TW201030870A - Anisotropic conductive film application device - Google Patents
Anisotropic conductive film application device Download PDFInfo
- Publication number
- TW201030870A TW201030870A TW098137468A TW98137468A TW201030870A TW 201030870 A TW201030870 A TW 201030870A TW 098137468 A TW098137468 A TW 098137468A TW 98137468 A TW98137468 A TW 98137468A TW 201030870 A TW201030870 A TW 201030870A
- Authority
- TW
- Taiwan
- Prior art keywords
- anisotropic conductive
- tape
- conductive film
- reel
- substrate
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
- B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
- B32B37/223—One or more of the layers being plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/202—LCD, i.e. liquid crystal displays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
- B32B38/185—Positioning, e.g. registration or centering during laying up combined with the cutting of one or more layers
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- H01L2924/01004—Beryllium [Be]
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- H01L2924/01005—Boron [B]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
Abstract
Description
201030870 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種貼附裝置，用以將用於安裝晶片或模組等 於基板上之異方性導電膜（ACF)貼附在基板上之既定位置。 【先前技術】 於例如將驅動用ic搭載在形成於液晶顯示面板周緣部之凸片 上之f形下，在將晶片狀之電子零件或模組等安裝在電子電路基 板上時，下述方法已被採用：於基板之既定位置貼附上異方性導 電膜（ACF · Anisotropic Conductive Film)，在此異方性導電膜上 載置電子零件等後，進絲板侧與電子零件等電極之間之定位再 進行暫時壓接’其後以壓接工具進行加熱壓接（持續壓接）， 性連接此等者之間（參照例如專利文獻丨等）。 本發明中，「異方性導電」、「異方導電性」、「異方性 性」等^見為與「異方性導電（杨〇tr〇picC〇nductive)」“ ί材「異方性導電膠帶」係指在基職隔“等 膜、積層片等形態中，特別稱寬度狹 ^ H等者於構成上無不同（參照專利文獻2等）。 件（黑子電路iic生導電膠帶（鮮膠帶）貼附於工作 牛_^十、方、專）既疋位置’以使異方性導電膜轉印之方法 ，下达方法已被採用（參照專利文獻3等）： 方法 將以切斷器等切斷成既定長度之里方性 輕輕壓接後僅將隔離部剝除以使異方;生t以貼附， 使用切斷器等將隔離部上 附不相關連之部分）加以切斷（半’、離°^(與貼 部分，於此狀態下以貼斛丁目,L j自隔離邛刀離去除不要的 於該基板。 、附具（貼附滾子或貼附頭）將膠帶壓接 又 ’因異方性導電膠帶昂貴，為避免浪費此不要的部分，亦 201030870 裝置:可自異方性導轉帶之隔離部侧以單獨使 膜之n熱併用之方式抵壓貼附頭，於切斷異方性導電 膜之^將其轉印於基板（參照專利文獻4〜5等）。 ㈣1方Ί方性導電膠帶通常係由製造膠帶之製造商以捲 iiirri25(w^翻之職提供，故舰喊置之該貼 貼附頭上方)可設置以可任意旋轉之方 ίϊίίϊΞ;;方性ί電膠帶供給機構(供給裝置)，藉由多數 白構ί之膠▼供給通道’可朝_頭絲板之間供給 自該捲1¾抽出之異方性導電膠帶。 用中之捲筒上的異方性導電膠帶麵量減少時，可 感^器等巧測設於捲筒捲怒附近膠帶（膠帶之終端附近）之末端 Ϊΐ 止供給財料轉帶與貼随置之翁（參照專利 墓雷新（更換）捲筒，自此未使用捲筒抽出異方性 ί )以導通該膠帶供給通道，廢棄新的異方 始端部直到正常的異方性導電膜來到該貼附頭之 位置為止’…、、後重新開始貼附裝置之運轉（參照專利文獻7等）。 又’亦有時會將複數捲筒預先設定於裝設部，更換此等者之 :己置：更換捲筒。作為更換複數捲筒配置之方法，有人提議下列 各方式· ❿ 分別設定捲筒於沿上下或是左右方向設置之支轴 者以使用之（專利文獻7);或 · 寻 设定2個捲筒彼此背對背，翻轉18〇。以切換之（專利文獻8等 );或是 ^ 收納該捲筒紐盒内’藉錢換料自動更換 專利文獻9〜10等）。 ' 且亦有人提議-方法’藉由夾頭機構握持未使用捲筒之膠 開始端’姐夾賴構健賴定之模式機，·使異方 電膠帶之開始端自動導通該膠帶供給通道（專利文獻8)。 、又，針對電減電腦、行树話等齡器之· #齡 液晶顯示面板之生產擴大’為提升生產效率或進行輕量化等，於 201030870 各種電子設備中，已開始應用使用該異方性導電（acf 電子零件的安裝技術，財性導賴_作業步驟< = 應多種類（多尺寸）、提升速度、降低成本等需求正 一 【先前技術文獻】 曰 【專利文獻】 【專利文獻1】曰本特開平5-323348號公報 【專利文獻2】日本特開2002-324432號公報 【專利文獻3】日本特開平6-6019號公報 【專利文獻4】日本特開平1〇_31〇743號公報 【專利文獻5】日本特開2001-171897號公報 【專利文獻6】日本特開2001-284005號公報 【專利文獻7】日本特開2005-336447號公報 【專利文獻8】日本特開平7-65648號公報 【專利文獻9】曰本特開平7_65648號公報 【專利文獻10】日本特開2006-96556號公報 【發明内容】 (發明所欲解決之課題） 然而，以如上述習知之單一貼附頭之異方性 ’已逐漸難以因應經大型化之液晶面板等，存在方生莫ς 處愈增加’貼附作業之產距時間(週期時即 地愈為增大之問題。 U即呈一直線 在此’為解決此問題，首先可考慮選擇加 的ίί增二之座數’需於工额確保用以二ίϊίϊ 'Ji面上變得長大，故在產品之處理或步驟管ί ^排列貼附裝置成—列而增加座數時 加。们⑽致作t人貝之增加，進而導致產品之成本增 201030870 附,ί於掉i發日月之目的在於提供—種異方性導電膜貼 故裝L本^寸精卩1 ’同時可變通性地因應各種形狀大小之基 +赚二同ϊ貼㈣方性導賴於絲板之複數處，可減少貼附 步驟之產距時間。 j (解決課題之手段） 置以 構成為t上述目的’本㈣之射料電賴置採取下列 定位^板疋位機構’將送入裝置本體内之基板移動至既定位 ❹ ❿ 堆疊構’對該經定位之基板既定部位供給 方r電膠帶’俾該異方性導 電膜基==壓該異方性導電膠帶，僅將異方性導 節之之貼附方向配置有複數個該貼附頭，以可調 含將頭之間隔’且該異方性導電膠帶供給機構包 該異方性導電膜貼附裝置之特徵在於： 相對附頭獨立設置該異方“電膠帶供給機構。 複數貼t轉電咖職置因在1舰喊置中内建有 度增加，t減:數或生產線長 附頭之間之間隔(間距)飞。夕種類，里生產之情形，可調節此等貼 (發明之效果) =即’於本發明之異方性導電膜貼附裝置中，沿 置以，印異方性 寸裝置了在不増大其設置空間之情形下，減少貼附作業m 201030870 時間。 且可調節此等各貼附頭相互之間之間隔，故可變通性地因應 電子電路基板大型化等導致貼附處增加或位置變更，或是貼附異 方性導電膜於指定有各種貼附位置之多種尺寸之電路基板之情形 。因此’本發明之異方性導電膜貼附裝置中，因應貼附異方性導 電膜之基板種賴（調變更所需之閒置時間亦可縮短 〇 /、特別是，經由既定配置更換機構設有複數之該捲筒裝設部， 形成=捲筒裝設部之配置’俾可依序更換同時受到裝設固定之複 數捲筒’並藉由既定之配置，使任—捲筒裝設部定位於可對該 附頭供給異方性導電膠帶之供給位置，另一捲筒裝設部中之任一 者定位於可更換捲筒之待命位置時，此貼附裝置之管理人 i (運行）中’亦可在手不接觸使用中之捲筒 卸下已使用之空捲筒，更換成捲繞有異方性導電膠帶之 且其中特別是當該異方性導電膠帶供給機構由 旋轉軸/作為該配置更換機構；及 读構成. 巧巧筒裝設部’配置成夾隔著織轉軸彼此背對背； 你罢且該旋轉抽18〇° ’ 一方之捲筒裝設部配置於該供仏 平ί向設部配置於該待命位置時，供給機構H 协士/需之&置面積小，可精簡配置於各貼附頭上方。因‘此， :電膜貼附裝置中，即使設有因應複數貼附頭 增大，频，柯抑繼本體尺寸之 f此，於該供給位置使用中之捲筒的異方性導 铪窃 ▼開始知部’重疊此等終端部與開始端部以接合此等者後 201030870 .貼顧重_始供給異方性導電 帶。因此，相較於更 貼附頭之情形，太^道手動方式將異方性導電谬帶迴繞至 序單i依置之異方性導電膠帶之更換連接方法其程 φ =決;!ί=握持新的捲筒之膝帶前端，令此夹賴ί 道之方气使異方性導電膠帶自動導通膠帶供給通 的昱i性異方性導電膠帶之終端部與該未使用 2ΐΓ Χ!::ϊί端部係藉由對此等膠帶之重複部位照射 组成灿曰皆接以施行時，無論構成該膠帶隔離部之樹脂 ，且成為何身可迅速於短時間内在該各膠帶之間進行連接（溶接）。 ❹― 【實施方式】 其次根據圖式詳細說明本發明實施形態。 ，1係本發明實施形態中異方性導電賴 =3圖，異方性導電膜貼附裝置中異方= Λ， 貼職如（及步驟内）基板之移動方 交之裝置内進深方向係y方向，敵上 本實施形態中異方性導電膜貼附裝置組裝並配置 液晶面板、電子電路基板等）'，以安裝晶 裝載器—基板清洗裝置—異方性導電膜貼附裝 ^依 201030870 晶片塵接裝置（C0G或是FPC之暫時壓接、 5CA〇I)—卸載器之程序構成。又，異方性導電膜接貼^檢查^ 亦非1座，而於步驟中連續設置有複數座。 、、寸裝置夕+ 首先說明關於異方性導電膜貼附裝置之動作 圖2中’異方性導電膜貼附裝置使用輸送臂將L位於;^)° 方)之繼置(省略圖示)清洗之:作 裝置本體内（Α->Β位置），將其移載至可、_ 邗仟臀導入 著z方向之θ軸旋轉，具吸附墊之移動平台且可繞 相機等確認並記憶異方性導電膜之貼_置()’，， 位置資訊，於貼附位置（D位置〕將 置(ϋ再配合此 該工作件W之既定位置上。/、雜導電膜_ (轉印）在 認貼二之相機等確 藉由位於步驟下游侧（圖示右方之陳置）可 或是晶片麗接裝置等的輸送臂（本例中係輪置 送出（圖2之F位置）。 心赏#2)朝下一步驟 其次說明_異方性導電廳随置之 圖1係自操作（控制）面板側勸家 貼附裝置之本_，_雜性導電膜 背面侧）係裝置内側。又，如前面^之一侧（紙面 圖示左方）送入裝詈太，& ?將作件W自步驟上游側（ 之輸送臂已省略圖示。