JP3271537B2 - Method of attaching anisotropic conductive material - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for attaching an anisotropic conductive material for attaching an electronic component to a work such as a liquid crystal panel.

[0002]

2. Description of the Related Art As a method for mounting an electronic component on a substrate or the like, a method using an anisotropic conductive material (hereinafter, referred to as ACF) is known. ACF is an adhesive tape, which is stuck on an electrode of a substrate such as a liquid crystal panel,
A method of crimping a chip from above is known. AC
Since F has an adhesive property and is difficult to handle, ACF is adhered to a base tape to form an anisotropic conductive tape (hereinafter, referred to as ACF tape), and the ACF tape is wound around a supply reel and handled. When attaching the ACF to the work, the ACF tape is pulled out from the supply reel, and the ACF side is pressed against the work by the pressure bonding head with the ACF side facing the work surface.

A conventional method for attaching an ACF will be described below with reference to the drawings. FIG. 15 is a front view of a main part of a conventional ACF attaching apparatus, and FIG. 16 is a sectional view of an ACF tape.
Reference numeral 1 denotes a main body frame, on which components to be described below are arranged. Reference numeral 2 denotes an ACF tape which is supplied from a supply reel (not shown) and travels in the direction indicated by the arrow. A
The CF tape 2 is configured by attaching an ACF 2a to a base tape 2b as shown in FIG. A cutter 12 is provided while the ACF tape 2 is running. Cutter 12
Are driven back and forth by a driving cylinder (not shown), and cutouts 15 are formed at predetermined intervals only in the ACF 2a of the ACF tape 2 supported by the tape receiver 14.

[0004] Two guide rollers 8 and 9 are provided below the main body frame 1. Guide rollers 8 and 9 are A
The running of the CF tape 2 is guided. A pressure bonding head 20 is provided between the two guide rollers 8 and 9. The pressure bonding head 20 is connected to a rod 21 a of a cylinder 21. When the rod 21a of the cylinder 21 protrudes and retracts, the pressure bonding head 20 moves up and down. A movable table 16 is provided below the main body frame 1. A substrate holder 17 is placed on the movable table 16. A substrate 18 is placed on the substrate holder 17. When the movable table 16 is driven, the substrate 18 moves in an arbitrary direction, and its position is adjusted.

Next, the operation of the ACF tape sticking apparatus will be described. FIG. 15 shows a state where the ACF tape 2 on the supply reel is out of stock and a new ACF tape 2 is set. The cutter 12 operates in a state where the feeding of the ACF tape 2 is stopped, and the ACF of the ACF tape 2 is stopped.
The notch 15 is formed only in the portion 2a. Next, the ACF tape 2 is moved to a predetermined A by a tape feed roller (not shown).
Sent by the CF attachment length L1.

After the running of the ACF tape 2 is stopped, the notch 15 is formed again by the cutter 12. This operation is repeated until the first notch 15 coincides with the edge position 20a of the pressure bonding head 20 on the upstream side of the tape. The edge position 20a is used as a reference for aligning the ACF tape 2 with the pressure bonding head 20. After this, the first ACF2
a is attached to the work.

Although the size of the chip varies depending on the type, the length L2 of the pressure bonding head 20 for pressing the ACF tape 2 against the substrate 18 is generally constant.
The ACF2 required is not changed for each chip.
The pressure bonding head 8 longer than the sticking length L1 of a may be used. Therefore, in this case, if the pressure bonding head 20 is lowered and the ACF 2a is attached to the work, the required length L
An ACF 2a having a length L2 longer than 1 is attached to the work.

[0008]

When the ACF 2a is continuously attached, only the predetermined length L1 exists from the upstream edge 20a of the crimping head 20 as a starting point, and the length L1 is related to the length of the crimping head 20. Instead, only the predetermined length L1 is attached to the work. However, as described above, when the ACF tape 2 is newly set, for example, the notch 15 formed first is aligned with the upstream edge 20a of the pressure bonding head 20. That is, the ACF 2a is continuously present downstream of this position of the ACF tape 2. Therefore, if the bonding is performed by moving the pressure bonding head 20 up and down as it is, the ACF 2a having a length equal to the length L2 of the pressure bonding head 20 is bonded to a work such as the substrate 18.

