WO2013179533A1

WO2013179533A1 - Acf bonding apparatus and acf bonding method

Info

Publication number: WO2013179533A1
Application number: PCT/JP2013/001413
Authority: WO
Inventors: 真五山田
Original assignee: パナソニック株式会社
Priority date: 2012-05-31
Filing date: 2013-03-06
Publication date: 2013-12-05
Also published as: JP5838305B2; JP2013251357A

Abstract

A tape member (Tp) is transported horizontally, an ACF segment (4s) which has been formed on a base tape (BT) by cutting a lead portion of an ACF tape (4) is positioned above a segment bonding area (3) on a substrate (2), and thereafter the AFC segment (4s) is pressed and bonded to the substrate (2) by means of a pressing tool (30). The base tape (BT) is removed from the ACF segment (4s) bonded to the substrate (2) by moving delamination pins (26) horizontally towards the upstream side of the transport direction of the tape material (Tp).

Description

ACF sticking apparatus and ACF sticking method

The present invention relates to an ACF adhering apparatus and an ACF adhering method for adhering an ACF slice made of an anisotropic conductive film against a substrate.

In a module manufacturing process such as a liquid crystal panel, an ACF adhering operation for adhering a slice (ACF slice) of an ACF (Anisotropic Conductive Film) tape made of an anisotropic conductive film to a substrate is performed by an ACF adhering apparatus. The ACF adhering device conveys a tape member formed by adhering an ACF tape to one side of a base tape, and an ACF section formed on the base tape by cutting the ACF tape at the head in the conveying direction of the tape member. A tape transport unit that positions the ACF section in a horizontal position above the section attachment site on the substrate, and the ACF section positioned in a horizontal position above the section attachment site on the substrate by the tape transport unit is pressed against the substrate by a pressing tool. After the pressing tool is pressed by the section attaching means to be attached and the section attaching means to attach the ACF section to the section attaching section on the substrate, the base tape is peeled from the ACF section attached to the substrate. It is the structure provided with the peeling mechanism.

The peeling mechanism is a pair of peeling members (usually pin members) arranged so as to be in contact with the upper surface side and the lower surface side of the base tape at a position downstream of the ACF section adhered to the substrate in the transport direction of the tape member. (Or a roller member) is horizontally moved toward the upstream side in the transport direction of the tape member, so that the base tape extending obliquely upward from the end of the ACF slice attached to the substrate is brought close to a vertical posture. The base tape is peeled from the ACF section by going (for example, Patent Document 1). The base tape tilt angle at the start of the movement of the peeling member is as stable as possible from the ACF section. Conventionally, the peeling member moves down so as to approach the substrate once before the peeling operation of the base tape is started, The inclination angle of Sutepu from the smaller was supposed to start a horizontal move.

Japanese Unexamined Patent Publication No. 2000-340616

However, the conventional ACF adhering apparatus requires a mechanism for moving the peeling member up and down, and there is a problem that the configuration becomes complicated and the cost is increased.

Therefore, an object of the present invention is to provide an ACF adhering apparatus and an ACF adhering method capable of performing stable peeling of a base tape with a simple configuration.

The ACF adhering apparatus of the present invention conveys a tape member formed by adhering an ACF tape to one side of a base tape, and the ACF tape at the head portion in the conveying direction of the tape member is cut to remove the ACF tape on the base tape. The ACF section formed on the substrate is positioned in a horizontal position above the section attachment site on the substrate, and is positioned in a horizontal position above the section attachment site on the substrate by the tape transport unit. A section adhering means for adhering the ACF slice to the substrate with a pressing tool, and the pressing tool is pressed by the section adhering means so that the ACF section is adhered to the section adhering site on the substrate. The substrate raising means for raising the substrate, and the ACF slice attached to the substrate after the substrate is raised by the substrate raising means. Also, a pair of peeling members arranged so as to be in contact with the upper surface side and the lower surface side of the base tape at the downstream position in the transport direction of the tape member are horizontally moved toward the upstream side in the transport direction of the tape member. And a peeling mechanism for peeling the base tape from the ACF slice adhered to the substrate.

