JP2010272702A - Anisotropic conductive material sticking device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To stick an anisotropic conductive material (ACF) on a sticking part of a substrate in a short tact with a low-costs device configuration. <P>SOLUTION: An ACF sticking device sticks the ACF on the sticking part 2a by pressing an ACF tape 5 by a sticking means 21, and peels a separator tape 5b from the stuck ACF by a peeling means 22. In the ACF sticking device, the sticking means 21, the peeling means 22 and a chuck means 23 for the separator tape 5b are arranged at a moving body 20 capable of moving along a side edge of the substrate 2, the ACF is stuck on the sticking part 2a by the sticking means 21 and the separator tape 5b is peeled by the peeling means 22 during movement of the moving body 20 in one direction, and the separator tape 5b is gripped by the chuck means 23 during return movement of the moving body 20 in the other direction to feed the ACF tape 5, thereby completing the sticking process in the process of moving the moving body 20 forward and backward once. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an anisotropic conductive material in which a laminated tape obtained by laminating an anisotropic conductive material on a separator tape is pressed against an application site disposed on a side edge of a substrate, and the anisotropic conductive material is applied to the application site. The present invention relates to a pasting device and a pasting method.

  As a method of mounting components on a substrate in a display panel such as a liquid crystal panel or a PDP (Plasma Display Panel), an anisotropic conductive material (hereinafter referred to as an electrode) disposed on the side edge of the substrate is used. , And may be described as ACF), and a part such as TCP (Tape Carrier Package), IC, thin LSI package component, FPC (Flexible Printed Circuits), COF (Chip On Film), etc. A method is known in which a component is mounted on a substrate by applying a temperature and a pressure to perform temporary pressure bonding and then applying a temperature and pressure higher than those of the temporary pressure bonding to perform main pressure bonding. In such a component mounting method, an ACF sticking apparatus using a laminated tape in which an ACF is laminated on a separator tape is used in order to stick an ACF to a sticking portion of a side edge of a substrate as described above.

  As a configuration of such an ACF sticking device, when the laminated tape is pulled out from the reel on which the laminated tape is wound and fed toward the sticking portion of the side edge portion of the substrate placed on the receiving portion, After cutting only the ACF to a predetermined length, the ACF is fed to a position above the pasting portion of the substrate, and the laminated tape is pressed by the pressure bonding means to stick the ACF cut to the predetermined length to the pasting portion of the substrate. Then, the separator tape is peeled off from the attached ACF to collect the separator tape tape, and the operation of feeding the next laminated tape is repeated.

  This type of ACF sticking apparatus will be described with reference to FIG. 11. The ACF sticking apparatus 41 moves and positions the substrate 42 supported by positioning means (not shown), and the side end of the substrate 42 is moved. While being supported from below by the lower receiving portion 43, the laminated tape 45 is supplied from the tape supply portion 44 and disposed on the side end portion of the substrate 42, and the laminated tape 45 is pressed from above by the crimping mechanism portion 46. The ACF is attached to the substrate 42, the separator tape is peeled off from the ACF attached to the substrate 42 by the peeling mechanism unit 47, and the separator tape of the peeled laminated tape 45 is collected by the tape collecting unit 48. ing. The pressure-bonding mechanism portion 46 has a pressure-bonding surface 49a facing the lower receiving portion 43 disposed below, and a pressure-bonding head 49 that performs a bonding operation of the laminated tape 45, and a cylinder device that drives the pressure-bonding head 49 up and down. The head lifting device 50 is provided. The crimping head 49 incorporates a heating means (not shown) so that the crimping surface 49a of the crimping head 49 can be heated to a predetermined temperature.

  On the other hand, as an ACF sticking device that can stick ACF to sticking parts of different lengths with a single heating tool, the substrate is supported by a support table so as to be horizontally movable, and a heating roller is provided between the tape guide and the peeling mechanism. The heating roller can be switched between a crimping position where the ACF is applied and a retracting position where interference with the peeling mechanism is avoided. The heating roller is positioned at the crimping position to heat the laminated tape. In a pressed state, the substrate is moved on the support table to attach the ACF to the application site, then the pressure roller is retracted to the retracted position, and then the release mechanism is moved to release the separator tape, and then the release mechanism is restored. There is known one in which a laminated tape is fed after being moved (see, for example, Patent Document 1).

Moreover, as an ACF sticking device, a sticking roller whose position can be switched between a sticking position where the ACF is pasted and a position retracted upwardly on a movable body that can reciprocate at least a distance corresponding to the length of the sticking part; A peeling roller for peeling the separator tape and a tape feed chuck for gripping the separator tape when feeding the laminated tape are arranged, and a chuck means for holding the separator tape at the time of peeling is arranged at the front position in the moving direction at the time of application. After moving the moving body forward while feeding the separator tape with the tape feeding chuck, the tape feeding chuck is opened and returned, and then the moving body is moved forward to apply the application roller. After pasting the ACF with the chuck means, the separator tape is gripped by the chuck means, and the moving body is moved backward with the sticking roller retracted. That so as to peel the separator tape at the release roller is known (e.g., see Patent Document 2).