且使用示右方）送出 已經誇張其厚度圖示之。 、、、、方性泠電（ACF)膠帶 電膜貼随置由下列者構成: 同）之形'細糊―卿===== 201030870 :以下相同）加以裝設固定； 壓接部Q，使異方性導電膠帶抵緊工作件臂； 平台S (基板疋位機構）’使應貼附異方性導電膜之工作件％ 移動至既定位置以定位之； 輸送機構’用以送入送出工作件W; 控制機構，統一控制此等各部及機構；及 電源部等。 使異方性導電膠贡丁抵緊工作件w之壓接部Q，如圖3之重要部 分放大圖所示，分別由包含貼附頭⑷，之2組壓接單元Qu (第通201030870 VI. Description of the Invention: [Technical Field] The present invention relates to an attachment device for attaching an anisotropic conductive film (ACF) for mounting a wafer or a module to a substrate. The established location. [Prior Art] For example, when a driving ic is mounted on a fin formed on a peripheral portion of a liquid crystal display panel, when a wafer-shaped electronic component or a module or the like is mounted on an electronic circuit board, the following method has been used. It is used to attach an anisotropic conductive film (ACF · Anisotropic Conductive Film) to a predetermined position of the substrate, and after placing an electronic component or the like on the anisotropic conductive film, between the wire inlet side and an electrode such as an electronic component After the positioning, the temporary pressure bonding is performed, and then the pressure bonding is performed by a pressure bonding tool (continuous pressure bonding), and the connection is made between them (see, for example, Patent Document No.). In the present invention, "isoelectric conduction", "hetero-conductivity", "hetero-sexuality", and the like are related to "isotropic conduction (杨〇tr〇picC〇nductive)" In the form of a film such as a film or a laminated film, the width of the substrate is not different (see Patent Document 2, etc.). (The black sub-circuit iic conductive tape ( The fresh tape is attached to the work _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The device is cut into the inner length of the predetermined length, and the spacer is peeled off to make the opposite side; the t is attached, and the disconnector is attached to the isolation portion by using a cutter or the like) Cut off (half', away from ° (with the paste part, in this state to stick to the cinch, L j from the isolation of the file to remove the unwanted substrate., attachment (attach roller or attached head) Crimp the tape and 'because the anisotropic conductive tape is expensive, in order to avoid wasting this unnecessary part, also 201030870 device: can be different On the side of the partition of the square conduction belt, the attachment head is pressed against the heat of the film n, and the anisotropic conductive film is cut and transferred to the substrate (see Patent Documents 4 to 5, etc.). (4) The square-sided conductive tape is usually provided by the manufacturer of the tape, iiirri25 (w^ is provided by the staff, so the ship is placed above the head) and can be set to rotate freely; ίϊίί;; The square-shaped electric tape feeding mechanism (supply device) supplies the anisotropic conductive tape extracted from the roll 13⁄4 by the supply path of the plurality of white glues. When the amount of the anisotropic conductive tape is reduced, the sensor can be measured at the end of the tape near the end of the roll (near the end of the tape) to supply the material to the tape and the accompanying article (refer to The patent tomb new (replacement) reel, from which the reel is not used to extract the anisotropy ί) to turn on the tape supply channel, discard the new heterogeneous beginning until the normal anisotropic conductive film comes to the attachment head After the position of '..., and then restart the operation of the attachment device (refer to the patent document) 7, etc.) Also, the plural reels are sometimes set in the installation unit, and the replacement of these is the same: the replacement: the reel is replaced. As a method of replacing the multiple reels, the following methods have been proposed. The roller is set to be used in the up-and-down or left-right direction of the reel (Patent Document 7); or • The two reels are set back to each other and turned over by 18 〇 to switch (Patent Document 8, etc.) Or ^ Included in the reel box, 'replace the money and automatically replace the patent documents 9 to 10, etc.'. And there is also a proposal - method 'by holding the glue start end of the unused reel by the collet mechanism' The sisters rely on the model machine of Jianjian Lai Ding, and the tape feeding channel is automatically turned on at the beginning of the electric tape (Patent Document 8). Moreover, for the computer, the tree, etc. The production of display panels has been expanded to increase production efficiency or reduce weight. In 201030870, various electronic devices have been used to apply the anisotropic conductive (acf electronic components installation technology, financial guidance _ homework steps < = Should be of multiple types (multiple sizes), In the case of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the patent document [Patent Document 1] Japanese Patent Laid-Open No. Hei No. 2001-284005 (Patent Document 5) Japanese Laid-Open Patent Publication No. 2001-171897 [Patent Document 7] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. 