JP3037510B2 - Cover tape for electronic component carrier - Google Patents
Cover tape for electronic component carrierInfo
- Publication number
- JP3037510B2 JP3037510B2 JP4213786A JP21378692A JP3037510B2 JP 3037510 B2 JP3037510 B2 JP 3037510B2 JP 4213786 A JP4213786 A JP 4213786A JP 21378692 A JP21378692 A JP 21378692A JP 3037510 B2 JP3037510 B2 JP 3037510B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- tape
- pressure
- cover tape
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Packages (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はＩＣ等の電子部品を実装
機に搬送する場合に使用する電子部品用キャリアテ−プ
のカバ−テ−プに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cover tape of a carrier tape for an electronic component used for transferring an electronic component such as an IC to a mounting machine.
【０００２】[0002]
【従来の技術】回路板にＩＣ等の電子部品を実装する場
合、実装機への電子部品の搬送には、通常テ−プキャリ
ア方式を使用している。即ち、一定間隔ごとに電子部品
収容凹部を設け、片脇部に送り孔を穿設したキャリアテ
−プ本体を走行させ、この走行キャリアテ−プ本体の電
子部品収容凹部に電子部品を収容し、更に、カバ−テ−
プを繰り出し、このカバ−テ−プを走行中のキャリアテ
−プ本体に重ね接着して電子部品担持キャリアテ−プを
作成し、この電子部品担持キャリアテ−プを一旦リ−ル
に巻回し、このリ−ルから電子部品担持キャリアテ−プ
を送りロ−ルにより送りロ−ルのピンとキャリアテ−プ
の送り孔とを噛止させつつ引出し、この引出した電子部
品担持キャリアテ−プを電子部品実装機に搬入し、カバ
−テ−プを剥離のうえ、電子部品を取り出し、次から次
へと回路板に装着していく方式を使用している。上記カ
バ−テ−プには、接着剤にホットメルト型接着剤を使用
したものと、感圧性接着剤を使用したものとが知られて
いる。2. Description of the Related Art When electronic components such as ICs are mounted on a circuit board, a tape carrier system is usually used to transport the electronic components to a mounting machine. That is, the electronic component accommodating recesses are provided at regular intervals, the carrier tape main body having a feed hole formed on one side is run, and the electronic components are accommodated in the electronic component accommodating concave portions of the traveling carrier tape main body. , And moreover, cover
The electronic component carrying carrier tape is prepared by feeding out the tape, overlapping the tape with the main body of the traveling carrier tape, and bonding the electronic component carrying carrier tape to a reel. The electronic component-carrying carrier tape is turned from the reel and pulled out by a feed roll while engaging a pin of the feed roll with a feed hole of the carrier tape. In this system, the electronic component is taken out of the cover, the cover tape is peeled off, the electronic component is taken out, and the electronic component is mounted on the circuit board one after another. As the cover tape, those using a hot-melt type adhesive as an adhesive and those using a pressure-sensitive adhesive are known.
【０００３】これらのカバ−テ−プのうち、ホットメル
トタイプのものにおいては、キャリアテ−プ本体への重
ね接着に加熱プロセスを必要とし、電子部品収容時のテ
−プ走行速度を余り速くし得ず、高速化に不利である。
また、接着力が微妙な加熱のバラツキ（例えば、周囲温
度の変化）により左右され易く、剥離力が一定せず、上
記電子部品の取り出しに支障を来すこともある。[0003] Of these cover tapes, the hot melt type requires a heating process for laminating and bonding to the carrier tape body, so that the tape traveling speed at the time of accommodating the electronic parts is too high. This is disadvantageous for speeding up.
In addition, the adhesive force is easily affected by minute variations in heating (for example, changes in ambient temperature), and the peeling force is not constant, which may hinder the removal of the electronic component.
【０００４】他方、感圧性接着タイプのカバ−テ−プに
おいては、上記したホットメルトタイプの不利を排除で
きる。しかしながら、キャリアテ−プの凹部に収容され
た電子部品がその凹部空間に面するカバ−テ−プ部分の
感圧性接着剤に接触し、電子部品がカバ−テ−プ側に移
着されて電子部品の取出しに支障を来したり、電子部品
が粘着剤で汚損されて電子部品の実装に支障を来したり
すことがある。 On the other hand, in the case of a pressure-sensitive adhesive type cover tape, the above-mentioned disadvantages of the hot melt type can be eliminated. However, the electronic component accommodated in the concave portion of the carrier tape comes into contact with the pressure-sensitive adhesive in the cover tape portion facing the concave portion space, and the electronic component is transferred to the cover tape side. The removal of electronic components may be hindered,
May be contaminated with the adhesive and hinder the mounting of electronic components.