An extra ACF2 longer than the predetermined length L1
If a is left as it is, it has been a quality problem such that it adheres to the crimping tool 20 at the time of final crimping after chip mounting and causes contamination. Therefore, conventionally, in these cases, some manual treatment was required. For example, measures such as manually peeling off the extra stuck portion have been taken. The above problem also occurs when the size of the chip changes due to the change of the chip type. Therefore, it has been desired to eliminate this problem in terms of maintenance management and quality control.

Accordingly, an object of the present invention is to solve the above-mentioned problems of the conventional method and to provide an ACF attaching method capable of efficiently attaching an ACF.

[0011]

According to the present invention, there is provided a method for attaching an anisotropic conductive material, wherein an anisotropic conductive material adhered to one surface of a base tape is moved over a work while an electronic device is pressed by a pressure head. A method of attaching an anisotropic conductive material to be attached on an electrode of a work to which a component is to be bonded,
Forming a notch in the anisotropic conductive material, feeding the anisotropic conductive material downstream of the notch to a position where the pressure bonding head can press the tape by means of a tape feeding means, and moving the pressure bonding head up and down Bonding the anisotropic conductive material downstream of the notch to the discarded portion, and pressing the anisotropic conductive material upstream of the notch and cut to a predetermined length to the crimping position of the crimping head. And a step of moving the pressure bonding head up and down and sticking the anisotropic conductive material cut to a predetermined length on the electrode of the work.

[0012]

According to the present invention, when the ACF tape is replaced, the ACF downstream of the first notch at a predetermined interval is attached to a predetermined discarded portion. wear. Therefore, on the upstream side of the first cutout, all the ACFs are cut to a predetermined length, so that it is not necessary to perform a stripping process by acquisition.

(Embodiment 1) FIG. 1 is a front view of an anisotropic conductive material sticking apparatus according to Embodiment 1 of the present invention, FIG. 2 is a perspective view of the anisotropic conductive material sticking apparatus, FIG. 3 is a block diagram of a control system of the sticking apparatus for the anisotropic conductive material, and FIGS. 4, 5, 6, 7, 8, 9, 9, 10, 11, and 12.
FIG. 3 is a partial front view of the sticking device for the anisotropic conductive material.

First, the structure of the device for attaching an anisotropic conductive material will be described with reference to FIG. 1 is a body frame,
Elements described below are provided. Reference numeral 3 denotes a supply reel on which the ACF tape 2 is wound. As shown in FIG. 16, the ACF tape 2 includes two layers of an ACF 2a and a base tape 2b. A roller 4 for feeding the tape is provided on a side of the supply reel 3. The roller 4 is driven via a belt 6 by a tape feeding motor 5 provided on the back surface of the main body frame 1.
Guide rollers 7, 8, and 9 are provided on the left and below the roller 4 for feeding the tape.

Between the roller 4 and the guide roller 7, a tension generator 10 made of a transparent bottomed cylindrical body is provided. The bottom of the tension generator 10 is connected to a suction device (not shown). A predetermined tension is applied to the ACF tape 2 hanging inside the tension generator 10 by sucking the inside of the tension generator 10. A tape detection sensor 11 is provided above the tension generator 10. Tape detection sensor 11
Optically detects the presence or absence of the ACF tape 2 inside the tension generator 10 and notifies the tape feeding control unit 41 (FIG. 3).

A cutter 12 is provided between the guide rollers 7 and 8. The cutter 12 is driven back and forth by a cylinder 13. The cutter 12 makes cutouts 15 at predetermined intervals only in the ACF 2 a of the ACF tape 2 supported by the tape receiver 14. A movable table 16 is provided below the main body frame 1. A substrate holder 17 is mounted on the movable table 16, and a substrate 18 and a dumping stage 19 as a dumping unit are mounted on the substrate holder 17. The discarding stage 19 has an ACF2 longer than a predetermined length.
It is a plate-like member for affixing and discarding a, and is exchangeably attached to the substrate holder 17. When the movable table 16 is driven, the substrate 18 moves in an arbitrary direction, and its position is adjusted. Further, the movable table 16 moves the dumping stage 19 between a dumping position immediately below the pressure bonding head 20 and a lateral retreat position.