  Also, as an ACF sticking device, the laminated tape is fed so that the ACF to be stuck is opposed to the sticking part of the substrate, and then the sticking part of the substrate is supported by the substrate support and heated by the heating means. Then, with the laminating tape pressed by the affixing roller, the affixing roller is moved to affix the ACF to the affixing site. The thing which peeled the separator tape by doing is known (for example, refer patent document 3).

Japanese Patent Laid-Open No. 9-211485 Japanese Patent No. 3738603 JP 2007-324471 A

  However, since the conventional example shown in FIG. 11 uses a crimping head 49 having a length corresponding to the length of the part to be bonded to the substrate 42, the crimping surface 49 a of the crimping head 49 and the lower receiving portion 43 are parallel to each other. If the degree of flatness and flatness are not ensured with a high degree of accuracy, a good quality sticking state cannot be obtained, and if the substrate 42 is enlarged and the length of the sticking part becomes long, a heavy and long pressure bonding head 49 is required. However, there is a problem that adjustment and maintenance for pressing and heating evenly over the entire length are troublesome because of the large size and high accuracy required for the large-sized device configuration. . The laminated tape feeding process, the affixing process in which the crimping head 49 of the crimping mechanism section 46 moves up and down, and the separator tape peeling process in which the peeling mechanism 47 reciprocates are sequentially performed. Since the operation process is sequentially performed separately, the ACF attaching process takes time, and it is difficult to reduce the tact time.

  On the other hand, in the configuration described in Patent Document 1, a heating roller is used instead of using a large pressure bonding head, and the ACF is attached by moving the substrate table that supports the substrate while heating and pressing the laminated tape with the heating roller. Therefore, the apparatus configuration of the sticking mechanism portion is not large, and high accuracy is not required for parallelism and flatness. Therefore, the cost of the apparatus configuration can be reduced and the maintainability can be improved. ACF sticking process by relative movement of substrate and substrate, separator tape peeling process by reciprocating movement of peeling mechanism, and laminated tape feeding process are sequentially performed. There is a problem that it is difficult to shorten the tact time of the process. Also, the heating roller is pressurized and heated, but because it is a roller, it is heated and pressurized by line contact, so the heat transfer efficiency is poor and it heats locally. If the heat transfer is attempted, the heat receiving part may be overheated and the ACF may be altered, and the locally pressurized part is moved, so that the conductive particles in the pressurized part of the ACF are pushed out to both sides. Therefore, there may be a problem that the distribution density of the conductive particles may vary.

  Also in the configuration described in Patent Document 2, the feeding process of the laminated tape, the application process of the ACF by the movement of the application roller when the moving body moves forward, and the separation of the separator tape by the movement of the peeling roller when the moving body moves backward Since it is configured to perform the peeling process, it is necessary to reciprocate the moving body twice for feeding the laminated tape, sticking the ACF, and peeling the separator tape. There is a problem that it is difficult to shorten the tact time of the process.

  In the configuration described in Patent Document 3, the heating is performed by the heating means on the substrate support side, but the feeding process of the laminated tape, the application of the ACF by the reciprocating movement of the application roller and the release roller, and the separator Since the tape peeling process is performed, the ACF sticking process takes time, and it is difficult to reduce the tact time of the ACF sticking process.

  In view of the above-described conventional problems, an object of the present invention is to provide an anisotropic conductive material sticking device and a sticking method capable of sticking an anisotropic conductive material in a short tact with a low-cost device configuration.

  An anisotropic conductive material pasting apparatus of the present invention includes a tape supply unit that supplies a laminated tape obtained by laminating an anisotropic conductive material on a separator tape, and a laminated tape supplied from the tape supply unit on a side edge of a substrate. A tape guiding means for guiding the tape to be disposed on a sticking site provided along the longitudinal direction; a sticking means for pressing the laminated tape from the separator tape side to stick the anisotropic conductive material to the sticking site; In the anisotropic conductive material pasting apparatus comprising a peeling means for peeling the separator tape from the attached anisotropic conductive material, and a tape collecting unit for collecting the separated separator tape, in the longitudinal direction of the side edge portion of the substrate A moving body movable along the moving body is provided, and a sticking means, a peeling means, and a separator tape chuck means from which the anisotropic conductive material is peeled are arranged on the moving body, and the sticking means is moved in one direction of the moving body. The separator tape is peeled off from the anisotropic conductive material pasted by the peeling means and the separator tape is peeled off by the chuck means when the moving body returns to the other direction. It grips and feeds a laminated tape.

  According to this configuration, since the sticking means, the peeling means, and the chuck means are arranged on the movable body that can move along the longitudinal direction of the side edge portion of the substrate, high precision parallelism and flatness are required. Even if it is a target for a large substrate, it can be a simple and low-cost structure, and when moving the moving body in one direction, the anisotropic conductive material is attached and the separator tape is peeled off. Since the separator tape is gripped by the chuck means during the return movement in the other direction and the laminated tape is fed, the sticking of the anisotropic conductive material can be completed by one reciprocation of the moving body, An anisotropic conductive material can be affixed with a short tact.

  The affixing means has a flat pressing part that presses the laminated tape from the separator tape side to the affixing part of the substrate and is thermally coupled to the heating means, and the pressing unit is in a pressed state and a pressed avoidance state. Switching means to switch between the two, the laminated tape is pressed by a flat pressing part, so there is no risk of excessive load acting locally, and the pressing force and heat are applied appropriately and uniformly. It is possible to secure a high-quality sticking state with high reliability without reaching the position where no pressing is required, without adversely affecting the distribution density of the conductive particles in the anisotropic conductive material. By switching to the pressing avoidance state at that time, it is possible to reliably paste without affecting the outside of the pasting range. As a method of thermally coupling the heating means to the pressing unit, any method such as a heat transfer method, a heat radiation method, or an electromagnetic induction heating method can be applied.

Further, the pressing unit is supported so that the intermediate portion can swing around the support shaft, the pressing unit is disposed on one end side of the pressing unit, and the switching unit is disposed on the other end side of the pressing unit. If a pressing force applying means for applying a pressing force by rotating and rotating around the support shaft and a pressing force adjusting means are provided, the pressing unit can swing around the support shaft, With a simple configuration that applies rotational biasing force by its own weight or a spring, etc., it is possible to apply the pressing force of the pressing unit in the pressing direction that presses the laminated tape from the separator tape side to the application part of the substrate, and reverse rotational biasing force It is possible to easily adjust the pressing force, and it is possible to switch to the pressing avoidance state by a simple switching means that pushes down the other end side of the pressing unit. Grant It is possible.

  In addition, when a heating means is provided in the lower support part that supports the side edge of the substrate, when the anisotropic conductive material is applied to the application site, it is applied to the application site of the substrate from the laminated tape side by the pressing unit. In addition to heating the anisotropic conductive material, the part to be attached to the substrate is also heated from the bottom side, so that the required heat can be reliably applied even when attaching at high speed, ensuring a high quality attachment state. can do.

  In addition, if the moving body is provided with a regulating roller that rolls in contact with the separator tape of the laminated tape and engages both side edges of the laminated tape at the forward position in the moving direction during the application movement, even if the application site is long Since the laminating tape can be reliably restrained from being displaced while the anisotropic conductive material is adhered by sliding while pressing the laminated tape at the pressing portion, the anisotropic conductive material It can be applied with high accuracy in the width direction.

  In the anisotropic conductive material sticking method of the present invention, the laminated tape obtained by laminating the anisotropic conductive material on the separator tape is disposed on the sticking portion provided along the longitudinal direction on the side edge of the substrate. And an attaching step for attaching an anisotropic conductive material to the application site by pressing the laminated tape from the separator tape side when moving in one direction with an attaching means moving along the longitudinal direction of the side edge of the substrate. And a peeling process for peeling the separator tape from the anisotropic conductive material attached by the peeling means that moves in one direction together with the sticking means, and an anisotropy by the chuck means when returning to the other direction of the sticking means A feeding step of gripping the separator tape from which the conductive conductive material has been peeled and feeding the laminated tape.

  According to this configuration, the sticking of the anisotropic conductive material can be completed by one reciprocating movement of the sticking means, the peeling means, and the chuck means as described above, and the anisotropic conductive material is stuck with a short tact. be able to.

  In addition, when the laminating tape is pressed against the affixing portion of the substrate from the separator tape side at the flat pressing portion heated and controlled to a predetermined temperature, the laminating tape is pressed at the flat pressing portion. There is no risk of excessive load acting locally on the anisotropic conductive material, and it is possible to apply pressing force and heat appropriately and uniformly, and adversely affect the distribution density of the conductive particles in the anisotropic conductive material It is possible to ensure a high-quality pasting state with high reliability.

  Further, in the peeling process, when the anisotropic conductive material is pasted on the pasting site by the pasting means when moving in one direction, the pasting means is retracted in the direction away from the pasting site on the substrate or is retracted. If the separator tape is peeled to the end of the pasting part by the peeling means by further moving the peeling means moving in one direction together with the sticking means in the state, the anisotropic conductive material to be applied next is affected. The anisotropic conductive material can be reliably affixed to the end of the affixed part without any problem.

In addition, when the side edge of the substrate is supported by a receiving part controlled to be heated to a predetermined temperature and the application part of the side edge of the board is heated, the pressing part is attached to the application part of the substrate from the laminated tape side. By heating not only the anisotropic conductive material, but also the part where the substrate is applied from the bottom side, the required heat can be reliably applied even when attaching at high speed, and a high-quality paste can be obtained. Can be secured.

  According to the anisotropic conductive material sticking apparatus and the sticking method of the present invention, the sticking means, the peeling means, and the chuck means are arranged on the moving body that moves along the side edge of the substrate. Parallelism and flatness are not required, and a simple and low-cost configuration can be obtained. Also, the anisotropic conductive material can be attached, the separator tape can be peeled off, and the laminated tape can be removed by one reciprocation of the moving body. The feeding of the anisotropic conductive material can be completed by feeding, and the anisotropic conductive material can be pasted with a short tact.

The whole perspective view of one embodiment of the anisotropic conductive material sticking device concerning the present invention. The perspective view which shows the principal part structure of the embodiment. The perspective view which shows the other example of the board | substrate to which the embodiment is applied. The perspective view which shows the sticking mechanism part of the embodiment, and its periphery structure. The expansion perspective view of the sticking mechanism part of the embodiment. It is a three-plane figure which shows the structure of the sticking mechanism part of the embodiment, (a) is a top view, (b) is a front view, (c) is a side view. The sticking state by the sticking means in the embodiment is shown, (a) is a front view, (b) is a bottom view of the ACF. The operation | movement flowchart of the ACF sticking process in the embodiment. Operation | movement explanatory drawing of the first half of the ACF sticking process in the embodiment. Operation | movement explanatory drawing of the second half of the ACF sticking process in the embodiment. The perspective view which shows the whole schematic structure of the anisotropic conductive material sticking apparatus of a prior art example.

  Hereinafter, referring to FIG. 1 to FIG. 10, an embodiment in which the present invention is applied to an ACF attaching apparatus that attaches an anisotropic conductive material (hereinafter referred to as ACF) to a substrate such as a glass substrate of a liquid crystal display panel. To explain.

  1 and 2, the ACF sticking apparatus 1 according to the present embodiment includes a positioning means 3 for supporting and moving and positioning the substrate 2, and a side on which the sticking portion 2a to which the ACF is to be stuck is disposed. An ACF 5a is pressed by pressing a lower receiving portion 4 that supports the end portion from below and a laminated tape (hereinafter referred to as an ACF tape) 5 in which an ACF 5a (see FIGS. 5 to 7) is laminated on a separator tape 5b. After affixing to the affixing part 2a of the substrate 2, the affixing mechanism part 6 for peeling the separator tape 5b from the ACF 5a, the tape supply part 7 for supplying the ACF tape 5, and the supplied ACF tape 5 on the lower receiving part 4 The tape guide means 8 for guiding the substrate 2 so as to be disposed on the side portion of the substrate 2 positioned along the longitudinal direction of the substrate 2 and the separated separator tape 5b. It is constituted by a tape recovery section 9 for collecting. Reference numeral 10 denotes a transfer means for transferring the substrate 2 carried into the carry-in position of the ACF sticking apparatus 1 to the positioning means 3, and reference numeral 1 </ b> A denotes a control unit that performs overall operation control of the ACF sticking apparatus 1.

The tape supply unit 7 includes a supply reel 11 around which the ACF tape 5 is wound, a tension roller 12 that applies tension to the ACF tape 5 that is pulled out and supplied from the supply reel 11, and a terminal end of the supplied ACF tape 5. For each length corresponding to the length of the affixed portion 2a of the substrate 2 with respect to the ACF 5a continuously laminated on one surface of the separator tape 5b in the supplied ACF tape 5 And a cutter 14 for making a cut. Note that a tape connecting means for connecting the end of the ACF tape 5 and the starting end of the ACF tape 5 drawn out from the newly mounted supply reel 11 by heat welding, ultrasonic bonding, or the like may be provided.

  The tape guiding means 8 is provided on lift plates 15a and 15b, which can be switched up and down, respectively, and on the lift plates 15a and 15b. Guide rollers 16a and 16b disposed so as to guide the ACF tape 5 and the separator tape 5b, respectively, and a chuck 17 disposed on the elevating plate 15b on the tape recovery unit 9 side for gripping and fixing the separator tape 5b. When the elevating plates 15a and 15b are positioned at the lower position, the ACF tape 5 stretched between the guide rollers 16a and 16b is disposed on the affixing portion 2a of the substrate 2 supported on the lower receiving portion 4. It is configured to be. In addition, as shown in FIG. 2, the side edge of the substrate 2 is not limited to the case where a single long sticking part 2 a is provided, but as shown in FIG. In some cases, a plurality of application sites 2a are arranged at appropriate intervals at positions corresponding to the arranged electrode portions. The tape collecting unit 9 is constituted by a suction collecting means 18 for sucking and collecting the separator tape 5b.

  Next, the detailed structure of the sticking mechanism part 6 which is the principal part of this invention is demonstrated with reference to FIGS. The pasting mechanism portion 6 can be moved up and down between the pasting position and the retracted position retracted upward, and can be moved along the longitudinal direction of the side edge portion of the substrate 2 that is positioned and supported on the lower receiving portion 4. The moving body 20 is provided with an attaching means 21 for pressing the ACF tape 5 from the separator tape 5a side and attaching the ACF 5a to the attaching portion 2a, and the separator tape 5b from the attached ACF 5a. A peeling means 22 for peeling and a chuck means 23 for holding and fixing the peeled separator tape 5b are provided.

  The affixing means 21 comprises a pressing unit 24 having a flat pressing portion 25 at one end for pressing the ACF tape 5 from the separator tape 5b side so as to be swingable around a horizontal support shaft 26. A heater block 27 as a heating means is disposed between the spindle 26 and the spindle 26. Specifically, the other end of the heater block 27 is swingably supported by the support shaft 26, and a trowel member 28 made of a metal material having a high thermal conductivity is connected to the heater block 27 at one end. The pressing portion 25 is extended obliquely downward toward the side, and a pressing portion 25 is formed at the tip thereof. The tip 25a of the pressing portion 25 is raised so as to slide smoothly without being caught by the separator tape 5b. Further, the lower surface of the pressing portion 25 that is in contact with the separator tape 5b is coated with a fluororesin so as to reduce the frictional resistance and prevent the ACF 5a protruding from the pressing from adhering. The heater block 27 is configured by mounting a heater 27a on a block body capable of securing a required heat capacity, and the heater block 27 is in a pressing direction in which the ACF tape 5 is pressed from the separator tape 5b side to the application site of the substrate 2. Further, it has a function as a pressing force applying means for applying a predetermined pressing force to the pressing portion 25 by gravity acting on the mass of the heater, that is, the weight of the heater block 27 swingable by the support shaft 26 in the pressing direction. Yes.

As a specific numerical example of the pressing portion 25, the width dimension is usually slightly larger than the width dimension of the ACF tape 5 of about 1 to 2 mm. For example, when the width of the ACF tape 5 is 1 mm, 1.2 to 1. It is preferably set to about 5 mm, and the length is set to about 2 mm or more and about 3 ± 1 mm. Further, the applied pressing force depends on the physical properties of the ACF 5a, but about 1 ± 0.5 N / mm ² is appropriate. When the width of the ACF tape 5 is 1 mm and the length of the pressing portion 25 is 3 mm, it is preferable to set so that a load of 3N (about 300 g) is applied. Also, the temperature of the pressing portion 25 depends on the physical properties of the ACF 5a, but 60 to 100 ° C., and about 70 ° C. is optimal for the currently used ACF 5a, and the heater block 27 is set so that the temperature of the pressing portion 25 becomes this temperature. The temperature of is adjusted. In this way, by attaching the ACF 5a in a state where the pressing force and the heating temperature by the pressing portion 25 are appropriately set, as shown in FIGS. 7 (a) and 7 (b), particularly finer conductive particles in the ACF 5a. The ACF 5a can be properly applied to the application site 2a while maintaining an even distribution density without adversely affecting the distribution density of 5A.

  On the other end side of the support shaft 26 of the pressing unit 24, switching means 29 (see FIG. 5) for switching the pressing portion 25 between the pressing state and the pressing avoiding state is disposed. Specifically, the switching means 29 has an extension piece 30 extending from the heater block 27 to the other end side, and an operation means 31 such as a solenoid or an air cylinder is disposed on the upper part, and the operation means 31 is projected to extend. By depressing the piece 30, the pressing unit 24 rotates around the support shaft 26 against the pressing force by the pressing force applying means, and the pressing portion 25 rotates upward and is attached to the attaching portion 2a of the substrate 2. It is comprised so that it may space apart from the ACF tape 5 to be formed. Moreover, it is preferable to provide the pressing unit 24 with the pressing force adjusting means 32 (see FIG. 6B) of the pressing portion 25 as necessary. As the pressing force adjusting means 32, as shown by an imaginary line in FIG. 6B, an adjusting weight 32a is attached to the extension piece 30 so that the position of the extending piece 30 can be adjusted in the horizontal and near directions. Is preferred.