The ACF adhering method of the present invention conveys a tape member formed by adhering an ACF tape to one side of a base tape, cuts the ACF tape at the leading portion in the conveying direction of the tape member, and The tape transporting step for horizontally positioning the ACF section formed in the upper part of the section sticking site on the substrate, and the horizontal positioning of the ACF section in the tape transporting step above the section sticking site on the substrate. After affixing the ACF section on the substrate with a pressing tool, and affixing the ACF section to the section affixing site on the substrate by pressing the pressing tool in the section adhering step, A substrate raising step for raising the substrate, and a method of transporting the tape member rather than the ACF slice adhered to the substrate after raising the substrate in the substrate raising step A pair of peeling members disposed so as to be in contact with the upper surface side and the lower surface side of the base tape at a position downstream of the tape are attached to the substrate by moving horizontally toward the upstream side in the transport direction of the tape member. And a peeling step of peeling the base tape from the ACF section.

In the present invention, after attaching the ACF section to the substrate, the substrate is lifted to reduce the inclination angle of the base tape extending from the end of the ACF section, and then the peeling member is moved horizontally. The base tape can be peeled stably without requiring a mechanism for moving the peeling member up and down.

The front view of the ACF sticking apparatus in one embodiment of the present invention The side view of the ACF sticking apparatus in one embodiment of this invention The fragmentary top view of the ACF sticking apparatus in one embodiment of this invention The block diagram which shows the control system of the ACF sticking apparatus in one embodiment of this invention (A), (b), (c) is operation | movement explanatory drawing of the ACF sticking operation | work which the ACF sticking apparatus in one embodiment of this invention performs (A), (b), (c) is operation | movement explanatory drawing of the ACF sticking operation | work which the ACF sticking apparatus in one embodiment of this invention performs (A), (b), (c) is operation | movement explanatory drawing of the ACF sticking operation | work which the ACF sticking apparatus in one embodiment of this invention performs

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The ACF adhering apparatus 1 shown in FIG. 1, FIG. 2 and FIG. 3 constitutes a liquid crystal panel production line together with an electrode cleaning apparatus arranged on the upstream process side, a temporary crimping apparatus arranged on the downstream process side, a main crimping apparatus and the like. After receiving the substrate 2 as the liquid crystal panel substrate from the electrode cleaning device on the upstream process side, a plurality of section pasting sites 3 (each section pasting site 3 provided on the edge of the upper surface of the substrate 2 are provided. Each of which includes a plurality of electrodes 3a), a piece of ACF tape 4 (ACF piece 4s) made of an anisotropic conductive film is attached to each of the electrodes, and the substrate 2 is received by a temporary pressure bonding apparatus on the downstream process side. It is what you pass. In the ACF sticking apparatus 1 in the present embodiment, the ACF tape 4 is supplied in the state of a tape member Tp stuck on one side of the base tape BT, as shown in the enlarged view in FIG.

1, 2, and 3, the ACF adhering apparatus 1 includes an X-axis table 11 a and an X-axis table 11 a that are provided on a base 10 so as to extend in the X-axis direction (front-rear direction as viewed from an operator not shown). Can be moved along the Y-axis table 11b and the Y-axis table 11b provided extending in the Y-axis direction (left-right direction as viewed from the operator), and can be moved up and down with respect to the Y-axis table 11b. And a table-like substrate holding portion 12 provided movably in a horizontal plane by a substrate holding portion moving mechanism 11 comprising a θ table 11c provided so as to be rotatable about a vertical axis (Z axis), and extends in the X-axis direction. Further, a sticking head 14 supported by the frame 13 and a backup stage 15 standing in the rear of the substrate holding unit moving mechanism 11 and extending in the X-axis direction are provided.

