JPH01175747A - Apparatus and method for cutting conductive adhesive film - Google Patents

Abstract

PURPOSE:To obtain a cutting apparatus of a conductive adhesive film which feeds the conductive adhesive film to the required positions of a long flexible circuit board continuously and performs bonding work automatically by providing a driving means for feeding the long flexible circuit board, a driving means for feeding the long conductive adhesive film, a specific compression-bonding means, a cutter and a control means. CONSTITUTION:A first driving means which feeds a long flexible circuit board 1, a second driving means which feeds a protective file 2A and a long conductive adhesive film 2, a compression-bonding means 21 which bonds the conductive adhesive film 2 with predetermined dimensions to the predetermined position of the flexible circuit board 1 by compression, a heated cutter 70 which presses the conductive adhesive film 2 in the neighborhood of the compression-bonded part, a third driving means 70A which moves the cutter 70 vertically and a control means which controls the 1st-3rd driving means and the compression-bonding means 21 are provided. Further, the neighborhood of the compression-bonded part of the bonded conductive adhesive film 2 is pressed by the heated cutter 70 with the support film 2A between to produce deformation in the conductive adhesive film 2 and, at the same time, to apply a tension to the support film 2A to cut the conductive adhesive film 2.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to an apparatus and method for cutting a conductive adhesive film pressure-bonded to a long flexible wiring board.

[Prior Art] A conductive adhesive film (hereinafter simply referred to as a conductive film) for use in connection with an external device or circuit may be pressure-bonded onto a wiring pattern provided on a flexible wiring board.

Conventionally, as shown in FIGS. 6A and 6B, respectively, the conductive layer 102 layered with the protective film 101 is cut into required dimensions using a mold or the like. was. This requires an extra process, wastes the conductive film, and is not economical.

There was also a method in which the conductive film 102 and the protective film 101 were cut into predetermined dimensions and used, as shown in a plan view and a cross-sectional view, respectively, in FIGS. 7(^) and (B). This method is suitable for continuous operation by continuously supplying a conductive film to a long flexible circuit board.The present invention solves the above-mentioned conventional drawbacks, It is an object of the present invention to provide a conductive film cutting device for continuously supplying a conductive film and automatically performing a crimping operation, and a method for cutting a conductive film for efficient crimping.

[Means for Solving the Problems] In order to achieve such an object, the device of the present invention includes a first driving means for feeding a long flexible circuit board, and a long flexible circuit board laminated with a protective film. a second driving means for feeding a conductive adhesive film of a length, a crimping means for crimping a conductive adhesive film of a predetermined size to a predetermined location of a flexible circuit board, and a crimping part of the conductive adhesive film. a heated cutter that presses the vicinity; a third driving means for moving the cutter up and down; It is characterized by comprising second and third drive means and a control means for controlling the crimping means.

In the method of the present invention, a conductive adhesive film supported on a support is crimped to a predetermined location of a flexible circuit board over a predetermined length, and the vicinity of the crimped portion of the conductive adhesive film is heated from above the support. The method is characterized in that the conductive adhesive film is cut by pressing with a cutting tool to deform the conductive adhesive film and applying tension to the support.

[Function] According to the present invention, after both the long flexible circuit board and the long conductive film are fed and the conductive film of a predetermined length is crimped to a predetermined position of the flexible circuit board, the conductive film is Since the conductive film is cut, the conductive film can be used without wasting it, and the bonding work can be performed continuously and automatically.

[Example] The present invention will be described in detail below with reference to the drawings.

FIG. 1 is a front view showing an outline of a conductive film laminating machine that uses a conductive film cutting device according to the present invention.

This device is a device for bonding a conductive adhesive 2 to a flexible circuit board 1.

As shown in FIG. 2, the folding circuit board 1 is provided with perforations 3 at its side ends. An integrated circuit 4 is already mounted at a predetermined position on the substrate 1.

5 and 6 are wiring patterns. By the apparatus shown in FIG. 1, a conductive Di 2 of a predetermined size is pasted on one wiring pattern 5, and necessary terminals of a device such as a liquid crystal display controlled by an integrated circuit 4 are connected to the wiring pattern 5. Through the process, it is connected to the wiring pattern 5 via this conductive film 2. Note that, as shown in the figure, no conductive film is bonded to the wiring pattern to which no integrated circuit is attached. IC is a guide film.

The film-like flexible circuit board 1 has a thickness of, for example, 1
The conductive film 2 is made of polyimide resin with a thickness of about 00 μm.
For example, a film made of a thermoplastic resin film having conductivity only in the thickness direction and laminated with a conductive film 2 and a protective film 2^ as disclosed in Japanese Patent Application Laid-Open No. 81-55809 can be used.

