JPH0531837Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a balance device, and in particular, a method for peeling off a conductive adhesive film crimped onto a predetermined position of a long flexible wiring board and a protective film of the conductive adhesive film. The present invention relates to a balance device suitable for use in a device that does.

[Prior Art] A conductive adhesive film (hereinafter simply referred to as a conductive film) for use in connection with an external device or circuit may be pressure-bonded onto a wiring pattern provided on a flexible wiring board.

FIG. 7 shows a case in which a tape-shaped laminate consisting of a conductive film 2 and a protective film 2A is fed to a predetermined position on a long flexible circuit board, and the conductive film 2 is crimped onto the wiring board 1 by a crimping head 81. , shows a situation in which the conductive film 2 is cut at a predetermined portion using a cutter (not shown). The flexible wiring board 1 is fed to a predetermined position on the bonding table 82 by a feeding system (not shown). The tape-like body consisting of the conductive film 2 and the protective film 2A is supplied to the idler rollers 83, 84 and the tension roller 8 from a supply reel (not shown).
The protective film 2A is fed to the pressure bonding position via the roller 5, and is peeled off after the pressure bonding is completed. The tension roller 85 is provided at one end of a balance arm 87 that can swing around a shaft 86. A counterweight 88 is fixed to the other end of the balance arm 87. and a counterweight 88 constitute a tension balance device,
The tension applied to the tape-like laminate and the strength of the laminate are balanced.

Now, in order to peel off the conductive film 2 and the protective film 2A in the crimped state shown in FIG. Raise base 91. Protective film 2A and conductive film 2
Since it is not firmly adhered to the base 91
As a result of the rise, the portion of the conductive film 2 that is pressure-bonded to the flexible wiring board 1 remains on the flexible wiring board and is peeled off from the protective film 2A.

However, the conventional peeling apparatus causes problems as described below.

FIG. 8 shows the situation when the base 91 is raised in order to peel off the conductive film 2 and the protective film 2A that have been pressed together. The protective film 2A is the feed roller 9
0, so when the base 91 is raised for peeling, tension is applied to the protective film 2A.
T ₁ acts. However, only a tension T ₂ smaller than the tension T ₁ acts on the laminate consisting of the conductive film 2 and the protective film 2A. That is, when the tension is about to increase due to peeling, the balance arm 87 swings to relieve the tension, and the tension roller 85 moves in the direction of the arrow R shown in the figure. Therefore the tension T ₂
becomes smaller than T ₁ . As a result, peeling is not performed evenly on the left and right sides of the crimped portion, and the shearing force S shown in the figure acts on the crimped conductive film. There is a risk that the conductive film 2, which is very thin and does not have high strength, will deteriorate due to this shearing force. Further, since the peeling is not performed evenly on the left and right sides, there is also a drawback that the lifting distance of the base 91 for peeling becomes large.

[Problems to be solved by the invention] The present invention solves the above-mentioned conventional drawbacks, and makes it possible to peel off the crimped conductive film from the protective film evenly, thereby preventing damage to the conductive film. The purpose is to provide a balance device that does not require a balance device.

[Means for Solving the Problems] In order to achieve such an object, the present invention provides a tape-shaped laminate formed by bonding a first tape-shaped body and a second tape-shaped body to a predetermined position by a tape feeding means. from a predetermined position in the tape feeding path of a device that feeds the second tape-like body to another object and then peels off the crimped second tape-like body and the first tape-like body. Provided on the tape-shaped laminate supply side,
The invention is characterized by comprising a tension balance means including a balance arm having a roller at one end for guiding the tape-like laminate, and a fixing means for fixing the balance arm when peeling the first and second tape-like bodies. do.

[Function] According to the present invention, since the balance arm of the tension balance device is locked during peeling, the crimped conductive film is peeled off evenly on the left and right sides, so that the conductive film is not damaged during peeling.

[Example] The invention will be described in detail below with reference to the drawings.

FIG. 1 is a front view schematically showing a conductive film laminating machine to which a balance device according to the present invention is applied.

This device is a device for bonding a conductive adhesive film 2 to a flexible circuit board 1.

As shown in FIG. 2, the flexible circuit board 1 is provided with a barfration 3 at its side end. An integrated circuit 4 is already mounted at a predetermined position on the substrate 1. 5 and 6 are wiring patterns. By the device shown in FIG. 1, a conductive film 2 of a predetermined size is pasted onto one wiring pattern 5, and necessary terminals of a device such as a liquid crystal display controlled by an integrated circuit 4 are formed. is connected to the wiring pattern 5 via the conductive film 2 in a later step. Note that, as shown in the figure, no conductive film is bonded to the wiring pattern to which no integrated circuit is attached. 1C is a guide film.