  In addition, when the length in the longitudinal direction of the application site 2a is long, in order to effectively prevent the ACF tape 5 from being displaced during the moving process of the moving body 20 for applying the ACF 5a to the application site 2a, As indicated by a broken line in FIG. 4, the movable body 20 rolls in contact with the separator tape 5 b of the ACF tape 5 and engages with both side edges of the ACF tape 5 at the front position in the moving direction when the moving body 20 is stuck. It is preferable to arrange a regulating roller 33 that guides the ACF tape 5 before it is applied to the application site 2a. Further, if the substrate heating means 34 is disposed in the lower receiving portion 4 that supports the side edge portion of the substrate 2, the application portion 2a of the substrate 2 is heated, so that the ACF 5a can be applied more reliably and easily. This is preferable.

  The peeling means 22 is disposed obliquely above the presser roller 35 that moves while rolling along the upper surface of the ACF tape 5 attached to the application site 2 a of the substrate 2 as the moving body 20 moves. The separator tape 5b is wound around a part of the outer periphery, and is constituted by a peeling roller 36 that peels the separator tape 5b as the moving body 20 moves. The chuck means 23 is composed of a pair of gripping claws 23a, 23a that can be opened and closed so as to sandwich the separator tape 5b, and an actuator 23b such as a solenoid or an air cylinder that switches between opening and closing.

  Next, the process of attaching the ACF 5a to the application site 2a at the side edge of the substrate 2 by the ACF application apparatus 1 having the above-described configuration is described with reference to the operation flowcharts of FIGS. 1 and 8 and the operation descriptions of FIGS. This will be described with reference to the drawings. When the substrate 2 is carried into the ACF sticking apparatus 1, the side edge of the substrate 2 is positioned and supported on the lower receiving portion 4 by positioning means 3 (having X, Y, Z, and θ moving axes). . To start feeding the ACF tape 5 so as to correspond to this state, as shown in step (a) of FIG. 9, the guide rollers 16a and 16b and the moving body 20 of the pasting mechanism portion 6 rise to the retracted position. The chuck 17 is opened and the chuck of the moving body 20 in a state where the pressing portion 25 of the attaching means 21 is located at a retracted position in a direction away from the ACF tape 5 attached to the attaching portion 2 a of the substrate 2. The means 23 is closed and the separator tape 5b is held and fixed, and the movement of the moving body 20 in the direction of arrow A is started (step S1). Thereby, the ACF tape 5 is fed. Then, when the moving body 20 moves in the arrow A direction by a distance corresponding to the pasting position of the pasting site 2a, the feeding of the ACF tape 5 is completed as shown in the step (b) of FIG. 9 (step S2).

Next, as shown in step (c) of FIG. 9, the guide rollers 16 a and 16 b and the moving body 20 of the sticking mechanism 6 are attached to the sticking part 2 a of the substrate 2 as indicated by the arrow B. After being lowered to the application position (step S3), the chuck 17 is closed and the separator tape 5b is held and fixed as shown in step (d) of FIG. The chuck means 23 is opened, the switching means 29 is operated, the ACF tape 5 is pressed by the pressing portion 25, and pressing force and heat are applied to the ACF tape 5, thereby ACF 5a.
As shown by an arrow C from the sticking start position of the sticking part 2a of the substrate 2 to which the ACF 5a of the ACF tape 5 is stuck, the moving body 20 is moved. It starts and moves while applying pressing force and heat to the ACF tape 5 at the pressing portion 25 of the moving body 20 to start the application of the ACF 5a to the application site 2a of the substrate 2 (step S4). With the movement of the moving body 20 in the direction of arrow C, as shown in step (e) of FIG. Is performed by the peeling means 22 (step S5).

  Next, when the pressing portion 25 has completely passed the pasting end position of the pasting site 2a, the switching means 29 is operated to rotate the pasting means 21 as shown in step (f) of FIG. Is retracted in the upper direction away from the pasting site 2a of the substrate 2 (step S6), and the movement of the moving body 20 in the direction of arrow C is continued or temporarily stopped in that state, and then further moved, and the peeling means 22 is moved. When the presser roller 35 has passed the pasting end position of the pasting part 2a, as shown in the step (g) of FIG. 10, the separation of the separator tape 5b is completed (step S7). As shown in step (h), the movement of the moving body 20 of the sticking mechanism section 6 in the direction of arrow C is stopped and moved upward in the direction of arrow D to be positioned at the retracted position (step S8). Next, as shown in step (i) of FIG. 10, the ACF is a position where the pressing portion 25 can press the moving body 20 against the ACF tape 5 from the separator tape side and the pressing of the ACF 5 a can be started. By moving to the tape feed start position in the direction of arrow A and then returning to step (a) in FIG. 9 and repeating the above operation, the ACFs 5a are sequentially attached to the respective application sites 2a of the substrate 2.

