JPH0640466A - Cover tape for carrier of electronic component - Google Patents

Abstract

PURPOSE:To perform the bonding of a cover tape to the carrier tape main body without making a step by a method wherein a non-adhesion part by the application of a powder material is provided at a part which corresponds to a component storage recessed part being provided on a carrier tape main body, on one surface of a cover tape on which a heat-sensitive adhesive layer is provided. CONSTITUTION:A cover tape for which a pressure-sensitive adhesive layer 4 is provided on one surface of a support base 3 is put on the top and bonded to a carrier tape main body, on which electronic component storage recessed parts are provided in the longitudinal direction with even intervals, to close the recessed parts after the electronic components are contained. For such a carrier tape, a non-adhesion part by the application of a powder material is provided at an intermediate part of the width, which faces the component storage recessed part of the carrier tape main body, on the pressure-sensitive adhesive layer 4 of the cover tape. Hence, even when a step is made between the surface of the non-adhesion part and the surface of the pressure-sensitive adhesive layer, the step can be eliminated by the adhering pressure when the cover tape is put on the top and bonded to the carrier tape main body. Also, the electronic component is prevented from transferring to the cover tape side by the application of the powder material.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cover tape for an electronic component carrier tape used when an electronic component such as an IC is conveyed to a mounting machine.

[0002]

2. Description of the Related Art When an electronic component such as an IC is mounted on a circuit board, a tape carrier system is usually used to convey the electronic component to a mounting machine. That is, a carrier tape main body having electronic component accommodating recesses provided at regular intervals and a feed hole formed in one side is made to travel, and electronic components are accommodated in the electronic component accommodating recesses of the traveling carrier tape main body. , Further, cover
The cover tape is unwound, and the cover tape is overlaid and adhered to the running carrier tape main body to form an electronic component carrying carrier tape, and the electronic component carrying carrier tape is once wound on a reel. The carrier tape for supporting electronic parts is rotated from this reel, and is pulled out while the pin of the feed roll and the feed hole of the carrier tape are engaged by the feed roll, and the carrier tape for carrying electronic components is drawn out. A method is used in which the electronic component mounting machine is carried in, the cover tape is peeled off, the electronic components are taken out, and then mounted on the circuit board one after another. It is known that the above-mentioned cover tape uses a hot-melt type adhesive as an adhesive and uses a pressure-sensitive adhesive.

Among these cover tapes, the hot-melt type one requires a heating process for stacking and adhering it to the carrier tape body, so that the tape running speed when accommodating electronic parts is too high. It is not possible, and it is disadvantageous for speeding up.
In addition, the adhesive force is easily affected by subtle variations in heating (for example, changes in ambient temperature), the peeling force is not constant, and the removal of the electronic component may be hindered.

On the other hand, in the pressure-sensitive adhesive type cover tape, the disadvantages of the hot melt type can be eliminated. However, the electronic component housed in the concave portion of the carrier tape comes into contact with the pressure-sensitive adhesive of the cover tape portion facing the concave space, and the electronic component is transferred to the cover tape side. This may hinder the removal of electronic components.

In order to eliminate such problems, a non-adhesive film is formed on the surface of the pressure-sensitive adhesive layer in the middle portion of the width of the pressure-sensitive adhesive type cover tape which faces the recess for receiving electronic parts. It is known to adhere or apply a photo-curable material to the surface of the pressure-sensitive adhesive layer in the middle portion of the width, and irradiate it with light to provide a non-adhesive layer (Japanese Patent Laid-Open No. 64-37364).
issue).

[0006]

However, since the non-adhesive layer is provided by sticking or coating, a step between the surface of the non-adhesive layer and the surface of the pressure-sensitive adhesive cannot be avoided, and the cover sheet is not covered. The stress is concentrated on the step portion in the adhesive interface between the tape and the carrier tape main body, and peeling of the adhesive interface is likely to occur while the electronic component carrying carrier tape is repeatedly bent and conveyed.

An object of the present invention is to provide an electronic component carrier capable of maintaining good adhesive stability to a carrier tape body despite the presence of a step between the surface of the non-adhesive layer and the surface of the pressure sensitive adhesive. The purpose is to provide a cover tape for use.