Sometimes.
【０００５】かかる不具合を排除するには、感圧性接着
タイプカバ−テ−プの全巾のうち、上記電子部品収容凹
部に臨む巾中間部分の感圧性接着剤層表面に非粘着のフ
ィルムを貼着したり、その巾中間部分の感圧性接着剤層
表面に光硬化性材料を塗布し、光照射して非粘着材層を
設けることが公知である（特開昭６４−３７３６４
号）。更に、カバ−テ−プ基材の片面に、上記電子部品
収容凹部に臨む巾中間部分を除く巾両端部に感圧性接着
剤層を設け巾中間部分を基材素面の非粘着面のままにし
ておくことも公知である。 In order to eliminate such a problem, a non-adhesive film is adhered to the surface of the pressure-sensitive adhesive layer in the middle part of the width of the pressure-sensitive adhesive type cover tape which faces the recess for accommodating the electronic component. It is known that a photocurable material is applied to the surface of the pressure-sensitive adhesive layer in the middle part of the width, and a non-adhesive material layer is provided by irradiating light (Japanese Patent Laid-Open No. 64-36464).
issue). Further, the electronic component is provided on one side of the cover tape base material.
Pressure-sensitive adhesive on both ends of the width except the middle part facing the storage recess
Provide the agent layer and leave the middle part of the width as the non-adhesive surface of the base material surface.
Is also known.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、これら
のカバ−テ−プにおいては、巾中間部分の厚みが非粘着
フィルムまたは非粘着光硬化層の厚み分だけ厚くなり、
リ−ルに巻取ったときにテ−プ巾中間部分が膨れて巻回
状態が不安定となり、このリ−ル巻回体からカバ−テ−
プを繰り出して上記の走行キャリアテ−プ本体に接着す
る際、その巻回状態の不安定性のために、良好な接着状
態を確保し難い。However, in these cover tapes, the thickness of the middle part of the width is increased by the thickness of the non-adhesive film or the non-adhesive light-cured layer,
When wound on a reel, the tape width middle part expands and the winding state becomes unstable.
When the tape is pulled out and bonded to the traveling carrier tape body, it is difficult to secure a good bonding state due to the instability of the winding state.
【０００７】かかる不具合を排除するために、非粘着フ
ィルムまたは非粘着光硬化層（非粘着材層）の厚さを薄
くすることが考えられるが、この場合は、非粘着材層が
搬送中での電子部品との接触によって破れ易く、電子部
品のカバ−テ−プ側への移着を確実に防止し難い。更
に、カバ−テ−プ基材片面の巾両端部のみに感圧性接着
剤層を設け巾中間部分を基材素面の非粘着面のままにし
ておくものでは、リ−ルに巻き取ったときに巻回層間の
締付け圧力のために感圧性接着剤層の巾が広がって非粘
着部の巾が狭くなり、締め付け圧力が累積される巻取り
内層側ほどその狭巾化が顕著となり、電子部品が粘着剤
に接触するのを確実に防止し難い。また、感圧性接着剤
方式のカバ−テ−プをリ−ルから繰り出す際に非粘着フ
ィルを添着する方式も公知であるが、この方式では、カ
バ−テ−プの走行速度の低下が避けられず、高速化に支
障となる。In order to eliminate such a problem, it is conceivable to reduce the thickness of the non-adhesive film or the non-adhesive light-cured layer (non-adhesive material layer). It is easy to be broken by contact with the electronic component, and it is difficult to reliably prevent the electronic component from being transferred to the cover tape side. Change
Pressure-sensitive adhesive only on both ends of the width of one side of the cover tape base material
Provide the agent layer and leave the middle part of the width as the non-adhesive surface of the base material surface.
In the case of winding, when wound on a reel,
Due to the tightening pressure, the width of the pressure-sensitive adhesive
Winding where the width of the fitting part becomes narrow and the tightening pressure is accumulated
The narrower the inner layer is, the more noticeable the electronic component becomes.
