JP2005297457A - Sticking apparatus and sticking method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sticking apparatus and a sticking method capable of smoothly and precisely performing cutting by preventing an adhesive from sticking on a cutting means. <P>SOLUTION: The sticking apparatus 16 is equipped with a table 40 supporting a semiconductor wafer W, a sticking unit 41 sticking a thermal adhesive sheet S for die bonding, and a cutter 96 cutting the adhesive sheet in the width direction and the peripheral direction every semiconductor wafer. The table is constituted of the sticking table 40 controlled at a first temperature at which the adhesive sheet S is temporarily stuck on the wafer W, a table 47 for cutting an outer periphery which is controlled at a second temperature at which the viscosity of the adhesive sheet is decreased and cuts the adhesive tape in the peripheral direction, and a table 48 for adhesion which is controlled at a third temperature at which the adhesive sheet S is completely stuck on the wafer W. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a sticking apparatus and a sticking method, and in particular, a sticking apparatus and a sticking method capable of securely bonding a heat-sensitive adhesive sheet to an adherend while cutting the heat-sensitive adhesive sheet according to the size of the adherend. About.

  A semiconductor wafer (hereinafter simply referred to as “wafer”) on which a circuit surface is formed is divided into chips, and then each chip is picked up and bonded (die bonding) to a lead frame. This die bonding can be performed by previously sticking a heat-sensitive adhesive sheet for die bonding in the wafer processing step.

Such an adhesive tape sticking device is disclosed in, for example, Patent Document 1. The sticking device disclosed in the same document sucks and supports a wafer, and supplies a first table maintained at a preheating temperature for temporarily attaching an adhesive tape for die bonding, and the adhesive tape to the upper surface side of the wafer. A tape supply device, a press roll for pressing the adhesive tape supplied to the upper surface side of the wafer and temporarily attaching the adhesive tape to the wafer, a cutter for cutting the adhesive tape along the outer peripheral edge of the wafer, and an adhesive tape The apparatus includes a second table that sucks and supports the temporarily attached wafer, and a heating device that is disposed above the second table.
The wafer supported on the second table is heated to a temperature higher than the preheating temperature by the heating device, whereby the adhesive tape is completely bonded to the wafer.

JP 2003-257898 A

  However, in the configuration disclosed in Patent Document 1, since the adhesive tape is cut along the outer peripheral edge of the wafer in a state of being subjected to the preheating temperature, the adhesive tape at the outer peripheral position is viscous. It becomes. Therefore, it becomes difficult to perform the cutting operation with the cutter smoothly, and when it is cut, the adhesive is transferred to the blade edge region of the cutter, and the adhesive tape temporarily attached to the wafer is cut along the outer peripheral edge of the wafer thereafter. There is an inconvenience that cutting cannot be performed with high accuracy.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and an object of the present invention is to apply a heat-sensitive adhesive tape to an adherend such as a wafer so that the size of the adherend is the same. An object of the present invention is to provide a sticking device and a sticking method capable of sticking an adhesive tape to an adherend by performing smooth cutting while preventing the adhesive from transferring to the cutting means side when cutting.

In order to achieve the above object, the present invention includes a table for supporting an adherend, and a pasting unit for supplying a heat-sensitive adhesive sheet to the upper surface of the adherend and attaching the adhesive sheet to the adherend. In a sticking device including a cutting means for cutting the adhesive sheet for each adherend,
The table includes a first temperature for temporarily attaching the adhesive sheet, a second temperature for reducing the adhesiveness of the adhesive sheet to cut the adhesive sheet around the adherend, and the adhesive sheet on the adherend. The configuration is such that the temperature is controlled to the third temperature for complete adhesion.

  In the present invention, the table can be constituted by an independent table so as to keep the adherend at the first to third temperatures.

The present invention also provides a table for supporting a semiconductor wafer as an adherend, a sticking unit for feeding and sticking a belt-like heat-sensitive adhesive sheet to the upper surface of the semiconductor wafer, and the adhesive sheet for each semiconductor wafer. In a sticking device including cutting means for cutting into
The cutting means comprises a width direction cutting function for cutting the adhesive sheet in the width direction, and a circumferential direction cutting function for cutting the adhesive sheet along the outer periphery of the semiconductor wafer,
The table is a cutting table for temporarily attaching the adhesive sheet under the control of a first temperature, and for cutting the adhesive sheet around the semiconductor wafer under a second temperature lower than the first temperature. A structure is provided that includes a table and a bonding table that is controlled to a third temperature that is higher than the first temperature to completely bond the adhesive sheet to the semiconductor wafer.

  A die bonding sheet can be used as the adhesive sheet in the present invention.

  Moreover, the said adhesive sheet can also use the sheet | seat for protection which hardens | cures and forms a protective film.

