JPH06219467A - Electronic parts carrier tape and production thereof - Google Patents

Abstract

PURPOSE:To prevent detachment failure, as a result of adhesion of an electronic part to a cover tape or a bottom tape, when taking out the electronic part in a storage part, by linearly applying adhesives to the tapes, excepting parts corresponding to a tape feed hole and an electronic part storage hole. CONSTITUTION:A bottom tape 11 and a cover tape 15 are insulated films made of plastic or paper, and adhesives 12, 12', 16 and 16' are applied to the tapes, excepting parts corresponding to a tape feed hole 18 and a storage hole 19. The adhesives 12, 12', 16 and 16' are transferred in straight lines in the direction in which a carrier tape advances, for example by a transfer roller 13. The tape feed hole 18 and storage hole 19 are made through a paper tape 17, for example by the use of a die, and the bottom tape 11 to which the adhesives 12 and 12' are applied is stuck to the lower surface of the paper tape. Thereafter an electronic part is put in the hole formed from the storage hole 19 and the bottom tape 11. Then, the cover tape 15 is stuck to the upper surface of the paper tape 17 in which the electronic part is stored.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component carrier for forming an accommodating hole provided intermittently and supplying the electronic component accommodated in the accommodating hole to a predetermined portion of a circuit board for mounting. The present invention relates to a tape and a method for manufacturing the tape.

[0002]

2. Description of the Related Art FIG. 4 is a diagram for explaining a conventional paper carrier tape. FIG. 4A is a sectional view for explaining a state where electronic components are stored in the storage hole of the paper carrier tape, and FIG. 4B is a top view of the same.
4A and 4B, for example, the paper carrier tape 41 is preliminarily provided with a tape feed hole 42 and a storage hole 43 for storing an electronic component by a mold or the like. On the other hand, after the adhesive is applied to the entire upper surface of the bottom tape 46, it is attached to the lower surface of the paper carrier tape 41. Electronic components are stored in a hole formed by a storage hole 43 formed in the paper carrier tape 41 and a bottom tape 46. Then cover tape 4
The adhesive 5 is applied to the entire upper surface of the lower surface thereof, and then adhered to the upper surface of the paper carrier tape 41.

In this manner, the paper carrier tape containing the electronic components is transported to the circuit board mounting site in the wound state. When mounting the electronic component on the circuit board, the electronic component is sucked by, for example, suction tweezers of the mounting device while peeling off the cover tape 45 attached to the upper surface of the paper carrier tape 41, and the electronic component is attached to a predetermined portion of the circuit board. Carried and installed.

FIG. 5 is a diagram for explaining a plastic carrier tape. FIG. 5A is a sectional view for explaining a state where electronic components are stored in the storage hole of the plastic carrier tape. In FIG. 5A, for example, the plastic carrier tape 51 is preliminarily formed with a tape feed hole 52 and a bag-shaped storage hole 53 for storing electronic components by a mold or the like. The plastic carrier tape 51 is covered by attaching a cover tape 55 after the electronic component is stored in the storage hole 53.

[0005]

In recent years, there has been a demand for miniaturization of electronic parts packaged in a carrier tape. For example, the size of the electronic component is 1.0 × 0.5 ×
The one with 0.5 [mm] is becoming the main force. Since the electronic components are miniaturized in this way, the suction nozzle of the mounting device used when mounting on the circuit board can be miniaturized and the suction force can be small. However, when the electronic component stored in the carrier tape is sucked by the suction nozzle, the electronic component 44 may be adhered by the adhesive applied to the cover tape 45 and the bottom tape 46. In particular, in the suction nozzle that is downsized and has a small suction force, the electronic component 4 bonded by an adhesive is used.
An accident occurs in which 4 is missed.

