JP2856887B2 - Method and apparatus for crimping conductive adhesive film - Google Patents

Description

The present invention relates to a crimping method and a device for crimping a conductive adhesive film on a long flexible circuit board on which electronic components are mounted.

(Prior Art) As a manufacturing process of an electronic circuit device, a process of crimping a conductive adhesive film used for connection with an external device or an external circuit on a circuit pattern of a flexible circuit board on which electronic components such as an integrated circuit are attached. There is.

Here, the flexible circuit board is formed in a long shape in order to make the operation in the manufacturing process continuous, and in pressing the conductive adhesive film, JP-A-1-175747 and JP-A-1-175748 are used. As shown in the publication, a conductive adhesive film laminated with a protective film is formed in a long shape. Then, the conductive adhesive film is fed together with the flexible circuit board and supplied to a predetermined position on the flexible circuit board, and the pressure bonding head is operated to press the conductive adhesive film on the flexible circuit board. To separate the conductive adhesive film from the protective film, and only the conductive adhesive film is stuck on the flexible circuit board.

In this case, since the conductive adhesive film must be fed in accordance with the pressure bonding position on the flexible circuit board, the feeding position of the conductive adhesive film is limited for each flexible circuit board. That is, since it is used as a dedicated machine, it is not possible to supply a wide variety of flexible circuit boards. In addition, since the protective film that is in a laminated relationship with the conductive adhesive film is separated at the time of press bonding, the flexible circuit board on which the conductive adhesive film has been pressed is supplied to the next press unit, for example, or when the press unit is used. Occasionally, dust, cutting powder, or the like adheres to the surface of the conductive adhesive film, causing poor connection when subsequently connecting to an external device or an external circuit.

(Problems to be Solved by the Invention) As described above, in the conventional crimping method, it is difficult to supply various kinds of flexible circuit boards, and dust and connection powder adhere to the surface of the conductive adhesive film after the crimping. There is a problem that.

The present invention has been made in view of the above problems, and can easily perform pressure bonding of a conductive adhesive film to a plurality of types of flexible circuit boards. It is an object of the present invention to provide a method and a device for crimping a conductive adhesive film that can protect the film from adhesion.

[Configuration of the invention]

(Means for Solving the Problems) According to a method for crimping a conductive adhesive film according to claim 1, the method for crimping a conductive adhesive film on a long flexible circuit board to which an electronic component is attached is a method for crimping a conductive adhesive film. A sprocket capable of feeding at least two different types of flexible circuit boards is used. The sprocket sequentially intermittently feeds the flexible circuit boards in the length direction at intervals of mounting the electronic components, and is wound around a reel to laminate a protective film. One end of the conductive adhesive film is sandwiched, and the conductive adhesive film is drawn out in the length direction. The drawn conductive adhesive film has a predetermined length corresponding to the flexible circuit board. The conductive adhesive film is cut and held in a predetermined direction and at an angle, and the conductive adhesive film is moved to a predetermined position on the flexible circuit board. The conductive adhesive film is attached at a predetermined angle, and is pressed and pressed against the conductive adhesive film attached on the flexible circuit board.

According to a second aspect of the present invention, there is provided a crimping apparatus for crimping a conductive adhesive film on a long flexible circuit board to which electronic components are attached, wherein at least two types of flexible circuit boards having different widths are used. It has a feedable sprocket, and a feed mechanism for intermittently feeding the flexible circuit board in the length direction at intervals of mounting the electronic components by the sprocket, and a protective film wound around a reel are formed by lamination. Sandwich one end of the conductive adhesive film,
A draw-out chuck that pulls out the conductive adhesive film in the length direction thereof and a cutter that cuts the conductive adhesive film drawn out by the draw-out chuck, and the cutter forms a conductive adhesive film corresponding to the flexible circuit board. A conductive adhesive film supply mechanism for cutting the conductive adhesive film cut by a predetermined length, and a holding chuck for suction-holding the conductive adhesive film cut by the conductive adhesive film supply mechanism; and holding the holding chuck in a predetermined direction and at a predetermined angle. Moving and attaching a cut conductive adhesive film to a predetermined position on the flexible circuit board at a predetermined angle, and a pressure bonding mechanism for pressing and pressing the conductive adhesive film bonded on the flexible circuit board. It is provided.

(Function) In the present invention, a plurality of types of flexible circuit boards having different widths are respectively fed by a sprocket, the conductive adhesive film is cut into a predetermined length, and affixed to a predetermined position of the flexible circuit board at a predetermined angle. This makes it possible to cope with the manufacture of various types of electronic circuit devices having different sizes, component arrangements, or affixed states of the conductive adhesive film, and a state in which the conductive adhesive film is laminated with the protective film. , Which prevents dust and dirt from adhering to the conductive adhesive film.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 shows an apparatus for attaching a conductive adhesive film 12 cut into a predetermined size to a flexible circuit board 11 at a predetermined angle at a predetermined position.