  The cutting means includes a cutter, and the tip position of the cutter is provided so that the position can be adjusted between a position where the adhesive sheet is cut in the width direction and a position where the adhesive sheet is cut along the outer edge of the adherend. Further, the sticking device further includes a transfer device for transferring an adherend, and the transfer device includes a cooling unit.

Further, the present invention is a method for attaching a heat-sensitive adhesive die bonding adhesive sheet in the form of a band on the upper surface side of a semiconductor wafer,
Temporarily attaching the adhesive sheet while maintaining the semiconductor wafer or a table supporting the semiconductor wafer at a first temperature;
Cutting the sheet portion around the semiconductor wafer by lowering the viscosity of the adhesive sheet by maintaining the semiconductor wafer to which the adhesive sheet is temporarily attached at a second temperature lower than the first temperature;
And a step of bringing the semiconductor wafer and the adhesive sheet into a third temperature higher than the first temperature and completely bonding the adhesive sheet.

  In this specification, “temporary attachment” refers to a region in which the adhesive sheet is attached to an adherend such as a wafer and the adhesive sheet is cut according to the shape of the adherend. Refers to the state of initial adhesion that does not cause peeling or twisting of the adhesive sheet. “Complete adhesion” refers to a state of strong adhesion rather than temporary attachment, and is applied by subsequent processes such as dicing and pick-up processes. The state which shows the adhesiveness of the grade which an adhesive sheet does not peel from a body.

According to the present invention, after the adhesive sheet is temporarily attached to the adherend, the second temperature is used to reduce the adhesiveness of the adhesive sheet. Therefore, when performing the process of cutting the adhesive sheet at the temperature The cutting operation can be made smooth.
Therefore, when the adhesive sheet is cut along the outer peripheral edge of the wafer as the adherend, there is no transfer of the adhesive in the cutter blade region, and the cutting is performed for each wafer sequentially sent as the processing target. Can be performed with high accuracy.
In addition, when adopting a configuration in which the tables for maintaining the first to third temperatures are individually independent, it is possible to avoid a time lag when performing different temperature control with one table, and the temperature control of each table is also simple. Can be realized.
Furthermore, since the cutter has a width direction cutting function and a circumferential direction cutting function, the configuration can be simplified by sharing a single cutter.
Further, when the transfer device for transferring the adherend is constituted by a device provided with a cooling unit, when transferring the adherend, the adjustment to the preset temperature can be performed easily and quickly. Can be done.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a plan view in which the sticking apparatus according to the present embodiment is applied to a wafer processing apparatus, and FIG. 2 is a schematic cross-sectional view for explaining the wafer processing steps over time. . In these drawings, the wafer processing apparatus 10 targets a wafer W on which a UV curable protective tape PT (see FIG. 2) is attached to the surface forming a circuit surface, and has a thermosensitive adhesive property for die bonding on the back surface of the wafer W. After applying the adhesive sheet S (hereinafter referred to as “adhesive sheet S”), the apparatus is configured as a device for processing a series of steps of mounting the wafer W on the ring frame RF via the dicing tape DT.

  As shown in FIG. 1, the wafer processing apparatus 10 performs UV irradiation on a cassette 11 for storing wafers W, a robot 12 for sucking and holding wafers W taken out from the cassettes 11, and the protective tape PT. The UV irradiation unit 13, the alignment device 14 for positioning the wafer W, the sticking device 15 for sticking the adhesive sheet S (see FIG. 2) to the back surface of the aligned wafer W, and the adhesive sheet S were stuck. A dicing tape DT is attached to the subsequent wafer W, and the mounting device 17 for mounting the wafer W on the ring frame RF, the tape peeling device 18 for peeling the protective tape PT, and the wafer W from which the protective tape PT has been peeled are stored. The stocker 19 is configured to be provided.

  The wafer W is accommodated in the cassette 11 with the protective tape PT on the upper surface side, and the upper surface side of the protective tape PT is held by the robot 12 and transferred to the UV irradiation unit 13. As shown in FIG. 3, the robot 12 includes a uniaxial movement device 21, a slider 22 that moves along the uniaxial movement device 21, a vertical movement mechanism 24 erected on the slider 22, and the vertical movement. An articulated arm 26 provided at the upper end of the mechanism 24 and rotatable in a substantially horizontal plane; and a suction member 27 having a substantially C-shaped or substantially U-shaped planar shape attached to the tip of the arm 26; It is comprised by. Here, the suction member 27 is connected to the tip of the arm 26 via a rotation mechanism 28 that can reverse the surface of the wafer W to the front and back.

  As shown in FIG. 3, the UV irradiation unit 13 includes a suction table 30 on which the wafer W held by the suction member 27 of the robot 12 is transferred and sucked, and an upper position of the suction table 30. And a case 32 that covers the suction table 30 and the UV lamp 31. The suction table 30 is provided so as to be capable of reciprocating along the left-right direction in FIG.

