JPH04165693A - Pressure bonding device for conductive adhesion film - Google Patents

Abstract

PURPOSE:To make it possible to protect the surface of a conductive adhesion film from adhesion of dust and adhesive powder by a method wherein a pressure bonding device is provided with a adhering mechanism for adhering the film in a prescribed position on a circuit board at a prescribed angle and a pressure bonding mechanism, which enables a heater block to press the conductive adhesion film adhered on the flexible circuit board and makes the film pressure bond on the board. CONSTITUTION:An adhering mechanism 49 has a retention chuck 50 for attracting and holding a cut conductive adhesion film 12, the chuck 50 is moved to a prescribed direction and at a prescribed angle and the cut film 12 is adhered in a prescribed position on a flexible circuit board 11 at a prescribed angle. A pressure bonding mechanism 53 has a heater block 54 and the film 12 adhered on the board 11 by the mechanism 49 is pressed by this block 54 and is made to pressure bond on the board 11. This pressure bonding operation is conducted on a pressure bonding stage 56 provided in a pressure bonding position A. Thereby, the film 12 can easily be pressure bonded and as the film 12 is pressure bonded in a state that it is laminated with a protective film, the surface of the film 12 can be protected from adhesion of dust and adhesive powder even after the pressure bonding.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention is directed to a method of pressure-bonding a conductive adhesive film to a long flexible circuit board on which electronic components for controlling a liquid crystal display, etc. are attached, for example. related to a device for

(Prior art) In the manufacturing process of electronic circuit devices, a conductive adhesive film (hereinafter referred to as a conductive film) is used for connection with external devices or external circuits on the circuit pattern of a flexible circuit board on which electronic components such as integrated circuits are attached. There is a process of crimping the

Here, the flexible circuit board is formed in an elongated shape in order to make the work in the manufacturing process continuous, and the pressure bonding of the conductive film is described in Japanese Patent Application Laid-Open Nos. 1-175747 and 1-175748. As shown in the figure, the conductive film laminated with the protective film is formed in a long shape. Then, this is fed together with a flexible circuit board and supplied to a predetermined position on this flexible circuit board,
After the conductive film is crimped onto the flexible circuit board by operating the crimping head, the conductive film is cut with a cutter to separate it from the protective film, and only the conductive film is pasted onto the flexible circuit board. ing.

In this case, since the conductive film must be fed in accordance with the crimping location on the flexible circuit board, the feeding position of the conductive film is limited for each flexible circuit board.

That is, since it is used as a special purpose machine, it is not possible to supply a wide variety of flexible circuit boards. In addition, since the protective film laminated with the conductive film is separated and damaged when crimped, the flexible circuit board with the conductive film crimped is
Next) For example, dust or cutting powder may adhere to the surface of the conductive film during supply to the press unit or during work in the press unit, resulting in poor connection when connecting to external devices or external circuits later. It is the cause of this.

(Problems to be Solved by the Invention) As described above, with the conventional crimping method, it is difficult to supply a wide variety of flexible circuit boards, and the problem is that dust, connection powder, etc. adhere to the surface of the conductive film after crimping. There is a point.

An object of the present invention is to provide a conductive adhesive that can easily pressure-bond conductive films to multiple types of flexible circuit boards, and that can protect the surface of the conductive film from dust and connection powder even after pressure-bonding. An object of the present invention is to provide a membrane crimping device.

[Structure of the invention]

(Means for Solving the Problems) The present invention relates to an apparatus for pressure-bonding a conductive adhesive film to a long flexible circuit board on which electronic components are attached, and the present invention relates to an apparatus for pressure-bonding a conductive adhesive film to a long flexible circuit board on which electronic components are attached. A feeding mechanism that has a sprocket that can feed the flexible circuit board and sequentially feeds the flexible circuit board in the length direction intermittently by the mounting interval of the electronic component, and one end of the conductive adhesive film wound on the reel is held between the sprockets. It has a pull-out chuck that pulls out the conductive adhesive film in its length direction, and a cutter that cuts the conductive adhesive film pulled out by the pull-out chuck, and the cutter cuts the conductive adhesive film into a predetermined shape corresponding to the flexible circuit board. It has a conductive adhesive film supply mechanism that cuts the conductive adhesive film to length, and a holding chuck that sucks and holds the conductive adhesive film cut by the conductive adhesive film supply mechanism, and moves this holding chuck in a predetermined direction and angle. , has a pasting mechanism for pasting the cut conductive adhesive film on a predetermined position on a flexible circuit board at a predetermined angle, and a heater block, and the heater block presses the conductive adhesive film pasted on the flexible circuit board. The device is equipped with a crimping mechanism for crimping.

