JP5231176B2 - Anisotropic conductive film pasting device - Google Patents

Anisotropic conductive film pasting device Download PDF

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JP5231176B2
JP5231176B2 JP2008284240A JP2008284240A JP5231176B2 JP 5231176 B2 JP5231176 B2 JP 5231176B2 JP 2008284240 A JP2008284240 A JP 2008284240A JP 2008284240 A JP2008284240 A JP 2008284240A JP 5231176 B2 JP5231176 B2 JP 5231176B2
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anisotropic conductive
tape
conductive film
reel
pasting
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JP2010114194A (en
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仁彦 津田
拓 天羽
真一 西川
衛紅 郭
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KYODO DESIGN & PLANNING CORP.
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KYODO DESIGN & PLANNING CORP.
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Priority to JP2008284240A priority Critical patent/JP5231176B2/en
Priority to CN2009801415682A priority patent/CN102187748A/en
Priority to PCT/JP2009/068803 priority patent/WO2010053081A1/en
Priority to KR1020117007927A priority patent/KR20110084171A/en
Priority to TW098137468A priority patent/TW201030870A/en
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    • H—ELECTRICITY
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • B32B38/185—Positioning, e.g. registration or centering during laying up combined with the cutting of one or more layers
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
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    • H01L2924/19042—Component type being an inductor
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
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    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive

Description

本発明は、基板上にチップやモジュール等を実装するのに用いられる異方導電膜（ＡＣＦ）を、基板上の所定位置に貼り付けるための貼付装置に関するものである。   The present invention relates to a sticking apparatus for sticking an anisotropic conductive film (ACF) used for mounting a chip, a module, or the like on a substrate at a predetermined position on the substrate.

例えば、液晶表示パネルの周縁部に形成されたタブに駆動用ＩＣを搭載する場合など、電子回路基板にチップ状の電子部品やモジュール等を実装する場合は、基板の所定位置に異方導電膜（ＡＣＦ：Ａｎｉｓｏｔｒｏｐｉｃ Ｃｏｎｄｕｃｔｉｖｅ Ｆｉｌｍ）を貼り付け、この異方導電膜上に電子部品等を載せた後に、基板側と電子部品等の電極間の位置合わせを行なってから仮圧着を行ない、その後圧着ツールにて加熱圧着（本圧着）して、これらの間を電気的に接続する方法が用いられている。（例えば、特許文献１等を参照。）   For example, when mounting a chip-like electronic component or module on an electronic circuit board, such as when a driving IC is mounted on a tab formed at the peripheral edge of a liquid crystal display panel, an anisotropic conductive film is formed at a predetermined position on the board. (ACF: Anisotropic Conductive Film) is affixed, and electronic components are placed on the anisotropic conductive film, and then the substrate side and the electrodes of the electronic components are aligned, and then temporary crimping is performed. A method is used in which heat-pressure bonding (main pressure bonding) is used to electrically connect the two. (See, for example, Patent Document 1)

なお、本発明では、「異方性導電」，「異方導電性」，「異方性導電性」等を「異方導電（Ａｎｉｓｏｔｒｏｐｉｃ Ｃｏｎｄｕｃｔｉｖｅ）」と同じ意味として扱う。また、本発明における「異方導電テープ」とは、ベースフィルムまたはセパレータ等の基材の上に、上記「異方導電膜」（あるいは「異方導電フィルム」，「異方導電層」，「異方導電樹脂」，「異方導電体」等）が積層された状態のものを言い、積層フィルム，積層シート等の形態の中で、特に幅狭で帯状のものを「テープ」と呼ぶ。ただし、これらに構成上の違いはない（特許文献２等を参照）。   In the present invention, “anisotropic conductivity”, “anisotropic conductivity”, “anisotropic conductivity”, and the like are treated as the same meaning as “anisotropic conductivity”. In addition, the “anisotropic conductive tape” in the present invention is the above-described “anisotropic conductive film” (or “anisotropic conductive film”, “anisotropic conductive layer”, “ "Anisotropic conductive resin", "anisotropic conductor", etc.) are laminated, and among the forms of laminated films, laminated sheets, etc., particularly narrow and belt-like ones are called "tapes". However, there is no structural difference between them (see Patent Document 2 and the like).

従来、この異方導電テープ（ＡＣＦテープ）をワーク（電子回路基板等）の所定位置に貼り付けて異方導電膜を転写する方法としては、カッタ等で所定長さに切断した異方導電テープを貼り付け、軽く圧着した後セパレータのみを剥がして異方導電膜を残す方法や、セパレータ上の異方導電膜の不要部分（貼り付けに関与しない部分）をカッタ等を用いて切断（ハーフカット）し、不要部分をセパレータから分離除去した状態で、テープを上記基板に貼付けツール（貼付けローラまたは貼付けヘッド）で圧着する方法が用いられている（特許文献３等を参照）。   Conventionally, as a method for transferring the anisotropic conductive film by attaching this anisotropic conductive tape (ACF tape) to a predetermined position of a work (electronic circuit board or the like), an anisotropic conductive tape cut to a predetermined length with a cutter or the like is used. A method of leaving the anisotropic conductive film by peeling off only the separator after lightly pressing, and cutting the unnecessary part of the anisotropic conductive film on the separator (the part that does not participate in the attachment) using a cutter (half cut) In the state where unnecessary portions are separated and removed from the separator, a method of pressing the tape to the substrate with a sticking tool (sticking roller or sticking head) is used (see Patent Document 3, etc.).

なお、異方導電テープは高価であるため、この不要部分の無駄をなくすべく、異方導電テープのセパレータ側から、貼付けヘッドを圧力単独または圧力と加熱を併用して押し当て、異方導電膜を切断すると同時に基板に転写するようにした装置も提案されている（特許文献４〜５等を参照）。   In addition, since anisotropic conductive tape is expensive, in order to eliminate the waste of this unnecessary portion, the adhesive head is pressed from the separator side of the anisotropic conductive tape by pressing the pressure head alone or in combination with pressure and heating. There has also been proposed an apparatus that cuts the film and transfers it to the substrate at the same time (see Patent Documents 4 to 5).

一方、異方導電テープは、通常、１２５ｍｍφまたは２５０ｍｍφのリールに巻回された形でテープ製造メーカーより提供されることから、貼付装置の上記貼付けヘッドの近傍（たいていの場合は貼付けヘッドの上方）には、このリールを回転自在に軸支する異方導電テープ供給手段（供給装置）が設けられており、多数のガイドローラ等からなるテープ供給経路によって、上記リールから引き出された異方導電テープが、貼付けヘッドと基板との間に供給されるように構成されている。   On the other hand, the anisotropic conductive tape is usually provided by the tape manufacturer in a form wound on a 125 mmφ or 250 mmφ reel, so that it is in the vicinity of the above-mentioned sticking head of the sticking device (in most cases, above the sticking head). Is provided with an anisotropic conductive tape supply means (supply device) for rotatably supporting the reel, and the anisotropic conductive tape drawn from the reel by a tape supply path including a number of guide rollers and the like. Is configured to be supplied between the pasting head and the substrate.

また、使用中のリール上の異方導電テープの残量が少なくなった場合には、センサ等により、リールの巻き芯近くのテープ（テープの終端近傍）に設けられたエンドマークが検出され、異方導電テープの供給と貼付装置の動作が停止する（特許文献６等を参照）。そして、リールを新しいものに交換（付け替え）し、この未使用リールから異方導電テープを引き出して（「口出し」して）上記テープ供給経路に導通させ、正常な異方導電膜が上記貼付けヘッドの位置に来るまで新しい異方導電テープの開始端部を破棄した後、貼付装置の運転が再開される（特許文献７等を参照）。   Also, when the remaining amount of anisotropic conductive tape on the reel in use is low, an end mark provided on the tape (near the end of the tape) near the reel core is detected by a sensor or the like, The supply of the anisotropic conductive tape and the operation of the sticking device are stopped (see Patent Document 6). Then, the reel is replaced (replaced) with a new one, and the anisotropic conductive tape is pulled out from this unused reel ("spoke out") to conduct to the tape supply path, and the normal anisotropic conductive film is attached to the pasting head. After discarding the starting end of the new anisotropic conductive tape until it reaches the position, the operation of the sticking device is resumed (see Patent Document 7 and the like).

なお、複数のリールを装着部に予めセットしておき、これらの配置を入れ換えてリール交換を行なう場合もある。複数リールの配置交換を行なう手段としては、上下あるいは左右に設置された支軸にそれぞれリールをセットし、これらを切り替えて使用する方法（特許文献７）や、２つのリールを背中合わせにセットし、１８０°反転させて切り替える方法（特許文献８等）、あるいは、上記リールをカセットに収め、このカセットをチェンジャ等により自動交換する方法などが提案されている（特許文献９〜１０等を参照）。   In some cases, a plurality of reels are set in advance in the mounting portion, and the reels are exchanged by replacing these arrangements. As means for exchanging the arrangement of a plurality of reels, the reels are respectively set on the support shafts installed on the top and bottom or the left and right, and these are used by switching them (Patent Document 7), or two reels are set back to back, A method of switching by reversing 180 ° (Patent Document 8 or the like) or a method of storing the reel in a cassette and automatically replacing the cassette by a changer or the like has been proposed (see Patent Documents 9 to 10).