  The alignment device 14 includes an alignment table 34 that includes an XY movement mechanism and is rotatably provided, and a camera that is provided on the upper surface side of the alignment table 34 and detects a V notch or the like (not shown) of the wafer W. And a uniaxial robot 37 that supports the alignment table 34 so as to be able to advance and retreat with respect to the lower position of the transport plate 36.

  The transfer plate 36 has a suction surface on the lower surface side, and receives the UV irradiated wafer W via the robot 12. At this time, the wafer W is reversed to the state where the protective tape PT side is the lower surface side and is sucked to the suction surface of the transfer plate 36. The transport plate 36 is positioned above the alignment table 34 and is movably provided in the left-right direction in FIG. When the transfer plate 36 receives the UV irradiated wafer W from the robot 12, the alignment table 34 moves to the lower surface side of the wafer W via the uniaxial robot 37 to receive the wafer W, and then performs alignment and transfer. The wafer W is again adsorbed on the plate 36 and transferred to the attaching device 15.

  As shown in FIGS. 3 to 5, the sticking device 15 receives a wafer W from the transfer plate 36 and supports the wafer W, and the back surface of the wafer W attracted to the sticking table 40. Adhering unit 41 for temporarily attaching the adhesive sheet S to the side (upper surface side), cutting means 43 for cutting the adhesive sheet S in the width direction for each wafer W, and the wafer W from the adhering table 40 to be transferred. The transfer device 45 and the wafer W transferred via the transfer device 45 are sucked and supported, and the unnecessary adhesive sheet portion S1 (see FIG. 4) protruding from the outer periphery of the wafer W is cut by the cutting means 43. Peripheral cutting table 47 for bonding, and an adhesive table for adhering the temporarily-attached adhesive sheet S to the wafer W together with the peripheral cutting table 47 48, is configured to include a recovery unit 50 for recovering the unnecessary adhesive sheet part S1 truncated at the outer peripheral edge position of the wafer W.

  As shown in FIG. 4, the pasting table 40 has a first temperature at which the upper surface side is formed as an adsorption surface, and the adhesive sheet S can be melted to a certain extent and temporarily attached to the wafer W. In the present embodiment, a heater built-in type that is maintained at approximately 110 ° C. is used. The pasting table 40 is between a position where the wafer W can be received from the transfer plate 36 via the moving device 52 and a position passing through the lower region of the pasting unit 41 and reaching the upper side of the outer peripheral cutting table 47. Are provided so as to be capable of reciprocating, and can be moved up and down via an elevating device 53. The moving device 52 penetrates through a pair of rails 54, 54, a slide plate 55 that is guided by the rails 54 and moves on the rail 54, and a bracket 57 fixed to the slide plate 55. A ball spline shaft 58 and a motor M (see FIG. 1) that rotationally drives the ball spline shaft 58 are configured. Here, the motor M is fixed to a frame (not shown), while the other end is rotatably supported by the bearing 60. Accordingly, the application table 40 reciprocates in the left-right direction in FIG. The elevating device 53 includes a vertical movement mechanism 62 arranged at the center of the lower surface of the sticking table 40, a guide block 63 fixed on the slide plate 55, and four pieces that can be raised and lowered along the guide block 63. When the vertical movement mechanism 62 moves back and forth in the vertical direction, the sticking table 40 moves up and down to receive the wafer W from the transfer plate 36.

  On the upper surface of the pasting table 40, cutter receiving grooves 40A for cutting the strip-shaped adhesive sheet S fed out from the pasting unit 41 in the width direction are formed, and on both side surfaces along the moving direction of the pasting table 40. A rack 65 constituting an interlocking mechanism and a guide bar 67 attached to the outer surface of the rack 65 are provided at the upper part.

  As shown in FIGS. 5 and 6, the sticking unit 41 is provided in a region of a plate-like frame F disposed above the sticking table 40. The affixing unit 41 includes a support roll 70 that supports the heat-sensitive adhesive sheet S wound in a roll shape so as to be supplied, a drive roll 71 and a pinch roll 72 that apply a feeding force to the adhesive sheet S, and an adhesive. A take-up roll 73 for winding the release sheet PS laminated on the sheet S, two guide rolls 74, 74 disposed between the support roll 70 and the pinch roll 72, and these guide rolls 74, 74 are provided. The pressure roller 76 that presses the lead end region of the adhesive sheet S from which the release sheet PS has been peeled against the upper surface of the sticking table 40 and sandwiches it, and the adhesive sheet S on the back side of the wafer W (FIG. 5). A press roll 78 that is sequentially pressed and temporarily attached to the middle upper surface side), and is disposed at a position immediately before the press roll 78 in the feeding direction of the adhesive sheet S. It is constituted by a tension roll 79 and guide roll 80. The press roll 78 includes a heater as a heating means. Further, the lower surface side of the pressing member 76 has an adsorbing portion, and adsorbs and holds the end portion of the adhesive sheet S.