It is difficult to reliably prevent contact with It is also known to attach a non-adhesive fill when the cover tape of the pressure-sensitive adhesive system is fed from the reel. However, in this system, a decrease in the traveling speed of the cover tape is avoided. And it hinders speeding up.
【０００８】本発明の目的は、電子部品の感圧性接着剤
層への移着を確実に防止し得、しかも走行キャリアテ−
プ本体に、良好に接着できる感圧性接着タイプの電子部
品キャリア用カバ−テ−プを提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to surely prevent the transfer of an electronic component to a pressure-sensitive adhesive layer, and furthermore, to provide a traveling carrier tape.
An object of the present invention is to provide a cover tape for an electronic component carrier of a pressure-sensitive adhesive type which can be satisfactorily adhered to a main body.
【０００９】[0009]
【課題を解決するための手段】本発明に係わる電子部品
のキャリア用カバ−テ−プは、電子部品収容凹部を有す
るキャリアテ−プ本体に重ね接着して使用されるカバ−
テ−プにおいて、支持基材の片面での上記凹部に臨む巾
中間部分に接して非粘着材層を、その巾中間部分の両側
に接して感圧性接着剤層を両層の厚さをほぼ等しくして
それぞれ設けたことを特徴とする構成であり、非粘着材
層と感圧性接着剤層との厚みの差は５０μｍ以下とする
ことが好ましい。SUMMARY OF THE INVENTION A cover tape for a carrier of an electronic component according to the present invention is used by being superposed and adhered to a carrier tape body having an electronic component receiving recess.
Te - In-flop, the non-adhesive material layer in contact with the width middle portion facing the recess at one side of the supporting substrate, approximately the thickness of the pressure-sensitive adhesive layer both layers in contact with both sides of the width middle portion This is a configuration characterized by being provided equally, and the difference in thickness between the non-adhesive material layer and the pressure-sensitive adhesive layer is preferably 50 μm or less.
【００１０】[0010]
【作用】非粘着層と感圧性接着剤層との厚みをほぼ等し
くしてあるので、リ−ルへの巻回姿態を安定にでき、こ
のリ−ル巻回カバ−テ−プを安定な引っ張り張力状態で
走行キャリアテ−プ本体に良好に重ね接着できる。Since the thickness of the non-adhesive layer and that of the pressure-sensitive adhesive layer are substantially equal, the appearance of winding on the reel can be stabilized, and the reel winding tape can be stabilized. It can be satisfactorily overlapped and adhered to the traveling carrier tape main body in the state of tensile tension.
【００１１】[0011]
【実施例】以下、図面により本発明の実施例を説明す
る。図１の（イ）並びに図１の（ロ）は本発明のカバ−
テ−プの異なるキャリアテ−プ本体への使用状態を示
し、図１の（イ）に示すものにおいては、キャリアテ−
プ本体（例えば、紙テ−プ）１に所定の一定間隔を隔て
て電子部品収容用孔１１を設け、該テ−プの下面に下側
カバ−テ−プｃ1を接着し、孔１１に電子部品ａを収容
のうえ、上側カバ−テ−プｃ2を接着してあり、図１の
（ロ）に示すものにおいては、プラスチック製のキャリ
アテ−プ本体１に所定の一定間隔を隔てて電子部品収容
用凹部１１をエンボス成形によって形成し、この凹部１
１に電子部品ａを収容のうえ、カバ−テ−プｃ3を接着
してあり、これらのカバ−テ−プｃ1，ｃ2，ｃ3等に本
発明のカバ−テ−プが使用される。Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1A and 1B show the cover of the present invention.
The state of use of the tape on a carrier tape body having a different tape is shown. In the case shown in FIG.
Flop body (e.g., Kamite - flop) 1 to provided the electronic component accommodating hole 11 at a predetermined constant interval,該Te - Te - - lower cover on the bottom surface of up to adhere the flop c 1, holes 11 on top of the housing the electronic components a, the upper cover - Te - Yes by bonding flop c 2, in that shown in the (b) 1, plastic carrier tape - a predetermined constant intervals up body 1 A recess 11 for accommodating the electronic component is formed by embossing.