[0008]

A cover tape for a carrier of an electronic component according to the present invention is used as a pressure-sensitive adhesive layer on one surface of the carrier tape body having an electronic component accommodating recess. In the cover tape having, the intermediate width portion of the pressure-sensitive adhesive layer facing the recess is made non-tacky by applying a powder material.

[0009]

Even if there is a step between the surface of the non-adhesive portion and the surface of the pressure-sensitive adhesive layer, the non-adhesive portion is formed by applying the powder material, so that the cover tape for the carrier can be formed. The pressure difference (roll pressure) at the time of stacking and adhering to the carrier tape body eliminates the step, and peeling due to stress concentration due to the step can be prevented.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. 1A and 1B are the covers of the present invention.
FIG. 1 shows the usage state of carrier tapes having different tapes, and in the case shown in FIG.
A hole 11 for accommodating electronic parts is provided in a main body (for example, a paper tape) at a predetermined constant interval, and a lower cover tape c ₁ is adhered to the lower surface of the tape to form a hole 11 on top of the housing the electronic components a, the upper cover - Te - Yes by bonding flop c _2, in that shown in the (b) 1, plastic carrier tape - a predetermined constant intervals up body 1 A recess 11 for accommodating an electronic component is formed separately by embossing.
Upon receiving an electronic component a to 1, cover - Te - Yes by bonding flop c _3, these cover - Te - cover of the present invention to flop c _1, c _2, c _3, etc. - Te - flops used To be done.

In addition, in FIGS. 1A and 1B, 2 is a hole for feeding a carrier tape, which is provided at regular intervals in the length direction.

FIG. 2 is a cross sectional view showing a cover tape according to the present invention. In FIG. 2, 3 is a supporting base material, and for example, polyethylene terephthalate or polypropylene is used.

Reference numeral 4 denotes a pressure-sensitive adhesive layer provided on one surface of the supporting base material, which is a usual acrylic type, rubber type, silicone type or the like. For example, polymethylmethacrylate
, A polyacrylic ester / polyacrylic acid copolymer, polyvinyl chloride, polybutadiene, polyisoprene, etc.
Its thickness is usually 1 μm to 100 μm, preferably 5 μm.
It is set as μm to 50 μm.

Reference numeral 5 is a non-adhesive layer provided by coating a powder material on the middle portion of the width of the pressure-sensitive adhesive layer 4, and the width of the concave portion or hole 11 for accommodating electronic parts of the carrier tape body 1 is larger than the width. It has a slightly wider width.

This powder material usually has an average particle size of 50.
Those having a size of μm or less are used. As the material of the powder material, an appropriate material can be used as long as it does not cause any trouble such as soft error in electronic parts. For example, ceramic powder, SiO ₂ , zinc stearate, magnesium oxide powder, etc. Can be used. Also, as the coating method,
Using a method in which a hopper filled with powder is coated on the pressure-sensitive adhesive layer via a weak adhesive roll, a method in which powder is electrostatically coated, or a polymer binder such as polyvinyl alcohol is used. It is possible to use a method such as coating.

[0016]

The cover tape for a carrier of an electronic component of the present invention has the structure as described above, and since the non-adhesive layer portion is provided by coating the powder material, the surface of the non-adhesive portion is not affected. Even if there is a step between the pressure-sensitive adhesive layer surface and the carrier tape body, the step can be eliminated by the adhesive pressure when stacking and adhering the carrier tape body. Even when the tape is conveyed after being bent, the cover tape and the carrier tape main body can be stably held without stress concentration caused by the presence of the step. Of course, transfer of the electronic component to the cover tape side can be prevented due to the non-adhesive portion formed by applying the powder substance.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a different electronic component carrier tape using the carrier cover tape of the present invention.

FIG. 2 is an explanatory diagram showing an example of the present invention.

[Explanation of symbols]

 3 Supporting substrate 4 Pressure-sensitive adhesive layer 5 Non-adhesive part

Claims (1)

[Claims] 1. A cover tape having a pressure-sensitive adhesive layer on one surface, which is used by being laminated and adhered to a carrier tape body having a recess for accommodating electronic parts, wherein the pressure-sensitive adhesive layer has the above-mentioned structure. A cover tape for a carrier of an electronic component, characterized in that an intermediate width portion facing the recess is made non-adhesive by applying a powder material.