また、未使用リールのテープ開始端をチャック手段により把持し、このチャック手段を予め決められたパターンに沿って移動させることにより、異方導電テープの開始端を上記テープ供給経路に自動的に導通させる方法も提案されている（特許文献８）。   Also, the starting end of the anisotropic conductive tape is automatically conducted to the above-mentioned tape supply path by holding the tape starting end of the unused reel by the chuck means and moving the chuck means along a predetermined pattern. A method of causing this is also proposed (Patent Document 8).

ところで、テレビやパソコン，携帯電話等のディスプレイへの利用による液晶表示パネルの生産拡大は言うに及ばず、生産効率の向上や軽量化等のために、種々の電子機器において、上記異方導電（ＡＣＦ）テープを用いた電子部品の実装技術が使われ始めており、異方導電膜の貼り付け作業工程の効率化や多品種（多サイズ）対応，スピードアップ，コストダウン等の要望が大きくなってきている。
特開平５−３２３３４８号公報 特開２００２−３２４４３２号公報 特開平６−６０１９号公報 特開平１０−３１０７４３号公報 特開２００１−１７１８９７号公報 特開２００１−２８４００５号公報 特開２００５−３３６４４７号公報 特開平７−６５６４８号公報 特開平７−６５６４８号公報 特開２００６−９６５５６号公報 By the way, it goes without saying that the production of liquid crystal display panels has been expanded through the use in displays such as televisions, personal computers and mobile phones. In order to improve production efficiency and reduce weight, various anisotropic electronic devices ( Electronic component mounting technology using ACF) tape has begun to be used, and there are increasing demands for improving the efficiency of the anisotropic conductive film pasting process, supporting various types (multiple sizes), speeding up, and reducing costs. ing.
JP-A-5-323348 JP 2002-324432 A JP-A-6-6019 JP-A-10-310743 JP 2001-171897 A JP 2001-284005 A JP 2005-336447 A JP-A-7-65648 JP-A-7-65648 JP 2006-96556 A

しかしながら、上記のような従来のシングル貼付けヘッドの異方導電膜貼付装置では、益々大型化する液晶パネル等への対応が難しく、異方導電膜の貼付個所が増えれば増えるほど、貼付作業のタクトタイム（サイクルタイム）が直線的に増大してしまうという問題があった。   However, in the conventional anisotropic conductive film pasting device of the single pasting head as described above, it is difficult to cope with an increasingly large liquid crystal panel, etc. There is a problem that the time (cycle time) increases linearly.

そこで、この問題を解決すべく、貼付装置の台数を増やすという選択がまず考えられるが、貼付装置の台数を増やすには、設置するための工場内に広いスペースを確保せねばならず、ライン（工程）が長大となるため、製品のハンドリングや工程管理，メンテナンス面でのロスが生じてしまう。   In order to solve this problem, the first option is to increase the number of applicators, but in order to increase the number of applicators, it is necessary to secure a large space in the factory for installation. Process) is long, resulting in loss of product handling, process management, and maintenance.

また、貼付装置を並べて台数を増やした場合、人間の動く動線を考慮すると、１人の作業員でテープ（リール）補給や管理・メンテナンスできる装置の台数には限りがあるため、作業人員の増加、ひいては製品のコストアップになってしまう可能性もある。   In addition, when the number of sticking devices is increased, the number of devices that can be replenished, managed, and maintained by a single worker is limited, considering the flow of human movement. There is also a possibility that the cost will increase due to an increase.

本発明は、このような事情に鑑みてなされたもので、コンパクトな本体サイズでありながら、種々の形状・大きさの基板に柔軟に対応可能で、この基板の複数個所に同時に異方導電膜を貼り付けることにより、貼付工程のタクトタイムを低減することのできる異方導電膜貼付装置の提供をその目的とする。   The present invention has been made in view of such circumstances, and while being a compact body size, it can flexibly handle substrates of various shapes and sizes, and an anisotropic conductive film can be simultaneously applied to a plurality of locations on the substrate. It is an object of the present invention to provide an anisotropic conductive film sticking apparatus that can reduce the tact time of the sticking process by sticking.

上記の目的を達成するため、本発明の異方導電膜貼付装置は、装置本体内に搬入された基板を所定の位置に移動させて位置決めする基板位置決め手段と、上記位置決めされた基板の所定の部位に、セパレータと異方導電膜とが積層された異方導電テープを、その異方導電膜の面が上記基板に対峙する向きとなるよう供給する異方導電テープ供給手段と、上記異方導電テープをセパレータ側から押圧して異方導電膜のみを基板上に転写して貼り付ける貼付けヘッドとを備えた異方導電膜貼付装置であって、上記貼付けヘッドが、異方導電膜の貼り付け方向に沿って複数個配設され、各貼付けヘッドの間隔が調節可能に設定され、上記異方導電テープ供給手段が、異方導電テープが巻回されたリールを装着保持するリール装着部を備えているとともに、上記異方導電テープ供給手段には、回転軸と、この回転軸を挟んで背中合わせに配設された２個のリール装着部とからなる配置交換手段が設けられ、上記回転軸を１８０°回転させることによって、いずれかのリール装着部が、上記貼付けヘッドに異方導電テープを供給可能な供給位置に位置決めされ、他のリール装着部のいずれかが、リールの付け替えが可能な待機位置に位置決めされるようになっており、この異方導電テープ供給手段が、上記貼付けヘッドごとに独立して設けられている構成をとる。 In order to achieve the above object, an anisotropic conductive film pasting apparatus of the present invention includes a substrate positioning means for positioning a substrate carried into the apparatus body by moving it to a predetermined position, and a predetermined position of the positioned substrate. An anisotropic conductive tape supply means for supplying an anisotropic conductive tape in which a separator and an anisotropic conductive film are laminated to a part so that the surface of the anisotropic conductive film faces the substrate, and the anisotropic An anisotropic conductive film pasting apparatus comprising a pasting head that presses a conductive tape from the separator side and transfers and pastes only the anisotropic conductive film onto the substrate, wherein the pasting head attaches the anisotropic conductive film. A plurality of reel mounting portions arranged along the attaching direction, the interval between the pasting heads is set to be adjustable , and the anisotropic conductive tape supply means mounts and holds a reel on which the anisotropic conductive tape is wound. and it is equipped with a door To, above the anisotropic conductive tape supply means, a rotary shaft, the sides of the rotation axis consisting of two reel mounting portion disposed back-to-back arrangement exchange means is provided, 180 ° to the rotation axis By rotating, one of the reel mounting portions is positioned at a supply position where the anisotropic conductive tape can be supplied to the pasting head, and one of the other reel mounting portions is set at a standby position where the reel can be replaced. The anisotropic conductive tape supply means is configured to be positioned independently for each of the pasting heads.

本発明の異方導電膜貼付装置は、複数の貼付けヘッドを１台の貼付装置に内蔵することによって、従来の貼付装置のように、マシン台数やライン長を増加させることなく、異方導電膜の貼付工程のタクトタイムを低減するとともに、今後の液晶パネルの大型化や多品種・少量生産への対応を考慮して、これら貼付けヘッド間の間隔（ピッチ）を調節できる構成としたものである。   The anisotropic conductive film sticking apparatus of the present invention includes a plurality of sticking heads in a single sticking apparatus, so that the anisotropic conductive film does not increase the number of machines and the line length as in the conventional sticking apparatus. In addition to reducing the tact time of the pasting process, it is possible to adjust the spacing (pitch) between these pasting heads in consideration of future enlargement of liquid crystal panels and support for high-mix, low-volume production. .

すなわち、本発明の異方導電膜貼付装置は、異方導電テープを基板の所定位置に押し当てて転写する貼付けヘッドが、異方導電膜の貼り付け方向に沿って複数個配設されていることから、１ステップの動作で２つ以上の指定個所に異方導電膜を同時に転写することができる。したがって、本発明の異方導電膜貼付装置は、その設置スペースを増大させることなく、貼付作業のタクトタイムを低減することができる。   That is, in the anisotropic conductive film pasting apparatus of the present invention, a plurality of pasting heads are arranged along the direction in which the anisotropic conductive film is pasted to press and transfer the anisotropic conductive tape to a predetermined position of the substrate. For this reason, the anisotropic conductive film can be simultaneously transferred to two or more designated locations in a one-step operation. Therefore, the anisotropic conductive film sticking apparatus of the present invention can reduce the tact time of the sticking work without increasing the installation space.

また、これら各貼付けヘッドが、互いの間の間隔が調節可能なように構成されていることから、電子回路基板の大型化等による貼付個所の増加や位置の変更、あるいは、様々な貼付位置が指定された多様なサイズの回路基板へ、柔軟に対応することが可能となる。したがって、本発明の異方導電膜貼付装置は、異方導電膜を貼り付ける基板の品種変更に応じた設定（セッティング）変更に要するアイドルタイムも短縮することができる。   In addition, since each of these pasting heads is configured so that the distance between them can be adjusted, an increase in the number of places to be pasted due to an increase in the size of the electronic circuit board, a change in position, or various pasting positions. It is possible to flexibly cope with circuit boards of various designated sizes. Therefore, the anisotropic conductive film pasting apparatus of the present invention can also shorten the idle time required for the setting change according to the type change of the substrate to which the anisotropic conductive film is attached.