(Function) In the present invention, multiple types of flexible circuit boards with different width dimensions can be fed by the subblock, and the conductive adhesive film is cut to a predetermined length by the conductive adhesive film supply mechanism. Since this can be attached to a predetermined position on the flexible circuit board at a predetermined angle, it is possible to manufacture a wide variety of electronic circuit devices that differ in size, component arrangement, or conductive film attachment state. Furthermore, since the conductive film is laminated with the protective film and is pressed together, it is possible to prevent dust, dust, etc. from adhering to the conductive film.

(Example) Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

Figure 1 is a flexible circuit board! 1 shows an apparatus for pasting a conductive adhesive film (hereinafter referred to as conductive film) 12 cut into a predetermined size at a predetermined location at a predetermined angle.

The flexible circuit board 11 is made of polyimide resin with a thickness of about 100 μm, and is formed into a long shape as shown in FIG. 2, with perforations 13 formed on both sides thereof. Then, on the flexible circuit board 11, electronic components 14 such as integrated circuits and wiring patterns 141 are attached in a previous process. Furthermore, reference holes 15 are provided near these electronic components 14, respectively, to indicate a predetermined positional relationship with respect to these electronic components 14.

Note that these electronic components 14 are inspected in the previous process, and if the electronic component 14 itself or the wiring pattern 14a is defective, a defect indicator hole 16 is formed at a predetermined position on the flexible circuit board 11. .

The flexible circuit board 11 having such a structure is wound around a supply reel 19 provided on the left side of the main body base 18 shown in FIG. 1 together with a protective film Ila for protecting electronic components.

As shown in FIG. 2, the conductive film 12 is cut into strips and pasted at a predetermined position (on the wiring pattern 141) on the flexible circuit board 11 at a predetermined angle (direction), for example. As disclosed in Japanese Unexamined Patent Publication No. 61-55809, a thermoplastic resin having conductivity only in the thickness direction is formed into a long shape. This conductive film 1
2, as shown in FIG. 3, has a protective film 12M and a protective film 12b laminated on its front and back sides, and as shown in FIG. It is wrapped.

Next, the feeding mechanism 21 for the flexible circuit board 11 will be explained. This feeding mechanism 21 intermittently feeds the flexible circuit board 11 wound together with the protective film II on the supply reel 20 to a position where it is pressed against the conductive film 12, and includes an idler 22 and a tension roller 23. , a guide roller 24, and a sprocket 25. Then, by driving the rotating shaft 19a of the supply reel 19, the flexible circuit board 11 fed out from the reel 19 is separated from the protective film I18, and then fed while maintaining a predetermined tension by the tension roller 23. do.

The sprocket 25 meshes with the perforations 13 provided on both sides of the flexible circuit board 11, and adjusts its feed amount to the pitch of the reference hole 15, that is,
The mounting interval of electronic components 14 is regulated. In addition, this sprocket 25 has feed teeth 251.2 with different outer diameters at positions with different width dimensions, as shown in FIG. 4, so that a plurality of types of flexible circuit boards 11 with different width dimensions can be fed.
5b is provided in a stepped structure.

The tension roller 23 is attached to the flexible circuit board 1
It absorbs the tension and slack due to the difference between the supply speed and the winding speed that occur in the feeding process of step 1.Although detailed illustrations are omitted, it is attached to the tip of the arm with the intermediate part as the fulcrum.
A predetermined tension is generated in the flexible circuit board 11 that is passed around the tension roller 23 by a counterweight or the like provided at the other end. In addition,
This configuration is the same for each of the other tension rollers described later.

Protective film 11 separated during the feeding process of flexible circuit board II! Idler 26, tension roller 2
7. It passes through the idler 28 and is wound onto the take-up reel 29.

Next, the supply mechanism 31 for the conductive film 12 will be explained. This supply mechanism 31 feeds the conductive film 12 wound around the supply reel 20 to the cutting position B, and at this cutting position B,
The conductive film 12 is cut into a predetermined length corresponding to the type of the flexible circuit board 11, and the pull-out chuck 32 and the pull-out chuck hold one end of the flexible circuit board 11 and pull it out in the length direction. It has a cutter 33 for cutting the drawn out conductive film 12. These will be explained in detail below.

The supply reel 20 is provided with a frame 34 erected on the main body base 18 above the crimping position A.

Then, by driving the rotating shaft 2θa of the supply reel 20, the conductive film 12 laminated therebetween along with the protective film 121 and the protective film +2b is sent out, and the idler 35, tension roller 36, which is also attached to the frame 34, It is fed between a pair of guide rollers 38 via an idler 37.

Further, after the conductive film 12 laminated together with the protective film 12a and the protective film 12b passes through the pair of guide rollers 38, only the protective film +2b is separated from the conductive film 12, as shown in detail in FIG. .