Upon receiving an electronic component a to 1, cover - Te - Yes by bonding flop c 3, these cover - Te - cover of the present invention to flop c 1, c 2, c 3, etc. - Te - flops used Is done.
【００１２】なお、図１の（イ）並びに図１の（ロ）に
おいて、２はキャリアテ−プ送り用の孔であり、長さ方
向に一定間隔を隔てて設けられている。In FIGS. 1 (a) and 1 (b), reference numeral 2 denotes a carrier tape feeding hole which is provided at regular intervals in the length direction.
【００１３】図２は本発明のカバ−テ−プを示す横断面
説明図である。図２において、３は支持基材であり、例
えば、ポリエチレンテレフタレ−トやポリプロピレンが
使用される。FIG. 2 is an explanatory cross-sectional view showing a cover tape of the present invention. In FIG. 2, reference numeral 3 denotes a supporting substrate, for example, polyethylene terephthalate or polypropylene is used.
【００１４】４は支持基材片面の巾中間部に設けられた
非粘着層であり、上記キャリアテ−プ本体１の電子部品
収容用凹部または孔１１の巾よりもやや広い巾とされて
いる。５は非粘着層４の両側に間隙ｄを隔てて塗布され
た感圧性接着剤であり、この感圧性接着剤５の塗布厚み
と非粘着層４の厚みとがほぼ等しくされている。Reference numeral 4 denotes a non-adhesive layer provided in the middle portion of the width of one side of the supporting base material, and has a width slightly larger than the width of the concave portion or hole 11 for accommodating the electronic component of the carrier tape body 1. . Reference numeral 5 denotes a pressure-sensitive adhesive applied to both sides of the non-adhesive layer 4 with a gap d therebetween, and the applied thickness of the pressure-sensitive adhesive 5 is substantially equal to the thickness of the non-adhesive layer 4.
【００１５】上記非粘着層４の材質には、電子部品に接
触しても電子部品に悪影響を及ぼさず、かつ、支持基材
３に強固に接着され、しかも、支持基材３に対し伸縮
性、追従性のあるものであれば適宜のものを使用でき
る。特に、ハロゲン系の元素を含むものは使用しないこ
とが安全であり、使用せざるを得ない場合は、電子部品
に影響を与えない範囲内とすることが必要である。この
非粘着層４は図示の帯状の外、細線状とすることもで
き、一本乃至数本のディスペンサ−を使用しての塗工ま
たはフアンテンコ−トダイコ−タ等による塗工等で設け
られる。The material of the non-adhesive layer 4 does not adversely affect the electronic component even when it comes into contact with the electronic component, and is firmly adhered to the support base material 3. Any suitable one can be used as long as it has a following property. In particular, it is safe to not use a material containing a halogen-based element, and if it must be used, it must be within a range that does not affect electronic components. The non-adhesive layer 4 may be formed in a thin line shape in addition to the band shape shown in the drawing, and is provided by coating using one or several dispensers, coating with a fan-coated die coater or the like.
【００１６】上記感圧性接着剤層５と非粘着層４との間
の間隙ｄは、非粘着層４への感圧性接着剤の付着防止の
ために設けてあり、余り広くすると、後述するカバ−テ
−プの巻回状態の安定性を保証し難くなるので、０．１
ｍｍ〜１０ｍｍ、好ましくは、０．５ｍｍ〜３ｍｍとさ
れる。The gap d between the pressure-sensitive adhesive layer 5 and the non-adhesive layer 4 is provided to prevent the pressure-sensitive adhesive from adhering to the non-adhesive layer 4. -Since it is difficult to guarantee the stability of the wound state of the tape, 0.1
mm to 10 mm, preferably 0.5 mm to 3 mm.
【００１７】上記感圧性接着剤層５には、通常のアクリ
ル系、ゴム系、シリコ−ン系等を使用でき、例えば、ポ
リメチルメタクリレ−ト、ポリアクリル酸エステル／ポ
リアクリル酸共重合体、ポリ塩化ビニル、ポリブタジェ
ン、ポリイソプレン等の高分子の単体または混合物が使
用され、その塗工には、ディスペンサ−塗布の外、フア
ンテンコ−トダイコ−タによる塗工、グラビア塗工等も
使用できる。The pressure-sensitive adhesive layer 5 can be made of ordinary acrylic, rubber, silicone, etc., such as polymethyl methacrylate, polyacrylate / polyacrylic acid copolymer. A simple substance or a mixture of polymers such as polyvinyl chloride, polybutadiene, and polyisoprene are used. In addition to coating with a dispenser, coating with a phantene coat die coater, gravure coating, or the like can be used.