FIG. 5B is a view for explaining a device for preventing accidents due to the adhesive applied to the cover tape. The carrier tape shown in FIG. 5B is described, for example, in Japanese Utility Model Publication No. 62-36766. That is, in the above publication, as shown in FIG. 5B, the plastic tape 51 has a feed hole 52 and a storage portion 53 formed therein. And the cover tape 55
Has an adhesive applied to the lower surface of the electronic component 5
A sheet member serving as a lid is attached to the upper part of a storage unit 53 that stores the four. Therefore, the electronic component 54 is not adhered to the cover tape 55 side when the cover tape 55 is peeled off and taken out from the storage portion 53. However, the device described in the above publication requires not only a sheet member that serves as a lid, but also labor for attaching this sheet member.

The present invention is intended to solve the above problems, and when taking out an electronic component housed in a housing portion, the electronic component is not adhered to a cover tape or a bottom tape and cannot be removed. An object of the present invention is to provide a carrier tape and a manufacturing method thereof. It is another object of the present invention to provide a carrier tape which can use an existing manufacturing apparatus and can reduce the amount of adhesive used, and a manufacturing method thereof.

[0008]

[Means for Solving the Problems]

(First Invention) In order to achieve the above object, the carrier tape of the present invention can be mounted on a circuit board by automatically supplying a packaged electronic component, which comprises a tape feed hole (18) and an electronic component. With a tape (17) having a storage hole (19) for storing a tape, and an adhesive (12, 12 ') linearly formed in a portion other than the tape feed hole (18) and the storage hole (19), A bottom tape (11) adhered to the lower part of the tape (17) and an adhesive (12, 12 ') linearly formed on the part other than the tape feed hole (18) and the storage hole (19). , A cover tape (15) adhered to the top of the tape (17).

(Second Invention) A method of manufacturing a carrier tape according to the present invention comprises a first step of forming a tape feed hole (18) and a housing hole (19) for housing an electronic component in the tape, and a bottom tape (11). ) On a portion of the upper surface of the tape (17) which does not come into contact with the tape feeding hole (18) and the housing hole (19), a linear adhesive (12,
The second step of transferring 12 ', 16, 16') by the transfer roller (13), and the bottom tape (11) on the lower surface of the tape (17) formed with the tape feed hole (18) and the storage hole (19). ) Is attached, a fourth step is to store electronic components in the storage hole (19) of the tape (17), and the tape feed hole (18) and the storage are provided on the lower surface of the cover tape (15). In the part that does not contact the hole (19),
A linear adhesive (1
2, 12 ', 16, 16') is transferred by a transfer roller (13), and a sixth step of attaching the cover tape (15) to the upper surface of the tape (17). Characterize.

(Third Invention) A method of manufacturing a carrier tape according to the present invention comprises a first step of forming a tape feed hole (18) and a housing hole (19) for housing an electronic component in the tape, and a bottom tape (11). ) On a portion of the upper surface of the tape (17) which is not in contact with the tape feed hole (18) and the housing hole (19), a linear adhesive (2
Second step of transferring 1, 21 ', 21 ", 25", 25', 25 ") by a transfer roller (22) consisting of a sprocket, and a tape feed hole (18) and a storage hole (19)
A third step of adhering the bottom tape (11) to the lower surface of the tape (17) having been molded, a fourth step of accommodating electronic parts in the accommodating hole (19) of the tape, and a cover tape (15) A linear adhesive (21, 21 ′, 2
1 ″, 25, 25 ′, 25 ″) is transferred by a transfer roller (22) made of a sprocket, and a sixth step of attaching the cover tape (15) to the upper surface of the tape (17). It is characterized by consisting of.

(Fourth Invention) In the method of manufacturing a carrier tape according to the present invention, the first step is to apply the adhesives (34, 34 ') on the upper and lower surfaces of the tape (31) except for the tape feed holes (32). And a second step of forming a tape feed hole (32) and a storage hole (33, 33′33 ″) for storing an electronic component in the tape (31) coated with the adhesive (34, 34 ′). , Tape feed hole (32) and storage hole (3
3, 33'33 ″) is formed on the lower surface of the tape (31), the third step of attaching the bottom tape (15), and the storage holes (33, 33′33 ″) of the tape (31). It is characterized by comprising a fourth step of housing the electronic component and a fifth step of attaching the cover tape (36) to the upper surface of the tape (31).