7-65648 (Patent Document No. 7-65648) [Patent Document 10] Japanese Patent Laid-Open No. 2006-96556 </ br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br> 'The time of production of the attached work (the problem of increasing the number of cycles at the time of the cycle). U is a straight line here. To solve this problem, you can first consider choosing the number of ίί增二's seats. It is necessary to make sure that the 'Ji surface is grown up, so it is processed or stepped in the product. ί ^ Arrange the attachment device into a column and add the number of seats. We (10) caused an increase in the number of people, which in turn led to an increase in the cost of the product. 201030870 Attached, the purpose of the day is to provide an anisotropic conductive film paste. Adapted to the various shapes and sizes of the base + earned two ϊ stickers (four) squareness depends on the plural of the silk board, can reduce the production time of the attachment step. j (means for solving the problem) is configured to be the above-mentioned purpose of the above-mentioned (4), and the following positioning device is used to move the substrate fed into the device body to the position ❹ 堆叠 stack structure The positioned substrate is supplied with a predetermined portion of the electric tape. The anisotropic conductive film base == pressing the anisotropic conductive tape, and only a plurality of the attachments are arranged in the attachment direction of the anisotropic guide. The head is adjustable to include the spacing of the heads, and the anisotropic conductive tape supply mechanism includes the anisotropic conductive film attaching device, wherein: the opposite side is separately provided with the opposite side "electric tape supply mechanism. t Turning the electric coffee position due to the built-in increase in the 1 ship shouting, t minus: the number or the interval between the long lines of the production line (pitch) fly. The type of eve, the production situation, can adjust these stickers (Effects of the Invention) = That is, in the anisotropic conductive film attaching device of the present invention, the position of the printed anisotropy device is reduced, and the time for attaching the work m 201030870 is reduced. And can adjust the spacing between the attachment heads, Therefore, in view of the increase in size or position of the electronic circuit board due to the increase in the size of the electronic circuit board, or the attachment of the anisotropic conductive film to a circuit board of various sizes in which various attachment positions are specified, the present invention is In the anisotropic conductive film attaching device, the substrate type to which the anisotropic conductive film is attached may be shortened (the idle time required for the change of the adjustment may be shortened), and in particular, a plurality of the replacement mechanism is provided via the predetermined arrangement. The reel mounting portion is formed so that the configuration of the reel mounting portion can be sequentially replaced and the plurality of reels fixed by the mounting are fixed, and the arbitrary reel mounting portion can be positioned by the predetermined configuration. The attachment head supplies the supply position of the anisotropic conductive tape, and when any one of the other reel attachment portions is positioned at the standby position of the replaceable reel, the manager of the attachment device i (running) The used empty reel can be removed without touching the in-use reel, and replaced with an anisotropic conductive tape and especially when the anisotropic conductive tape supply mechanism is rotated/as the configuration Change institution; and read Into the clever tube installation 'configured to be placed back to back from each other across the weaving shaft; you should then pull the pump 18 ° ° 'One of the reel installations is placed in the supply unit to be placed on the standby In the position, the supply mechanism H is a small area, and can be arranged in a small area above the attachment heads. Because of this, in the film attachment device, even if there is an increase in the number of attachment heads, Frequency, Ke suppresses the size of the body, and the anisotropic plagiarism of the reel in use at the supply position starts to know that the end part overlaps the end part and the start end to join the person after 201030870.