  The drive roll 71 and the take-up roll 73 are driven to rotate by motors M1 and M2 provided on the back side of the frame F, respectively. The pressing member 76, the press roll 78, and the tension roll 79 are provided so as to be movable up and down via cylinders 82, 83, and 84, respectively. As shown in FIGS. 7 and 8, both ends of the press roll 78 are coupled to the cylinder 83 via brackets 85, and both ends of the rotation center shaft 86 interact with the rack 65. Thus, a pair of pinions 88 and 88 constituting an interlocking mechanism, and a pair of rollers 89 and 89 as a rotating body are fixed to a further outer position of these pinions 88. The pinions 88 and 88 are provided so as to be able to mesh with the rack 65, while the rollers 89 and 89 are configured to roll on the guide bar 67 irrespective of the rotation of the press roll 78.

  As shown in FIGS. 5 and 6, the cutting means 43 is provided on an arm portion 90 extending along the moving direction of the sticking table 40, and a lower surface of the distal end side (left end side in FIG. 5) of the arm portion 90. And a cutter unit 92 provided so as to be able to advance and retreat via a single-axis robot 91. The cutter unit 92 includes a cutter up / down cylinder 95 supported by a bracket 94 that moves along the uniaxial robot 91, and a cutter 96 attached to the tip of the cutter up / down cylinder 95. Here, the cutter up / down cylinder 95 is attached to the bracket 95 so as to be rotatable in a substantially vertical plane, whereby the cutter blade can be moved in a state in which the tip position of the cutter 96 follows the arc locus in the substantially vertical plane. The adhesive sheet S is set so as not to protrude from the wafer W at the time of circular cutting, which will be described later, and can be advanced and retracted along the extending direction of the arm portion 90 by the uniaxial robot 91. Has been. As shown in FIG. 1, the cutting means 43 is supported so as to be movable by driving the motor M3 on a guide 97 that is directed in a direction (Y direction in FIG. 1) orthogonal to the moving direction of the sticking table 40. Has been. Therefore, the function of cutting the adhesive sheet S in the width direction when the tip of the cutter 96 enters the cutter receiving groove 40A of the sticking table 40 and the entire cutting means 43 moves along the guide 97 is achieved. It will be.

  As shown in FIGS. 4 and 9 to 14, the transfer device 45 includes a plate-like suction plate 100 that sucks the wafer W to the lower surface side, and a cooling unit provided on the upper surface side of the suction plate 100. 101, an arm 102 that supports the suction plate 100, and a uniaxial robot 105 that moves the arm 102 in the Y direction. The suction plate 100, when adhering the wafer W after the adhesive sheet S has been cut in the width direction on the sticking table 40 (see FIG. 10), is the first temperature during temporary attachment (110 ° C.). For example, the wafer W is cooled to room temperature, and the viscosity of the adhesive sheet S is reduced or eliminated to prevent the transfer of the adhesive to the cutter 96. Further, the transfer device 45 transfers the wafer W from the sticking table 40 to the outer periphery cutting table 47, and bonds the wafer W after the unnecessary adhesive sheet portion S1 is cut by the outer periphery cutting table 47. The wafer W is transferred to the table 48, and the wafer W after the adhesive sheet S is completely bonded by the bonding table 48 is transferred to the next process.

  As shown in FIG. 4, the uniaxial robot 105 is disposed substantially parallel to the guide 97 at a position above the guide 97 of the cutting means 43. This single-axis robot 105 is provided with a cylinder 106 extending in a direction perpendicular to the vertical direction and a lift slider 108 that can be lifted and lowered via the cylinder 106, and the lift slider 108 has a base end side of the arm 102 (FIG. 9). The middle right end side) is connected.

  As shown in FIGS. 4 and 11, the outer peripheral cutting table 47 receives the wafer W from the sticking table 40 via the transfer device 45 and sucks it to remove an unnecessary adhesive sheet around the wafer W. It is a table for cutting part S1 with cutting means 43. In this embodiment, the outer periphery cutting table 47 is maintained at a normal temperature as the second temperature. The upper surface is formed as an adsorption surface, and a circumferential groove 47A corresponding to the periphery of the outer periphery of the wafer W. It is configured with. The outer periphery cutting table 47 is supported on the elevating plate 111 via the rotation mechanism 110 on the lower surface side. The rotating mechanism 110 includes a rotating shaft 112 whose axial direction is the vertical direction, a rotating bearing 103 that supports the rotating shaft 112, a driven pulley 114 fixed around the rotating shaft 112, and a side of the driven pulley 114. A main driving pulley 115 that is positioned and fixed to the output shaft of the motor M4, and a belt 117 that is wound around the pulleys 114, 115. A table 47 is provided to be rotatable in a plane. Therefore, when the cutter 96 enters the circumferential groove 47A and the outer circumferential cutting table 47 rotates, the function of cutting the adhesive sheet S in the circumferential direction, that is, circumferential cutting is achieved. The cutting in the circumferential direction can also be achieved by configuring the cutter unit 92 to be rotatable in a horizontal plane.