After that, the conductive film 12 passes through the guide roller 39 and the clamp 40 together with the protective film 12 and reaches the cutting position B, and its tip is held by a pull-out chuck 32. The moving base 41 is attached to the left end, and the right end of the moving base 41 is screwed into a ball screw 42.

This ball screw 42 is rotationally driven by a first pulse motor 43 mounted on the frame 34, and moves the movable base 41 and the drawer chuck 32 back and forth in the horizontal direction shown in the figure.

The cutter 33 cuts the conductive film 12 pulled out to a predetermined length by the pull-out chuck 32, and is opened and closed by an actuator (not shown).

The protective film +2b separated from the conductive film 12 at the pair of guide rollers 38 passes through an idler 45 and a tension roller 46, and then is wound up by a take-up reel 47.

Next, the pasting mechanism 49 of the conductive film 12 will be explained. This pasting mechanism 49 includes a holding chuck 50 that attracts and holds the cut conductive film 12 (which integrally holds the protective film 121 in a laminated state).
The holding chuck 50 is moved in a predetermined direction and angle, and the cut conductive film 12 is attached to a predetermined position on the flexible circuit board 11 at a suitable angle.

The holding chuck 50 is mounted on a rotary actuator 5.
1, and 90 along the plane direction (direction perpendicular to the page)
° Constructed so that it can be rotated. Further, this holding chuck 50 is movable in the upper F direction by a cylinder (not shown), and further movable in any direction along the plane direction by an X-Y table 7 (not shown).

Next, the crimping mechanism 53 will be explained. This crimping mechanism 53 is
A heater block 54 is provided, and the heater block 54 presses and presses the conductive film 12 pasted onto the flexible circuit board 11 by the pasting mechanism 49. Note that this crimping operation is performed on a crimping table 56 provided at the crimping position fiA.

The heater block 54 has a rotary actuator 55 and is configured to be able to rotate by 90 degrees along the plane direction. Further, this heater block 54 is movable in two downward directions by a cylinder (not shown), and further movable in any direction along the plane by an X-Y table (not shown).

The conductive film 12 is crimped at the crimping position A, and the flexible circuit board 11 is sent out by the sprocket 25, and then passes through a tension roller 58 and a guide roller 59 to the next unit, such as a press, as shown in FIG. Unit 60 is supplied.

Further, a detection device 62 for detecting the feeding position of the flexible circuit board 11 is located at a position to the left of the crimping position A in the figure.
is provided. This detection device 62 has two sensors 63 and 64, as shown in FIG. perform a delinquency test, i.e.
If a defective indicator hole 16 is detected, the wiring pattern 14a
A signal is output so that the subsequent conductive film 12 is not pasted to the surface.

The sensor 64 also detects the reference hole 15 and determines the feeding position of the flexible circuit board 11. The detection positions of these sensors 63 and 64 are one electronic component before the position where the conductive film 12 is attached to the flexible circuit board 11.

By operating each of the mechanisms described above, the flexible circuit board 11
A microblower (not shown) or the like may be used as a control device for attaching the conductive film 12 cut into strips to predetermined locations.

In the above configuration, a control device (not shown) operates the supply reel 19 and sprocket 25 shown in FIG. This operation is controlled to stop when it is determined based on the detection signal from the sensor 64 that the electronic component 14 to be crimped has reached a predetermined crimping position.

On the other hand, after the conductive film 12 is separated from the protective film 12b at the pair of guide rollers 38, the leading end portion is held by the pull-out chuck 32 while being laminated with the protective film 12a. In this state, the pulse motor 43 is operated to move the drawer chuck 32 to the right in the figure via the ball screw 42 and the moving base 41 screwed therewith, thereby moving the conductive film 12 to the protective film 12! and pull it out to a predetermined length. After that, the conductive film 12 (the protective film 12 and the protective film 12 are laminated together; the same applies hereinafter) is held by the clamp 40, and the holding chuck 50 is lowered one step to attract and hold the conductive film 12, and then the cutter 33 to cut the conductive film 12 into a predetermined length corresponding to the drawn-out length.

Here, the drawn-out length of the conductive film 12, that is, the length of the conductive film 12 after cutting, is set in advance in a control device (not shown) according to the type of flexible circuit board 11 to which the conductive film 12 is attached. .

After the above cutting operation, the holding chuck 50 holding the cut conductive film 12 is moved to a predetermined attachment position on the flexible circuit board 11 using an X-Y table (not shown).