顾重_starts to supply the anisotropic conductive tape. Therefore, compared with the case of attaching the head, the manual method of the anisotropic conductive tape is retracted to the replacement of the anisotropic conductive tape according to the sequence i. The connection method is φ = 决;! ί=The front end of the knee belt of the new reel is held, so that the 方 性 之 使 使 使 使 使 使 使 使 使 使 使 性 性 性 性 性 性 性 性 性 性 性 性 性 性 性 性 性 性 性 性 性The end of the tape and the unused 2ΐΓ :!::ϊ 端 end are illuminated by repeated parts of the tape When the composition of the scented sputum is carried out, regardless of the resin constituting the separation portion of the tape, it is possible to quickly connect (seal) the respective tapes in a short time. [Embodiment] Next, an embodiment of the present invention will be described in detail based on the drawings. 1 is an anisotropic conductive ray=3 diagram in the embodiment of the present invention, and an anisotropic = Λ in the anisotropic conductive film attaching device, and the depth direction of the device in the moving side of the substrate (and in the step) In the y direction, in the present embodiment, the anisotropic conductive film attaching device is assembled and disposed with a liquid crystal panel, an electronic circuit board, etc.) to mount the crystal loader-substrate cleaning device-the anisotropic conductive film attaching 201030870 Chip dusting device (C0G or FPC temporary crimping, 5CA〇I)—the program of the unloader. Moreover, the anisotropic conductive film is attached to the inspection ^ is not a seat, and a plurality of seats are continuously provided in the step. First, the operation of the anisotropic conductive film attaching device will be described first. In the second embodiment, the 'isolated conductive film attaching device uses the transport arm to locate L; ^)°) (the illustration is omitted) Cleaning: as the device body (Α-> Β position), transfer it to the _ 邗仟 邗仟 hip into the z direction of the θ axis rotation, with the adsorption pad mobile platform and can be confirmed around the camera and The memory of the anisotropic conductive film _ _ () ', position information, will be placed at the attachment position (D position) (ϋ with this work piece W at a given position. /, miscellaneous conductive film _ (turn Printed on the downstream side of the step (the right side of the figure), or the transfer arm of the wafer splicing device, etc. (in this case, the wheel is sent out (F position in Figure 2). ). 心赏#2) The next step is explained next to the next step. Figure 1 is the self-operating (control) panel side of the self-operating (control) panel, and the back side of the hybrid conductive film. The inside of the device. In addition, if one side of the front side (the left side of the paper drawing) is fed into the device too, & ? will be the workpiece W from the upstream side of the step (the transfer arm) The illustration has been omitted, and the right side is used to send out the thickness diagram. The square, electric, and electric (ACF) tapes are attached to the following: ===== 201030870 : Same as below) fixed; crimping part Q, make the anisotropic conductive tape against the workpiece arm; platform S (substrate clamping mechanism) should be attached with an anisotropic conductive film The working piece % is moved to a predetermined position to be positioned; the conveying mechanism 'for feeding the sending work piece W; the control mechanism for controlling the various parts and mechanisms; and the power supply unit. The anisotropic conductive rubber tribute is pressed against the crimping portion Q of the working piece w, as shown in the enlarged view of the important part of Fig. 3, respectively, by two sets of crimping units Qu including the attaching head (4).
Q ❹ 接早7GQUl及第2壓接單元QU2之總稱：以下相同）構成。又，如圖 ’ 2組壓接單兀QUl&QU2夾隔著此等者中央呈線對稱（鏡像）關係 ，大致同時作動。 各壓接單元Qm、Qu2包含： 該貼附頭1、r ;及 缸筒2、2’，使此等貼附頭1、1，上下移動；Q 构成 The combination of the 7GQU1 and the 2nd crimping unit QU2 is the same as the following. Further, as shown in the figure, the two sets of crimping single-joints QUl & QU2 are in line symmetry (mirror) relationship between the centers of the two, and act at substantially the same time. Each of the crimping units Qm and Qu2 includes: the attaching head 1, r; and the cylinders 2, 2' to move the attaching heads 1, 1 up and down;
且經由後述之梦轉帶，將供給於定位在既定位置之該 =各=1 二之間之異方性導電膠帶A、御離部侧加 _@於隔離部之異方性導麵轉印至工作件W 之才曰疋處。 ^性導電膜之軸方向（圖示左右 ♦ X方向）配置，並形成為其一方之壓接單元（本例中係 ==滑動，故可調整各貼附頭卜1，之間異方性導“貼 未Η又導電膜貼附裝置之壓接單元Qui、Qu2裝設有 緊接於供給至貼軸、1，前之異方性 f t電膜部位切斷（半切）為既定長度。因此， =將所⑥長度之異方性導麵轉印至王作件歡既定位置 f (，印)後’顿絲方性料科了之隔 ^And via the dream belt described later, the anisotropic conductive tape A, which is supplied between the ===1, which is positioned at a predetermined position, is added to the side of the detachment portion, and the anisotropic guide surface is transferred to the isolation portion. To the work piece W. The axial direction of the conductive film (the left and right x direction of the figure) is arranged and formed as one of the crimping units (in this example, the == sliding, so the appendix can be adjusted, and the anisotropy between them) The crimping unit Qui and Qu2 which are attached to the uncoated and conductive film attaching device are provided with the cut-off (half cut) of the anisotropy ft film portion immediately before the supply to the attached shaft, and the length is set to a predetermined length. , = Transfer the 6-length anisotropic guide to the position of the king's work, the position f (, printed) after the 'Don's square material section ^