  The lifting plate 111 that supports the outer periphery cutting table 47 is provided so as to be lifted and lowered via the lifting device 120. As shown in FIG. 4, the lifting device 120 includes a block 123 attached to the back side of a substantially L-shaped support body 122 that supports the lifting plate 111, and a pair of links connected to both sides of the support body 122. The elevating side plate 124, a pair of upright guides 125 that guide the elevating side plate 124 in the vertical direction, a screw shaft 126 that extends through the block 123 in the vertical direction, a lower end of the screw shaft 126, and an upright guide 125 The pulleys 127 and 128 are respectively fixed to the output shaft of the motor M5 disposed in the vicinity of the lower end, and the belt 129 is wound around the pulleys 127 and 128. The screw shaft 126 is rotated by driving the motor M5. By doing so, the cutting table 47 can be moved up and down.

  The bonding table 48 is disposed on the side upper part of the outer periphery cutting table 47 through a frame (not shown). The bonding table 48 has an upper surface configured as a suction surface. The wafer W is transferred from the outer peripheral cutting table 47 via the transfer device 45, and the wafer W to which the adhesive sheet S is temporarily attached is attached. The adhesive sheet S is completely bonded to the wafer W by heating. In the present embodiment, the bonding table 48 is controlled to about 180 ° C. as the third temperature.

  The collection device 50 is a device for adsorbing and collecting the unnecessary adhesive sheet portion S1 around the wafer W on the cutting table 47. The recovery device 50 includes a cross arm 130 having a substantially X shape in plan view and a lower surface side of each tip having a suction function, a connection arm 131 that supports a substantially central position of the cross arm 130, and a base of the connection arm 131. A cylinder 132 that supports the end side and is disposed in a direction substantially orthogonal to the guide 97 of the cutting means 43 in a plane, a slider 133 that is movable along the cylinder 132, and an unnecessary adhesive sheet portion It is comprised by the collection box 135 which collect | recovers S1. The cross arm 130 is provided so as to be able to reciprocate between the upper position of the outer periphery cutting table 47 and the upper position of the collection box 135, and by releasing the adsorption to the unnecessary adhesive sheet portion S1 on the collection box 135. The unnecessary adhesive sheet portion S1 can be dropped into the collection box 135.

  The wafer W to which the adhesive sheet S is completely bonded by the bonding table 48 is transferred again to the mounting device 17 side via the transfer device 45. At this time, the transfer device 45 that sucks the wafer W cools the wafer W via the cooling unit 101 in the transfer process. As shown in FIG. 1 and FIGS. 13 to 16, the mounting device 17 has a mount table 137 that attracts the ring frame RF and the wafer W, and a tape attaching unit 138 that attaches the dicing tape DT. A pair of rails 139 to be moved is included. Here, the dicing tape DT is used as a raw material in which a dicing tape piece having a slightly smaller diameter than the outer diameter of the ring frame RF is temporarily attached to one surface of a strip-like peeling tape ST.

  Although the mount table 137 is schematically illustrated here, a configuration substantially similar to that of the pasting table 40 described above is employed, whereby the mount table 137 can be moved up and down and along the rail 139. It is movable.

  The tape applying unit 138 includes a support roll 140 that is provided in the plane of the plate-like support frame F <b> 1 and supports the dicing tape DT wound in a roll shape so that the dicing tape DT can be fed, and the peeling that is fed from the support roll 140. A peel plate 142 that peels off the dicing tape DT by sharply turning back the tape ST, and a take-up roll 143 that winds up the peel tape ST folded back by the peel plate 142 are provided. Therefore, as shown in FIG. 14, after the mount table 137 is moved to the tape applying unit 138 side, the upper surface position of the mount table 137 is raised, and the mount table 137 is moved in the direction indicated by the solid line position on the left side in the figure. By moving, the dicing tape DT is attached to the upper surface of the ring frame RF and the adhesive sheet S, whereby the wafer W can be mounted on the ring frame RF. As shown in FIG. 15, the ring frame RF is accommodated in the frame stocker 145 and transferred onto the mount table 137 via the transfer arm 147. The workpiece K mounted on the ring frame RF on the mount table 137 is sucked and held by the transfer arm 147. The transfer arm 147 transfers the workpiece K to the transfer arm 149 with the front and back surfaces of the workpiece K reversed, and the workpiece K held by the transfer arm 149 is transferred to the processing position of the next process. It becomes.