  As described above, according to the present embodiment, the ACF 5a is attached and the separator tape 5b is peeled when the moving mechanism 20 of the attaching mechanism 6 moves in one direction (arrow C direction) (FIG. 9D). e) to FIG. 10 (f) and FIG. 10 (g)), the separator tape 5b is gripped by the chuck means 23 when the moving body 20 returns to the other direction (arrow A direction) and the ACF tape 5 is fed (see FIG. 9 (a) and 9 (b)), the application of the ACF 5a to the application site 2a arranged along the longitudinal direction of the side edge of the substrate 2 is completed by one reciprocation of the moving body 20. ACF5a can be pasted with a short tact.

  In addition, since the pasting mechanism section 6 has a configuration in which the pasting means 21, the peeling means 22 and the chuck means 23 are disposed on the movable body 20 movable along the longitudinal direction of the side edge of the substrate 2, a compact configuration. Compared to a conventional example equipped with a pressure-bonding head, high precision parallelism and flatness are not required, and even a large substrate is a simple and low-cost configuration. In addition, adjustment and maintenance are greatly simplified, the work efficiency is improved, and the productivity can be improved.

  The pasting means 21 includes a pressing unit 24 having a flat pressing portion 25 and a heater block 27, and a switching means 29 for switching the pressing unit 24 between a pressing state and a pressing avoiding state. As a result, the ACF tape 5 is pressed against the affixing portion 2a of the substrate 2 by the flat pressing portion 25, so that an excessive load is not applied locally, and appropriate pressing force and heat are uniformly applied. In addition, since there is no possibility of adversely affecting the distribution density of the conductive particles 5A in the ACF 5a, it is possible to ensure a high quality attached state with high reliability. Further, when the pressing portion 25 reaches a position where the pressing is unnecessary, the pressing portion 25 is separated from the applying portion 2a of the substrate 2 and switched to the pressing avoidance state, and the separation operation of the separator tape 5b is continued to the end position of the applying portion 2a. Therefore, the ACF 5a can be reliably pasted over the entire length of the pasting site 2a without affecting the outside of the pasting range.

  Further, the pressing unit 24 is configured to be swingable around the support shaft 26 in the intermediate portion, and the pressing unit 25 is disposed on one end side of the pressing unit 24 and the switching means 29 is disposed on the other end side of the pressing unit 24. And a heater block 27, which serves as both a pressing force applying means for applying a pressing force by rotating the pressing unit 24 around the supporting shaft 26 and a heating means, is disposed between the pressing portion 25 and the supporting shaft 26. With the configuration, it is possible to apply a pressing force to the pressing portion 25 and to perform heating with a simple configuration. It is also possible to switch to the pressing avoidance state by a simple switching means 29 that pushes down the other end side of the pressing unit 24. Moreover, the pressing force can be easily adjusted by making it possible to apply a reverse rotation biasing force. Thus, an appropriate sticking state can be easily ensured with a simple configuration.

  In addition, when the substrate heating means 34 is disposed on the lower receiving portion 4 that supports the side edge portion of the substrate 2 as indicated by a broken line in FIG. 4, the ACF 5 a is applied to the application site 2 a by the pressing portion 25. In addition to heating the ACF 5a to be attached to the attachment part 2a of the substrate 2 from the tape 5 side, the required heat can be ensured even when attaching at high speed by heating the attachment part 2a of the substrate 2 from the lower surface side. It is possible to ensure a high quality paste.

  Further, as shown by a broken line in FIG. 4, the moving body 20 abuts against the separator tape 5 b of the ACF tape 5 at the front position in the moving direction at the time of sticking movement, and engages with both side edges of the ACF tape 5. If the regulating roller 33 that guides the ACF tape 5 before being applied to the application site 2a is provided, even if the application site 2a is long, the ACF 5a is applied by sliding while pressing the ACF tape 5 at the pressing portion 25. Since the displacement of the ACF tape 5 can be reliably controlled in the meantime, the ACF 5a can be attached in the width direction with high accuracy.

  In the above embodiment, an example in which the planar pressing portion 25 is applied as the pressing portion that presses the ACF tape 5 has been described. However, a roller may be applied depending on circumstances. However, it is preferable to apply the flat pressing portion 25 as described above, so that a uniform and high quality sticking state can be stably secured.