Qu上部之減雜吸並时絲置外部之剛域缝接Μ 於各貼附頭1 1女裝有保溫各貼附頭卜1，之保溫機構（省 11 201030870 '2’附近配置捲繞有石夕膠 筒r、r及】夕膊稱以下相同）之小捲筒"（矽膠膠帶供給捲 t里帶回收捲筒Γ2、Γ4之總稱：以下相同），如圖3，^ 與異方!>生導電膠帶丁不同之供給路線，於異方性 贿糾等異錄導轉射無陶1、1，之間 驟動，本實施職之異紐導電__置可以1步 3作士!作件w同時轉印異方性導電膜至2個以上之指定處。 。匕，本發明之異方性導電賴喊置可減少軸作業之產距時The upper part of the Qu is reduced by the suction and the wire is placed outside the rigid domain. 于 Attached to each head 1 1 Women's clothing has a heat-insulated head attached to the head 1, the insulation mechanism (provincial 11 201030870 '2' near the configuration winding Shixi rubber cylinder r, r and 夕 膊 称 称 称 称 称 称 称 称 称 称 称 ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) !>The production route of different conductive tapes is different. In the case of heterosexual bribery, etc., there is no difference between the 1st and the 1st, and there is a sudden movement between the two, and the implementation is different. __ can be set in 1 step 3 Shi! The workpiece w simultaneously transfers the anisotropic conductive film to more than two designated places. .匕, the anisotropic conductive yoke of the present invention can reduce the distance of the shaft operation
G 且可調節此等各貼附頭卜i，之間之間隔，故 細處增加或位置敎，或战附異二 導電膜於‘疋有各種貼驗置之多種尺寸之電絲板之情形。 又’將異方性導電膠射半切之切斷器單元，或將各貼 、1加以保溫之保溫機構等未受特別限定，因應使用之異方 膠或祕’献進行細之基板麵献寸觀用即可 可之使用不使用’或異方性導電膠帶R回收方法等亦 且於本實施形態中，雖已揭示僅沿工作件w之移動方向（圖 示χ方向）具有複數貼附頭卜1，之異方性導電膜貼附裝置之例，但® 除此等者外，亦可沿與基板移動方向正交之方向（示配 置1個或是複數貼附頭。 3^门；配 二順帶一提，使用本實施形態中之異方性導電膜貼附裝置，針 對係工作件W之液晶顯示（LCD)面板，以COG方式等安裝驅動 器ic於其周緣部時’異方性導電膜之轉印（Pre_B〇nding)條件為 貼附頭卜1’溫度：50〜70。〇、壓接壓：#q1MPa、每丨處之壓接時間 ·· 0.7〜1.5秒。且相較於習知之單一頭貼附裝置，係本實施例之雙 (兩）頭貼附裝置時，產距時間提升約1.7倍（以時間而言約縮短 40%)。 、 12 201030870 伽於對該壓接部Q供給異方性導電料τ之膠帶供給 給部Ρ中亦設有分別對應於該2組壓接單元如及如 2 供給單元Pu (第1膠帶供給單元PUl及第2膠帶供給單元G and can adjust the interval between these attached heads, so the details are increased or the position is 敎, or the case where the different conductive film is attached to the wire board of various sizes. . In addition, the cutter unit that cuts the anisotropic conductive glue and cuts the half, or the heat-insulating mechanism that heats each of the stickers and the 1 is not particularly limited, and the thin-sided substrate is used for the use of the iso-gel or the secret. In the present embodiment, it has been disclosed that only the use of the work piece or the anisotropic conductive tape R is not used, and it is disclosed that only the direction of movement of the work piece w (the direction of the figure )) has a plurality of affixed heads. 1. An example of an anisotropic conductive film attaching device, but in addition to this, it may be arranged in a direction orthogonal to the moving direction of the substrate (indicating one or a plurality of attaching heads). Secondly, in the case of using the anisotropic conductive film attaching device of the present embodiment, the liquid crystal display (LCD) panel of the workpiece W is mounted on the peripheral portion thereof by a COG method or the like. The film transfer (Pre_B〇nding) condition is attached to the head 1' temperature: 50~70. 〇, pressure connection: #q1MPa, crimping time per ··· 0.7~1.5 seconds, and compared with The conventional single head attaching device is the double (two) head attaching device of the embodiment, and the distance is The increase is about 1.7 times (about 40% in terms of time). 12, 201030870 The tape supply unit 伽 which supplies the anisotropic conductive material τ to the crimping portion Q is also provided corresponding to the two groups. The crimping unit is, for example, 2 supply unit Pu (first tape supply unit PU1 and second tape supply unit)
Pu2之L稱：以下相同），各谬帶供給單元叫及pu2中配置有： 旋轉軸3及3,； ㈣捲Μ裝設部4A、4B及4A’、4B，’爽隔著此旋轉軸3及3,彼此背 對才而對向； 夾頭5A、5B及5A，、5B，，對應於各捲筒裝設部。 且於膠帶供給單元Pui、Pu2中，各單元逐一設有： 感測器6、6,，偵測異方性導電膠帶τ之末端記號； 超音波振盪器1〇、10,； 膠帶終端部握持構件7、7,； 膠帶終端部用切斷器8、8,； 移動滾子9、9,； 膠帶熔接用承接構件U、1Γ ;及 膠帶開始端部用切斷器12、12,等。 又，如圖3，2組膠帶供給單元pUl、pU2亦與上述壓接單元 越著此等权巾央呈賴稱（鏡像）_。且於^ 贡供給早兀Pui、之中間位置設有支持基台U，支持該移動 滚子9、=’、膠帶熔觀承接構件1]t、1]t，及膠帶開始端侧切斷器 12、12’等，並包含致動器等，以個別控制此等者沿該異方 ^ 膜貼附方向（圖示左右方向）之移動。 、 圖4 (a)係自裝置之橫向（單元pU2側）觀察膠帶供給單元 之圖 '圖4⑹係自裳置上方往下觀察該膠帶供給單元pUi之圖。1 又’此等圖中，已省略異方性導電膠帶T之圖示。 ^圖4 (a) ’於膠帶供給單元Pui (匕2亦相同）中該基台烈大 致中央，配置有藉由步進馬達等來回旋轉（轉動）⑽。之旋轉抽3 ，於此旋轉軸3上端附近安裝有捲筒襄設部从及犯，俾 旋轉軸3彼此背對背而對向。 且於該旋轉軸3之下端附近，配置有對應於捲筒農設部4a之央 13 201030870 頭5A和對應於捲筒裝設部4B之夾頭5B，俾與捲筒裝 ^同，夾隔著軸3對稱，且此等者之基部延伸設置而固定^旋$ 軸3，如圖4 (b)，夾頭5A及5B可與捲筒裝設部仏及犯同步旋轉。 又’後述利用於處理異方性導電膠帶T終端部之膠帶終端部握 持構件7及膠帶終端部用切斷器8如圖4 (a),不使用時可導入至不 異方縣娜帶T雜之位置，槪異錄導謂竹彼此接 σ時如以雙點劃線所示，移動（前進）至圖示左方。 其次說明關於如以上構成之膠帶供給單元pu中捲筒R之更換 〇 堂ί胜及將另—賴異方鱗電科了之_端部接合於異方性導 =帶T之終端部之方法。又，膠帶供給單元％與％構成相同， 故僅說明關於第丨膠帶供給單元pUi。 壮皮(a)〜（c)、圖6 U)〜（c)及圖7 (a)〜（c)係按階段 ^序^明此膠帶供給單元Puit|^方性導電勝帶微此之接合方法 圖，七別相當於以下所述之膠帶接合程序之STEpi〜STEp9。 首先圖5 (a)顯示一狀態，膠帶供給單元Pu!之一方捲筒梦 於可對該壓接單元Qui (貼附頭υ供給異方性導電^ Π ί j置（圖示右側），由該捲筒裝設部4A裝設固定之「使 -ί Rl之異方性導電膠帶Tl剩餘量少。此時，在配置於 之感測器6侧到形成於剩下少量之異方性導電 〇 里近，Γ記號之時點，停止以壓接單元加貼附 STEP1 }。