装置のテーピング方法
は、半導体装置を台紙テープの接着部分に貼り付けて配
列させ、前記半導体装置の配列部の両側で前記送り穴の
内側に、前記半導体装置の厚さより厚くかつ収縮性のあ
る素材からなるガード部材を、前記台紙テープに貼り付
けて配設し、前記半導体装置を配設した前記台紙テープ
を巻いた時に、この台紙テープの外力から前記半導体装
置が保護されるようにすることを特徴とする。Further taping method of the semiconductor device of the present invention, a semiconductor device is arranged affixed to the adhesive portion of the backing tape on the inside of both sides in the feed hole array portion of the semiconductor device, the thickness of the semiconductor device Oh of Halfbeak thickness KuKatsu shrinkable
A guard member made of a material
The semiconductor device is protected from external force of the mounting tape when the mounting tape on which the semiconductor device is mounted is wound.
【０００９】本発明の構成によれば、台紙テープ上に半
導体装置の厚さより厚いガード部材を設けているので、
この台紙テープをリールに巻いた時も 台紙テープの下
に台紙テープが当るので、台紙テープが直接半導体装置
に接触することがなくなり、台紙テープの外力から半導
体装置を保護することができ、半導体装置が脱落した
り、その位置がずれたり、その外部端子を変形させるこ
ともなくなる。According to the structure of the present invention, since the guard member thicker than the thickness of the semiconductor device is provided on the mounting tape,
Even when the mount tape is wound on a reel, the mount tape is applied under the mount tape, so that the mount tape does not directly contact the semiconductor device, and the semiconductor device can be protected from external force of the mount tape. Is not dropped, the position is not shifted, and the external terminal is not deformed.
【００１０】[0010]
【発明の実施の形態】次に本発明の実施形態を図面によ
り説明する。図１（ａ）〜（ｃ）は本発明の一実施形態
を説明する平面図、側面図および部分斜視図である。本
実施形態は、半導体装置３を台紙テープ１の接着部分に
貼り付けて配列させ、この配列部に両側に送り穴２を有
する従来の半導体装置包装用テープに対して、半導体装
置の配列部の両側で送り穴２の内側に、半導体装置３の
厚さより厚いガード部材５を配設したものである。この
ガード部材５は、半導体装置３の高さより厚い高さの収
縮性素材からなるものを用い、台紙テープ１上に接着剤
等で固定される。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. 1A to 1C are a plan view, a side view, and a partial perspective view illustrating an embodiment of the present invention. In the present embodiment, the semiconductor device 3 is attached to the adhesive portion of the mounting tape 1 and arranged, and the conventional semiconductor device packaging tape having the perforations 2 on both sides in this arrangement portion is compared with the semiconductor device arrangement portion. A guard member 5 thicker than the thickness of the semiconductor device 3 is disposed inside the perforation hole 2 on both sides. The guard member 5 is made of a contractible material having a height greater than the height of the semiconductor device 3 and is fixed on the mounting tape 1 with an adhesive or the like.
【００１１】このように構成された半導体装置包装用テ
ープは、図２の断面図に示すように、リール７に巻き付
けられて運搬され保管される。従来の構造では、半導体
装置包装用テープをリール７に巻き付けた時、半導体装
置３の上に台紙テープ１が重なってしまったが、本実施
形態では、台紙テープ１に設けたガード部材５を介して
台紙テープ１が重なるため、半導体装置３と台紙テープ
１とが重ならなくなり、台紙テープ１の外力から半導体
装置３を保護することができる。The semiconductor device packaging tape thus constructed is wound around a reel 7, transported and stored, as shown in the sectional view of FIG. In the conventional structure, when the semiconductor device packaging tape is wound around the reel 7, the mount tape 1 overlaps the semiconductor device 3. In the present embodiment, however, the guard tape 5 provided on the mount tape 1 is interposed. Since the mounting tape 1 overlaps, the semiconductor device 3 and the mounting tape 1 do not overlap, and the semiconductor device 3 can be protected from the external force of the mounting tape 1.
【００１２】なおガード部材５の収縮性素材としては、
発泡性ゴムがある。この発泡性ゴムを接着剤で台紙テー
プ１上に固定し、さらに台紙テープ１に半導体装置３を
保持させることにより、この発泡性ゴムからなるガード
部材５上に台紙テープ１が重なるため、半導体装置３と
台紙テープ１とが接触することがなくなる。The contractive material of the guard member 5 includes
There is foamable rubber. By fixing the foamable rubber on the mounting tape 1 with an adhesive and further holding the semiconductor device 3 on the mounting tape 1, the mounting tape 1 overlaps the guard member 5 made of the foaming rubber. 3 and the backing tape 1 do not come into contact with each other.
【００１３】図３は本発明の他の実施形態を説明する部
分斜視図である。本実施形態は、ガード部材５として、
収縮性のある素材が硬質紙を加工して細い帯をジャバラ
状にしたガード部材５ａを用いた場合を示している。こ
の場合、台紙テープ１上にジャバラ状にした硬質紙の底
面を接着剤で固定し、半導体装置３を保持し固定させて
いる。この場合も、図１の実施形態と同様に、半導体装
置３と台紙テープ１とが接触することがなくなる。FIG. 3 is a partial perspective view for explaining another embodiment of the present invention. In the present embodiment, as the guard member 5,
This figure shows a case in which a guard member 5a in which a thin band is formed into a bellows shape by processing a hard paper as a shrinkable material is used. In this case, the bottom of the bellows-shaped hard paper is fixed on the mounting tape 1 with an adhesive, and the semiconductor device 3 is held and fixed. Also in this case, as in the embodiment of FIG. 1, the semiconductor device 3 and the mounting tape 1 do not come into contact with each other.
