JPH02258573A - Carrier tape - Google Patents

Abstract

PURPOSE:To prevent the occurrence of rejected outer leads due to the deformation resulting from an accidental shock given to carrier tape by providing a cavity with a relief at each of its corners. CONSTITUTION:Each cavity 7 is provided with a relief 8 at each of the fur corners so as to avoid contact with an outer lead 3 located at each end of the individual rows of the outer leads 3 mounted to a semiconductor 1 received in the cavity 7. Four position limiting parts 9 are so arranged as to project to near the ends of the outer leads 3 at the central part of each row of the outer leads 3, thereby effecting a positional restraint substantially over the semiconductor 1 received in the cavity 7. Even if the semiconductor 1 is made to rotate by the shocks resulting from the dropping of carrier tape, the endmost outer leads 3 of each row are only entered into the reliefs 8 free from contact with the side walls of the cavity 7.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a carrier tape, in particular, a carrier tape that stores an article in a cavity formed in the carrier tape body, and
This product is used to package small electronic devices such as semiconductor devices, capacitors, resistors, etc., and is used to package small electronic devices such as semiconductor devices, capacitors, and resistors. Regarding what works for you.

(Prior Art) As a carrier tape used for packaging small electronic devices such as semiconductor devices, capacitors, resistors, etc.
For example, as described in Japanese Unexamined Patent Publication No. 62-271858, a carrier tape body is formed with a plurality of cavities for storing objects to be packaged and arranged next to each other with a connecting portion in between. and a cover tape attached to the main surface of the carrier tape main body on the cavity opening side, and the electronic device is stored in the cavity of the carrier tape main body, and the stored articles are stored by applying the cover tape. Some are configured to be sealed and packaged.

Such carrier tapes are generally wound into reel shapes for ease of storage and transportation. When unpacking, the cover tape is peeled off in one direction from the carrier tape main body while the carrier tape is unwound from the reel.

[Problem to be solved by the invention]

However, in such a carrier tape, a semiconductor integrated circuit device C equipped with a surface-mounted package is hereinafter referred to as a semiconductor device. ) is packaged, there is a problem in that defects such as lead bending occur when a strong impact is applied, such as when the packaged and wound carrier tape is dropped.

A carrier tape that is configured to restrict excessive movement of a semiconductor device by fixing the corner part of the package of the semiconductor device with a part of the side wall of the cavity or a protruding member is Proposed.

However, in such a carrier tape, the corner part of the pancage of the semiconductor device is fixed by a part of the cavity or a protruding member, so there is a problem that it becomes difficult to load the IC into the cavity. This was revealed by the present inventor.

SUMMARY OF THE INVENTION An object of the present invention is to provide a carrier tape that can prevent leads from bending and the like, and can also suppress deterioration in the workability of loading objects.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the problem]

An overview of typical inventions disclosed in this application is as follows.

In other words, there are multiple cavities for storing the items to be packed.
A carrier tape comprising a carrier tape main body arranged side by side with a connecting portion in between, and a cover tape attached to the main surface of the carrier tape main body on the opening side of the center hole, Relief portions are formed at each corner of each cavity of the carrier tape main body so as to escape from the corner of the object to be packaged.

[Effect]

According to the above-mentioned means, relief parts are formed at each corner of the cavity so that the corners of the packaged object can escape, so that in the unlikely event that the carrier tape in the packaged state falls and receives a strong impact, Even if the corner portion of the object to be packed does not collide with the cavity, the corner portion of the object to be packed will not be damaged.

In addition, since relief parts are only formed at each corner of the cavity so that the corner parts of the objects to be packed can escape, the relief parts become an obstacle when loading the objects to be packed into the cavity. Therefore, a reduction in loading work can be avoided.

〔Example〕

Fig. 1 is a partially omitted perspective view showing a carrier tape according to an embodiment of the present invention, Fig. 2 is a plan view showing a state in which the cover tape is removed, and Fig. 3 is shown along the line ■-■ in Fig. 2. A cross-sectional view along
FIGS. 4 and 5 are partial plan views of the tank for explaining its function.

In this embodiment, the carrier tape according to the present invention is configured to package a semiconductor device Z (QFP/IC) 1 having a quad flatback package. A semiconductor device 1 as an article to be packaged includes a resin-sealed package 2 formed in a square flat shape, and a plurality of outer leads 3 are protruded from each of the four sides of the package 2, and the lower end is They are aligned and bent into a gull wing shape so as to slightly protrude from the bottom surface of the package.

This carrier tape 4 includes a carrier tape body and a cover tape. The carrier tape body 5 is made of resin such as polyvinyl chloride, polystyrene, etc.
For example, by suitable means such as calender roll forming, etc., the thickness is 0.5 mm. The size is about 2 au and the size is 1 for a semiconductor device.
It is formed into a tape shape with a constant width larger than the MpL width of. Particularly, but not limited to, when storing a semiconductor device, static electricity such as frictional static electricity becomes an obstacle. Therefore, in order to prevent the occurrence of troubles due to static electricity, it is desirable to use a material in which carbon powder is kneaded into the carrier tape main body 5.

Small holes 6 are regularly arranged in the longitudinal direction and opened in the thickness direction at both end sides of the carrier tape main body 5, and these small holes 6 serve as feeding claws in a conveying device for the carrier tape 4. It is configured so that it can be engaged with. A large number of cavities 7 for accommodating the semiconductor devices 1 are arranged in a single column in the longitudinal direction with connecting portions 11 in between, and are recessed in one thickness direction in the widthwise center of the carrier tape main body 5. has been done. Each cavity 7 is formed by molding a part of the carrier tape main body 5 by expanding the thickness in one direction into a square hole shape with a constant depth that can accommodate the semiconductor device 1 as an object to be packaged with a suitable margin. each formed. Further, the arrangement interval (pitch) of the seven groups of cavities in the longitudinal direction is set to be constant over the entire length.

Escape parts 8 are arranged at four corners of each of the cavities 7 so that the outer leads 3 located at both end areas of the three groups of outer leads in the semiconductor device 1 housed in the cavity 7 can escape. are formed respectively. That is, the relief portion 8 bulges outward in the radial direction so that the facing surface thereof is separated from the tip of the outer lead 3 at a portion facing some of the outer leads 3 located at both end regions in the row of the group of outer leads 3. Molded. Therefore, in the center of the four side surfaces of the cavity 7, the position regulating part 9, which is close to the tip side of the three groups of outer leads, is disposed between the relief parts 8.8 at both ends, and is directed radially inward. Each is bulge-molded. That is, the four position regulating portions 9 are configured to substantially regulate the position of the semiconductor device l accommodated in the cavity 7 by being close to the tips of the three groups of outer leads in the center of the row of three groups of outer leads. has been done.

Further, a supporting portion 10 is disposed at the center of the bottom surface of the cavity 7, and is formed into a raised square shape having a constant height and approximately the same size as the package 2 of the semiconductor device 1. There is.

Further, on both sides of the cavity 7 on the main surface of the carrier tape main body 5 on the opening side of the cavity 7, a long and narrow joining margin 12 for joining the cover tape is virtually formed.

On the other hand, the cover tape 14 is formed into a tape shape whose width is narrower than the width of the carrier tape main body 5 by the amount of the small hole 6, and can be easily bonded to the carrier tape main body 5 by thermocompression, such as with polypropylene as a base. material is used,
It is integrally molded by suitable means such as calender roll molding.

The thickness of this cover tape 14 is set to about 60 to 70 μm.

When the semiconductor device 1 is packed in the carrier tape 4 that includes the carrier tape body 5 and the cover tape 14 having the above-described configuration, the semiconductor device 1 is first placed in a predetermined position in the cavity 7 of the carrier tape body 5. Normally, the outer leads 3 are placed facing downward and are inserted one after another.

Subsequently, the cover tape 14 is arranged and brought into contact with the upper surface of the carrier tape main body 5 so as to close the opening of the cavity 7 in which the semiconductor device l is housed, and is also bonded by a thermocompression bonding device (not shown). Joining allowance on both sides 12.12
It is continuously thermocompressed along the line. Through this thermocompression bonding operation, the cover tape 14 is fixedly adhered to the carrier tape body 5 by the thermocompression bonding portion 13 formed between the contact surfaces of the carrier tape body 5 and the cover tape 14, and becomes a solid. At this time, the thermocompression bonding portion 13 is formed continuously over the entire length of the carrier tape 4, and is formed to have a constant width and a constant strength. Therefore, the bonding strength of the thermocompression bonded portion 13 is uniform over the entire length of the carrier tape 4.

Next, the carrier tape 4 with the cover tape 14 attached to the carrier tape body 5 is continuously wound into a reel by a suitable winding device (not disclosed). The carrier tape 4 is thus stored or transported in a reeled state.

By the way, as shown in FIG. 4, in the case of the conventional example in which no escape part is formed in the cavity 7', when the carrier tape is dropped and +l: 92 is applied,
The housed semiconductor device 11 rotates in the circumferential direction, and the outer lead 3 collides with the side surface of the cavity 7'. The inventor has discovered that, in most cases, the outer lead 3 bent at the time of this collision is the outer lead 3 located at the end of the row of three groups of outer leads.

Therefore, in this embodiment, relief parts 8 are formed at each corner of the cavity leaf to prevent the outer leads 3 located at the ends of the row of three groups of outer leads from coming into contact with the side surface of the cavity 7. I decided to do so.

That is, in this embodiment, since relief portions 8 are formed at each corner of the cavity 7, gaps where the carrier tape is dropped or subjected to impact, as shown in FIG. , even if the semiconductor device 1 rotates in the circumferential direction, the rear leads ('3) located at the ends of the three groups of outer leads only enter the relief part 8 and do not come into contact with the side wall of the cavity 7. No. As a result, outer lead 3
This will prevent the outer lead 3 from being bent poorly due to contact with the side wall of the cavity 7.

At this time, since the package 2 of the semiconductor device 1 is supported on the support portion 10 raised on the bottom surface of the cavity 7, the semiconductor device 1 rotates on the support portion 10, and as a result, the outer lead 3 moves closer to the sides of the cavity 7 at both ends of the row 6. In other words, the supporting portion 10 can enhance the effect of preventing bending defects due to the relief portion 8.

Furthermore, in this embodiment, the defective bending of the outer lead 3 is not prevented by preventing the semiconductor device from moving, but by preventing the outer lead 3 from coming into contact with the relief portion 8. Due to the bending defect prevention structure, the loading workability into the cavity 7 of the semiconductor device 1 is not deteriorated.

Here, the position of the semiconductor device I in the cavity 7 in the circumferential direction is restricted by a position restriction part 9 that is provided on the side surface of the cavity 7 in a radial direction and protrudes relative to the escape part 8.
is ensured by being close to the central tip of the third row of outer leads.

According to the embodiment described above, the following effects can be obtained.

(1) By forming relief parts at each corner of the cavity, it is possible to avoid contact between the cavity and the outer leads located at the ends of the outer lead group row in the semiconductor device as the packaged object. , it is possible to prevent the occurrence of bending defects in the outer lead when an unexpected impact is applied to the carrier tape.

(2) By avoiding contact of the outer leads with the escape part and preventing bending defects of the outer leads, the bending defect prevention structure prevents a decline in workability of loading semiconductor devices as objects to be packaged into cavities. Therefore, it is possible to secure advantages such as ease of packaging work using carrier tape.

(3) Raise the support part on the bottom of the cavity,
By supporting the semiconductor bag (1) as an object to be packed in a pan cage, when an impact occurs, the semiconductor device is rotated on the support part, and the outer lead group row approaches the side surface of the cavity at both ends thereof. Since the outer lead can be caused to move in this manner, the effect of preventing bending of the outer lead from occurring in the RFB defect can be enhanced at the relief portion formed at the corner portion of the cavity.

Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Not even.

For example, the cavity and the reliefs formed at its corners may be configured as shown in FIGS. 6 and 7, respectively.

In FIG. 6, cavity 7A is a semiconductor device (SOP/I) equipped with a small outline package.
C), and a relief part 8A is formed in the corner part of the two side surfaces corresponding to the 7 outer leads 3A of the cavity IA.
A position regulating portion 9A is formed in the center of the side surface.

The functions and effects of the second embodiment are the same as those of the first embodiment.

In FIG. 7, cavity 7B is a semiconductor device F (S O
P.
A position regulating portion 9B is formed in the center of the two side surfaces.

The functions and effects of the third embodiment are the same as those of the first embodiment.

Further, the joint portion that joins the carrier tape main body and the cover tape is not limited to being formed by thermocompression bonding, but may be formed by bonding with an adhesive or the like.

Furthermore, the feeding holes are not limited to being arranged on both ends of the carrier tape body.

In the above explanation, the invention made by the present inventor has mainly been explained in the case where it is applied to the storage and packaging technology of semiconductor devices, which is the field of application that formed the background of the invention, but it is not limited thereto. It can be applied to techniques for storing and handling small electronic devices such as, etc., as well as other small items.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

By forming relief parts at each corner of the cavity, contact between the outer leads located at the ends of the row of outer lead groups in the semiconductor device to be packaged and the cavity can be avoided. It is possible to prevent the occurrence of bending defects in the outer lead when an unexpected impact is applied to the outer lead.

[Brief explanation of drawings]

Fig. 1 is a partially cutaway perspective view showing a carrier tab according to an embodiment of the present invention, Fig. 2 is a plan view showing the state with the cover tape removed, and Fig. 3 is taken along the lit-tll line in Fig. 2. I refuse! i′
Figure i, Figure 715J4, and Figure 5 are partial plan views for explaining the operation. FIGS. 6 and 7 are partial plan views showing other embodiments, respectively. ■...Semiconductor device (packaged item), 2...Resin sealing package, 3.38...Outer lead, 4...Carrier tape, 5...Carrier tape body, 6...Small Hole, 7, IA, IB...Cavity 8.8A, 8
B...Escape part, 9.9A, 9B...Position regulation part, 1
．． 0. Supporting part, 11... Connection part, 12... Joining margin part, ] 3. Thermocompression bonding part (joint part), 14... Cover tape.

Claims (3)

[Claims] 1. A carrier tape body is formed with a plurality of cavities for storing objects to be packaged and arranged next to each other with connecting portions in between, and the carrier tape body is attached to the main surface of the carrier tape body on the cavity opening side. A carrier tape comprising a cover tape, wherein relief portions are formed at each corner of each cavity of the carrier tape main body so as to escape from the corner of an object to be packaged. . 2. 2. The carrier tape according to claim 1, wherein the relief portion is configured to escape a corner portion of a lead group row of a semiconductor integrated circuit device housed in the cavity. 3. 2. The carrier tape according to claim 1, wherein a supporting portion is formed at a central portion of the bottom surface of the cavity to be raised to a certain height.