This flexible circuit board 11 is made of a polyimide resin having a thickness of about 100 μm, and as shown in FIG.
It is formed in a long shape, and perforations 13 are formed on both sides. And the flexible circuit board 11
Electronic components 14 such as integrated circuits and wiring patterns 14a
Is attached in the previous process. Further, near the electronic components 14, reference holes 15 indicating a predetermined positional relationship with respect to the electronic components 14 are provided.

In addition, these electronic components 14 have been inspected in the previous process, and the electronic components 14 themselves and the wiring pattern have been inspected.
If 14a is defective, a defective display hole 16 is formed at a predetermined position on the flexible circuit board 11.

The flexible circuit board 11 having such a configuration is wound around a supply reel 19 provided on the left side of the main body base 18 shown in FIG. 1 together with a protective film 11a for protecting electronic components.

As shown in FIG. 2, the conductive adhesive film 12 is cut into a strip shape, and is stuck on the wiring pattern 14a at a predetermined position on the flexible circuit board 11 at a predetermined angle. In this case, a thermoplastic resin having conductivity only in the thickness direction is formed in a long shape. Then, as shown in FIG. 3, the conductive adhesive film 12 has a protective film
As shown in FIG. 1, the protective film 12b is wound around a supply reel 20 located substantially at the center of the main body base 18.

Next, the feeding mechanism 21 of the flexible circuit board 11 will be described.

This feeding mechanism 21 attaches the protective film 11a to the supply reel 20.
The intermittently feeding the wound flexible circuit board 11 to a position A for crimping with the conductive adhesive film 12 includes an idler 22, a tension roller 23, a guide roller 24, and a sprocket 25. Then, by driving the rotation shaft 19a of the supply reel 19, the flexible circuit board 11 sent out from the supply reel 19 is separated from the protective film 11a, and is then fed by the tension roller 23 while maintaining a predetermined tension.

Further, the sprocket 25 meshes with the perforations 13 provided on both sides of the flexible circuit board 11, and adjusts the feed amount to the pitch of the reference hole 15, that is, the electronic component 14.
Restrict the installation interval. Also, this sprocket 25
As shown in FIG. 4, a stepped structure in which feed dogs 25a and 25b having different outer diameters are provided at positions having different width dimensions so that a plurality of types of flexible circuit boards 11 having different width dimensions can be fed. I do.

Further, the tension roller 23 absorbs tension and slack based on a difference between a supply speed and a winding speed generated in a feeding process of the flexible circuit board 11, and is attached to a tip of an arm having a middle portion as a fulcrum. A predetermined tension is generated on the flexible circuit board 11 stretched around the tension roller 23 by a counter weight or the like provided at the other end. This configuration is the same for the other tension rollers.

Then, the protective film 11a separated in the process of feeding the flexible circuit board 11 is wound on a take-up reel 29 via an idler 26, a tension roller 27 and an idler 28.

Next, the conductive adhesive film supply mechanism 31 for the conductive adhesive film 12 will be described.

The conductive adhesive film supply mechanism 31 feeds the conductive adhesive film 12 wound around the supply reel 20 to the cutting position B, and at this cutting position B, transfers the conductive adhesive film 12 to the flexible circuit board 11. And a pull-out chuck 32 that holds one end of the flexible circuit board 11 and pulls out the lengthwise direction.
The cutter 33 has a cutter 33 for cutting the conductive adhesive film 12 drawn out by the method.

First, the supply reel 20 is provided with a frame 34 erected on the main body base 18 above the crimping position A. Then, by driving the rotating shaft 20a of the supply reel 20, the protective film 12a and the protective film 12b are sent out together with the conductive adhesive film 12 laminated therebetween, and the idler 35, a tension roller The paper is fed between a pair of guide rollers 38 via an idler 37. After the conductive adhesive film 12 laminated with the protective film 12a and the protective film 12b passes through the pair of guide rollers 38, only the protective film 12b is separated from the conductive adhesive film 12.

Thereafter, the conductive adhesive film 12 reaches the cutting position B via the guide roller 39 and the clamp 40 together with the protective film 12a, and the leading end is held by the extraction chuck 32.

The draw-out chuck 32 is attached to the left end of the moving base 41 in the figure, and the right end of the moving base 41 is screwed with a ball screw. The ball screw 42 has a pulse motor 43 mounted on the frame 34.
The rotation base is driven by the
32 is moved in the horizontal direction in the figure.

The cutter 33 cuts the conductive adhesive film 12 drawn out to a predetermined length by the draw-out chuck 32, and is opened and closed by an actuator (not shown).

The protective film 12b separated from the conductive adhesive film 12 at the pair of guide rollers 38 passes through an idler 45 and a tension roller 46, and then is taken up by a take-up reel 47.