さらに、本発明の異方導電膜貼付装置には、上記異方導電テープ供給手段として、回転軸と、この回転軸を挟んで背中合わせに配設された２個のリール装着部とからなる配置交換手段が設けられ、同時に装着保持された複数のリールの配置を順次入れ換えできるように形成されているとともに、所定の配置において、いずれかのリール装着部が、上記貼付けヘッドに異方導電テープを供給可能な供給位置に位置決めされ、他のリール装着部のいずれかが、リールの付け替えが可能な待機位置に位置決めされるようになっている。そのため、この貼付装置の管理者（作業者）は、装置の稼働（ランニング）中であっても、使用中のリールに手を触れることなく、使用済みの空リールを取り外し、異方導電テープが巻回された新たなリールに交換することができる。 Furthermore, in the anisotropic conductive film pasting apparatus of the present invention, as the anisotropic conductive tape supply means, an arrangement replacement comprising a rotating shaft and two reel mounting portions disposed back to back across the rotating shaft is provided. Means are provided so that the arrangement of a plurality of reels mounted and held at the same time can be sequentially replaced, and in a predetermined arrangement, any of the reel mounting portions supplies anisotropic conductive tape to the pasting head. It is positioned at a possible supply position, and any one of the other reel mounting portions is positioned at a standby position where the reel can be replaced . Therefore , the administrator (operator) of this sticking device removes the used empty reel without touching the reel in use even while the device is running, and the anisotropic conductive tape is removed. It can be exchanged for a new reel that has been wound.

しかも、上記異方導電テープ供給手段（配置交換手段）は、上記回転軸を１８０°回転させることによって、一方のリール装着部が上記供給位置に、他方のリール装着部が上記待機位置に配置されるようになっていることから、供給手段の水平方向における必要設置面積が小さく、各貼付けヘッドの上方にコンパクトに配設することが可能になる。したがって、本発明の異方導電膜貼付装置は、複数の貼付けヘッドに対応する同数の異方導電テープ供給手段を設けた場合でも、装置本体サイズの増大が抑えられ、この貼付装置自身をコンパクトに構成することができる。 Moreover, the anisotropic conductive tape supply means (arrangement exchange means), by rotating the upper Symbol rotation axis 180 °, on one of the reel mounting portion above the supply position, other reel mounting portion disposed in the standby position since it is adapted to be, required installation area in the horizontal direction of the feed means is small, it is possible to arrange compactly above each application head. Therefore, the anisotropic conductive film pasting apparatus of the present invention can suppress an increase in the apparatus body size even when the same number of anisotropic conductive tape supply means corresponding to a plurality of pasting heads is provided, and the pasting apparatus itself can be made compact. Can be configured.

ここで、上記供給位置で使用中のリールの異方導電テープの残量が少なくなった時、この残余少量テープの終端部近傍をテープ把持部材で把持するとともに終端部側のテープを切断し、上記残余少量テープの終端部を固定した状態で上記回転軸を１８０°回転させて、当該残余少量テープの終端部に、上記待機位置に待機していたリールから引き出した未使用の異方導電テープの開始端部を近接させ、これら終端部と開始端部とを重ね合わせて接合した後、上記テープ把持部材の把持を解除して、上記貼付けヘッドへの異方導電テープの供給を再開するように構成した場合は、複雑な手順や装置を用いることなく、上記テープ供給経路および貼付けヘッドに、新たな未使用リールからの異方導電テープを自動で供給できるようになる。したがって、本発明の異方導電膜貼付装置は、リール交換後に異方導電テープをテープ供給経路に沿って手動で貼付けヘッドまで引き回す場合に比べ、大幅な手間の軽減と時間短縮を実現することができる。   Here, when the remaining amount of the anisotropic conductive tape of the reel in use at the supply position is reduced, the vicinity of the terminal portion of the remaining small amount of tape is gripped by the tape gripping member and the tape on the terminal portion side is cut. Unused anisotropic conductive tape drawn from the reel waiting at the standby position at the end of the remaining small amount tape by rotating the rotating shaft 180 ° with the end of the remaining small amount tape fixed. The start end portion of the tape is brought close to each other, the end portion and the start end portion are overlapped and joined, and then the holding of the tape holding member is released and the supply of the anisotropic conductive tape to the pasting head is resumed. In this configuration, the anisotropic conductive tape from the new unused reel can be automatically supplied to the tape supply path and the pasting head without using a complicated procedure or apparatus. Therefore, the anisotropic conductive film pasting apparatus of the present invention can realize a significant reduction in labor and time compared to the case where the anisotropic conductive tape is manually routed to the pasting head along the tape supply path after reel replacement. it can.

また、本発明の貼付装置における異方導電テープの交換・接続方法は、手順がシンプルで、かつ、デリケートな異方導電テープをあまり揺り動かさないことから、先に述べたような、新たなリールのテープ先端をチャック手段により把持し、このチャック手段を予め決められたパターンに沿って移動させて、異方導電テープをテープ供給経路に自動的に導通させる方法（特許文献８等）と比べても、確実で素早いテープ交換が可能で、異方導電膜貼付装置の運転再開までのアイドルタイムを短縮することができる。なお、本発明の貼付装置における異方導電テープの交換・接続方法には、「口出し」のために引き出して破棄する（無駄になる）テープの分量が少ないという利点もある。   In addition, the method for exchanging and connecting the anisotropic conductive tape in the sticking device of the present invention is simple in procedure and does not shake the delicate anisotropic conductive tape so much. Compared to a method in which the tip of the tape is gripped by the chuck means, and the chuck means is moved along a predetermined pattern to automatically conduct the anisotropic conductive tape to the tape supply path (eg, Patent Document 8). The tape can be exchanged reliably and quickly, and the idle time until the operation of the anisotropic conductive film pasting apparatus is restarted can be shortened. Note that the anisotropic conductive tape replacement / connection method in the sticking device of the present invention also has an advantage that the amount of tape to be pulled out and discarded (waste) for "out" is small.

そして、上記残余少量の異方導電テープの終端部と上記未使用の異方導電テープの開始端部との接合を、これらテープの重複部位への超音波の照射による融着によって行なう場合は、上記各テープ間の接続（融着）を、当該テープのセパレータを構成する樹脂の組成に関わらず、素早く短時間で行なうことができる。   And when joining the terminal portion of the residual anisotropic conductive tape and the starting end portion of the unused anisotropic conductive tape by fusion by ultrasonic irradiation to the overlapping portions of these tapes, The connection (fusion) between the tapes can be performed quickly and in a short time regardless of the composition of the resin constituting the separator of the tape.

つぎに、本発明の実施の形態を、図面にもとづいて詳しく説明する。   Next, embodiments of the present invention will be described in detail with reference to the drawings.

図１は、本発明の実施形態における異方導電膜貼付装置の本体内の概略構成図であり、図２は、この異方導電膜貼付装置における異方導電膜の貼付手順を説明する図である。なお、貼付装置内（および工程内）における基板の流れ方向をｘ方向、このｘ方向に直交する装置内の奥行き方向をｙ方向、装置の上下（天地）方向をｚ方向として説明する。   FIG. 1 is a schematic configuration diagram inside a main body of an anisotropic conductive film pasting apparatus according to an embodiment of the present invention, and FIG. 2 is a diagram for explaining an anisotropic conductive film pasting procedure in the anisotropic conductive film pasting apparatus. is there. In the following description, the substrate flow direction in the sticking apparatus (and in the process) is the x direction, the depth direction in the apparatus orthogonal to the x direction is the y direction, and the vertical (top / bottom) direction of the apparatus is the z direction.

本実施形態における異方導電膜貼付装置は、ワークＷ（液晶パネル，電子回路基板等）に、異方導電膜を介在させてチップ状電子部品やモジュール等を実装する工程（ライン）の一部に組み込まれて配置されているものであり、工程全体としては、ローダー→基板洗浄装置→異方導電膜貼付装置（ＡＣＦ転写）→チップ圧着装置（ＣＯＧあるいはＦＰＣの仮圧着，本圧着）→検査装置（ＡＯＩ）→アンローダーの順に構成されている。なお、異方導電膜貼付装置も１台ではなく、工程中に複数台が連続して設置されている場合が多い。   The anisotropic conductive film pasting apparatus in the present embodiment is a part of a process (line) for mounting chip-shaped electronic components, modules, and the like on a work W (liquid crystal panel, electronic circuit board, etc.) with an anisotropic conductive film interposed therebetween. The entire process is as follows: loader → substrate cleaning device → anisotropic conductive film pasting device (ACF transfer) → chip crimping device (COG or FPC temporary crimping, final crimping) → inspection It is configured in the order of device (AOI) → unloader. In addition, the anisotropic conductive film sticking apparatus is not only one unit, but a plurality of units are often continuously installed during the process.