1 and 2, a base plate 20 that is a base portion of the sticking head 14 is fixed to a frame 13, and a tape supply reel 21 is attached to an upper front portion of the base plate 20. The tape supply reel 21 is driven by a supply reel drive motor 21a provided on the back side of the base plate 20 to feed out and supply the tape member Tp.

A tape transport unit 22 for transporting the tape member Tp supplied by the tape supply reel 21 is provided on the front surface of the base plate 20. The tape transport unit 22 is fed by a pair of feed rollers 23 that perform a feed operation of the tape member Tp across the portion of the base tape BT of the tape member Tp supplied by the tape supply reel 21, and the pair of feed rollers 23. A plurality of tape guide rollers (first guide roller 24a, second guide roller 24b, third guide roller 24c) for guiding the tape member Tp along a predetermined path and the base tape BT pulled by the feed roller 23 are sucked. And a tape recovery unit 25 for recovery.

In FIG. 1, among the plurality of guide rollers, the first guide roller 24a is movable in a roller moving groove 20a formed in the upper left portion of the base plate 20 so as to extend in the vertical direction. It is biased upward. The second guide roller 24b is provided below the first guide roller 24a and on the lower left side of the base plate 20, and the third guide roller 24c is on the right side of the second guide roller 24b and on the right side of the base plate 20. It is provided at the bottom. The pair of feed rollers 23 is provided above the third guide roller 24c and aligned in the left-right direction at the center on the right side of the base plate 20.

Of the tape member Tp conveyed by the tape conveying unit 22, the region between the second guide roller 24b and the third guide roller 24c is in contact with the upper surface side and the lower surface side of the base tape BT of the tape member Tp, respectively. A pair of arranged peeling pins 26 (a peeling member, which may be a roller in addition to a pin) are provided, and the tape member Tp between the second guide roller 24b and the peeling pin 26 is held in a horizontal posture. Is done. The two peeling pins 26 are fixed to a moving base 27 that is movable in the horizontal direction with respect to the base plate 20.

The feed roller 23 feeds the tape member Tp by rotating the feed roller drive motor 23 a (FIG. 2) provided on the back side of the base plate 20, and the tape collection unit 25 is a tape provided on the back side of the base plate 20. The suction operation of the base tape BT is performed by the operation of the recovery unit driving unit 25a (FIG. 2).

The tape member Tp fed out from the tape supply reel 21 is given an appropriate tension by the first guide roller 24a being biased upward in the roller moving groove 20a, and the first guide roller 24a and the second guide roller 24b, the left region of the base plate 20 is held in a vertically extending posture, and the lower region of the base plate 20 is extended in the horizontal (left / right) direction between the second guide roller 24b and the peeling pin 26. Retained. Further, the tape member Tp is held between the third guide roller 24c and the feed roller 23 in a posture in which the right region of the base plate 20 extends in the vertical direction.

The tape transport unit 22 rotates the feed roller 23 in the forward direction while sucking the base tape BT of the tape member Tp delivered by the tape supply reel 21 by the tape recovery unit 25, thereby moving the tape member Tp in the forward direction (second guide roller). 24b and the third guide roller 24c in the direction of flowing from left to right (arrow A shown in FIG. 1), and the base tape BT of the tape member Tp that the tape supply reel 21 winds can be conveyed. The tape member Tp is rotated in the reverse direction by rotating the feed roller 23 in the reverse direction while being sucked by the tape collecting unit 25 (the direction between the second guide roller 24b and the third guide roller 24c flows from right to left). It can be returned (conveyance return is performed).

A portion of the ACF tape 4 in the tape member Tp is located on the left side of the front surface of the base plate 20 and sandwiches the tape member Tp guided in the vertical direction by the first guide roller 24a and the second guide roller 24b from both the left and right sides. A tape cutting unit 28 that cuts only half (half cut) to form the ACF slice 4s is provided.