  As shown in FIG. 15, the transfer arm 147 includes a slider 151 that can be moved up and down along the guide column 150, an arm 152 supported by the slider 151, and extends from the arm 152 in all directions. It comprises a branch arm 153 that adsorbs the ring frame RF. The arm 152 is provided so as to be rotatable about the axis thereof, so that the workpiece K can be transferred to the transfer arm 149 with the protective tape PT on the upper surface side.

  The transfer arm 149 is provided so as to be movable in the left-right direction in FIG. 15 via a cylinder device 155. The transfer arm 149 has substantially the same configuration as the transfer arm 147 except that it does not have a rotation function.

  The workpiece K attracted and held by the transfer arm 149 is transferred to the tape peeling device 18. The tape peeling device 18 includes a peeling table 156 and a peeling unit 157 that peels the protective tape PT from the workpiece K transferred to the peeling table 156. The peeling table 156 is provided so as to be movable along the rail 160, and the protective tape PT on the upper surface side is peeled in the moving process. Although the detailed structure of the peeling unit 157 is not shown here, the same unit as the peeling unit disclosed in Japanese Patent Application No. 2004-15912 already proposed by the present applicant is adopted. Has been.

  The workpiece K from which the protective tape PT has been peeled off by the tape peeling unit 157 is transferred to the transfer rail 162 by a transfer mechanism (not shown), moves on the transfer rail 162 via the workpiece transfer cylinder 161, and is stored in the stocker 19. Is done. The workpiece K stored in the stocker 19 is diced into a chip size in a post-process process, and after being subjected to a heat treatment, it is picked up and bonded to the lead frame.

  Next, the wafer processing process in this embodiment will be described.

  A large number of wafers W each having a protective tape PT attached to the circuit surface are accommodated in the cassette 11. The wafer W is transferred to the UV irradiation unit 13 by the robot 12 and subjected to a predetermined UV process, and the wafer W after the UV curing process is transferred to the transfer plate 36 via the robot 12.

  After the wafer W is transferred to the alignment table 34 via the transfer plate 36 and alignment processing is performed, the wafer W is transferred again to the sticking table 40 via the transfer plate 36. At this time, the sticking table 40 is controlled to maintain approximately 110 ° C. as the first temperature at which the adhesive sheet S can be temporarily attached. Further, the wafer W is adsorbed in a state where the protective tape PT is in contact with the table surface, and therefore, the back surface of the wafer W is in a state where it is the upper surface side.

  As shown in FIG. 5, when the sticking table 40 is moved to a predetermined position of the sticking unit 41, the lead end region of the adhesive sheet S sucked and held on the lower surface side of the pressing member 76 is stuck by the lowering of the pressing member 76. It comes into contact with the upper surface of the table 40. After this contact is completed, the press roll 78 is lowered and the adhesive sheet S is sandwiched between the upper surface of the wafer W (see FIG. 7). Next, the pressing member 76 is lifted by releasing the suction. At this time, the rollers 89 provided on both end sides of the press roll 78 come into contact with the upper surface of the guide bar 67, and at the same time, the pinion 88 is engaged with the rack 65, and the pinion 88 can rotate and move along the rack 65. . In this state, the sticking table 40 moves to the right side in FIG. 5 and the press roll 78 rotates due to the engagement between the rack 65 and the pinion 88, and the roller 89 rolls on the guide bar 67 as a guide surface. The fed adhesive sheet S is stuck on the upper surface of the wafer W. The press roll 78 is controlled to maintain approximately 110 ° C. by a heater which is a built-in heating means.

  When the adhesive sheet S is stuck to the wafer W in this way and the pressing member 76 reaches the upper position immediately after passing through the cutter receiving groove 40A, the sticking table 40 is located almost directly above the outer periphery cutting table 47. Will be reached. Then, the pressing member 76 is lowered to bring the adhesive sheet S into contact with the sticking table 40 (see FIG. 6). Thereafter, the cutter 96 of the cutting means 43 enters the cutter receiving groove 40A, and the arm portion 90 supporting the cutter unit 92 moves in the direction perpendicular to the paper surface in FIG. 6 to cut the adhesive sheet S in the width direction. . At this time, since the region of the adhesive sheet S corresponding to the cutter receiving groove 40A is not in contact with the table surface, the viscosity of the region is lowered, and the transfer of the adhesive to the cutter 96 is not a problem. When the cutting in the width direction is completed, the pressing member 76 sucks the adhesive sheet S located on the lower surface side of the pressing member 76 and returns to the raised position to prepare for the next bonding to the wafer W. Further, the cutting means 43 is displaced to a position where the cutting edge position of the cutter 96 is raised by the raising of the cutter up / down cylinder 95 and retreats away from the upper surface position of the affixing table 40, that is, upward in FIG. It will be.

  Next, as shown in FIG. 9, the suction plate 100 of the transfer device 45 moves so as to be positioned above the pasting table 40 by the operation of the uniaxial robot 105 and the lowering of the cylinder 106, and the suction is performed by the lowering of the cylinder 107. The surface position of the plate 100 is lowered to suck and hold the wafer W to which the adhesive sheet S is stuck. As a result, the sticking table 40 moves to a position for sucking and holding the wafer W to be processed next, and at the same time, the outer peripheral cutting table 47 is lifted and sucked onto the upper surface of the cutting table 47 by the suction plate 100. The wafer W being transferred is transferred. At this time, the wafer W that has reached the temporary attachment temperature on the sticking table 40 receives a cooling action while being adsorbed on the adsorption plate 100 and is kept in a state of being lowered to substantially normal temperature.

  As shown in FIG. 11, when the wafer W is transferred to and held by suction on the outer periphery cutting table 47, the transfer device 45 moves in a direction away from the upper position of the outer periphery cutting table 47 while cutting. The means 43 moves on the outer periphery cutting table 47 (see FIG. 12). Then, by moving the uniaxial robot 91 by a predetermined amount and lowering the cutter vertical cylinder 95, the cutter 96 penetrates downward at a position substantially corresponding to the outer peripheral edge of the wafer W, and the tip is received in the circumferential groove 47A. . In this state, the sticking table 47 is rotated in the horizontal plane by the rotating mechanism 110, and the unnecessary adhesive sheet portion S1 protruding outside the outer periphery of the wafer W is cut along the circumferential direction. When this cutting is completed, the cutting means 43 moves from the upper position of the outer periphery cutting table 47 to a position where it is retracted again, while the cross arm 130 of the collecting device 50 moves onto the unnecessary adhesive sheet portion S1 and does not require the cutting. The adhesive sheet portion S1 is adsorbed and moved onto the collection box 135 to drop the unnecessary adhesive sheet portion S1.

  The transfer device 45 moves onto the outer periphery cutting table 47 so that the cross arm 130 moves to the collection box 135 side, and after the wafer W is adsorbed again, the wafer W is moved to the upper surface of the bonding table 48. Included.

  The wafer W transferred to the bonding table 48 is controlled so that the bonding table 48 maintains a third temperature of approximately 180 ° C., whereby the bonding sheet S is completely bonded to the wafer W. Will be affected. Then, after a predetermined time has elapsed, the wafer W is sucked by the suction plate 100 of the transfer device 45 and is subjected to a cooling action to return to normal temperature again.

  The wafer W that has fallen in temperature while being attracted to the transfer device 45 is transferred to the mount table 137 that is attracting the ring frame RF, and then mounted to the ring frame RF via the dicing tape DT. Then, the workpiece K having the wafer W mounted on the ring frame RF is transferred to the peeling table 156 in a state where the wafer W is reversed, and then the UV-cured protective tape PT is transferred to the wafer by the tape peeling device 18. It is peeled off from the circuit surface and accommodated in the stocker 19.

  Therefore, according to such an embodiment, a series of processes up to the stage before dicing can be efficiently and automatically performed on the wafer W on which the protective tape PT is attached to the circuit surface. Get the effect.

  In particular, the rotation of the press roll 78 when the adhesive sheet S is attached to the wafer W is caused by the interlocking mechanism between the rack 65 and the pinion 88, that is, the press roll 78 presses the wafer W against the press. Since the roll 78 is not configured to rotate, it is possible to prevent the occurrence of bubbles and the like by extending the adhesive sheet S, generating warpage, and warping deformation after the adhesive sheet S is pasted. It is possible to maintain good adhesion accuracy when bonding to the lead frame. In addition, the roller 89 that rolls on the upper surface of the guide bar 67 provided on the side surface of the rack 65 is provided on the central shaft 86 of the press roll 78, so that the surface pressure generated between the press roll 78 and the wear W is obtained. Can be made constant, and it becomes possible to avoid a sticking failure by avoiding a change in surface pressure accompanying a change in the contact area.

  Further, when the adhesive sheet S is cut along the outer peripheral edge of the wafer W, the wafer W is cut at a temperature lower than the temporary attachment temperature, so that the adhesive is prevented from transferring to the cutter 96. It is possible to cut the adhesive sheet S smoothly and accurately. In addition, since the cutter 96 has a width direction cutting function and a circumferential direction cutting function with respect to the adhesive sheet S, the configuration can be simplified by sharing the single cutting means 43. It becomes possible.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, although the sticking device 16 in the above-described embodiment is illustrated and described as a device for sticking the die bonding adhesive sheet S to the wafer W, the sticking device 16 can also be applied to the case where other sheets are stuck to the wafer W. The adherend may be other than a wafer.