The film-like flexible circuit board 1 is made of polyimide resin with a thickness of about 100 μm, for example, and the conductive film 2 is made of thermoplastic material having conductivity only in the thickness direction, as disclosed in, for example, Japanese Patent Laid-Open No. 61-55809. It is possible to use a resin film in which a conductive film 2 and a protective film 2A are laminated.

Before explaining the operation of the present invention, the apparatus shown in the first figure will be briefly explained.

In the figure, 11 is the main body of the device. The flexible circuit board 1 is wound around the supply reel 12 in a layered manner with a protective film 1A for protecting the attached integrated circuit. The rotating shaft 12A of the supply reel 12 is driven to send the flexible circuit board 1 through an idler 13, a tension roller 14, and a guide roller 15 to a working position A, and further to a sprocket 16 through a section A. At this time, the protective film 1A is the idler 17
A, tension roller 18 and idler 17
B and is wound onto the take-up reel 19. Reference numeral 20 denotes a base on which is mounted a pressure bonding head 21 for bonding the conductive film 2 to the flexible circuit board 1 and a cutter for cutting the conductive film 2 to a predetermined size.
It is possible to move up and down on the frame 22 of 1. The conductive film 2 is wound around the supply reel 23 in a laminated state with the protective film 2A. The rotating shaft 23A of the reel 23 is driven to send out the conductive film 2 together with the protective film 2A. The fed conductive film 2 passes through idlers 24 and 25, a tension roller 26, and a guide roller 27, and reaches the pressure bonding head 21. The tension roller 26 will be explained in detail later. After the conductive film and the flexible circuit board are bonded together, the protective film 2A is pulled up by the feed roller 28, passed through the guide roller 29, idlers 30, 31, and tension roller 32, and then wound onto the take-up reel 33. It will be done. The flexible circuit board that has been pasted is moved to tension roller 3.
4 and guide roller 35 to the next unit,
For example, it is supplied to the press unit 36.

During the process of transferring the flexible circuit board and conductive film, each film or film is moved by a tension roller 14, so that the tension caused by the difference between the feeding speed and the winding speed is balanced with the strength of the film or film. 18, 26, 32 and 34. For example, the tension roller 14 has an arm 1 that is swingable by a shaft 14A.
A counterweight 14C is fixed to the other end of the arm 14B, and the tension roller 14 moves up and down as the tension changes.
Axes 18A, 26A, 34A, arms 18B, 26 for tension rollers 18, 26 and 34
B, 34B and counterweight 18C, 2
The functions of 6C and 34C are exactly the same as those of 14A, 14B and 14C, respectively. Although not shown, the tension roller 32 also operates in exactly the same way as the other tension rollers.

In this device, a flexible circuit board to which a guide film is connected at the top in the same manner as in the conventional example is used to first position the work area using a sensor 40, and finely adjust the position using a sensor 50. Thereafter, the conductive film 2 is bonded using the pressure bonding head 21. After that, the conductive film 2 is cut with a cutter, and the bonding condition is inspected by the bonding inspection device 60, and then the next step is performed.

The series of operations described above and the adjustment of the supply and winding speeds of each film and membrane can be controlled by a single controller, for example, a microprocessor.

FIG. 3 shows an enlarged view of the apparatus shown in FIG. 1 near the working position.

11A is a frame forming a part of the main body 11,
A frame 22 is fixed. 16A is a holding roller, 22A is a cylinder for moving the base 20, and 22B is a guide thereof. 70 is the first
A cutter (not shown), 70A is a cylinder for moving the cutter 70 on the base 20, and 70B is a guide thereof.

The sensor 40 shown in FIG. 1 is installed on the attachment table 11B provided on the pedestal 11A. More specifically, sensor 40 is a first sensor that detects an integrated circuit.
a second sensor 42 for detecting perforation, and a third sensor 42 for checking for defects.
sensors 43 and mounting bases 44 for mounting them
It is made up of

Sensors 41, 42 and 43 are each LED
It consists of a light-emitting component such as and a light-receiving component such as a phototransistor. In this example, the light emitted from the light-emitting component is irradiated onto the object to be detected, and the presence or absence of reflected light is detected to detect the presence or absence of the object to be detected.