【００１８】上記カバ−テ−プにおいては、非粘着層４
と感圧性接着剤層５との厚みをほぼ等しくしてあるの
で、安定な巻回状態でリ−ルに巻回でき、このリ−ル巻
回カバ−テ−プを安定な張力状態で繰り出しつつ走行カ
バ−テ−プ本体に重ね接着していくことができ、走行カ
バ−テ−プ本体を良好な接着状態でカバ−できる。通常
感圧性接着剤層の厚みは、１μｍ〜１００μｍ好ましく
は、５μｍ〜５０μｍとされ、この感圧性接着剤層と上
記非粘着層との厚さの差は５０μｍ以下とされる。In the cover tape, the non-adhesive layer 4
And the thickness of the pressure-sensitive adhesive layer 5 are substantially equal, so that the reel can be wound in a stable wound state, and the reel wound cover tape is fed out in a stable tension state. The traveling cover tape body can be overlapped and adhered to the traveling cover tape body, and the traveling cover tape body can be covered with a good adhesion state. Usually, the thickness of the pressure-sensitive adhesive layer is 1 μm to 100 μm, preferably 5 μm to 50 μm, and the difference in thickness between the pressure-sensitive adhesive layer and the non-adhesive layer is 50 μm or less.
【００１９】[0019]
【発明の効果】本発明の電子部品のキャリア用カバ−テ
−プは、上述した通りの構成であり、非粘着層部分の厚
みと感圧性接着剤層との厚みをほぼ等しくしてあるか
ら、当該テ−プのリ−ルへの巻回状態を充分に安定な状
態になし得、リ−ルからのカバ−テ−プの繰り出しを安
定な張力状態で行うことができ、走行キャリアテ−プ本
体に良好に接着でき、感圧性接着方式のより一層の高速
走行化が可能となる。The cover tape for a carrier of an electronic component according to the present invention has the structure described above, and the thickness of the non-adhesive layer portion and the thickness of the pressure-sensitive adhesive layer are substantially equal. In addition, the tape can be wound around the reel in a sufficiently stable state, the cover tape can be fed out from the reel in a stable tension state, and the traveling carrier tape can be used. -It is possible to adhere well to the main body of the pump, and it is possible to further increase the speed of the pressure-sensitive adhesive system.
【００２０】また、非粘着材層部分には、従来の非粘着
フィルム貼着方式、または、光硬化非粘着方式とは異な
り、たとえ、非粘着材層の破れによる粘着剤の現出があ
り得ず、更にテ−プ基材片面の巾両端部のみに感圧性接
着剤層を設け基材片面の巾中間部を非粘着の基材素面の
ままにしておくものと異なり、リ−ル巻回圧力下での巾
両端部粘着剤の基材巾中間部への流動を非粘着剤層４の
存在のために阻止できるから、電子部品が粘着剤に接触
するのを確実に防止でき、電子部品のカバ−テ−プ側へ
の移着や電子部品の粘着剤汚損を良好に排除できる。勿
論、感圧性接着方式であるので、ホットメルト方式の既
述した不利を全て解消できる。Also, unlike the conventional non-adhesive film sticking method or the photo-curing non-adhesive method, the non-adhesive layer may show an adhesive due to tearing of the non-adhesive layer. And pressure-sensitive contact only at both ends of the width of one side of the tape substrate
The adhesive layer is provided and the middle part of the width of one side of the base material is
Unlike what is left, the width under the reel winding pressure
The flow of the adhesive at both ends to the intermediate portion of the base material width is controlled by the non-adhesive layer 4.
Electronic components come into contact with adhesive because they can be stopped because of their presence
This can reliably prevent the transfer of the electronic component to the cover tape side and the contamination of the electronic component with the adhesive. Of course, since it is a pressure-sensitive adhesive system, all the disadvantages described above of the hot melt system can be eliminated.
【図１】本発明のキャリア用カバ−テ−プを使用した異
なる電子部品キャリアテ−プを示す説明図である。FIG. 1 is an explanatory view showing a different electronic component carrier tape using a carrier tape of the present invention.
