JPS6134292Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention is a semiconductor device, such as a glass molded diode, which has an approximately cylindrical element covered with an insulating material and lead wires of approximately equal length extending on both sides of the element. It relates to a container used to store multiple items.

Bag packaging or taping packaging is commonly used to package the above-mentioned semiconductor devices for transportation. In bag packaging, the device is stored as is in a polyethylene bag, for example, and since the device is not particularly supported, external force is applied to the lead wires during storage or transportation, leading to bending of the lead wires and deterioration of device characteristics. There was a possibility. Taping packaging involves fixing the device on a support with adhesive tape, and allows for automatic insertion and automatic forming, but since most of the surface of the device is exposed to the outside air, Dirt may adhere to the surface of the device during transportation, increasing surface leakage current and potentially deteriorating device characteristics. Furthermore, there was a risk that the lead wire would come off from the element portion due to an external force used to straighten the bend of the lead wire during taping. Furthermore, taping sometimes caused adhesive substances to adhere to the lead wires, impairing solderability.

This invention allows the device to be stored without applying external force, so that there is no risk of deterioration of device characteristics or contamination.
It is an object of the present invention to provide a container that can be automatically taken out (auto-chucking) for mounting on a circuit device, and that can be easily exposed to outside air and packaged.

The purpose of this is to accommodate a plurality of semiconductor devices in which the semiconductor storage container has a substantially cylindrical element portion and lead wires of substantially equal length extending on both sides of the element, and the width is greater than the length of the semiconductor device. an inner tray that is narrow and supports lead wires on both sides of the element near the element part at right angles to the longitudinal direction; and a recess that is wider than the length of the element and into which the inner tray is fitted in the center along the longitudinal direction. This is achieved by comprising an outer tray with a

Embodiments of the present invention will be described below with reference to the drawings. The tray of the present invention is divided into an inner tray and an outer tray, so that when removing the stored semiconductor elements from the tray in order to mount them on a circuit device, etc., it is necessary to grasp the lead wires protruding from both sides of the inner tray. Automatic removal (auto chucking)
The outer tray has a size and shape that can accommodate the semiconductor elements housed in the inner tray without protruding. 1 and 2 show the inner tray 10.
The figure is a top view, and FIG. 2 is a long side sectional view. For example, the thickness of synthetic resin such as transparent vinyl chloride is 0.4~
It is formed from a 0.6mm plate and is manufactured by press molding from the plate or direct injection molding. As shown in FIG. 2, the substrate 1 is bent so that the peripheral edge 2 is drawn with a thick edge. Two rows of lead wire support portions 3 running parallel to the vertical direction are provided on the substrate surface. The support portion 3 has a sawtooth shape in which peaks 4 and valleys 5 are arranged alternately. The substrate between two rows of parallel support parts 3 sinks in a direction opposite to the peaks 4 of the support parts to form a recess 6. The lead wire of the semiconductor element is placed on the support part 3, and the element part of the element is shaped to fit in the recess 6.

3 and 4 illustrate an outer tray 20, which is typically constructed of similar materials to the inner tray 10. The substrate 11 has a protruding edge 12 surrounding the periphery and two rows of protruding ridges 13 lower than the protruding edges running parallel to each other in the vertical direction. Further, holes 14 are made at appropriate locations on the substrate 11. FIG. 5 shows the inner tray 10 and the fourth tray shown in FIG.
This is a side view showing a state in which the high withstand voltage diode shown in FIG. 7 is housed in combination with the outer tray 20 shown in the figure. The substrate peripheral edge 2 of the inner tray fits inside the protrusion 13 of the outer tray. Therefore, it is necessary that the width W of the inner tray is approximately equal to and does not exceed the inner distance a of the protrusion 13 in the width direction. The position when a semiconductor element, for example a high voltage diode 30 shown in FIG. 7, is housed in this combination tray is shown by a broken line. The device is supported by lead wires 31 in the valleys 5 of the support portion 3 of the inner tray 10. The element part 32 of the element is located in the recess 6 between the two supports 3. Therefore, the distance b between the supporting parts 3 is the distance b between the element parts 32 of the element.
must be larger than the length l. In order to protect the element, the height h of the crest 4 is equal to the radius D/2 of the element part 32 of the element and the lead so that the top surface of the ridge 4 of the support part is at a higher position than the upper edge of the element part 32 of the element. It must be higher than the sum of the radii d/2 of the lines, ie the dimension C. In addition, since the element part 32 of the device enters the recess 6 between the support parts 3, the depth f of the recess 6 is
must be larger than the difference between the radius D/2 of the element portion and the radius d/2 of the lead wire, that is, the dimension g. The width (b in this case) of the recess 6 is not smaller than the length l of the element portion 32, but is substantially equal to it, and limits movement of the element in the width direction. Furthermore, when the inner tray 10 is fitted to the outer tray 20, the lead wires 31 of the elements extend above the outer tray 20, so the top surface of the protrusion 13 of the outer tray is placed inside so as not to get in the way of the lead wires. It must be lower than the top surface of the substrate 1 of the tray 10. That is, the height H of the protrusion 13 needs to be smaller than the thickness i of the substrate of the inner tray. Furthermore, since the semiconductor device must fit between the protruding edges 12 of the outer tray so as not to protrude from the tray, the inner distance W of the protruding edges 12 must be larger than the total length L of the semiconductor device, and the edge 12 The height j of the top surface of the inner tray must be greater than or equal to the sum of the thickness i of the substrate of the inner tray and the diameter d of the lead wire. Although not shown in FIG. 5, in order for the peripheral edge 2 of the substrate 1 of the inner tray 10 to fit inside the protrusion 13 of the outer tray 20 in the vertical direction, the inner tray 10 in FIG. It is necessary that the length S be approximately equal to, but not exceed, the longitudinal inner spacing t of the edges 12 of the outer tray 20 in FIG. Further, it is preferable to provide a hole 14 provided in the bottom surface of the outer tray 20 because it is useful for inserting a finger when removing the inner tray 10 from the outer tray 20.