A pressure bonding head 2 is provided between the guide rollers 8 and 9.
0 is provided. The pressure bonding head 20 is connected to a rod 21 a of a cylinder 21. The crimping head 20 moves up and down by the rod 21a of the crimping head lowering cylinder 21 protruding and retracting. Crimping head 20 is ACF tape 2
Is pressed against the substrate 18 to attach the ACF 2a to the substrate 18.

A feed amount detecting roller 22 and a receiving roller 23 are arranged in parallel above the guide roller 9 so as to sandwich the base tape 2b. As shown in FIG. 2, the feed amount detecting roller 22 has a gear cut 25 on the outer surface. When the base tape 2b runs in contact with the teeth, the feed amount detecting roller 22 is rotated. This rotation is transmitted to the encoder 26, and the encoder 26 transmits a pulse corresponding to the feed amount of the base tape 2b to the tape feed control unit 42 (FIG. 3). The combination of the feed amount detecting roller 22 and the encoder 26 constitutes a feed amount detecting unit.

A tape feed roller 27 is provided above the feed amount detecting roller 22. Tape feed roller 27
Is driven by a tape feed motor 28 provided on the back of the main body frame 1. The tape feed roller 27 and the tape feed motor 28 constitute a tape feed unit.
The clamp roller 2 is arranged alongside the tape feed roller 27.
9 are provided. As shown in FIG. 1, the clamp roller 29 presses the base tape 24 against the tape feed roller 27 by a spring 30. A tape take-up reel 31 is provided beside the tape feed roller 27.
The tape take-up reel 31 is provided with rotational tension by a motor (not shown).
Is wound up.

In FIG. 2, reference numeral 32 denotes a base tape peeling pin.
It is attached to. The belt 34 is wound around a pulley 35. Pulley 35 is a base tape peeling motor 36
Is driven to rotate. Accordingly, when the base tape peeling motor 36 rotates, the base tape peeling pin 32 moves horizontally. These elements constitute a base tape peeling means.

Next, the configuration of the control system will be described with reference to the block diagram of FIG. The tape feeding controller 41 receives a signal from the tape detection sensor 11 and controls the tape feeding motor 5. That is, when the tape detection sensor 11 stops detecting the ACF tape 2 in the tension generator 10, the tape feeding motor 4 is driven for a predetermined time. The predetermined time refers to a time until the ACF tape 2 is supplied into the tension generator 10 by a sufficient amount in the feeding.

The tape feed control unit 42 receives the rotation of the tape feed amount detecting roller 22 by a pulse from the encoder 26 and controls the tape feed motor 28. Motor control unit 4
3 controls the operation of the tape peeling motor 36 and the movable table 16 for moving the substrate 18. Cylinder control unit 4
4 controls the operation of the cutter driving cylinder 13 and the pressure bonding head lowering cylinder 21.

The main controller 40 controls the tape feed controller 41, the tape feed controller 42, the motor controller 43, and the cylinder controller 44 as a whole. The storage unit 45 stores a sequence program pattern such as a discarding operation program 46 and a pasting operation program 47, and transmits the sequence program pattern to the main control unit 40 as necessary. The operation input unit 48 allows the operator to select an appropriate operation mode and
The following three modes are provided for inputting to the
Mode A is a mode in which a normal sticking operation is performed from a discarding operation, mode B is a mode in which a normal operation is started immediately, and mode C is a mode in which only a discarding operation is performed.
The notifying means 49 displays on a display attached to the apparatus and issues an alarm in order to notify the operator of necessary items such as tape breakage.

The ACF sticking apparatus has the above-described configuration. The sticking operation will be described below with reference to FIGS.
This will be described with reference to FIG. FIG. 4 shows a state in which a new ACF tape 2 is set. The setting is performed by winding the leading end of the ACF tape 2 on a tape winding reel 31. In this case, when the mode A is selected and input by the operation input unit 48, the operation shifts to the normal pasting operation after performing the discarding operation. FIGS. 5 to 8 show the operation of the apparatus according to the discarding operation program 46.