【００１４】[0014]
【発明の効果】以上説明したように本発明によれば、ガ
ード部材を台紙テープ上に設けているので、半導体装置
と台紙テープとの接触がなくなり、半導体装置に台紙テ
ープからの外力を防ぎ、半導体装置の脱落や位置ずれを
防止することができ、また半導体装置の外部端子が変形
することもなくなるという効果がある。As described above, according to the present invention, since the guard member is provided on the mounting tape, there is no contact between the semiconductor device and the mounting tape, and the semiconductor device can be prevented from an external force from the mounting tape. This has the effect of preventing the semiconductor device from falling off or displacing, and preventing external terminals of the semiconductor device from being deformed.
【図１】本発明の一実施形態を説明する平面図、側面図
および部分斜視図。FIG. 1 is a plan view, a side view, and a partial perspective view illustrating an embodiment of the present invention.
【図２】本実施形態をリールに実装した状態の断面図。FIG. 2 is a sectional view showing a state where the embodiment is mounted on a reel.
【図３】本発明の他の実施形態を説明する部分斜視図。FIG. 3 is a partial perspective view illustrating another embodiment of the present invention.
【図４】従来例の半導体装置包装用紙テープを示す平面
図および側面図。FIG. 4 is a plan view and a side view showing a conventional semiconductor device packaging paper tape.
【図５】従来例をリールに実装した状態の斜視図および
その断面図。FIG. 5 is a perspective view showing a state in which a conventional example is mounted on a reel and a sectional view thereof.
１ 台紙テープ ２ 送り穴 ３ 半導体装置（製品） ４ 保持テープ ５，５ａ ガード部材 ６ 接着部 ７ リール DESCRIPTION OF SYMBOLS 1 Mount tape 2 Feed hole 3 Semiconductor device (product) 4 Holding tape 5, 5a Guard member 6 Adhesive part 7 Reel
Claims (4)
り付けて配列させ、この配列部に両側に送り穴を有する
半導体装置包装用テープにおいて、前記半導体装置の配
列部の両側で前記送り穴の内側に、前記半導体装置の厚
さより厚くかつ収縮性のある素材からなるガード部材
を、前記台紙テープに貼り付けて配設し、前記台紙テー
プを巻いた時、この台紙テープの外力から前記半導体装
置を保護するようにしたこと特徴とする半導体装置包装
用テープ。1. A semiconductor device packaging tape having a semiconductor device attached to an adhesive portion of a mounting tape and arranged with perforations on both sides in the arrangement portion, wherein the perforations are formed on both sides of the semiconductor device arrangement portion. inside, the guard member made of a material with a thickness KuKatsu shrinkable than the thickness of the semiconductor device, disposed adhered to the mount tape, when wrapped the mount tape, the semiconductor from external forces of the mount tape A semiconductor device packaging tape characterized in that the device is protected.
ゴムからなる請求項１記載の半導体装置包装用テープ。2. The semiconductor device packaging tape according to claim 1 , wherein the shrinkable material of the guard member is made of foamable rubber.
を加工して細い帯をジャバラ状にしたものからなる請求
項１記載の半導体装置包装用テープ。3. The semiconductor device packaging tape according to claim 1 , wherein the shrinkable material of the guard member is formed by processing a hard paper to form a thin band into a bellows shape.
り付けて配列させ、前記半導体装置の配列部の両側で前
記送り穴の内側に、前記半導体装置の厚さより厚くかつ
収縮性のある素材からなるガード部材を、前記台紙テー
プに貼り付けて配設し、前記半導体装置を配設した前記
台紙テープを巻いた時に、この台紙テープの外力から前
記半導体装置が保護されるようにすることを特徴とする
半導体装置のテーピング方法。4. The semiconductor device is attached to an adhesive portion of a mounting tape and arranged, and on both sides of the arrangement portion of the semiconductor device inside the perforation hole , the semiconductor device is thicker than the semiconductor device.
A guard member made of a shrinkable material, said mount tape
Disposed paste the flop, wherein when wound with the backing tape arranged semiconductor devices, taping method of a semiconductor device which is characterized in that so that the semiconductor device from external forces of the mount tape is protected .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9201687A JP3001468B2 (en) | 1997-07-28 | 1997-07-28 | Tape for wrapping semiconductor device and taping method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9201687A JP3001468B2 (en) | 1997-07-28 | 1997-07-28 | Tape for wrapping semiconductor device and taping method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1143176A JPH1143176A (en) | 1999-02-16 |
| JP3001468B2 true JP3001468B2 (en) | 2000-01-24 |
Family
ID=16445247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9201687A Expired - Fee Related JP3001468B2 (en) | 1997-07-28 | 1997-07-28 | Tape for wrapping semiconductor device and taping method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3001468B2 (en) |
-
1997
- 1997-07-28 JP JP9201687A patent/JP3001468B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1143176A (en) | 1999-02-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19991019 |
|
| LAPS | Cancellation because of no payment of annual fees |