 Next, the attaching mechanism 49 of the conductive adhesive film 12 will be described.

The sticking mechanism 49 has a holding chuck 50 that sucks and holds the cut conductive adhesive film 12 that is integral with the protective film 12a being laminated, and moves the holding chuck 50 in a predetermined direction and angle. Then, the cut conductive adhesive film 12 is attached to a predetermined position on the flexible circuit board 11 at a predetermined angle.

The holding chuck 50 is a rotary actuator.
51, and is configured to be able to turn 90 ° along the plane direction. The holding chuck 50 is configured to be vertically movable by a cylinder (not shown) and to be movable in an arbitrary direction along a plane by an XY table (not shown).

 Next, the pressure bonding mechanism 53 will be described.

The crimping mechanism 53 has a heater block 54, and the heater block 54 presses and bonds the conductive adhesive film 12 stuck on the flexible circuit board 11 by the sticking mechanism 49. This crimping operation is performed on the crimping table 56 provided at the crimping position A.

Further, the heater block 54 has a rotary actuator 55 and is configured to be able to turn 90 ° in a plane direction. The heater block 54 can be moved vertically by a cylinder (not shown), and can be moved in any direction along the plane by an XY table (not shown).

Note that the conductive adhesive film 12 is crimped at the crimping position A, and the flexible circuit board sent out by the sprocket 25.
11, is supplied to the next unit, for example, a press unit 60, via a tension roller 58 and a guide roller 59, as shown in FIG.

Further, a detection device 62 for detecting a feeding position of the flexible circuit board 11 is provided at a position on the left side of the crimping position A. As shown in FIG. 3, the detection device 62 has two sensors 63 and 64. Of these sensors, the sensor 63 checks the presence or absence of the defect display hole 16 shown in FIG. That is, when the defective display hole 16 is detected,
A signal is output so that the subsequent conductive adhesive film 12 is not attached to the wiring pattern 14a. The sensor 64 detects the reference hole 15 and determines the feeding position of the flexible circuit board 11. The detection positions of these sensors 63 and 64 are
This is a position one electronic component before the position where the conductive adhesive film 12 is attached to the flexible circuit board 11.

Then, each of the above-described mechanisms is operated, and the conductive adhesive film 12 cut into a strip shape is provided at a predetermined portion of the flexible circuit board 11.
A microprocessor or the like (not shown) may be used as a control device for controlling the attachment of the information.

 Next, the operation of the above embodiment will be described.

First, a control device (not shown) operates the supply reel 19 and the sprocket 25 shown in FIG. 1 to feed the flexible circuit board 11. This operation is based on the detection signal from the sensor 64, the electronic component 14 to be crimped,
Stop control is performed when it is determined that the predetermined crimping position has been reached.

On the other hand, after the conductive adhesive film 12 is separated from the protective film 12b at the pair of guide rollers 38, the distal end portion is held by the extraction chuck 32 in a state of being laminated on the protective film 12a. In this state, the pulse motor 43 is operated, and the ball screw 42 and the moving base 41 screwed therewith are operated.
The extraction chuck 32 is moved to the right through the, and the conductive adhesive film 12 is drawn out together with the protective film 12a by a predetermined length. Thereafter, the conductive adhesive film 12 on which the protective film 12a is integrally laminated is held by the clamp 40, and the holding chuck 50 is lowered by one step to suck and hold the conductive adhesive film 12, and the cutter 33 is operated. Then, the conductive adhesive film 12 is cut into a predetermined length corresponding to the drawing length.

Here, the drawn-out length of the conductive adhesive film 12, that is, the length of the conductive adhesive film 12 after cutting, depends on the type of the flexible circuit board 11 to which the conductive adhesive film 12 is attached, Is set in advance.

After the cutting operation, the holding chuck 50 holding the cut conductive adhesive film 12 is moved to a predetermined bonding position on the flexible circuit board 11 by an XY table (not shown).

Here, depending on the type of the flexible circuit board 11, the sticking direction of the conductive adhesive film 12 is parallel to the feeding direction of the flexible circuit board 11 as shown in FIG. Since there is a case where the angle is perpendicular to the feeding direction as shown in b), the rotary actuator 51 is operated according to the type and the sticking angle is determined.

Thereafter, if there is no component failure based on the detection result of the sensor 63, the holding chuck 50 is further lowered, and the conductive adhesive film is
12 is pasted on the flexible circuit board 11. The holding chuck 50 rises after the attachment and returns to the origin.

Next, the pressure bonding mechanism 53 is operated, and the heater block 54 is moved to X
By using the −Y table, the conductive adhesive film 12 is moved onto the conductive adhesive film 12 attached on the flexible circuit board 11, and the conductive adhesive film 12 is pressed against the flexible circuit board 11 on the crimping stand 56. The heater block 54 is heated to 100 to 150 ° C., and the conductive adhesive film 12 made of a thermoplastic resin is securely mounted on the flexible circuit board 11.