FIG. 5 shows a step of forming the notch 15 in the ACF 2a. First, a notch 15 is formed in the ACF tape 2 by the cutter 12 while the running of the ACF tape 2 is stopped. Thereafter, a tape feed roller 27 as a tape feed means rotates to feed the ACF tape 2 by a predetermined length. A
If the CF tape 2 stops, the cutter 12 returns to the ACF
A notch 15 is formed in the tape 2. Top notch 1
The tape feeding and the formation of the notch 15 are repeated until the position 5 is located at the upstream edge 20a of the pressure bonding head 20 which is the positioning reference point of the ACF tape 2. In this state, the crimping head 20 can crimp the ACF tape 2. At the same time, the movable table 16 is driven, and the pressure bonding head 20 is moved to the substrate holder 1.
7 so as to be positioned above the discarding stage 19 on the upper surface 7.

Next, as shown in FIG. 6, the pressing head lowering cylinder 21 operates, and the pressing head 20
Is pressed against the discarding stage 19, and only the ACF 2a of the ACF tape 2 is attached to the discarding stage 19. Thereafter, the pressure bonding head 20 is moved to the pressure bonding head lowering cylinder 2
1 returns to the raised position. As shown in FIG. 7, in this state, the base tape peeling pin 32 is horizontally moved in the direction of the arrow by driving the base tape peeling motor 36. As a result, the ACF 2a portion of the discarded ACF tape 2 is left on the surface of the discarding stage 19 and the base tape 2b
Only stripped. The base tape peeling pin 32 returns to its original position after moving horizontally by a predetermined amount (FIG. 8).

With the above, the dumping operation is completed, and thereafter, the operation shifts to the normal sticking operation. As shown in FIG. 9, the base tape 2b is fed by a tape feed roller 27 as a tape feed means. As a result, the ACF tape 2 continuous with the base tape 2b is also fed. The ACF tape 2 is sent to a position where it can be crimped, and is positioned with respect to the crimp head 20. The alignment between the first notch 15 on the upstream side starting from the discarded portion and the upstream edge 20a of the pressure bonding head 20 is a positioning reference.

At the same time, the movable table 16 is driven, and the substrate 18 is moved and positioned below the pressure bonding head 20. After the positioning of the substrate 18, the pressure bonding head lowering cylinder 21 is operated, and the pressure bonding head 20 presses the ACF tape 2 against the surface of the substrate 18 which is a work (FIG. 10). Next, when the pressure bonding head 20 is lifted, the base tape peeling pin 32 moves horizontally in the direction of the arrow and the attached ACF 2a
The base tape 2b is peeled off from FIG. FIG. 12 shows a state in which the base tape peeling pin 32 has returned to the original position, whereby the normal attaching operation of the ACF 2a is completed.

(Embodiment 2) FIG. 13 is a front view of an anisotropic conductive material sticking apparatus according to Embodiment 2 of the present invention.
4 is a perspective view of a discarded portion of the anisotropic conductive material sticking device. In FIG. 13, the ACF material applying apparatus according to the second embodiment is replaced with a take-up sheet-type disposal apparatus 50 instead of the disposal stage 19 of the ACF material applying apparatus according to the first embodiment. It is a thing.
In FIG. 14, a band-shaped discarded sheet 52 is mounted below the pressure bonding head 20. The discarded sheet 52 is wound around a supply reel 53 and is wound around a take-up reel 54 around the upper surface of the receiving table 51. Cradle 5
1 is a pressure bonding head 2 pressed against a discarded sheet 52
It receives a pressure of 0. The cradle 51 is a base plate 55
Attached to.

The take-up reel 54 and the supply reel 53 are mounted on bearings 56, 5 mounted on a base plate 55.
7. Rotary shaft 58 of take-up reel 54
Is provided with a pulley 59. The pulley 59 is driven by a motor 60 via a belt 61. Therefore, when the motor 60 rotates intermittently, the take-up reel 54 is driven, and the discarded sheet 52 is pitch-fed. Except for the above description, the configuration is the same as that of the first embodiment. In FIG.