Before explaining the present invention in detail, the apparatus shown in the first figure will be briefly explained.

In the figure, 11 is the main body of the device. The flexible circuit board 1 is wound around the supply reel 12 in an overlapping manner with a protective film IA for protecting the attached integrated circuit. The rotating shaft 12A of the supply reel 12 is driven to move the flexible circuit board 1 to the idler 13. It is sent to the working position A via the tension roller 14 and the guide roller 15, and further guided to the sprocket 16 via the section A. At this time, the protective film IA is placed on the idler 17. It is wound onto a take-up reel 20 via a tension roller 18 and an idler 19. A base 20 is equipped with a pressure bonding head 21 for bonding the conductive film 2 to the flexible circuit board 1 and a cutter for cutting the conductive film 2 to a predetermined size, and is movable up and down on the frame 22 of the main body 11. The conductive film 2 is wound around the supply reel 23 in a laminated state with the protective film 2A. Rotating shaft 23 of reel 23
A is driven to send out the conductive film 2 together with the protective film 2A. The conductive film 2 sent out passes through idlers 24, 25, tension rollers 26, and guide rollers 27, and reaches the pressure bonding head 2I. After the bonding of the conductive film and the flexible circuit board is completed, the protection 11i2^ is pulled up by the feed roller 28, and then moved to the guide roller 29. idler 30
．． 31! s and tension roller 32, and then wound onto a take-up reel 33. The flexible circuit board that has been bonded passes through a tension roller 34 and a guide roller 35 and is then transferred to the next unit, for example, the press unit 3.
6.

In the process of transferring the flexible circuit board and conductive film, each film or film is moved by tension rollers 14, 18, 26 so that the tension caused by the difference between the feeding speed and the winding speed is balanced with the strength of the film or film. ．．
32 and 34. for example,
The tension roller 14 is supported by one end of an arm 14B that can be moved downwardly by a shaft 14A, and a counterweight 14C is fixed to the other end of the arm 14B, so that the tension roller 14 moves up and down as the tension changes. Axis 18A, 26^ for tension rollers 18, 21i and 34
, 34A, arms 188, 288° 34B and counterweights 18C, 26G, 311C are completely similar in function to 14^, 14B and 14c, respectively. Although not shown, the tension roller 32 also operates in exactly the same way as the other tension rollers.

In this device, a flexible circuit board to which a guide film is connected in the same way as in the conventional example is connected to the sensor 4.
0 to first position the work area and finely adjust the position using the sensor 50.
The conductive film 2 is bonded by the following method. After that, the conductive film 2 is cut with a cutter, and the bonding condition is inspected by the bonding inspection device 60, and then the next step is performed.

The above series of operations and the adjustment of the feeding and winding speeds of each film and film can be controlled by one control device, for example, a microprocessor.

FIG. 3 shows an enlarged view of the apparatus shown in FIG. 1 near the working position.

Reference numeral 11A denotes a pedestal that forms part of the main body 11, and a frame 22 is fixed thereto. 16A is a holding roller, 22^ is a cylinder for moving the base 20, and 22B is its guide. 70 is a cutter not shown in FIG. OA is a cylinder that moves the cutter 70 on the base 20, and 70B is its guide.

The sensor 40 shown in FIG. 1 is installed on the pedestal 1111 attached to the pedestal 11A. More specifically, the sensor 40 consists of a first sensor 41 for detecting an integrated circuit, a second sensor 42 for detecting half-omission, a third sensor 43 for checking for defects, and a mounting base 44 for mounting them. ing.

The sensors 41, 42, and 43 each consist of a light-emitting component such as an LED and a light-concentrating component such as a phototransistor.
In this example, the presence or absence of the detection object is detected by irradiating light emitted from the light-emitting component onto the detection object and detecting the presence or absence of reflected light.

The position at which the sensors 41 and 42 detect the electronic component 4 and the perforation, respectively, is a position one electronic component before the position where the conductive film 2 is pressed onto the flexible circuit board 1, that is, a preparation position. The flexible circuit board 1 is positioned when the electronic component 4 comes to this position, is fed a predetermined distance to the work position, and the position is accurately adjusted by the sensor 50, and the conductive film is crimped and cut.

The cutting operation will be explained with reference to the flowchart in FIG.