[0012]

[Operation] In the present invention, attention was paid to the fact that the tape width had a margin due to the tensile strength of the carrier tape with respect to the miniaturization of electronic components. That is, since the carrier tape tends to have a high tape feeding speed, it is necessary for the carrier tape to have such a width that the tensile strength of the carrier tape can be maintained even in a downsized electronic component. Therefore, with the miniaturization of electronic components,
It was discovered that the carrier tape has a space in the area other than the area where the feed hole and the storage hole for the electronic component are formed, and the adhesive is applied to the area corresponding to this area, which causes problems in the conventional example. I solved the point.

(First Invention) In the bottom tape, for example, the adhesive is linearly applied in the traveling direction or in the direction perpendicular to the traveling direction and in the portions other than the tape feed hole and the storage hole. Similarly, in the cover tape, for example, the adhesive is linearly applied in the traveling direction or in the direction perpendicular to the traveling direction, and in the portions other than the tape feed hole and the storage hole. For this reason, the adhesive is not applied to the bottom tape and the cover tape above and below the storage portion in which the electronic components are stored. Therefore, when the electronic component is taken out from the storage portion, the electronic component is not damaged even by the suction nozzle having a small suction force.

(Second Invention) On the upper surface of the bottom tape and the lower surface of the cover tape, a linear adhesive is formed by the transfer roller at a portion which does not come into contact with the tape feed hole and the accommodating hole and along the tape traveling direction. Transcribed. As the transfer roller, those used for applying electrodes and the like when manufacturing a tubular capacitor or a hybrid integrated circuit device can be used. Therefore, according to the manufacturing method of the present invention, the existing manufacturing apparatus can be used, and since the adhesive is not applied to the entire surfaces of the bottom tape and the cover tape, the amount of the adhesive can be saved.

(Third Invention) On the upper surface of the bottom tape and the lower surface of the cover tape, a linear adhesive is transferred by a sprocket at a portion which does not come into contact with the tape feed hole and the housing hole, and at a right angle to the tape traveling direction. To be done. The sprocket is an intermittent transfer so that the adhesive is not applied to the portions corresponding to the tape feed hole and the storage hole,
What is used to apply electrodes and the like when manufacturing a hybrid integrated circuit device can be used. Therefore, according to the manufacturing method of the present invention, the existing manufacturing apparatus can be used, and since the adhesive is not applied to the entire surfaces of the bottom tape and the cover tape, the amount of the adhesive can be saved.

(Fourth Invention) An adhesive is applied to the upper and lower surfaces of the tape except for the tape feed holes. Then, the tape storage hole is formed by, for example, a press. Then, the electronic component is inserted into the storage hole of the tape formed by attaching the bottom tape to which the adhesive is not applied to the lower surface of the tape, and then attaching the cover tape. Therefore,
Since the bottom tape and the cover tape are not coated with the adhesive, when the electronic component inserted into the storage hole is taken out by the suction nozzle, the adhesive does not damage the electronic component.

[0017]

EXAMPLE FIG. 1 is an example of the present invention and is a diagram for explaining a method of applying an adhesive agent to a bottom tape and a cover tape along a traveling direction of a carrier tape. (A) shows a cross-sectional view when the adhesive is applied.
(B) is a top view showing a state in which an adhesive is applied.
(C) is an explanatory view for attaching a bottom tape and a cover tape to a paper tape to produce a carrier tape. In FIG. 1, the bottom tape 11 and the cover tape 15 are insulating films made of plastic or paper. For example, adhesives 12, 12 ', 16 and 16' are provided on portions other than a tape feed hole 18 and a storage hole 19 which will be described later. Is applied.