The tape cutting unit 28 is movable in the left-right direction (that is, the direction orthogonal to the surface of the tape member Tp) in the left region of the tape member Tp extending vertically between the first guide roller 24a and the second guide roller 24b. The cutter 28a, the cutter drive cylinder 28b for driving the cutter 28a so that the cutter 28a moves between the left storage position and the right protrusion position (arrow B shown in FIG. 1) and the first Provided at the position facing the cutter 28a in the horizontal direction in the right region of the tape member Tp extending in the vertical direction between the guide roller 24a and the second guide roller 24b (that is, the position where the tape member Tp is sandwiched between the cutter 28a). The back plate portion 28c is formed.

In the tape cutting unit 28, a clearance corresponding to the thickness of the base tape BT is secured between the cutter 28a and the back plate portion 28c in a state of being in the protruding position. For this reason, when the cutter drive cylinder 28b moves the cutter 28a from the storage position to the protruding position with the tape member Tp extending vertically between the first guide roller 24a and the second guide roller 24b, the tape The cutter 28a is pressed perpendicularly to the ACF tape 4 on the left side of the member Tp, and only the ACF tape 4 is cut from the tape member Tp. At this time, the back plate portion 28 c functions as a contact plate that supports the base tape BT on the right side of the tape member Tp and takes the reaction force of the pressing load of the cutter 28 a against the ACF tape 4.

In FIG. 1, a tool elevating cylinder 29 is provided at the center of the front surface of the base plate 20 and below the tape supply reel 21 with the piston rod 29 a facing downward, and at the lower end of the piston rod 29 a of the tool elevating cylinder 29. A pressing tool 30 is attached.

As shown in FIGS. 1 and 2, the pressing tool 30 is positioned above the backup stage 15. When the pressing tool 30 is moved downward from the upper position to the lower position by the tool elevating cylinder 29, the pressing tool 30 is moved to the second guide roller. The tape member Tp held in the horizontal posture by the b and the peeling pin 26 is pushed downward to bring the tape member Tp close to the upper surface of the backup stage 15. For this reason, if the ACF slice 4s is positioned below the pressing tool 30 with the substrate 2 in contact with the upper surface of the backup stage 15, the ACF slice 4s is pressed against the substrate 2 by the downward movement of the pressing tool 30. Pasted. In the pressing tool 30, a heater 31 (FIGS. 1 and 2) for heating the pressing tool 30 in advance before the ACF slice 4s is attached to the substrate 2 is provided.

In FIG. 1, an imaging camera 32 is provided on the right side of the base plate 20 with the imaging field of view directed downward. The imaging camera 32 has two positioning marks 2m (FIG. 3) at the end in the X-axis direction of the substrate 2 positioned immediately below the imaging field of view when the substrate holding unit moving mechanism 11 moves the substrate 2 in the horizontal direction. ) From above.

In the movement operation of the substrate 2 held by the substrate holding unit 12, the control device 40 controls the operation of the substrate holding unit drive mechanism 41 (FIG. 4) including the X-axis table 11a, the Y-axis table 11b, and the θ table 11c (not shown). Made by doing.

The transport operation of the tape member Tp by the tape transport unit 22 is performed when the control device 40 controls the operation of the supply reel drive motor 21a, the feed roller drive motor 23a, and the tape recovery unit drive unit 25a (FIG. 4). The position of the leading portion of the ACF tape 4 at Tp is the information on the rotational speed of one feed roller 23 detected by the rotational speed detection sensor 42 (FIG. 4) provided on the base plate 20 and the radius of the feed roller 23. It is calculated in the control device 40 from data or the like.

The movement operation of the cutter 28a in the left-right direction in the tape cutting unit 28, that is, the cutting (half-cut) operation of the ACF tape 4 by the cutter 28a is performed by the control device 40 controlling the operation of the cutter driving cylinder 28b (FIG. 4). ), The raising / lowering operation of the pressing tool 30 is performed when the control device 40 controls the operation of the tool raising / lowering cylinder 29. The heating control of the heater 31 provided inside the pressing tool 30 is performed by the control device 40 (FIG. 4).