These operations are repeated while advancing the position of the electronic component 14 one by one, and a conductive adhesive film is applied to all the electronic components 14.
It ends when the crimping of 12 is completed.

Here, the feed mechanism 21 of the flexible circuit board 11 has a stepped structure as shown in FIG. 4 so that a plurality of types of flexible circuit boards having different width dimensions can be used without replacing the sprocket. 11 can be fed, and it can easily cope with multi-product feeding. Also, the conductive adhesive film supply mechanism 31 of the conductive adhesive film 12 can determine the cutting length of the conductive adhesive film 12 corresponding to the type of the flexible circuit board 11, and the attaching mechanism 49 can also determine the cut conductive material. Since the adhesive film 12 can be stuck to a predetermined position of the flexible circuit board 11 at a predetermined angle, it is possible to easily cope with various types from these points.

Also, based on the detection result of the sensor 64, the bonding and pressing operation is performed only when the electronic component 14 and the wiring pattern 14a are normal, so that the conductive adhesive film 12 can be used effectively, and the efficiency of the bonding and pressing operation is improved. Further, the conductive adhesive film 12
While the protective film 12a is laminated, the flexible circuit board 11
Since it is attached and crimped on the top, it is possible to prevent dust and dust from adhering to the conductive adhesive film 12, and to obtain a stable connection state.

〔The invention's effect〕

According to the present invention, a plurality of types of flexible circuit boards having different width dimensions can be respectively fed by a sprocket, the conductive adhesive film is cut into a predetermined length, and a predetermined angle of Since it can be attached, it can be used for the manufacture of various types of electronic circuit devices with different sizes, component arrangements, and different states of application of the conductive adhesive film, so it is easy to crimp the conductive adhesive film to multiple types of flexible circuit boards. In addition, since the conductive adhesive film is pressure-bonded while being laminated with the protective film, the surface of the conductive adhesive film can be protected from the adhesion of dust and connection powder even after pressure bonding.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of a device for crimping a conductive adhesive film according to the present invention, and FIGS. 2 (a) and 2 (b) are plan views each showing a configuration example of a flexible circuit board to be crimped in the present invention. FIG. 3 is an enlarged partial front view showing a main part of the apparatus shown in FIG. 1, and FIG. 4 is an external view showing a configuration example of a sprocket used in the present invention. 11 ... Flexible circuit board, 12 ... Conductive adhesive film, 14
... electronic parts, 21 ... feeding mechanism, 25 ... sprocket,
31: Conductive adhesive film supply mechanism, 32: Pull-out chuck, 33
…… Cutter, 49 …… Affixing mechanism, 50 …… Holding chuck, 53
…… Crimping mechanism.

Claims (2)

(57) [Claims] In a crimping method for crimping a conductive adhesive film on a long flexible circuit board to which electronic components are attached, a sprocket capable of feeding at least two kinds of flexible circuit boards having different width dimensions is used. The flexible circuit board is sequentially intermittently fed by a sprocket in the length direction at intervals of mounting the electronic components, and one end of a conductive adhesive film wound around a reel and laminated with a protective film is sandwiched. Pull out the conductive adhesive film in the length direction, cut the conductive adhesive film to a predetermined length corresponding to the flexible circuit board, and hold the cut conductive adhesive film to a predetermined length. Moving in a direction and at an angle, sticking the conductive adhesive film at a predetermined position on the flexible circuit board at a predetermined angle, and sticking on the flexible circuit board A method for crimping a conductive adhesive film, comprising pressing and pressing the obtained conductive adhesive film. 2. A crimping apparatus for crimping a conductive adhesive film on a long flexible circuit board to which an electronic component is attached, comprising a sprocket capable of feeding at least two types of flexible circuit boards having different width dimensions. A feed mechanism for intermittently feeding the flexible circuit board in the length direction at intervals of mounting the electronic components by the sprocket, and one end of a conductive adhesive film on which a protective film wound around a reel is formed. A drawer chuck for pulling out the conductive adhesive film in the longitudinal direction thereof, and a cutter for cutting the conductive adhesive film drawn by the drawer chuck. The cutter has a conductive adhesive film corresponding to the flexible circuit board. A conductive adhesive film supply mechanism that cuts the conductive adhesive film into a predetermined length, and adsorbs and holds the conductive adhesive film cut by the conductive adhesive film supply mechanism. A holding mechanism for moving the holding chuck in a predetermined direction and at an angle, and bonding the cut conductive adhesive film to a predetermined position on the flexible circuit board at a predetermined angle; and And a pressure bonding mechanism for pressing and pressing the attached conductive adhesive film.