Bottom tape 11 and cover tape 15
The adhesive 12, 12 ′, 16, 16 ′ formed on the tape is, for example, of a thermoplastic polyolefin type, and is formed by a transfer roller 13 that forms an electrode when manufacturing a tubular capacitor or a hybrid integrated circuit device, for example, by a tape. It is linearly transferred at a portion other than the feed hole 18 and the storage hole 19 and along the traveling direction of the carrier tape. Transfer roller 13
Transfers the adhesives 12, 12 ', 16, 16' onto the bottom tape 11 and the cover tape 15 while rolling the two-wheeled vehicle coupled by the rotating shaft 14, for example.

The paper tape 17 made of a mount forming a tape feed hole 18 for feeding a tape and a housing hole 19 for housing an electronic component (not shown) has a width of 8 mm and a thickness of 0.6 mm, for example. Then, in the paper tape 17, the tape feed hole 18 and the storage hole 1 are formed by, for example, a mold.
9 is drilled. On the lower surface of the paper tape 17, the bottom tape 11 in which the adhesives 12 and 12 'are linearly formed is attached. After that, the electronic component is stored in the hole formed by the storage hole 19 and the bottom tape 11. The cover tape 15 is attached to the upper surface of the paper tape 17 containing the electronic components.

The carrier tape thus manufactured is wound and conveyed to the site where electronic components are mounted.
The mounting device removes the cover tape 15 of the carrier tape and sucks the electronic component housed in the housing hole 19 by a suction nozzle (not shown) to carry it to a predetermined position on the circuit board.

FIG. 2 is a view for explaining a method of applying an adhesive to the bottom tape and the cover tape at right angles to the traveling direction of the carrier tape in another embodiment of the present invention. (A) is a cross-sectional view of the bottom tape coated with the adhesive, which is cut at a right angle to the traveling direction.
(B) is a cross-sectional view showing a state in which an adhesive is applied.
(C) is an explanatory view for attaching a bottom tape and a cover tape to a paper tape to produce a carrier tape. In FIG. 2, the bottom tape 11 and the cover tape 15 are insulating films made of plastic. For example, adhesives 21, 21 ′, 21 ″, 25, 25 ′ are provided on portions other than the tape feed hole 18 and the storage hole 19 described later. ,
25 ″ is applied.

Bottom tape 11 and cover tape 15
Adhesives 21, 21 ', 21 ", 25, 2 formed on
Reference numerals 5'and 25 "are, for example, of a thermoplastic polyolefin type, and are provided at a portion other than the tape feed hole 18 and the storage hole 19 by a transfer roller 22 formed of a sprocket that forms an electrode when manufacturing a hybrid integrated circuit device. In addition, the transfer roller 22 made of a sprocket has, for example, intermittently formed transfer portions 23, 23 ', 23 ", and the adhesive 21 applied to this portion is transferred at right angles to the traveling direction of the carrier tape. , 21 ', 21 ", 25, 2
5'and 25 "are bottom tape 11 and cover tape 1
Transfer to 5.

The paper tape 17 is provided with a tape feed hole 18 and a storage hole 19 by using, for example, a mold.
On the lower surface of the paper tape 17, as shown in FIG.
The bottom tape 11 on which the adhesives 21, 21 ', and 21 "are linearly formed is adhered. Thereafter, the electronic component is stored in the hole formed by the storage hole 19 and the bottom tape 11. , A paper tape containing electronic components 1
The cover tape 15 is attached to the upper surface of the cover 7.

The carrier tape thus manufactured is wound and conveyed to the site where electronic parts are mounted. The mounting device removes the cover tape 15 of the carrier tape and sucks the electronic component housed in the housing hole 19 by a suction nozzle (not shown) to carry it to a predetermined position on the circuit board.