、並彳τ止自供給單几Pu〗供給異方性導電膠帶Τι ( 捲繞i的換(用圖=側）預先f設有已充分 _ 旦確5忍該壓接單凡Qui停止，通常會導入至不妨礙里方 ίΐίίί:1移動之_位置（參編（a))的膠帶供給單元Pu ，帶_口_寺構件7與膠帶終端部用切斷器8即如圖5 (b)，前1 14 201030870 進至裝置前側（紙面正面側方向），定位於異方性導電膠帶τ之 動位置（STEP2)。 1 接著如圖5 (c)，如夾頭之膠帶終端部握持構件7將位於該握 持部之間之異方性導電膠帶Τι的終端附近部加以握持後（STEp3 ) ，如圖6 (a)，如剪刀之膠帶終端部用切斷器8動作，將較該膠帶 終端部握持構件7之握持部位更朝膠帶終端侧之異方性導電朦帶 1\加以切斷（STEP4)。Pu's L scale: the same as the following), each of the belt supply units and pu2 are arranged with: rotating shafts 3 and 3,; (d) winding units 4A, 4B and 4A', 4B, 'cooling the rotating shaft 3 and 3, facing each other oppositely; the chucks 5A, 5B and 5A, 5B correspond to the respective drum mounting portions. And in the tape supply unit Pui, Pu2, each unit is provided one by one: sensors 6, 6 to detect the end mark of the anisotropic conductive tape τ; ultrasonic oscillator 1 〇, 10,; tape end grip Holders 7, 7;; cutters 8 and 8 for tape end portions; moving rollers 9, 9; tape receiving members U, 1; and tape start end cutters 12, 12, etc. . Further, as shown in Fig. 3, the two sets of tape supply units pU1, pU2 are also referred to as "image" _ with the above-mentioned pressure-bonding unit. And in the middle of the supply of the early 兀Pui, the support base U is provided, and the moving roller 9 , = ', the tape fusion receiving member 1] t, 1] t, and the tape start end side cutter 12 are supported. , 12', etc., and including actuators, etc., to individually control the movement of these along the direction of the film attachment (the left and right direction of the figure). Fig. 4 (a) is a view of the tape supply unit viewed from the lateral direction of the apparatus (on the unit pU2 side). Fig. 4 (6) is a view of the tape supply unit pUi viewed from above the skirt. 1 In the drawings, the illustration of the anisotropic conductive tape T has been omitted. Fig. 4 (a) ' In the tape supply unit Pui (the same is true for 匕2), the base is strongly centered, and is rotated (rotated) by a stepping motor or the like (10). The rotary pumping 3 is mounted on the vicinity of the upper end of the rotary shaft 3 with the reel assembly and the rotary shaft 3 facing away from each other. In the vicinity of the lower end of the rotating shaft 3, a head 5A corresponding to the center of the reeling unit 4a and a head 5A corresponding to the reel mounting portion 4B are disposed, and the reel and the reel are mounted together. The shafts 3 are symmetrical, and the bases of these are extended to fix the shaft 3, as shown in Fig. 4(b), the chucks 5A and 5B can rotate in synchronization with the drum assembly. Further, the tape end portion grip member 7 and the tape end portion cutter 8 which are used for processing the distal end portion of the anisotropic conductive tape T will be introduced into the non-conventional county belt when not in use as shown in Fig. 4 (a). The location of the T miscellaneous, the different recordings indicate that when the bamboos are connected to each other, as shown by the two-dot chain line, move (advance) to the left of the figure. Next, a method for joining the reel of the reel R in the tape supply unit pu configured as described above and joining the end portion of the anisotropic guide = the T with the T-end portion . Further, since the tape supply unit % and % have the same configuration, only the second tape supply unit pUi will be described. Zhuangpi (a) ~ (c), Figure 6 U) ~ (c) and Figure 7 (a) ~ (c) according to the stage ^ ^ ^ This tape supply unit Puit | ^ square conductivity wins this In the bonding method diagram, seven different types correspond to the STEpi to STEp9 of the tape bonding procedure described below. First, Figure 5 (a) shows a state in which one of the tape supply units Pu! is dreamed of supplying the crimping unit Qui (the attached head is supplied with an anisotropic conductive device) (right side of the figure), The reel mounting portion 4A is provided with a fixed amount of "there is a small amount of the anisotropic conductive tape T1. In this case, the sensor 6 is disposed on the side of the sensor 6 to form a small amount of anisotropic conduction. At the time of the 〇 近 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Pre-f is fully provided _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The temple member 7 and the tape end portion cutter 8 are positioned as shown in Fig. 5 (b), front 1 14 201030870 to the front side of the device (the front side of the paper), and positioned at the moving position of the anisotropic conductive tape τ (STEP 2) 1 Next, as shown in Fig. 5(c), the tape end portion holding member 7 such as the chuck will be located near the terminal end of the anisotropic conductive tape 该 between the holding portions. After being held (STEp3), as shown in Fig. 6(a), the tape end portion of the scissors is operated by the cutter 8, and the holding portion of the tape end portion holding member 7 is more toward the tape end side. The conductive conductive tape 1\ is cut off (STEP 4).
又’開啟膠帶終端部用切斷器8，並同時如圖6 (b)，移動移 動滚子9至不干擾以下述程序更換捲筒&、仏配置之位 方）（STEP5)。 移動滾子9之退避-旦結束，係_Ri、&之配置更換機 _軸3即藉絲自㈣機構之齡等指示步進馬達等旋轉 始旋轉，如圖6 (c)，於旋轉180。之時點停止。此時，連接旋轉軸 亡之各^筒裝設部仏及犯之配置賴，位於供給位置（圖 之捲~裝設部4A移動至可更換捲筒R之待命位置（圖示 Γ相，’位於待命位置之捲筒裝設部婦動至可 定位_〇供給異方性導電料T2之供給位置而 又連接^轉軸3下&附近之各夾頭5Α、5^亦盘捲筒|今邻 4Α、_步則㉙更換，賴的捲机之開倾部^ 持構件7握持之狀態之異方 時間，膠奸與畴Tl之重昼精的由 其後’如圖7 (b)，移動膠帶開始端部用切 201030870 部與異方 端部終 面侧方向），導人至不妨礙異施肋側（紙面背 端部彼此之賴業之膠帶“用以二， 卞璦更換捲同R!、R2g&置之位置（圖示 如以上’本實施形態中之異方性導雷胺目±Κί4壯52 剩下少量之捲筒職』 異方性導電膠帶丁1與12之連接作業。 ㈣體與連接 對應瞻内，雖個別設有 裝置本身。 做置本體尺寸之增大，以精簡構成此貼附 的異導電谬外之終端部與該未使用 射超音波，使位照 方性導電膠帶T之間之連接（溶接）。、辦4内進行該各異 方性導:膠J:: J方::J合剩下少量的異 部時，雖亦__1練開始端 方式接合膠帶炫$，以自動之 右之時間進行完畢，故可自偵測到’可以約娜左 16 201030870 且空出之捲筒R〆系定位於可更換（更換）新的捲敵之待命位 置，故此裝置之管理人（作業員）即使在裝置運轉（運行）中亦 可在手不接觸使财之捲触之情形下，於任何_點卸下經使用 之空捲筒R，更換成捲繞有異方性導電膠帶丁之新的捲筒R。 又，於社實施形態中，雖已麻作為捲散之配置更換機構 ，2個捲筒裝設部4A、4B夾隔著旋轉軸3翻轉18〇。動作之配置，但 亦=周向等距配置與此等者相同之捲筒裝設部3個以上 之知:轉依序更換配置。 ^捲筒R之配置更換麟不射使雜著軸_以更換配置 亦可为別设疋捲筒於沿上下或是左右方向設置之支軸， 切換此等者以使用之。當然，亦可使用作業員以 方性t方性導電膠帶Tl之終端部與未使用的異 ,ν甘1電勝2開始知部之方法亦可不使用超音波熔接，代之 黏£等以加熱方法進行之雜，或以黏接劑或黏接膠帶等進行之 (產業上利用性） Φ 晶顯或模組等於液 之異方性導電膜（ACF)貼附於既定位置。财之電子令件等 八間皁說明】 ， 圖1係本翻實麵齡衫性導電繼峨置之概略構成 圍Ο /4丄* ™ . 【圖式簡單說明】 圖 圖 园導電膜貼附裝置内移動基板之說明 _係圖1之重要部分放大圖。 裝置帶供給單元®1，圖4 (b)係自 明圖圖ΰ程係序膠fr::帶開始端部接合程序之說 圖6 (幻〜（c)係膠帶終端部與膠帶開始端部接合程序之說 17 201030870 明圖，分別係相當於程序STEP4〜6之圖。 圖7 (a)〜（c)係膠帶終端部與膠帶開始端部接合程序之說 明圖，分別係相當於程序STEP7〜9之圖。 【主要元件符號說明】Further, the cutter 8 for the tape end portion is opened, and at the same time, as shown in Fig. 6 (b), the moving roller 9 is moved so as not to interfere with the replacement of the reel & 仏 arrangement by the following procedure (STEP 5). When the retracting of the moving roller 9 is completed, the _Ri, & configuration change machine _ axis 3 is the rotation of the stepping motor, etc., as indicated by the age of the (four) mechanism, as shown in Fig. 6 (c). 180. Stop at that time. At this time, the respective mounting portions and the arrangement of the rotating shaft are connected to the supply position (the scroll of the drawing to the mounting portion 4A is moved to the standby position of the replaceable reel R (picture Γ phase, ' The reel mounting portion of the standby position is ready for positioning _ 〇 supply of the supply position of the anisotropic conductive material T2 and connected to the respective collet 5 under the shaft 3 & 5 亦, 5 ^ also reel | The neighboring 4Α, the _step is replaced by 29, the opening of the laminating machine of the laminating machine is held by the holding member 7 in the state of dissent, and the colloid and the domain of Tl are the same as the following figure 7 (b) , the beginning of the moving tape is cut with the end of the 201030870 and the end of the opposite end of the end of the side, and the guide is not obstructed by the side of the opposite side of the rib (the tape at the back end of the paper is used for the second one) With the position of R!, R2g & (the above is shown in the above description, the anisotropy in the present embodiment is ± Κί4 strong 52, and a small amount of reel is left.) The connection of the anisotropic conductive tape D1 and 12 (4) The body and the connection correspond to each other, although the device itself is separately provided. The size of the body is increased to reduce the heterogeneity of the attached structure. The external terminal portion and the unused ultrasonic wave are used to connect (dissolve) the positional conductive tape T. The heterogeneous guide is performed in the inside of the device: glue J:: J side::J When there is a small amount of alien parts left, although it is also __1, the beginning of the way to engage the tape to dazzle $, and the automatic right time is completed, so it can detect the 'can Yona left 16 201030870 and the vacant reel R The 〆 is positioned to replace (replace) the new volume of the enemy's standby position, so the manager (operator) of the device can be in contact with the financial volume even if the device is in operation (running). At any point, the empty reel R to be used is removed, and replaced with a new reel R in which the anisotropic conductive tape is wound. Further, in the embodiment of the present invention, the device is replaced by a disposition device. The two reel mounting portions 4A and 4B are reversed by 18 turns across the rotating shaft 3. The arrangement of the operations is as follows: but also the circumferentially equidistant arrangement of the same three or more reel mounting units is known: Replace the configuration in order. ^Replacement of the roll R is not to make the miscellaneous axis _ to replace the configuration, you can also set up the roll on the top and bottom Or the support shaft set in the left and right direction, switch to use these. Of course, you can also use the operator to square the t-square conductive tape Tl terminal part and the unused difference, ν 甘1 wins 2 The method of the part can also be carried out without using ultrasonic welding, and it can be carried out by heating, or by adhesive or adhesive tape (industrial use). Φ Crystal display or module is equal to liquid. The square conductive film (ACF) is attached to the established position. The eight soaps such as the electronic electronic parts are shown in Fig. 1 , and the figure 1 is the outline composition of the sturdy face-stained conductive shackles /4丄* TM . [Simple description of the drawing] Description of the moving substrate in the conductive film attaching device of the figure _ is an enlarged view of an important part of Fig. 1. The device has a supply unit®1, and Fig. 4(b) is a self-explanatory process. The fuse is fr:: the beginning of the end joint is shown in Fig. 6. (The phantom~(c) tape end is joined to the beginning of the tape. Description of the program 17 201030870 The drawings are equivalent to the diagrams of the procedures STEP 4 to 6. Fig. 7 (a) to (c) are explanatory diagrams of the bonding procedure of the tape end portion and the tape start end, respectively, corresponding to the program STEP7~ Figure 9. [Main component symbol description]
Pu、PH!、Pu2...膠帶供給單元 P. ..膠帶供給部Pu, PH!, Pu2... tape supply unit P. .. tape supply unit
Qu、Qui、Qu2..·壓接單元 Q. ..膠帶壓接部 R. Ri〜R4...捲筒 ri、r3...矽膠膠帶供給捲筒 r2、r4...矽膠膠帶回收捲筒 r...小捲筒 S. ..平台 T. Tr-IV..異方性導電膠帶 U. ..支持基台 V. Vi、V2...矽膠膠帶 W. ..工作件 1、 Γ...貼附頭 2、 2’...缸筒 3、 3’...旋轉軸 4A、4B、4A，、4B，...捲筒裝設部 5A、5B、5A，、5B’..·夾頭 6、 6’...感測器 7、 7’...膠帶終端部握持構件 8、 8’...膠帶終端部用切斷器 9、 9’...移動滚子 10、 10’...超音波振盪器 11、 1Γ...膠帶熔接用承接構件 12、 12’...膠帶開始端部用切斷器 201030870 20...基台Qu, Qui, Qu2..·Crimping unit Q. .. Tape crimping part R. Ri~R4... Reel ri, r3... Silicone tape supply reel r2, r4... Silicone tape Recycling roll Tube r... small reel S. .. platform T. Tr-IV.. anisotropic conductive tape U. .. support abutment V. Vi, V2... silicone tape W. .. work piece 1, Γ...attachment head 2, 2'...cylinder cylinder 3, 3'...rotary shafts 4A, 4B, 4A, 4B, ... reel mounting portions 5A, 5B, 5A, 5B '..·Chuck 6, 6'...sensor 7, 7'...tape end portion grip member 8, 8'... tape end portion cutter 9, 9'... Moving roller 10, 10'... ultrasonic oscillator 11, 1 Γ... tape welding receiving member 12, 12'... tape start end cutter 201030870 20... abutment
1919
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008284240A JP5231176B2 (en) | 2008-11-05 | 2008-11-05 | Anisotropic conductive film pasting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201030870A true TW201030870A (en) | 2010-08-16 |
Family
ID=42152889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098137468A TW201030870A (en) | 2008-11-05 | 2009-11-04 | Anisotropic conductive film application device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5231176B2 (en) |
| KR (1) | KR20110084171A (en) |
| CN (1) | CN102187748A (en) |
| TW (1) | TW201030870A (en) |
| WO (1) | WO2010053081A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5381971B2 (en) * | 2010-12-27 | 2014-01-08 | パナソニック株式会社 | ACF sticking apparatus and ACF sticking method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3821623B2 (en) * | 1999-12-14 | 2006-09-13 | 松下電器産業株式会社 | Chip bonding equipment |
| JP4778404B2 (en) * | 2005-12-16 | 2011-09-21 | パナソニック株式会社 | Sticking device |
-
2008
- 2008-11-05 JP JP2008284240A patent/JP5231176B2/en not_active Expired - Fee Related
-
2009
- 2009-11-04 KR KR1020117007927A patent/KR20110084171A/en not_active Application Discontinuation
- 2009-11-04 WO PCT/JP2009/068803 patent/WO2010053081A1/en active Application Filing
- 2009-11-04 CN CN2009801415682A patent/CN102187748A/en active Pending
- 2009-11-04 TW TW098137468A patent/TW201030870A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010114194A (en) | 2010-05-20 |
| CN102187748A (en) | 2011-09-14 |
| WO2010053081A1 (en) | 2010-05-14 |
| KR20110084171A (en) | 2011-07-21 |
| JP5231176B2 (en) | 2013-07-10 |
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