The operation of the discarding portion according to the second embodiment will be described below. At the time of the operation according to the discarding operation program 46 (corresponding to FIG. 5 in the example of the first embodiment), the movable table 15 is driven and the discarding portion 50 is moved so as to be located immediately below the pressure bonding head 20. Thereafter, the pressure bonding head 20 descends, and the ACF 2 a for the discarded shot is attached to the discarded sheet 52 on the receiving table 51.

Thereafter, only the base tape 2b is peeled off by the tape peeling pins 32, and the discarded sheet leaves the discarded ACF 62. Each time the ACF 2a is adhered once, the motor 60 is driven to take up the take-up reel 54.
Takes up the discarded sheet 52 by a predetermined pitch. The discarded sheet 52, which has been completely discarded for a length of one turn, is replaced with a new one.

The present invention is not limited to the above embodiment. For example, instead of the substrate 18 being moved by the movable table 16, the substrate 18 may be fixed and the main body frame 1 may be movable. Further, a dummy substrate placed on the substrate holder 17 may be used as the dumping portion.

[0034]

According to the present invention, when the ACF tape is replaced, unnecessary AC power downstream of the first notch is used.
F can be affixed to a predetermined dumping stage and discarded.

[Brief description of the drawings]

FIG. 1 is a front view of a device for attaching an anisotropic conductive material according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a device for attaching an anisotropic conductive material according to the first embodiment of the present invention;

FIG. 3 is a block diagram of a control system of the device for attaching an anisotropic conductive material according to the first embodiment of the present invention.

FIG. 4 is a partial front view of the device for attaching an anisotropic conductive material according to the first embodiment of the present invention;

FIG. 5 is a partial front view of the device for attaching an anisotropic conductive material according to the first embodiment of the present invention;

FIG. 6 is a partial front view of the device for attaching an anisotropic conductive material according to the first embodiment of the present invention;

FIG. 7 is a partial front view of the device for attaching an anisotropic conductive material according to the first embodiment of the present invention;

FIG. 8 is a partial front view of the device for attaching an anisotropic conductive material according to the first embodiment of the present invention;

FIG. 9 is a partial front view of the device for attaching an anisotropic conductive material according to the first embodiment of the present invention;

FIG. 10 is a partial front view of the device for attaching an anisotropic conductive material according to the first embodiment of the present invention;

FIG. 11 is a partial front view of the device for attaching an anisotropic conductive material according to the first embodiment of the present invention;

FIG. 12 is a partial front view of the device for attaching an anisotropic conductive material according to the first embodiment of the present invention;

FIG. 13 is a front view of the device for attaching an anisotropic conductive material according to the second embodiment of the present invention;

FIG. 14 is a perspective view of a discarded portion of the device for attaching an anisotropic conductive material according to the second embodiment of the present invention.

FIG. 15 is a front view of a main part of a conventional ACF attaching apparatus.

FIG. 16 is a sectional view of an ACF tape.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Main body frame 2 ACF tape 2a ACF 2b Base tape 3 Supply reel 10 Tension generator 12 Cutter 15 Notch 18 Substrate 19 Discarding stage (discarding portion) 20 Crimping head 31 Take-up reel

Claims (1)

(57) [Claims] 1. An anisotropic conductive material attached to an electrode of a work to which an electronic component is bonded by a pressure bonding head while running the anisotropic conductive material attached to one surface of a base tape over the work. A bonding method, wherein a step of forming a notch in the anisotropic conductive material, a step of feeding an anisotropic conductive material downstream of the notch to the crimping position of the crimping head by a tape feeding means, Moving the head up and down to attach the anisotropic conductive material downstream of the notch to the discarded portion; and cutting the anisotropic conductive material cut to a predetermined length upstream of the notch. Sending the material to the crimping position of the crimping head by the tape feeding means, and moving the crimping head up and down to paste the anisotropic conductive material cut to a predetermined length on the electrode of the work. Anisotropic conductive material characterized by: Paste method.