まず、異方導電膜貼付装置の動作（ワークフロー）について説明する。
図２において、異方導電膜貼付装置は、工程の上流側（図示左方）に位置する洗浄装置（図示省略）で洗浄されたワークＷを、搬送ア−ムを用いて装置本体内に取り込み（Ａ→Ｂ位置）、ｘｙ二方向に移動可能でかつｚ方向のθ軸回りに回転可能な吸着パッド付き移動ステージに移載した後（Ｂ位置）、複数のカメラ等を用いて異方導電膜の貼り付け位置を確認・記憶してから（Ｃ位置）、その位置情報に合わせて、貼り付けポジション（Ｄ位置）で上記ワークＷの所定位置に、異方導電膜の貼り付け（転写）を行なう。 First, the operation (workflow) of the anisotropic conductive film pasting apparatus will be described.
In FIG. 2, the anisotropic conductive film pasting apparatus takes in the workpiece W, which has been cleaned by a cleaning apparatus (not shown) located upstream of the process (left side in the figure), into the apparatus body using a transfer arm. (A → B position), transferred to a moving stage with suction pad that can move in two xy directions and rotate around the θ axis in the z direction (B position), and then anisotropically conductive using multiple cameras After confirming and storing the film attachment position (C position), the anisotropic conductive film is attached (transferred) to the predetermined position of the workpiece W at the attachment position (D position) according to the position information. To do.

なお、貼り付けポジション（図２のＤ位置）においても、図示しないカメラ等による貼り付け位置の確認および基板の位置決めが行なわれている。そして、移動ステージのｘｙ方向への移動あるいはθ軸回りの回転を繰り返して、ワークＷの縦横の端縁に設定された複数の指定個所に、異方導電膜が何度かに分けて貼り付けされる。また、上記異方導電膜の貼り付け（複数台の貼付装置がある場合は本機の担当範囲のみ）が完了したワークＷ（図２のＥ位置）は、工程の下流側（図示右方）に位置する別の異方導電膜貼付装置あるいはチップ圧着装置等の搬送ア−ム（本例においては搬送アーム＃２）によって、次のステップへと搬出されて行くこととなる（図２のＦ位置）。   At the pasting position (position D in FIG. 2), the pasting position is confirmed and the substrate is positioned by a camera (not shown). Then, by repeatedly moving the moving stage in the xy direction or rotating around the θ axis, the anisotropic conductive film is pasted in a plurality of designated locations set at the vertical and horizontal edges of the workpiece W in several portions. Is done. Also, the workpiece W (position E in FIG. 2) on which the anisotropic conductive film has been attached (if there are a plurality of attachment devices, only the area in charge of this machine) is the downstream side of the process (right side in the figure) It is carried out to the next step by a transfer arm (in this example, transfer arm # 2) such as another anisotropic conductive film sticking device or a chip crimping device located at (step F in FIG. 2). position).

つぎに、異方導電膜貼付装置の構成について説明する。
図１は、本実施形態における異方導電膜貼付装置の本体内を操作（制御）パネル側から見た図であり、その操作パネル側（紙面表側）を装置の手前側、後述するリール交換などのために開閉可能な作業用パネルのある側（紙面裏側）を装置の奥側として説明する。なお、先に述べたような、ワークＷを工程の上流側（図示左方）から装置本体内に搬入し、工程の下流側（図示右方）に搬出する搬送アームは図示を省略している。また、貼付に使用される異方導電（ＡＣＦ）テープは、その厚みを強調して図示している。 Next, the configuration of the anisotropic conductive film pasting device will be described.
FIG. 1 is a view of the inside of the main body of the anisotropic conductive film pasting apparatus according to the present embodiment as viewed from the operation (control) panel side. The operation panel side (the front side of the drawing) is the front side of the apparatus, reel replacement described later, etc. Therefore, the side with the work panel that can be opened and closed (the back side of the paper) will be described as the back side of the apparatus. Note that the transfer arm for carrying the workpiece W into the apparatus main body from the upstream side (left side in the figure) and carrying it out to the downstream side (right side in the figure) as described above is omitted. . An anisotropic conductive (ACF) tape used for sticking is illustrated with its thickness emphasized.

この異方導電膜貼付装置は、リールＲ（図におけるＲ1〜Ｒ4の総称：以下同じ）に巻回された形でメーカーから出荷される異方導電テープＴ（図におけるＴ1〜Ｔ4の総称：以下同じ）を装着保持するテープ供給部Ｐと、異方導電テープをワークＷに押し付ける圧着部Ｑと、異方導電膜を貼り付けるべきワークＷを所定位置に移動させて位置決めするステージＳ（基板位置決め手段）と、ワークＷを搬入・搬出するための搬送手段、および、これら各部および手段を統合的にコントロールする制御手段と電源部等から構成されている。 This anisotropic conductive film affixing device is an anisotropic conductive tape T (T 1 to T 4 in the figure) shipped from the manufacturer in a form wound on a reel R (generic name of R 1 to R 4 in the figure: the same applies hereinafter). A tape supply unit P for mounting and holding the same, and a pressure bonding unit Q for pressing the anisotropic conductive tape against the work W, and a stage for moving and positioning the work W to which the anisotropic conductive film is to be attached to a predetermined position. S (substrate positioning means), conveying means for loading / unloading the workpiece W, control means for controlling these parts and means in an integrated manner, a power supply part, and the like.

異方導電テープＴをワークＷに押し付ける圧着部Ｑは、図３の要部拡大図に示すように、それぞれ貼付けヘッド１および１’を備える２組の圧着ユニットＱｕ（第１圧着ユニットＱｕ1および第２圧着ユニットＱｕ2の総称：以下同じ）からなる。なお、図のように、２組の圧着ユニットＱｕ1およびＱｕ2は、これらの中央を挟んで線対称（鏡像）関係にあり、ほぼ同時に作動する。 Crimping portion Q pressed against the anisotropic conductive tape T to the workpiece W, as shown in enlarged view of FIG. 3, two sets of crimping unit Qu (first crimping unit Qu 1 and comprising a 1 and 1 ', respectively application head The second crimping unit Qu 2 is a generic name: the same applies hereinafter). As shown in the figure, the two sets of crimping units Qu 1 and Qu 2 are in a line symmetry (mirror image) relationship with their centers in between, and operate almost simultaneously.

各圧着ユニットＱｕ1，Ｑｕ2は、上記貼付けヘッド１，１’と、これら貼付けヘッド１，１’を上下に移動させるシリンダ２，２’とを備えており、所定位置に位置決めされた上記ワークＷと各貼付けヘッド１，１’の間に供給された異方導電テープＴ1，Ｔ3を、後述するシリコンテープを介してセパレータ側から押圧することにより、セパレータに積層された異方導電膜のみをワークＷの指定個所に転写する。 Each crimping unit Qu 1 , Qu 2 includes the above-mentioned pasting heads 1, 1 ′ and cylinders 2, 2 ′ for moving these pasting heads 1, 1 ′ up and down, and the workpiece positioned at a predetermined position. Anisotropic conductive film laminated on the separator by pressing anisotropic conductive tapes T 1 and T 3 supplied between W and each of the pasting heads 1 and 1 ′ from the separator side through a silicon tape described later. Is transferred to the designated part of the workpiece W.

また、圧着ユニットＱｕ1およびＱｕ2は、異方導電膜の貼付方向（図示左右：ｘ方向）に沿って配設されており、その一方の圧着ユニット（本例においてはＱｕ2）が上記貼付方向にスライドできるように形成されていることから、各貼付けヘッド１，１’間の異方導電膜の貼付方向の間隔を調整することが可能である。 Further, the crimping units Qu 1 and Qu 2 are arranged along the direction of sticking the anisotropic conductive film (left and right in the figure: x direction), and one of the crimping units (Qu 2 in this example) is attached to the sticking unit. Since it is formed so as to be slidable in the direction, it is possible to adjust the spacing in the sticking direction of the anisotropic conductive film between the sticking heads 1, 1 ′.

なお、この異方導電膜貼付装置の圧着ユニットＱｕ1，Ｑｕ2には、図示しないカッタユニットが装着されており、貼付けヘッド１，１’に供給される直前の異方導電テープＴの異方導電膜部位のみを、所定長さに切断（ハーフカット）している。したがって、ワークＷの所定位置には、所要長さの異方導電膜のみが転写され、押圧（転写）後は、異方導電テープＴのセパレータ部位のみが、圧着ユニットＱｕ上部の吸引孔から装置外部の回収箱等へ吸引・回収されることとなる。 Note that a cutter unit (not shown) is attached to the pressure bonding units Qu 1 and Qu 2 of the anisotropic conductive film pasting apparatus, and the anisotropic conductive tape T just before being supplied to the pasting heads 1 and 1 ′ is anisotropic. Only the conductive film portion is cut into a predetermined length (half cut). Therefore, only the anisotropic conductive film having a required length is transferred to a predetermined position of the workpiece W, and after pressing (transfer), only the separator portion of the anisotropic conductive tape T is transferred from the suction hole above the pressure bonding unit Qu. It will be sucked and collected in an external collection box.