【図２】本発明の実施例を示す説明図である。FIG. 2 is an explanatory diagram showing an embodiment of the present invention.
３ 支持基材 ４ 非粘着層 ５ 感圧性接着剤層 3 support base material 4 non-adhesive layer 5 pressure-sensitive adhesive layer
フロントページの続き (56)参考文献 特開 昭64−37364（ＪＰ，Ａ) 実開 昭62−132142（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) B65D 73/02 Continuation of the front page (56) References JP-A-64-37364 (JP, A) JP-A-62-132142 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) B65D 73 / 02
Claims (2)
本体に重ね接着して使用されるカバ−テ−プにおいて、
支持基材の片面での上記凹部に臨む巾中間部分に接して
非粘着材層を、その巾中間部分の両側に接して感圧性接
着剤層を両層の厚さをほぼ等しくしてそれぞれ設けたこ
とを特徴とする電子部品のキャリア用カバ−テ−プ。1. A cover tape which is used by being overlapped and adhered to a carrier tape body having an electronic component accommodating recess.
In contact with the width middle portion facing the recess at one side of the supporting substrate
A cover tape for a carrier of an electronic component, wherein a non-adhesive material layer is provided in contact with both sides of a middle portion of the width thereof, and a pressure-sensitive adhesive layer is provided so that the thicknesses of both layers are substantially equal.
が５０μｍ以下である請求項１記載の電子部品のキャリ
ア用カバ−テ−プ。2. A cover tape for a carrier of an electronic component according to claim 1, wherein the difference in thickness between the non-adhesive material layer and the pressure-sensitive adhesive layer is 50 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4213786A JP3037510B2 (en) | 1992-07-17 | 1992-07-17 | Cover tape for electronic component carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4213786A JP3037510B2 (en) | 1992-07-17 | 1992-07-17 | Cover tape for electronic component carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0640467A JPH0640467A (en) | 1994-02-15 |
| JP3037510B2 true JP3037510B2 (en) | 2000-04-24 |
Family
ID=16645029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4213786A Expired - Fee Related JP3037510B2 (en) | 1992-07-17 | 1992-07-17 | Cover tape for electronic component carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3037510B2 (en) |
-
1992
- 1992-07-17 JP JP4213786A patent/JP3037510B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0640467A (en) | 1994-02-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0300838B2 (en) | Cover tape for sealing the chip-holding parts of a carrier tape | |
| US6027802A (en) | Cover tape for packaging | |
| JPS58125464A (en) | Tape of laminated polyform supporter | |
| CA2192323A1 (en) | Method for Manufacturing Tape Tab Stock that May be Used to Produce Tape Tab Fasteners for Disposable Absorbent Articles | |
| EP0597991B1 (en) | Ultra-thin adhesive tape, roll of composite material for obtaining it and method for providing them | |
| JP3037510B2 (en) | Cover tape for electronic component carrier | |
| US6331335B1 (en) | Self-adhesive wire strap and methods of constructing and utilizing same | |
| JP3004476B2 (en) | Cover tape for electronic component carrier | |
| JPH0640466A (en) | Cover tape for carrier of electronic component | |
| JP2607569Y2 (en) | Composite adhesive label | |
| JPH1121521A (en) | Double-coated pressure-sensitive adhesive tape | |
| JP4478850B2 (en) | Method for producing special tack paper | |
| JP2001098233A (en) | Coating film transfer tape | |
| JPH037318Y2 (en) | ||
| JP2606876Y2 (en) | Cover tape for transporting chip body, rewinding body and electronic component | |
| JPH09258664A (en) | Thermosensitve adhesive type label | |
| JPH069984Y2 (en) | Electronic component carrier | |
| JP2001175181A (en) | Label laminate | |
| JPH069986Y2 (en) | Electronic component carrier | |
| JPH11292141A (en) | Unsealing label of packaging film | |
| JPH0955402A (en) | Carrier tape for semiconductor element | |
| JPS629311Y2 (en) | ||
| JPH0936182A (en) | Semiconductor element carrier tape | |
| JPH0622869Y2 (en) | label | |
| JPH06219467A (en) | Electronic parts carrier tape and production thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120225 Year of fee payment: 12 |
|
| LAPS | Cancellation because of no payment of annual fees |