  According to the anisotropic conductive material sticking apparatus and the sticking method of the present invention, the sticking means, the peeling means, and the chuck means are arranged on the moving body that moves along the side edge of the substrate. Parallelism and flatness are not required, and a simple and low-cost configuration can be obtained. Also, the anisotropic conductive material can be attached, the separator tape can be peeled off, and the laminated tape can be removed by one reciprocation of the moving body. The feeding of the anisotropic conductive material can be completed by feeding, and the anisotropic conductive material can be pasted with a short tact, so the various parts can be mounted by sticking the anisotropic conductive material to the board It can utilize suitably for the component mounting apparatus to do.

1 Anisotropic conductive material sticking device (ACF sticking device)
1A Control unit 2 Substrate 2a Affixed part 4 Bottom receiving part 5 Multilayer tape
5a Anisotropic conductive material (ACF)
5b Separator tape 6 Adhering mechanism 7 Tape supplying unit 8 Tape guiding unit 9 Tape collecting unit 20 Moving body 21 Adhering unit 22 Peeling unit 23 Chuck unit 24 Press unit 25 Press unit 26 Support shaft 27 Heater block (heating unit, applying pressure) means)
29 Switching means 31 Operating means (solenoid)
32 pressing force adjusting means 33 regulating roller 34 substrate heating means

Claims (9)

A tape supply unit that supplies a laminated tape in which an anisotropic conductive material is laminated on a separator tape, and a laminated tape supplied from the tape supply unit on the side edge of the substrate along the longitudinal direction. A tape guiding means for guiding the laminated tape, a sticking means for pressing the laminated tape from the separator tape side to stick the anisotropic conductive material to the sticking site, and a separator tape from the stuck anisotropic conductive material. In an anisotropic conductive material sticking device comprising a peeling means for peeling, and a tape collecting unit for collecting the peeled separator tape,
Provide a movable body movable along the longitudinal direction of the side edge of the substrate,
In the moving body, a sticking means, a peeling means, and a separator tape chuck means from which the anisotropic conductive material has been peeled off,
At the time of moving the moving body in one direction, the anisotropic conductive material is applied to the application site by the attaching means and the separator tape is peeled off from the anisotropic conductive material attached by the removing means, and the moving body is moved in the other direction. An anisotropic conductive material sticking apparatus, wherein the laminated tape is fed by holding the separator tape by the chuck means during the return movement.   The affixing means includes a pressing unit that has a flat pressing part that presses the laminated tape from the separator tape side to the affixing part of the substrate and is thermally coupled to the heating means, and the pressing unit is in a pressing state and a pressing avoidance state. The anisotropic conductive material sticking device according to claim 1, further comprising switching means for switching between them.   The pressing unit is supported so that the intermediate portion can swing around the support shaft, the pressing unit is disposed on one end side of the pressing unit, and the switching unit is disposed on the other end side of the pressing unit to support the pressing unit. 3. An anisotropic conductive material pasting apparatus according to claim 2, further comprising: a pressing force applying unit that applies a pressing force by rotating and energizing the shaft and a pressing force adjusting unit.   The anisotropic conductive material sticking device according to any one of claims 1 to 3, wherein a substrate heating means is disposed in a lower receiving portion that supports a side edge portion of the substrate.   The moving body is provided with a regulating roller that contacts and rolls against the separator tape of the laminated tape at a forward position in the moving direction during the sticking movement, and engages with both side edges of the laminated tape. The anisotropic conductive material sticking device according to any one of 4. An arrangement step of arranging a laminated tape obtained by laminating an anisotropic conductive material on a separator tape on a pasting portion provided along a longitudinal direction of the side edge portion of the substrate;
A sticking step of sticking the anisotropic conductive material to the sticking site by pressing the laminated tape from the separator tape side when moving in one direction with the sticking means moving along the longitudinal direction of the side edge of the substrate;
In one direction, a peeling step of peeling the separator tape from the anisotropic conductive material pasted by the peeling means moving with the sticking means,
An anisotropic conductive material having a feeding step of gripping a separator tape from which the anisotropic conductive material has been peeled off by the chuck means during feeding and returning to the other direction of the sticking means and feeding the laminated tape Pasting method.   The anisotropic conductive material sticking method according to claim 6, wherein the sticking step presses the laminated tape from the separator tape side to the sticking portion of the substrate with a flat pressing portion controlled to be heated to a predetermined temperature. In the peeling process, after the anisotropic conductive material is pasted to the pasting site by the pasting means when moving in one direction, the pasting means is retracted in a direction away from the pasting site of the substrate or in a retracted state. The anisotropic conductive material according to claim 6 or 7, wherein the separator tape is peeled to the end of the pasting portion by the peeling means by further moving the peeling means moving in one direction together with the sticking means. Pasting method.   The side edge part of a board | substrate is supported by the receiving part by which heating control was carried out to predetermined temperature, and the sticking site | part of the side edge part of a board | substrate is heated, The any one of Claims 6-8 characterized by the above-mentioned. Anisotropic conductive material sticking method.