  Further, the arrangement, moving direction, and the like of the individual units constituting the wafer processing apparatus 10 are not limited to the illustrated configuration example, and it is sufficient if the same processing steps can be performed.

  Moreover, the temperature of the said sticking table 40, the outer periphery cutting table 47, and the adhesion | attachment table 48 does not limit this invention, It changes according to the characteristic of the heat-sensitive adhesive sheet used.

1 is a schematic plan view showing an overall configuration in which the present invention is applied to a wafer processing apparatus. Schematic cross-sectional view for explaining the wafer processing process over time The front view which shows the initial stage process of a wafer, and a sticking apparatus. The schematic perspective view of a sticking apparatus. The schematic front view which shows the initial stage which temporarily attaches an adhesive sheet. The schematic front view when attaching an adhesive sheet temporarily and cut | disconnecting the said sheet | seat in the width direction. The schematic perspective view which shows a sticking table and a interlocking mechanism. The side view of FIG. The schematic front view which shows operation | movement of a cutting | disconnection means. The schematic front view which shows the state which transfers a wafer from the sticking table to the table for outer periphery cutting. FIG. 11 is a schematic front view showing the next stage of FIG. 10. The schematic front view which shows the state which cut | disconnects the sheet | seat part which remains on the wafer outer periphery transferred by the outer periphery cut table. The schematic plan view which shows the area | region which transfers a wafer by the transfer apparatus. The schematic front view of a mounting apparatus. The schematic front view which shows the transfer state of the workpiece | work which mounted the wafer to the ring frame. FIG. 16 is a schematic plan view of FIG. 15.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Wafer processing apparatus 15 Sticking apparatus 40 Sticking table 40A Cutter receiving groove 41 Sticking unit 43 Cutting means 47 Perimeter cutting table 47A Circumferential groove 48 Adhesive table 70 Support roll (supply means)
96 Cutter 101 Cooling unit W Semiconductor wafer PT Protective tape S Adhesive sheet (Thermosensitive adhesive sheet)
S1 Unnecessary adhesive sheet

Claims (8)

A table that supports the adherend, a pasting unit that supplies a heat-sensitive adhesive sheet to the upper surface of the adherend and affixes the adhesive sheet to the adherend, and cuts the adhesive sheet for each adherend In a sticking device including cutting means for
The table includes a first temperature for temporarily attaching the adhesive sheet, a second temperature for reducing the adhesiveness of the adhesive sheet to cut the adhesive sheet around the adherend, and the adhesive sheet on the adherend. A pasting apparatus controlled to a third temperature for complete adhesion. 2. The sticking apparatus according to claim 1, wherein the table is constituted by an independent table so as to keep the adherend at the first to third temperatures. A table for supporting the semiconductor wafer as an adherend, a pasting unit for feeding and sticking a belt-like heat-sensitive adhesive sheet to the upper surface of the semiconductor wafer, and a cutting means for cutting the adhesive sheet for each semiconductor wafer; In a pasting device including:
The cutting means comprises a width direction cutting function for cutting the adhesive sheet in the width direction, and a circumferential direction cutting function for cutting the adhesive sheet along the outer periphery of the semiconductor wafer,
The table is a cutting table for temporarily attaching the adhesive sheet under the control of a first temperature, and for cutting the adhesive sheet around the semiconductor wafer under a second temperature lower than the first temperature. A pasting apparatus comprising: a table; and an adhesion table that is controlled to a third temperature that is higher than the first temperature and completely adheres the adhesive sheet to the semiconductor wafer. 4. The sticking apparatus according to claim 1, wherein the adhesive sheet is a die bonding sheet. The sticking apparatus according to claim 3, wherein the adhesive sheet is a protective sheet that is cured to form a protective film. The cutting means includes a cutter, and the tip position of the cutter is provided such that the position of the cutter can be adjusted between a position where the adhesive sheet is cut in the width direction and a position where the adhesive sheet is cut along the outer edge of the adherend. The sticking device according to any one of claims 3 to 5, wherein: The sticking device according to claim 2, further comprising a transfer device for transferring the adherend, wherein the transfer device includes a cooling unit. A method of sticking a heat-sensitive adhesive die bonding adhesive sheet in the form of a strip on the upper surface side of a semiconductor wafer,
Temporarily attaching the adhesive sheet while maintaining the semiconductor wafer or a table supporting the semiconductor wafer at a first temperature;
Cutting the sheet portion around the semiconductor wafer by reducing the adhesiveness of the adhesive sheet by maintaining the semiconductor wafer temporarily attached with the adhesive sheet at a second temperature lower than the first temperature;
And a step of bringing the semiconductor wafer and the adhesive sheet to a third temperature that is higher than the first temperature and completely adhering the adhesive sheet.

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