The position where the sensors 41 and 42 detect the electronic component 4 and perforation, respectively, is a position one electronic component before the position where the conductive film 2 is pressed onto the flexible circuit board 1, that is, a preparation position. The flexible circuit board 1 is an electronic component 4
When it reaches this position, it is positioned, is fed a predetermined distance to the work position, and its position is accurately adjusted by the sensor 50, and the work of crimping and cutting the conductive film is performed.

The conductive film is crimped by pressing the heated crimping head 21 against the laminate of the conductive film 2 and the protective film 2A and the flexible circuit board 1. The conductive film 2 is cut by pressing a heated cutter 70 against the protective film 2A. At this time, only the conductive film 2 is cut, and the protective film 2A
is not disconnected.

After the conductive film 2 is cut, the conductive film 2 is crimped.
The base 20 is raised to peel off the protective film 2A. The arm 26B is swingable about the shaft 26A, and the tension roller 26, the arm 26B, and the counterweight 26C constitute a balance device that balances the tension acting on the laminate of the conductive film 2 and the protective film 2A. do. In the present invention, the balance arm 26B is fixed by the stopper 71 when the base 20 is raised.

FIG. 4 is a partial sectional view for explaining the fixing mechanism. A cylinder 73 is attached to the base 20 via a mounting plate 72. There are two holes in the base 20.
0A is provided in which a piston rod 74 for moving the stopper 71 can move.

When the cutting of the conductive film 2 is completed, a control device (not shown) supplies fluid such as air to the cylinder 73 and drives the piston rod 74 to move the stopper 71 to the position shown by diagonal lines in the drawing, and then the arm 26B is moved.
Press and secure. And then base 2
Move 0 upwards. Note that 2 in Figure 4
6D is the rotation axis of the tension roller 26.

FIG. 5 shows the state of peeling when the arm 26 is fixed and the base 20 is raised. For the sake of simplicity, the cutter 70 is not shown. Arm 2
6B is fixed by the stopper 71, tension is applied evenly to the left and right sides of the protective film 2A, and the protective film 2A and the conductive film 2 that have been crimped are peeled off evenly. Therefore, no unidirectional shearing force is applied to the conductive film 2, and the conductive film 2 is not damaged.

In order to prevent the conductive film 2 from coming into contact with the tension roller 26 and causing contamination, the structure of the balance arm and tension roller may be configured as shown in FIG. 6, for example. That is, two tension rollers 75 and 76 are provided on one side of an arm 77 that can swing around a rotating shaft 78, and a counterweight 79 is provided on the other side, and the stacked body of the conductive film 2 and the protective film 2A is transferred to the supply reel 23. If the conductive film 2 is fed in the order of → idler 24 → tension roller 75 → tension roller 76 → idler 25, the conductive film 2 will not come into contact with the surface of any roller. Conductive film 2 and protective film 2
Fixing the arm 77 upon separation from A is the same as in the previous embodiment.

[Effects of the present invention] As explained above, according to the present invention, the balance arm of the tension balance device is locked during peeling, so that the crimped conductive film is peeled off evenly on the left and right sides. never gets hurt.

[Brief explanation of the drawing]

Fig. 1 is a front view of a conductive film laminating machine to which the balance device of the present invention is applied, Fig. 2 is a plan view of a flexible circuit board, Fig. 3 is a partially enlarged view of the conductive film laminating machine, and Fig. 4 is a A partial sectional view of an embodiment of the present invention, FIG. 5 is a diagram showing a state of peeling of a conductive film according to the present invention,
FIG. 6 is a partial front view of another embodiment of the present invention;
The figure shows a state in which a conductive film is crimped, and FIG. 8 shows a state in which it is peeled off by a conventional device. 1... Flexible circuit board, 2... Conductive film,
2A...protective film, 3...barflation, 4
...Electronic component, 20...Base, 26B...Arm, 71...Stopper, 73...Cylinder, 74
...Piston rod.

Claims (1)

[Claims for Utility Model Registration] A tape-shaped laminate formed by laminating first and second tape-shaped bodies is fed to a predetermined position by a tape feeding means, and the second tape-shaped body is provided on the tape-shaped laminate supply side from the predetermined position in the tape feeding path in the device for peeling the crimped second tape-shaped body and the first tape-shaped body after being crimped to the object; a tension balance means including a balance arm having a roller for guiding the tape-like laminate in the part; and a fixing means for fixing the balance arm when peeling the first and second tape-like bodies. Features a balance device.