また、各貼付けヘッド１，１’には、各ヘッド１，１’を保温する保温手段（図示省略）が取り付けられているとともに、それぞれの貼付けヘッド１，１’およびシリンダ２，２’の近傍には、シリコンテープＶ（Ｖ1，Ｖ2の総称：以下同じ）を巻回した小リールｒ（シリコンテープ供給リールｒ1，ｒ3およびシリコンテープ回収リールｒ2，ｒ4の総称：以下同じ）が配設されており、図３のように、異方導電テープＴとは異なる供給ルートを用いて、シリコンテープＶが異方導電テープＴと各貼付けヘッド１，１’の間に供給されている。なお、上記シリコンテープＶは、異方導電テープＴを保護するとともに、これら異方導電テープＴとヘッド１，１’の間の離型性を高めるために用いられる。 Each of the pasting heads 1 and 1 ′ is provided with heat retaining means (not shown) for keeping the heads 1 and 1 ′ warm, and in the vicinity of the pasting heads 1 and 1 ′ and the cylinders 2 and 2 ′. Includes a small reel r (generic name of silicon tape supply reels r 1 and r 3 and silicon tape recovery reels r 2 and r 4 ) wound with a silicon tape V (generic name of V 1 and V 2 : the same applies hereinafter). As shown in FIG. 3, the silicon tape V is supplied between the anisotropic conductive tape T and each of the pasting heads 1 and 1 ′ using a supply route different from that of the anisotropic conductive tape T. ing. The silicon tape V is used for protecting the anisotropic conductive tape T and enhancing the releasability between the anisotropic conductive tape T and the heads 1 and 1 ′.

以上の構成により、本実施形態の異方導電膜貼付装置は、ワークＷに対し、１ステップの動作で２つ以上の指定個所に異方導電膜を同時に転写することができる。したがって、本発明の異方導電膜貼付装置は、貼付作業のタクトタイムを低減することが可能になる。   With the above configuration, the anisotropic conductive film pasting apparatus according to the present embodiment can simultaneously transfer the anisotropic conductive film to the workpiece W at two or more designated locations in one step. Therefore, the anisotropic conductive film sticking device of the present invention can reduce the tact time of the sticking work.

また、これら各貼付けヘッド１，１’間の間隔が調節可能に構成されていることから、ワークＷの大型化等による貼付個所の増加や位置の変更、あるいは、様々な貼付位置が指定された多様なサイズの回路基板へ、柔軟に対応することができる。   In addition, since the interval between each of the pasting heads 1 and 1 ′ is configured to be adjustable, the number of pasting points is increased or the position is changed due to the enlargement of the workpiece W, or various pasting positions are designated. It can flexibly cope with circuit boards of various sizes.

なお、異方導電テープＴのハーフカットを行なうカッタユニットや、各貼付けヘッド１，１’を保温する保温手段等は、特に限定されるものではなく、使用する異方導電テープＴの種類や規格、あるいは、貼り付けを行なう基板の種類やサイズ等に応じて使用すればよい。シリコンテープＶの使用・不使用や、異方導電テープＴの回収方法等も、適宜変更することが可能である。   The cutter unit for half-cutting the anisotropic conductive tape T, the heat retaining means for retaining each of the pasting heads 1, 1 ′ are not particularly limited, and the type and standard of the anisotropic conductive tape T to be used Alternatively, it may be used according to the type and size of the substrate to be attached. The use / nonuse of the silicon tape V, the method of collecting the anisotropic conductive tape T, and the like can be changed as appropriate.

また、本実施形態においては、ワークＷの流れ方向（図示ｘ方向）にのみ複数の貼付けヘッド１，１’を有する異方導電膜貼付装置の例を示したが、これらに加えて、基板の流れ方向に直交する方向（図示ｙ方向）にも１つあるいは複数の貼付けヘッドを配置してもよい。   Moreover, in this embodiment, although the example of the anisotropic conductive film sticking apparatus which has several sticking heads 1 and 1 'only in the flow direction (illustration x direction) of the workpiece | work W was shown, in addition to these, One or a plurality of pasting heads may be arranged in a direction (y direction in the figure) perpendicular to the flow direction.

ちなみに、本実施形態における異方導電膜貼付装置を用いて、ワークＷである液晶表示（ＬＣＤ）パネルに対し、その周縁部にドライバＩＣをＣＯＧ方式等で実装する場合の異方導電膜の転写（Ｐｒｅ−Ｂｏｎｄｉｎｇ）条件は、貼付けヘッド１，１’の温度：５０〜７０℃，圧着圧：約１ＭＰａ，１個所あたりの圧着時間：０．７〜１．５秒である。また、タクトタイムは、従来のシングルヘッドの貼付装置に比べ、本実施例のデュアル（ダブル）ヘッドの貼付装置の場合、約１．７倍（時間にして約４０％短縮）に向上する。   By the way, using the anisotropic conductive film pasting apparatus according to the present embodiment, the anisotropic conductive film is transferred when a driver IC is mounted on the periphery of the liquid crystal display (LCD) panel as the work W by the COG method or the like. (Pre-bonding) conditions are: temperature of the pasting head 1, 1 ′: 50 to 70 ° C., pressure bonding pressure: about 1 MPa, pressure bonding time per place: 0.7 to 1.5 seconds. In addition, the tact time is improved by about 1.7 times (about 40% reduction in time) in the case of the dual (double) head sticking device of the present embodiment as compared with the conventional single head sticking device.

つぎに、上記圧着部Ｑに異方導電テープＴを供給するテープ供給部Ｐについて説明する。テープ供給部Ｐにも、上記２組の圧着ユニットＱｕ1およびＱｕ2のそれぞれに対応する２組のテープ供給ユニットＰｕ（第１テープ供給ユニットＰｕ1および第２テープ供給ユニットＰｕ2の総称：以下同じ）が設けられており、各テープ供給ユニットＰｕ1およびＰｕ2は、回転軸３および３’と、この回転軸３および３’を挟んで背中合わせに対向するリール装着部４Ａ，４Ｂおよび４Ａ’，４Ｂ’と、各リール装着部に対応するチャック５Ａ，５Ｂおよび５Ａ’，５Ｂ’とが配置されている。 Next, the tape supply unit P that supplies the anisotropic conductive tape T to the crimping part Q will be described. Also in the tape supply section P, two sets of tape supply units Pu corresponding to the two sets of crimping units Qu 1 and Qu 2 (generic name of the first tape supply unit Pu 1 and the second tape supply unit Pu 2 : The tape supply units Pu 1 and Pu 2 are provided with rotating shafts 3 and 3 ′ and reel mounting portions 4A, 4B and 4A ′ that face each other across the rotating shafts 3 and 3 ′. , 4B ′ and chucks 5A, 5B and 5A ′, 5B ′ corresponding to the respective reel mounting portions are arranged.

また、テープ供給ユニットＰｕ1，Ｐｕ2には、各ユニットに１つずつ、異方導電テープＴのエンドマークを検出するセンサ６，６’と、超音波発振器１０，１０’、テープ終端部把持部材７，７’、テープ終端部用カッタ８，８’、移動ローラ９，９’、テープ融着用受け部材１１，１１’、テープ開始端部用カッタ１２，１２’等が設けられている。 The tape supply units Pu 1 and Pu 2 each include one sensor 6, 6 ′ for detecting the end mark of the anisotropic conductive tape T, the ultrasonic oscillator 10, 10 ′, and the end of the tape. The members 7, 7 ', the tape end part cutters 8, 8', the moving rollers 9, 9 ', the tape fusion receiving members 11, 11', the tape start end part cutters 12, 12 ', and the like are provided.

なお、図３のように、２組のテープ供給ユニットＰｕ1，Ｐｕ2も、上記圧着ユニットＱｕ1およびＱｕ2と同様、これらの中央を挟んで線対称（鏡像）関係にある。また、これらテープ供給ユニットＰｕ1，Ｐｕ2の中間位置には、上記移動ローラ９，９’、テープ融着用受け部材１１，１１’、テープ開始端部用カッタ１２，１２’等を支持するとともに、これらの上記異方導電膜の貼付方向（図示左右方向）への移動を個別に制御するアクチュエータ等を備える支持基台Ｕが設けられている。 As shown in FIG. 3, the two sets of tape supply units Pu 1 and Pu 2 are also in a line-symmetric (mirror image) relationship with their centers in between, as is the case with the crimping units Qu 1 and Qu 2 . In addition, the moving rollers 9, 9 ′, the tape fusing receiving members 11, 11 ′, the tape start end cutters 12, 12 ′, and the like are supported at intermediate positions of the tape supply units Pu 1 and Pu 2. A support base U including an actuator or the like for individually controlling the movement of the anisotropic conductive film in the sticking direction (left-right direction in the drawing) is provided.

図４（ａ）は、テープ供給ユニットＰｕ1を装置の横方向（ユニットＰｕ2側）から見た図であり、図４（ｂ）は、このテープ供給ユニットＰｕ1を装置の上方から見下ろした図である。なお、これらの図においては、異方導電テープＴの図示を省略している。 4A is a view of the tape supply unit Pu 1 as viewed from the lateral direction (unit Pu 2 side) of the apparatus, and FIG. 4B is a view of the tape supply unit Pu 1 as viewed from above the apparatus. FIG. In these drawings, the anisotropic conductive tape T is not shown.

図４（ａ）のように、テープ供給ユニットＰｕ1（Ｐｕ2も同様）においては、その基台２０の略中央に、ステッピングモータ等により１８０°往復回転（回動）する回転軸３が配置されており、この回転軸３の上端近傍には、該回転軸３を挟んで背中合わせに対向するように、リール装着部４Ａおよび４Ｂが取り付けられている。 As shown in FIG. 4A, in the tape supply unit Pu 1 (the same applies to Pu 2 ), a rotating shaft 3 that is reciprocally rotated (rotated) by 180 ° by a stepping motor or the like is disposed at the approximate center of the base 20. In the vicinity of the upper end of the rotary shaft 3, reel mounting portions 4A and 4B are attached so as to face each other back to back with the rotary shaft 3 interposed therebetween.

さらに、上記回転軸３の下端近傍には、リール装着部４Ａに対応するチャック５Ａとリール装着部４Ｂに対応するチャック５Ｂとが、リール装着部４Ａ，４Ｂと同様、軸３を挟んで対称となるように配置されているとともに、これらの基部が延設されて上記回転軸３に固定され、図４（ｂ）のように、チャック５Ａおよび５Ｂが、リール装着部４Ａおよび４Ｂに同期して回転するように構成されている。   Further, in the vicinity of the lower end of the rotary shaft 3, the chuck 5A corresponding to the reel mounting portion 4A and the chuck 5B corresponding to the reel mounting portion 4B are symmetrical with respect to the shaft 3 like the reel mounting portions 4A and 4B. These base portions are extended and fixed to the rotary shaft 3, and the chucks 5A and 5B are synchronized with the reel mounting portions 4A and 4B as shown in FIG. 4B. It is configured to rotate.

なお、後述する異方導電テープＴの終端部の処理に利用されるテープ終端部把持部材７およびテープ終端部用カッタ８は、図４（ａ）のように、使用しない時は、異方導電テープＴの走行に支障のない位置まで引き込まれており、異方導電テープＴ同士の接合時にのみ、２点鎖線で示すように、図示左方に移動（前進）するように構成されている。   Note that the tape end portion gripping member 7 and the tape end portion cutter 8 used for processing the end portion of the anisotropic conductive tape T, which will be described later, are anisotropically conductive when not in use, as shown in FIG. The tape T is drawn to a position that does not hinder the traveling of the tape T, and is moved (advanced) to the left in the drawing as indicated by a two-dot chain line only when the anisotropic conductive tapes T are joined.

つぎに、以上のような構成のテープ供給ユニットＰｕにおけるリールＲの交換方法、および、異方導電テープＴの終端部に別の新たな異方導電テープＴの開始端部を接合する方法について説明する。なお、テープ供給ユニットＰｕ1とＰｕ2とは同様の構成であるため、第１テープ供給ユニットＰｕ1についてのみ説明する。 Next, a method for exchanging the reel R in the tape supply unit Pu having the above-described configuration and a method for joining the start end of another anisotropic conductive tape T to the end of the anisotropic conductive tape T will be described. To do. Since the tape supply units Pu 1 and Pu 2 have the same configuration, only the first tape supply unit Pu 1 will be described.

図５（ａ）〜（ｃ），図６（ａ）〜（ｃ）および図７（ａ）〜（ｃ）は、このテープ供給ユニットＰｕ1における異方導電テープＴ同士の接合方法を、段階を追って順に説明する図であり、それぞれ、以下に述べるテープ接合手順のＳＴＥＰ１〜ＳＴＥＰ９に相当する。 Figure 5 (a) ~ (c) , FIG. 6 (a) ~ (c) and FIG. 7 (a) ~ (c) is a bonding method of the anisotropic conductive tape T between the tape supply unit Pu 1, step FIG. 4 is a diagram for explaining the steps sequentially, and corresponds to STEP 1 to STEP 9 of the tape joining procedure described below.

まず、図５（ａ）は、テープ供給ユニットＰｕ1の一方のリール装着部４Ａが、上記圧着ユニットＱｕ1（貼付けヘッド１）に異方導電テープＴ1を供給可能な供給位置（図示右側）に位置決めされ、このリール装着部４Ａに装着保持された「使用中」のリールＲ1の異方導電テープＴ1の残り量が少なくなった状態を示している。この時、残余少量となった異方導電テープＴ1の終端部近傍に形成されたエンドマークを、テープ供給ユニットＰｕ1に配設されたセンサ６が検出した時点で、圧着ユニットＱｕ1による異方導電膜の貼り付けと、供給ユニットＰｕ1からの異方導電テープＴ1の供給が停止される（ＳＴＥＰ１）。 First, FIG. 5 (a), one of the reel mounting portion 4A of the tape supply unit Pu 1 is the crimping unit Qu 1 (application head 1) capable of supplying feed position anisotropic conductive tape T 1 (shown right) The remaining amount of the anisotropic conductive tape T 1 of the “in use” reel R 1 mounted and held on the reel mounting portion 4A is reduced. At this time, when the sensor 6 disposed in the tape supply unit Pu 1 detects an end mark formed in the vicinity of the end portion of the anisotropic conductive tape T 1 that has become a small amount, a difference caused by the pressure-bonding unit Qu 1 is detected. The attachment of the anisotropic conductive film and the supply of the anisotropic conductive tape T 1 from the supply unit Pu 1 are stopped (STEP 1).

なお、他方のリール装着部４Ｂ（図示左側）には、新たな異方導電テープＴ2が充分に巻回された交換用のリールＲ2が予め装着されており、そのテープＴ2の開始端部がリールＲ2から引き出され、開始端部近傍の一部（約１０〜２０ｃｍ程度）の異方導電膜を除去した状態（セパレータのみとなった状態）で、上記異方導電テープＴ2の開始端部が、リール装着部４Ｂ用のチャック５Ｂに把持されている（リール付け替え作業）。 Note that a replacement reel R 2 around which a new anisotropic conductive tape T 2 is sufficiently wound is mounted in advance on the other reel mounting portion 4B (left side in the figure), and the start end of the tape T 2 is mounted. The portion of the anisotropic conductive tape T 2 is pulled out from the reel R 2 and a part of the anisotropic conductive film in the vicinity of the start end (about 10 to 20 cm) is removed (only the separator is formed). The start end is gripped by the chuck 5B for the reel mounting portion 4B (reel replacement operation).

そして、上記圧着ユニットＱｕ1の停止が確認されると、通常、異方導電テープＴ1の走行に支障のない奥側の位置（図４（ａ）参照）まで引き込まれていたテープ供給ユニットＰｕ1のテープ終端部把持部材７とテープ終端部用カッタ８が、図５（ｂ）のように、装置手前側（紙面表側方向）に前進して、異方導電テープＴ1の走行位置に位置決めされる（ＳＴＥＰ２）。 When it is confirmed that the crimping unit Qu 1 is stopped, the tape supply unit Pu that has been drawn to a position on the far side (see FIG. 4A) that does not hinder the traveling of the anisotropic conductive tape T 1 is usually used. As shown in FIG. 5B, the tape end portion gripping member 7 and the tape end portion cutter 8 are advanced to the front side of the apparatus (the front side of the sheet) and positioned at the travel position of the anisotropic conductive tape T 1. (STEP 2).

ついで、図５（ｃ）のように、チャック様のテープ終端部把持部材７が、その把持部の間に位置する異方導電テープＴ1の終端近傍部を把持した後（ＳＴＥＰ３）、図６（ａ）のように、はさみ様のテープ終端部用カッタ８が動作して、上記テープ終端部把持部材７の把持部位よりさらにテープ終端側の異方導電テープＴ1を切断する（ＳＴＥＰ４）。 Next, as shown in FIG. 5C, after the chuck-like tape end portion gripping member 7 grips the vicinity of the end portion of the anisotropic conductive tape T 1 located between the grip portions (STEP 3), FIG. As shown in (a), the scissor-like tape end part cutter 8 operates to cut the anisotropic conductive tape T 1 on the tape end side further than the holding part of the tape end part holding member 7 (STEP 4).

そして、テープ終端部用カッタ８が開くとともに、図６（ｂ）のように、移動ローラ９が、つぎの手順で行なわれるリールＲ1，Ｒ2の配置交換の邪魔にならない位置（図示右方）まで移動する（ＳＴＥＰ５）。 Then, the tape end cutter 8 is opened, and as shown in FIG. 6B, the moving roller 9 is positioned so as not to obstruct the replacement of the reels R 1 and R 2 performed in the following procedure (right side in the figure). ) (STEP 5).

移動ローラ９の退避が完了すると、制御手段からの指令等によるステッピングモータ等の回転によって、リールＲ1，Ｒ2の配置交換手段である回転軸３が回転を始め、図６（ｃ）のように、１８０°回転した時点でストップする。この時、回転軸の上端近傍に接続されている各リール装着部４Ａおよび４Ｂの配置が入れ換わり、供給位置（図示右側）にあったリール装着部４Ａが、リールＲの付け替え可能な待機位置（図示左側）に移動して位置決めされ、反対に、待機位置にあったリール装着部４Ｂが、圧着ユニットＱｕ1（貼付けヘッド１）に異方導電テープＴ2を供給可能な供給位置に移動して位置決めされる（ＳＴＥＰ６）。 When the retraction of the moving roller 9 is completed, the rotation shaft 3 as the arrangement exchanging means for the reels R 1 and R 2 starts to rotate by the rotation of the stepping motor or the like according to the command from the control means, as shown in FIG. Then, it stops when it is rotated 180 °. At this time, the arrangement of the reel mounting portions 4A and 4B connected in the vicinity of the upper end of the rotating shaft is switched, and the reel mounting portion 4A in the supply position (right side in the figure) can be replaced with a standby position (replaceable reel R). On the other hand, the reel mounting portion 4B located at the standby position moves to a supply position where the anisotropic conductive tape T 2 can be supplied to the crimping unit Qu 1 (the pasting head 1). It is positioned (STEP 6).

なお、回転軸３の下端近傍に接続されている各チャック５Ａ，５Ｂも、リール装着部４Ａ，４Ｂに同期して配置が入れ換わるため、新たなリールＲ2の開始端部（口出し部位）も、上記テープ終端部把持部材７に把持された状態の異方導電テープＴ1の終端部に、近接した位置に配置される。 Each chuck 5A connected near the lower end of the rotating shaft 3, 5B also, the reel mounting portion 4A, since the interchanged placement in synchronism with 4B, the start end of a new reel R 2 (yarn end finding sites) also The anisotropic conductive tape T 1 held by the tape terminal holding member 7 is disposed at a position close to the terminal of the anisotropic conductive tape T 1 .

リール装着部４Ａ，４Ｂの配置交換が確認されると、図７（ａ）のように、テープ融着用受け部材１１が、新たな異方導電テープＴ2の開始端部（異方導電膜が除去された部位）を、上記切断された異方導電テープＴ1の終端部に押し付け、これらを超音波発振器１０の発振子との間に挟み込む。そして、超音波発振器１０が超音波を所定時間照射することにより、テープＴ2とテープＴ1の重なり合った部位が融着・固定される（ＳＴＥＰ７）。 Reel mounting portion 4A, the arrangement exchange 4B is confirmed, as shown in FIG. 7 (a), the tape fusing receiving member 11, the start end portion of a new anisotropic conductive tape T 2 (anisotropic conductive film The removed portion) is pressed against the terminal portion of the cut anisotropic conductive tape T 1 , and is sandwiched between the oscillator of the ultrasonic oscillator 10. Then, when the ultrasonic oscillator 10 irradiates the ultrasonic wave for a predetermined time, the overlapping portion of the tape T 2 and the tape T 1 is fused and fixed (STEP 7).

その後、図７（ｂ）のように、テープ開始端部用カッタ１２が移動（図示左方）して、新たな異方導電テープＴ2における上記融着部位よりさらに開始端側の（余分となった）セパレータを切断し、異方導電テープＴ1の終端部と異方導電テープＴ2の開始端部の接合が完了する（ＳＴＥＰ８）。 Thereafter, as shown in FIG. 7 (b), the tape start end portion cutter 12 is moved (leftward), further start end side (the extra from the fusion site in a new anisotropic conductive tape T 2 It became) cutting the separator, bonding the anisotropic conductive end portion of the tape T 1 and the start end of the anisotropic conductive tape T 2 is completed (STEP 8).

つぎに、図７（ｃ）のように、異方導電テープＴ1の終端部を把持していたテープ終端部把持部材７と、テープ終端部用カッタ８が、装置奥側（紙面裏側方向）に後退して、異方導電テープＴ2の走行に支障のない位置まで引き込まれるとともに、上記テープ端部同士の融着作業に使用されたテープ融着用受け部材１１とテープ開始端部用カッタ１２とが、原位置（図示右方）に復帰する。最後に、リールＲ1，Ｒ2の配置交換の邪魔にならない位置（図示右側）まで退避していた移動ローラ９が、原位置（図示左方）に復帰して、新たなリールＲ2からの異方導電テープＴ2の供給が開始される（ＳＴＥＰ９）。 Next, as shown in FIG. 7 (c), the anisotropic conductive tape end portions gripping member 7 which has been gripping the end portion of the tape T 1, a tape terminal end cutter 8, the apparatus rear side (toward the back direction) The tape fusion receiving member 11 and the tape start end cutter 12 used for the fusion work between the tape ends are retracted to the position where there is no hindrance to the traveling of the anisotropic conductive tape T 2. Return to the original position (right side in the figure). Finally, the moving roller 9 evacuated to a position (the right side in the figure) that does not interfere with the arrangement exchange of the reels R 1 and R 2 returns to the original position (the left side in the figure), and is moved from the new reel R 2 . Supply of the anisotropic conductive tape T 2 is started (STEP 9).

以上のように、本実施形態における異方導電膜貼付装置は、残余少量となったリールＲ1と新たなリールＲ2の交換作業と、異方導電テープＴ1とＴ2の接続作業を、自動で素早く完了することができる。 As described above, the anisotropic conductive film pasting apparatus according to the present embodiment performs the replacement work of the reel R 1 and the new reel R 2 that have become a small amount, and the connection work of the anisotropic conductive tapes T 1 and T 2 . It can be completed automatically and quickly.

また、本実施形態における異方導電膜貼付装置は、各圧着ユニットＱｕ1，Ｑｕ2に対応する異方導電テープ供給手段（テープ供給ユニットＰｕ1，Ｐｕ2）を個別に設けているが、上記リールＲ交換方式によれば、これらテープ供給ユニットＰｕ1，Ｐｕ2の水平方向における必要設置面積が小さく、各貼付けヘッド１，１’の上方にコンパクトに配設することができる。したがって、装置本体サイズの増大が抑えられ、この貼付装置自身をコンパクトに構成することができる。 Further, the anisotropic conductive film pasting apparatus in the present embodiment is provided with anisotropic conductive tape supply means (tape supply units Pu 1 , Pu 2 ) corresponding to the respective crimping units Qu 1 , Qu 2 individually. According to the reel R exchanging method, the required installation area in the horizontal direction of these tape supply units Pu 1 and Pu 2 is small, and the tape supply units Pu 1 and Pu 2 can be arranged compactly above the pasting heads 1 and 1 ′. Accordingly, an increase in the size of the apparatus main body is suppressed, and the sticking apparatus itself can be configured compactly.

さらに、上記残余少量の異方導電テープＴ1の終端部と上記未使用の異方導電テープＴ2の開始端部との接合を、これらテープが重なり合った部位に超音波を照射して融着させることにより行なうことから、上記各異方導電テープＴ間の接続（融着）を素早くかつ短時間で行なうことができる。 Further, the end portion of the remaining anisotropic conductive tape T 1 and the start end portion of the unused anisotropic conductive tape T 2 are joined together by irradiating ultrasonic waves to the overlapping portions of these tapes. Therefore, connection (fusion) between the anisotropic conductive tapes T can be performed quickly and in a short time.

ちなみに、残余少量の異方導電テープＴ1の終端部と未使用の異方導電テープＴ2の開始端部との接合を、接着テープ等を用いて作業員が手で行なう場合、作業への慣れの程度にもよるが、通常１〜３分の時間を要する。それに対して、本実施形態のように、超音波融着を用いて自動でテープＴ1の終端部とテープＴ2の開始端部を接合した場合は、約１０秒ほどで終了するため、エンドマーク検出によるリールＲ停止（貼り付け停止）から約４０秒ほどで異方導電膜の貼り付けを再開できる。 By the way, if the worker manually joins the end of the remaining anisotropic conductive tape T 1 and the start of the unused anisotropic conductive tape T 2 with an adhesive tape or the like, Depending on the level of familiarity, it usually takes 1-3 minutes. On the other hand, when the end portion of the tape T 1 and the start end portion of the tape T 2 are automatically joined using ultrasonic fusion as in this embodiment, the end is completed in about 10 seconds. The application of the anisotropic conductive film can be resumed in about 40 seconds after the reel R is stopped by the mark detection.

また、空になったリールＲ1が、新たなリールＲの交換（付け替え）が可能な待機位置に位置決めされるようになっているため、この装置の管理者（作業者）は、装置の稼働（ランニング）中であっても、使用中のリールＲに手を触れることなく、自由なタイミングで、使用済みの空リールＲを取り外し、異方導電テープＴが巻回された新たなリールＲに交換することができる。 Further, since the emptied reel R 1 is positioned at a standby position where a new reel R can be exchanged (replaced), the manager (operator) of this apparatus operates the apparatus. Even during (running), the used empty reel R is removed at any time without touching the reel R in use, and a new reel R on which the anisotropic conductive tape T is wound is used. Can be exchanged.