FIG. 3 is a view for explaining a method of applying an adhesive to a carrier tape according to still another embodiment of the present invention. (A) shows a top view of the paper tape to which the adhesive is applied. (B) is a cross-sectional view of a paper tape to which an adhesive is applied. (C) is an explanatory view for attaching a bottom tape and a cover tape to a paper tape to produce a carrier tape. In FIG. 3, the paper tape 31 is provided with a tape feed hole 32 and storage holes 33, 33 ′, 33 ″ for storing electronic components, which is the same as the embodiment shown in FIGS. 1 and 2. And FIG.
The difference from the embodiment shown in FIG. 2 is that the adhesive 34, 34 'is applied to the paper tape 31 side. That is, the tape feed holes 32 are formed on the upper and lower surfaces of the paper tape 31.
Adhesives 34 and 34 'are applied to the portions excluding.

The paper tape 31 having the adhesives 34 and 34 'applied to the upper and lower surfaces is a tape feeding hole 32 and storage holes 33, 33' and 3 by a mold (not shown).
3 ″ is formed on the lower surface of the paper tape 31.
As shown in (c), the bottom tape 35 is attached.
After that, the electronic components are stored in the holes formed by the storage holes 33, 33 ′ and 33 ″ and the bottom tape 11.
The cover tape 36 is attached to the upper surface of the paper tape 31 containing the electronic components. After that, Figure 1
And the same processing as in FIG. 2 is performed.

For example, 10000 adsorption tests were carried out on the carrier tape shown in FIG. 3 and the carrier tape obtained by applying an adhesive to the entire surface of the bottom tape and the cover tape in the conventional example. As a result, the adsorption rate was 99.99% in the carrier tape shown in FIG. 3, whereas it was 99.99% in the conventional carrier. Therefore, in the carrier tape of the present embodiment, even if the electronic component is stored in the storage hole, the adhesive is not applied to the bottom portion and the upper portion of the storage hole, and therefore the electronic component is missed when the electronic component is taken out by the suction nozzle. Rarely.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments. And
Various design changes can be made without departing from the present invention described in the claims. For example, although the present embodiment has been described using the paper tape, the same applies to the case where the through hole is formed in the plastic tape or the storage hole is formed by embossing. In addition to the polyolefin, the adhesive is not particularly limited as long as it is a well-known adhesive such as polyacrylic or polyurethane. Further, the "adhesive" in the present invention and the examples includes not only the term "adhesive" but also a pressure-sensitive adhesive having adhesiveness when heat is applied. Further, the shape when applying the storage hole adhesive for storing the electronic component can be slightly modified without changing the gist of the present invention.

[0029]

According to the present invention, since the adhesive is not applied to the cover tape on the upper part of the housing hole for housing the electronic parts and the bottom tape on the lower part, the electronic parts are downsized and the suction force of the suction nozzle is reduced. Even if it decreases, there is little loss in taking out electronic parts. According to the present invention, the application of the adhesive to the cover tape, the bottom tape, and the like can be performed inexpensively and accurately because the device used for forming the electrodes and the like of the electronic component can be used as it is.

[Brief description of drawings]

FIG. 1 is a diagram for explaining a method of applying an adhesive to a bottom tape and a cover tape along a traveling direction of a carrier tape in an embodiment of the present invention. (I)
Shows a cross-sectional view when the adhesive is applied. (B) is a top view showing a state in which an adhesive is applied. (C) is an explanatory view for attaching a bottom tape and a cover tape to a paper tape to produce a carrier tape.

FIG. 2 is a view for explaining a method of applying an adhesive to a bottom tape and a cover tape at a right angle to a traveling direction of a carrier tape in another embodiment of the present invention.
(A) is a cross-sectional view of the bottom tape coated with the adhesive, which is cut at a right angle to the traveling direction. (B) is a cross-sectional view showing a state in which an adhesive is applied. (C) is an explanatory view for attaching a bottom tape and a cover tape to a paper tape to produce a carrier tape.