If the semiconductor device is supported on the inner tray of the container according to the present invention and combined with the outer tray, even if stacked with other combination trays during transportation during the manufacturing process, the device will remain on the bottom of the upper tray, the outer tray, and the inner tray. It is held within the space between the lead wire and the top surface of the lead wire, so that almost no external force is applied to the lead wire and the element section. In addition, if one tray or several stacked trays are wrapped and sealed in a transparent sealing material made of polypropylene film with good adhesion, they can be easily cut off from the outside air and the interior can be clearly seen for transactions or trading purposes. It is convenient to handle. In addition, when taking out semiconductor devices from a tray and using them, it is possible to take out only the inner tray containing the devices from the tray, set it in an auto-chucking device, and then automatically mount it on a circuit device, etc. be.

Each tray of the container according to the present invention can be made of a thin plate of transparent vinyl chloride with a thickness of 0.4 to 0.6 mm as shown in the example, and can be obtained lightweight and inexpensively.Also, since it is relatively soft, there is no risk of damaging the device. In addition to being strong enough to protect from external forces,
The device can also be seen through from the back side of the tray. Moreover, these trays can be washed after use and used repeatedly. However, it can also be made from other materials, such as metal, and can be formed into a thick-walled tray rather than a thin plate structure to accommodate large, heavy components.

As mentioned above, the present invention constructs a semiconductor device storage container from a set of trays made of inexpensive molded material, and allows the device to be transported and handled while preventing the influence of external forces and outside air on the device. It also completely eliminates the risk of deterioration of the characteristics of the solder and the adhesion of dirt that would impede soldering. Moreover, it is easy to automate the storage work, the appearance is beautiful, the entire element can be seen through, and the product value is improved, so it has great industrial effects.

[Brief explanation of the drawing]

Fig. 1 is a plan view of an embodiment of the inner tray based on the present invention, Fig. 2 is a sectional view taken along the line X-X of Fig. 1, and Fig. 3 is an outer tray used in combination with the inner tray of Fig. 1. A plan view, FIG. 4 is a sectional view taken along the line Y-Y in FIG. 3, FIG.
Short side sectional view showing only the inner tray of the figure, No. 7
The figure is a side view of a high voltage diode. 1: Inner tray substrate, 3: Support part, 6: Recessed part,
11: Outer tray substrate, 12: Projecting edge, 13:
Projection.

Claims (1)

[Claims for Utility Model Registration] 1. A device consisting of an inner tray and an outer tray for storing a plurality of semiconductor devices having a substantially cylindrical element portion and lead wires of substantially equal length extending on both sides of the element portion, , the inner tray has a width narrower than the length of the semiconductor element, supports lead wires on both sides of the element from below near the element part, and has two rows of uneven lead wires running parallel to the longitudinal direction of the tray. What is claimed is: 1. A semiconductor storage container comprising a support portion, an outer tray having a width wider than the length of the element, and a recess into which the inner tray is fitted in a central portion along the longitudinal direction of the outer tray. 2 In the semiconductor storage container described in claim 1 of the utility model registration claim, the inner tray runs approximately in the center of the width of the tray in the longitudinal direction, and has a radius of the element portion of the front air element and a radius of the lead wire. Two rows of support parts formed on the sawtooth that can support the lead wire between the protruding parts that protrude to a height greater than the sum of a recess running in the longitudinal direction approximately at the center of the element portion, having a width greater than or equal to the length of the element portion, and having a depth greater than or equal to the difference between the radius of the element portion and the radius of the lead wire; It has two rows of protrusions running in the longitudinal direction approximately in the center, and a protruding edge that surrounds the periphery and has an inner interval in the width direction that is equal to or longer than the entire length of the semiconductor element, and an inner tray is provided between the protrusions. A semiconductor characterized in that the top surface of the protruding strip is not higher than the top surface of the substrate of the inner tray when the two are fitted together, but the top surface of the protruding edge is at a position higher than the top surface of the substrate of the inner tray by more than the diameter of the lead wire. Element storage container.