Here, depending on the type of flexible circuit board 11, the pasting direction of the conductive film 12 may be parallel to the feeding direction of the flexible circuit board 11 as shown in FIG. 2(a), or parallel to the feeding direction of the flexible circuit board 11 as shown in FIG. ), there are cases in which the pasting direction is perpendicular to the feeding direction, so the rotary actuator 51 is operated according to the product type to determine the pasting angle.

Thereafter, if the detection result of the sensor 63 indicates that there is no component defect, the holding chuck 50 is further lowered and the conductive film 12 is pasted on the flexible circuit board 11.

After pasting, the holding chuck 50 rises and returns to its origin.

Next, the crimping mechanism 53 is operated, and the heater block 54 is moved onto the conductive film 12 pasted on the flexible circuit board 11 using the X-Y table.
is pressed onto the flexible circuit board 11 on the crimping table 56. The heater block 54 is heated to 100 to 150° C., and the conductive film 12 made of thermoplastic resin is reliably bonded onto the flexible circuit board 11.

The above operation is repeated while advancing the electronic components 14 one by one, and ends when the conductive film 12 is completely crimped onto all the electronic components 14.

Here, the feeding mechanism 21 for the flexible circuit board 11 is as follows:
By configuring the sprocket 25 in a stepped manner as shown in FIG. 4, it is possible to feed multiple types of flexible circuit boards 11 with different width dimensions without replacing the sprocket, which facilitates multi-product feeding. Can be easily handled. Furthermore, the supply mechanism 31 for the conductive film 12 can determine the cutting length of the conductive film 12 in accordance with the type of the flexible circuit board 11, and the pasting mechanism 49 supplies the cut conductive film 12 to a predetermined position on the flexible circuit board 11. Since it can be pasted at a predetermined angle, it can be easily applied to a wide variety of products.

Also, based on the detection results of the sensor 63, electronic components 14 and wiring patterns 14! Since the affixing and crimping work is performed only when the conductive film 12 is normal, the conductive film 12 can be used effectively, and the efficiency of the affixing and crimping work is improved. Furthermore, since the conductive film 12 is attached and pressure-bonded onto the flexible circuit board 11 while the protective film 12a is laminated, it is possible to prevent dirt and dust from adhering to the conductive film 12, and to obtain a stable connection state. I can do it.

〔Effect of the invention〕

As described above, according to the present invention, multiple types of flexible circuit boards with different width dimensions can be fed by the sprocket, and the conductive adhesive film can be cut to a predetermined length by the conductive adhesive film supply mechanism. Since this can be attached to a predetermined position on the flexible substrate at a predetermined angle, it is possible to manufacture a wide variety of electronic circuit devices that differ in size, component arrangement, or conductive film attachment state. The conductive film can be easily crimped onto multiple types of flexible circuit boards, and since the conductive film is crimped while laminated with the protective film, the surface of the conductive film is free from dust and connection powder even after crimping. can be protected from adhesion.

[Brief explanation of the drawing]

FIG. 1 is a front view showing an embodiment of a crimping apparatus for conductive adhesive films according to the present invention, and FIGS. 2(a) and 2(b) each show an example of the configuration of a flexible circuit board to be crimped in the present invention. 3 is an enlarged partial front view showing the essential parts of the device shown in FIG. 1, and FIG. 4 is an external view showing an example of the configuration of a sprocket used in the present invention. 11...Flexible circuit board, 12...Conductive adhesive film (conductive film),...Electronic component, 21...Feeding mechanism, 25
... Sprocket, 31 ... Conductive adhesive film supply mechanism, 3
2...Drawer chuck, 33...Cutter, 49...Passing mechanism, 50...Holding chuck, 53...Crimp mechanism. (a,) Cb) 11”1

Claims (1)

[Claims] (1) A device for pressure-bonding a conductive adhesive film to a long flexible circuit board on which electronic components are attached, which has a sprocket that can feed at least two types of flexible circuit boards with different width dimensions, and the sprocket A feeding mechanism that sequentially intermittently feeds the flexible circuit board in the length direction by the mounting interval of the electronic components, and a drawer chuck that grips one end of the conductive adhesive film wound on the reel and pulls it out in the length direction. and a conductive adhesive film supply mechanism having a cutter for cutting the conductive adhesive film pulled out by the pull-out chuck, and for cutting the conductive adhesive film to a predetermined length corresponding to the flexible circuit board with the cutter. This conductive adhesive film supply mechanism has a holding chuck that sucks and holds the cut conductive adhesive film, and moves this holding chuck in a predetermined direction and angle to transfer the cut conductive adhesive film to a flexible circuit board. Crimp-bonding of a conductive adhesive film, comprising: a pasting mechanism for pasting the conductive adhesive film on a flexible circuit board at a predetermined angle; and a pressure-bonding mechanism for pressing and crimping the conductive adhesive film pasted on a flexible circuit board. Device.