The control device drives the sprocket 16 by a pulse motor (not shown) and also drives the supply reel 12 to feed the flexible circuit board 1 (step 51). When the sensor 50 detects that the flexible circuit board l has reached the working position (step S2), the control device drives the supply reel 23 and the feed roller 28 by a pulse motor (not shown) to Membrane 2^
The laminate is fed to the lower surface of the crimping head 21 (step S3). Then, in step S4, the control device sends fluid such as air to the cylinder 22^ fixed to the frame 22, and the base 20 and the seat 20 are fed to the base 20. The crimping head 21 fixed via the frame 22 is lowered along the guide 22B fixed to the frame 22, and the conductive film 2 is crimped at a predetermined position on the flexible circuit board. The pressure bonding head 21 is heated to 100 to 150[deg.] C., and the conductive film 2 made of thermoplastic resin is well bonded onto the flexible circuit board. Next, in step S5, fluid such as air is supplied to the cylinder 70^ fixed to the base 20, and the heat insulating material 7
The cutter 70 fixed at 0G is lowered along the guide 70B fixed to the base 20. The portion of the conductive film pressed by the cutter 70 heated to about 200° C. becomes thinner. When the fluid supply to the cylinder 70A is stopped and the cutter 70 is raised, the tension acting on the laminate of the conductive film 2 and the protective film 2^ causes the high-strength protection film 2^ made of Teflon or the like to be removed. conductive film 2 laminated on
only is disconnected. When the supply of fluid to the cylinder 22^ is stopped and the crimping bed 21 is raised, the crimped conductive film is peeled off from the protective film and remains on the flexible circuit board, completing the crimping. Thereafter, in step S6, the same operation is repeated while advancing the position of the electronic components one by one until it is determined that all bonding is completed.

FIG. 5 shows how the conductive film is cut. The figure (^) shows a state in which the conductive film 2 and the flexible circuit board 1 are crimped by the crimping head 21. As shown in FIG. 3B, the cutter 70 presses the upstream side of the flexible circuit board in the transfer direction against the crimping portion. The tip of the cutter 70 is
In order not to damage i[2A, it is made into a flat shape with a thickness of, for example, about 0.5μI. The conductor @2 made of thermoplastic resin is deformed by the pressure of the cutter 70 heated to about 200° C., and only the pressed portion becomes thinner. At this point, when the cutter 70 is raised, the conductive film 11!2 is cut off due to the tension acting on the laminate of the conductive film 2 and the protection 112A, as shown in FIG. 2(C). Next, the same figure (
0), when the crimping head 21 is raised, the conductive @2 crimped onto the flexible circuit board 1 is peeled off from the protective film 2^, and the crimping work is completed.

[Effects of the Invention] As explained above, according to the present invention, both a long flexible circuit board and a long conductive film are fed, and a predetermined length of the conductive film is placed at a predetermined position on the flexible circuit board. Since the conductive film is cut after being crimped, the conductive film can be used without waste, and the bonding work can be performed continuously and automatically.

[Brief explanation of the drawing]

Fig. 1 is a front view of a conductive film laminating machine to which the conductive adhesive film cutting device of the present invention is applied, Fig. 2 is a plan view of a flexible circuit board, and Fig. 3 is a partially enlarged view of the conductive film laminating machine. , FIG. 4 is a flowchart explaining the present invention in detail, FIG. 5 is a diagram explaining the state of cutting the conductive film, and FIGS. 6 and 7 are diagrams showing the conventional conductive adhesive film. DESCRIPTION OF SYMBOLS 1... Flexible circuit board, 2... Conductive film, 3... Perforation, 4... Electronic component, 16... Sprocket, 21... Crimping cylinder, 22^... Cylinder, 40... ...Sensor, 41...Sensor for electronic parts, 42...Sensor for perforation, 70...Cutter, 70A...Cylinder. 61Ei pear turn 2nd figure 3rd figure 4th mountain

Claims (1)

[Claims] 1) A first device for feeding a long flexible circuit board
a second driving means for feeding the elongated conductive adhesive film laminated with the protective film; and a second drive means for press-bonding the conductive adhesive film of a predetermined size to a predetermined location of the flexible circuit board. a heated cutter for pressing the vicinity of the crimped portion of the conductive adhesive film; a third driving means for vertically moving the cutter; and a third drive means for moving the cutter up and down; 1. A cutting device for a conductive adhesive film, comprising a drive means and a control means for controlling a pressure bonding means. 2) A conductive adhesive film supported on a support is crimped to a predetermined location on a flexible circuit board over a predetermined length, and the vicinity of the crimped portion of the conductive adhesive film is heated from above the support. A method for cutting a conductive adhesive film, the method comprising: deforming the conductive adhesive film by pressing with a cutter cutter, and applying tension to the support to cut the conductive adhesive film. .