The moving base 27 to which the two peeling pins 26 are attached is a standby position (the position shown in FIG. 1) when the moving base drive mechanism 27a (FIG. 4) provided on the base plate 20 is controlled by the control device 40. , The position to the right of the pressing tool 30) and the left peeling position (position reaching the lower end of the left end of the pressing tool 30).

Imaging operation control by the imaging camera 32 is performed by the control device 40 (FIG. 4), and image data captured by the imaging camera 32 is sent to the control device 40 and image recognition is performed by the image recognition unit 40a (FIG. 4) of the control device 40. Is done.

Next, it was held by the substrate holding part 12 by the ACF sticking apparatus 1 using the operation explanatory diagrams of FIGS. 5 (a), (b), (c) to FIGS. 7 (a), (b), (c). An execution procedure of an operation of attaching the ACF section 4s to each section attaching portion 3 on the substrate 2 (ACF attaching work) will be described.

In the ACF adhering operation, the control device 40 first controls the operation of the substrate holding unit moving mechanism 11 to move the substrate 2 in the horizontal plane direction, and two positioning marks provided on the substrate 2 by the imaging camera 32. 2m is imaged, image recognition is performed, and the position is calculated. When the overall position of the substrate 2 is grasped by this, the control device 40 moves the substrate holding part 12 again, and the left end of the section attaching portion 3 to be attached with the ACF section 4s on the substrate 2 is pressed by the tool. The substrate 2 is positioned so as to be positioned below the left end of the line 30 (arrow C shown in FIG. 5A), and the supply reel drive motor 21a, the feed roller drive motor 23a, and the tape collecting unit drive unit 25a are operated. Control is performed to transport the tape member Tp (arrow D shown in FIG. 5A), and the ACF section 4s positioned at the head of the ACF tape 4 is pressed and the section pasting is positioned below the tool 30 Located above site 3. Specifically, the last part of the ACF section 4s to be pasted is positioned above the left end of the section pasting site 3 (below the left end of the pressing tool 30) (FIG. 5A). Process).

After performing the tape transport process, the control device 40 controls the operation of the substrate holding unit moving mechanism 11 to lower the substrate holding unit 12 and tries to attach the ACF slice 4s on the lower surface of the substrate 2 from now on. The part immediately below the section sticking site 3 is brought into contact with the upper surface of the backup stage 15 (FIG. 5 (b), arrow E1 shown in the figure). Then, the operation of the tool elevating cylinder 29 is controlled to move the pressing tool 30 downward from the upper position to the lower position (arrow F1 shown in FIG. 5C), and the pressing tool 30 heated in advance by the heater 31. Thus, the ACF slice 4s is pressed against the substrate 2 together with the base tape BT, and the ACF slice 4s is stuck to the slice sticking site 3 on the substrate 2 (FIG. 5C). As a result, when the ACF slice 4s is stuck to the slice sticking portion 3 on the substrate 2, the control device 40 operates the tool lifting cylinder 29 to raise the pressing tool 30 (FIG. 6A). Arrow F2 shown, section sticking step).

As described above, in the state where the pressing tool 30 is moved from the lower position to the upper position, the tape member Tp (from the both ends of the ACF slice 4s adhered on the substrate 2 as shown in FIG. On the right side of the ACF section 4s, the base tape BT) is inclined and extended upward, and the control device 40 raises the pressing tool 30 by using the tool lifting cylinder 29 or raises the pressing tool 30. At the same time, the operation of the substrate holding unit moving mechanism 11 is controlled to raise the substrate 2 (arrow E2 shown in FIG. 6A). As a result, the inclination angle φ of the tape member Tp extending from both ends of the ACF segment 4s from the horizontal plane decreases from φ1 (FIG. 5C) to φ2 (FIG. 6A).

When the control device 40 raises the substrate 2 in the substrate raising step, the control device 40 sandwiches the base tape BT at a position downstream of the ACF slice 4s adhered to the substrate 2 in the transport direction of the tape member Tp. The peeling pin 26 is moved together with the moving base 27 toward the upstream side in the transport direction of the tape member Tp (the direction opposite to the arrow A in FIG. 1) from the standby position to the peeling position. The base tape BT is peeled from the attached ACF slice 4s (FIG. 6 (b) → FIG. 6 (c). Arrow G1 shown in these drawings, peeling step).

In this peeling process, since the inclination angle φ of the base tape BT extending from the end of the ACF segment 4s is reduced in the above-described substrate raising process, the peeling pin 26 is moved horizontally, so that the base tape BT is stable. In this state, it is peeled off from the ACF slice 4s.

When the controller 40 executes the peeling process as described above, the two peeling pins 26 are moved horizontally together with the moving base 27 toward the downstream side in the transport direction of the tape member Tp (in the direction of arrow A in FIG. 1). To return to the standby position (FIG. 7 (a), arrow G2 shown in the figure). In parallel with this, the ACF tape 4 is cut (half cut) by the tape cutting unit 28 (arrow H shown in FIG. 7B) to form a new ACF slice 4s on the base tape BT. (FIG. 7B). Before cutting the ACF tape 4, the tape member Tp is transported or transported back as necessary, and the length of the ACF section 4 s after cutting corresponds to the length of the section pasting part 3. The predetermined length is set.

When the control device 40 cuts the ACF tape 4, the control device 40 moves the ACF slice 4 s newly positioned at the head of the ACF tape 4 after the ACF slice 4 s is pasted onto the substrate 2 (see FIG. 1). The substrate holding part 12 is moved so as to be attached to the section attaching part 3 (on the left), and the left end of the section attaching part 3 to which the ACF section 4s is attached is located below the left end of the pressing tool 30. In this way, the substrate 2 is positioned (arrow C shown in FIG. 7C) and the tape member Tp is transported (arrow D shown in FIG. 7C) to newly start the ACF tape 4. The ACF section 4s that is supposed to be located in the section is positioned above the section pasting site 3 (FIG. 7 (c), tape transport step). Since this state is exactly the same as the state shown in FIG. 5 (a) except that the section pasting site 3 is different, the ACF for all the section pasting sites 3 on the substrate 2 is repeated by repeating the above steps. The section 4s can be attached.

As described above, the ACF adhering apparatus 1 according to the present embodiment conveys the tape member Tp formed by adhering the ACF tape to one side of the base tape BT, and the ACF tape at the head in the conveying direction of the tape member Tp. 4 is cut, and the ACF slice 4s formed on the base tape BT is positioned in a horizontal position above the slice sticking portion 3 on the substrate 2. A tool lifting cylinder 29 as a section sticking means for pressing and sticking the ACF section 4s positioned in a horizontal position above the attachment part 3 to the substrate 2 by the pressing tool 30, and the pressing tool 30 is pressed by the tool lifting cylinder 29. After the ACF slice 4s is pasted on the slice pasting site 3 on the substrate 2, the substrate holding portion is moved as a substrate raising means for raising the substrate 2. After the substrate 2 is lifted by the mechanism 11 and the substrate holding part moving mechanism 11, the upper surface side and the lower surface of the base tape BT are positioned downstream of the ACF slice 4s adhered to the substrate 2 in the transport direction of the tape member Tp. A pair of peeling pins 26 (peeling members) arranged so as to be in contact with each side are horizontally moved toward the upstream side in the transport direction of the tape member Tp to thereby move the base tape BT from the ACF slice 4s adhered to the substrate 2 The movable base drive mechanism 27a is provided as a peeling mechanism that peels the film.

The ACF adhering method using the ACF adhering apparatus 1 conveys the tape member Tp formed by adhering the ACF tape 4 to one side of the base tape BT, and the ACF tape at the head in the conveying direction of the tape member Tp. 4 is cut to form the ACF section 4s formed on the base tape BT in a horizontal position above the section attaching portion 3 on the substrate 2, and the section attaching portion 3 on the substrate 2 in the tape conveying step. The ACF section 4s positioned in a horizontal position above the substrate 2 is pressed against the substrate 2 with a pressing tool and pasted, and the pressing tool 30 is pressed in the section pasting process so that the ACF section 4s is pasted onto the substrate 2 After being attached to the attachment part 3, the tape part is higher than the ACF slice 4s attached to the substrate 2 after the substrate 2 is raised in the substrate raising step and the substrate raising step for raising the substrate 2. By horizontally moving the pair of peeling pins 26 arranged so as to be in contact with the upper surface side and the lower surface side of the base tape BT at the downstream position in the transport direction of Tp, toward the upstream side in the transport direction of the tape member Tp. It includes a peeling step of peeling the base tape BT from the ACF slice 4s adhered to the substrate 2.

In ACF adhering apparatus 1 (ACF adhering method) according to the present embodiment, after attaching ACF slice 4s to substrate 2, substrate 2 is lifted and the base tape BT extends from the end of ACF slice 4s. Since the peeling member (peeling pin 26) is moved horizontally after the angle φ is reduced, stable peeling of the base tape BT can be achieved with a simple configuration without requiring a mechanism for moving the peeling member up and down. It can be carried out.

This application is based on a Japanese patent application filed on May 31, 2012 (Japanese Patent Application No. 2012-124099), the contents of which are incorporated herein by reference.

Provided is an ACF adhering apparatus and an ACF adhering method capable of performing stable peeling of a base tape with a simple configuration.

DESCRIPTION OF SYMBOLS 1 ACF sticking apparatus 2 Substrate 3 Section sticking part 4 ACF tape 4s ACF slice 11 Substrate holding part moving mechanism (board raising means)
22 Tape transport unit 26 Peeling pin (peeling member)
27a Movement base drive mechanism (peeling mechanism)
29 Tool lifting cylinder (section sticking means)
30 Pressing tool BT Base tape Tp Tape member

Claims

A tape member formed by attaching an ACF tape to one side of the base tape is transported, and the ACF tape formed on the base tape is cut on the base tape by cutting the ACF tape at the head in the transport direction of the tape member. A tape transport unit that is positioned in a horizontal position above the section attachment site of
Section attaching means for attaching the ACF section, which is positioned in a horizontal posture above the section attaching portion on the substrate by the tape transport unit, to the substrate by pressing the ACF section,
Substrate raising means for raising the substrate after the pressing tool is pressed by the section attaching means and the ACF section is attached to the section attaching portion on the substrate;
After the substrate is raised by the substrate raising means, the upper surface side and the lower surface side of the base tape are brought into contact with each other at a position downstream of the ACF section adhered to the substrate in the transport direction of the tape member. And a peeling mechanism for peeling the base tape from the ACF slice attached to the substrate by horizontally moving a pair of peeling members arranged on the substrate toward the upstream side in the transport direction of the tape member. ACF sticking device characterized by the above.
A tape member formed by attaching an ACF tape to one side of the base tape is transported, and the ACF section formed on the base tape is cut on the base tape by cutting the ACF tape at the head in the transport direction of the tape member. A tape transport step to be positioned in a horizontal posture above the section attachment site;
A section pasting step of pressing and pasting the ACF section positioned in a horizontal posture above the section pasting portion on the substrate in the tape conveying step by pressing against the substrate with a pressing tool;
A substrate raising step of raising the substrate after the ACF section is stuck to the section attaching portion on the substrate by pressing the pressing tool in the section attaching step;
After raising the substrate in the substrate raising step, the upper surface side and the lower surface side of the base tape are in contact with each other at a position downstream of the ACF slice adhered to the substrate in the transport direction of the tape member. And a peeling step of peeling the base tape from the ACF slice adhered to the substrate by horizontally moving a pair of peeling members arranged on the upstream side in the transport direction of the tape member. A method of attaching an ACF as a feature.