なお、以上の実施形態においては、リールＲの配置交換手段として、２つのリール装着部４Ａ，４Ｂが、回転軸３を挟んで１８０°反転動作する配置を例を示したが、これらと同様のリール装着部を周方向等配に３個以上配設して、軸の回転により配置を順次入れ換える構成としてもよい。   In the above embodiment, as an arrangement exchanging means for the reel R, an example is shown in which the two reel mounting portions 4A and 4B are reversed by 180 ° with the rotating shaft 3 interposed therebetween. A configuration may be adopted in which three or more reel mounting portions are arranged at equal intervals in the circumferential direction, and the arrangement is sequentially changed by rotating the shaft.

また、リールＲの配置交換手段は、一方または他方の面側に各１個ずつのリール装着部（４Ａ，４Ｂ）を備えるものだけではなく、一面側および他面側に、上下あるいは左右に設置された複数の支軸にそれぞれリールをセットする方法でもよい。 In addition, the arrangement replacement means for the reel R is not only provided with one reel mounting portion (4A, 4B) on one or the other surface side, but is also installed on the one surface side and the other surface side in the vertical and horizontal directions. reel each of a plurality of support shafts that are or may be a set toss Ru method.

さらに、残余少量の異方導電テープＴ1の終端部と未使用の異方導電テープＴ2の開始端部とを接合する方法も、超音波融着の代わりに、その他の加熱方法による融着や、接着剤や接着テープなどによる接着等を用いてもよい。 Furthermore, the method of joining the end portion of the remaining small amount of anisotropic conductive tape T 1 and the start end portion of the unused anisotropic conductive tape T 2 is also performed by fusion using another heating method instead of ultrasonic fusion. Alternatively, adhesion using an adhesive or an adhesive tape may be used.

本発明の実施形態における異方導電膜貼付装置の概略構成図である。It is a schematic block diagram of the anisotropic electrically conductive film sticking apparatus in embodiment of this invention. 異方導電膜貼付装置内における基板の移動を説明する図である。It is a figure explaining the movement of the board | substrate in an anisotropic conductive film sticking apparatus. 図１の要部拡大図である。It is a principal part enlarged view of FIG. （ａ）はテープ供給ユニットを装置の横方向から見た図であり、（ｂ）はテープ供給ユニットを装置の上方から見下ろした図である。(A) is the figure which looked at the tape supply unit from the horizontal direction of the apparatus, (b) is the figure which looked down at the tape supply unit from the upper direction of the apparatus. （ａ）〜（ｃ）は、テープ終端部とテープ開始端部の接合手順を説明する図であり、それぞれ手順ＳＴＥＰ１〜３に相当する図である。(A)-(c) is a figure explaining the joining procedure of a tape end part and a tape start end part, and is a figure respectively equivalent to procedure STEP1-3. （ａ）〜（ｃ）は、テープ終端部とテープ開始端部の接合手順を説明する図であり、それぞれ手順ＳＴＥＰ４〜６に相当する図である。(A)-(c) is a figure explaining the joining procedure of a tape end part and a tape start end part, and is a figure corresponded to procedure STEP4-6, respectively. （ａ）〜（ｃ）は、テープ終端部とテープ開始端部の接合手順を説明する図であり、それぞれ手順ＳＴＥＰ７〜９に相当する図である。(A)-(c) is a figure explaining the joining procedure of a tape end part and a tape start end part, and is a figure corresponded to procedure STEP7-9, respectively.

符号の説明Explanation of symbols

１，１’ 貼付けヘッド
Ｐ テープ供給部
Ｐｕ1，Ｐｕ2 テープ供給ユニット
Ｑ 圧着部
Ｑｕ1，Ｑｕ2 圧着ユニット
Ｒ1，Ｒ2，Ｒ3，Ｒ4 リール
Ｓ ステージ
Ｔ1，Ｔ2，Ｔ3，Ｔ4 異方導電テープ
Ｗ ワーク 1,1 'application heads P tape supplying portion Pu 1, Pu 2 tape supply unit Q crimping portion Qu 1, Qu 2 crimping unit R 1, R 2, R 3 , R 4 reels S stage T 1, T 2, T 3 , T 4 anisotropic conductive tape W Workpiece

Claims (3)

装置本体内に搬入された基板を所定の位置に移動させて位置決めする基板位置決め手段と、上記位置決めされた基板の所定の部位に、セパレータと異方導電膜とが積層された異方導電テープを、その異方導電膜の面が上記基板に対峙する向きとなるよう供給する異方導電テープ供給手段と、上記異方導電テープをセパレータ側から押圧して異方導電膜のみを基板上に転写して貼り付ける貼付けヘッドとを備えた異方導電膜貼付装置であって、上記貼付けヘッドが、異方導電膜の貼り付け方向に沿って複数個配設され、各貼付けヘッドの間隔が調節可能に設定され、上記異方導電テープ供給手段が、異方導電テープが巻回されたリールを装着保持するリール装着部を備えているとともに、上記異方導電テープ供給手段には、回転軸と、この回転軸を挟んで背中合わせに配設された２個のリール装着部とからなる配置交換手段が設けられ、上記回転軸を１８０°回転させることによって、いずれかのリール装着部が、上記貼付けヘッドに異方導電テープを供給可能な供給位置に位置決めされ、他のリール装着部のいずれかが、リールの付け替えが可能な待機位置に位置決めされるようになっており、この異方導電テープ供給手段が、上記貼付けヘッドごとに独立して設けられていることを特徴とする異方導電膜貼付装置。 A substrate positioning means for moving and positioning a substrate carried into the apparatus main body to a predetermined position, and an anisotropic conductive tape in which a separator and an anisotropic conductive film are laminated on a predetermined portion of the positioned substrate. The anisotropic conductive tape supply means for supplying the anisotropic conductive film so that the surface of the anisotropic conductive film faces the substrate, and the anisotropic conductive tape is pressed from the separator side to transfer only the anisotropic conductive film onto the substrate. An anisotropic conductive film pasting device provided with a pasting head for pasting, and a plurality of the pasting heads are arranged along the direction of pasting the anisotropic conductive film, and the interval between the pasting heads can be adjusted. is set to, the anisotropic conductive tape supply means, together with and a reel mounting portion anisotropic conductive tape to the mounting and holding the reel wound, the above-mentioned anisotropic conductive tape supply means, a rotary shaft This rotation An arrangement exchanging means consisting of two reel mounting portions arranged back to back with each other interposed therebetween is provided, and by rotating the rotating shaft by 180 °, one of the reel mounting portions is anisotropic to the pasting head. Positioned at a supply position where the conductive tape can be supplied, and any one of the other reel mounting portions is positioned at a standby position where the reel can be replaced. An anisotropic conductive film sticking apparatus, wherein the sticking head is provided independently for each sticking head. 上記供給位置で使用中のリールの異方導電テープの残量が少なくなった時、この残余少量テープの終端部近傍をテープ把持部材で把持するとともに終端部側のテープを切断し、上記残余少量テープの終端部を固定した状態で上記回転軸を１８０°回転させて、当該残余少量テープの終端部に、上記待機位置に待機していたリールから引き出した未使用の異方導電テープの開始端部を近接させ、これら終端部と開始端部とを重ね合わせて接合した後、上記テープ把持部材の把持を解除して、上記貼付けヘッドへの異方導電テープの供給を再開するようになっている請求項１記載の異方導電膜貼付装置。 When the remaining amount of anisotropic conductive tape on the reel in use at the supply position decreases, the remaining portion of the tape is gripped by the tape gripping member and the tape on the end portion side is cut, and the remaining amount of the residual tape is cut. With the end of the tape fixed, the rotary shaft is rotated 180 °, and the end of the remaining anisotropic tape is pulled out from the reel that has been waiting at the standby position at the end of the remaining small amount of tape. After the end portions and the start end portions are overlapped and joined, the holding of the tape holding member is released, and the supply of the anisotropic conductive tape to the pasting head is resumed. The anisotropic conductive film sticking apparatus according to claim 1 . 上記残余少量の異方導電テープの終端部と上記未使用の異方導電テープの開始端部との接合が、これらテープの重複部位への超音波の照射による融着によって行なわれるようになっている請求項２記載の異方導電膜貼付装置。 The end portion of the remaining anisotropic conductive tape and the start end portion of the unused anisotropic conductive tape are joined by fusion of ultrasonic waves to the overlapping portions of these tapes. The anisotropic conductive film sticking apparatus according to claim 2 .
JP2008284240A 2008-11-05 2008-11-05 Anisotropic conductive film pasting device Expired - Fee Related JP5231176B2 (en)

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JP2008284240A JP5231176B2 (en) 2008-11-05 2008-11-05 Anisotropic conductive film pasting device
CN2009801415682A CN102187748A (en) 2008-11-05 2009-11-04 Apparatus for adhering anisotropic conductive film
PCT/JP2009/068803 WO2010053081A1 (en) 2008-11-05 2009-11-04 Apparatus for adhering anisotropic conductive film
KR1020117007927A KR20110084171A (en) 2008-11-05 2009-11-04 Apparatus for adhering anisotropic conductive film
TW098137468A TW201030870A (en) 2008-11-05 2009-11-04 Anisotropic conductive film application device

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