FIG. 3 is a view for explaining a method of applying an adhesive to a carrier tape according to still another embodiment of the present invention. (A) shows a top view of the paper tape to which the adhesive is applied. (B) is a cross-sectional view of a paper tape to which an adhesive is applied. (C) is an explanatory view for attaching a bottom tape and a cover tape to a paper tape to produce a carrier tape.

FIG. 4 is a diagram for explaining a paper carrier tape in a conventional example. FIG. 4A is a sectional view for explaining a state where electronic components are stored in the storage hole of the paper carrier tape, and FIG. 4B is a top view of the same.

FIG. 5 is a diagram for explaining a plastic carrier tape. FIG. 5A is a sectional view for explaining a state where electronic components are stored in the storage hole of the plastic carrier tape.

[Explanation of symbols]

11, 35 ... Bottom tape 12, 12 '... Adhesive agent 13 ... Transfer roller 14 ... Rotating shaft 15, 36 ... Cover tape 16, 16', 21, 21 ', 21 ", 25, 25 ',
25 ", 34, 34 '... Adhesive agent 17, 31 ... Paper tape 18, 32 ... Tape feeding hole 19, 33, 33', 33" ... Storage hole 22 ... Transfer roller 23, 23 ', 23 "... Transferring section

Claims (4)

[Claims] 1. A carrier tape for electronic parts, which can be mounted on a circuit board by automatically supplying packaged electronic parts, comprising a tape having a tape feed hole and a housing hole for housing the electronic component, and the tape feed hole and A bottom tape adhered to the lower portion of the tape by an adhesive linearly formed in a portion other than the storage hole, and an adhesive linearly formed in a portion other than the tape feed hole and the storage hole, A carrier tape for electronic parts, comprising a cover tape adhered to the top of the tape, and a cover tape. 2. A first step of forming a tape feed hole and a housing hole for housing an electronic component in the tape; and a tape advancing to a portion of the upper surface of the bottom tape which does not come into contact with the tape feed hole and the housing hole. A second step of transferring a linear adhesive along the direction by a transfer roller, a third step of attaching the bottom tape to the lower surface of the tape having a tape feed hole and a housing hole formed therein, and a housing of the tape A fourth step of housing the electronic component in the hole, and transferring a linear adhesive along the moving direction of the tape to a portion of the lower surface of the cover tape which does not contact the tape feed hole and the housing hole by a transfer roller. A method of manufacturing a carrier tape for electronic parts, comprising: a fifth step; and a sixth step of attaching the cover tape to the upper surface of the tape. 3. A first step of forming a tape feeding hole and a housing hole for housing an electronic component in the tape; and a tape advancing to a portion of the upper surface of the bottom tape which is not in contact with the tape feeding hole and the housing hole. A second step of transferring a linear adhesive in a direction perpendicular to the direction by a transfer roller composed of a sprocket, and a third step of attaching the bottom tape to the lower surface of the tape having the tape feed hole and the storage hole formed therein, A fourth step of accommodating the electronic component in the accommodating hole of the tape, and a linear adhesive in a direction perpendicular to the tape advancing direction on a portion of the lower surface of the cover tape which is not in contact with the tape feeding hole and the accommodating hole. A carrier tape for electronic parts, comprising: a fifth step of transferring with a transfer roller composed of a sprocket; and a sixth step of attaching the cover tape to the upper surface of the tape. Manufacturing method. 4. A first step of applying an adhesive on the upper and lower surfaces of the tape except for a tape feed hole portion, and forming a tape feed hole and a housing hole for housing an electronic component in the adhesive-coated tape. A third step of attaching the bottom tape to the lower surface of the tape having the tape feed hole and the storage hole formed therein, a fourth step of storing an electronic component in the storage hole of the tape, and the tape A fifth step of adhering the cover tape to the upper surface of, and a method of manufacturing a carrier tape for electronic parts, comprising: