KR102649682B1 - Substrate processing system and substrate processing method - Google Patents

Abstract

an ultraviolet irradiation unit that irradiates ultraviolet rays to the protective tape protecting the substrate, a mount unit that mounts the substrate to a frame via an adhesive tape provided on a side opposite to the protective tape after ultraviolet irradiation with respect to the substrate, and A substrate processing system comprising a peeling part that peels the protective tape from the substrate mounted on the frame via an adhesive tape, and the ultraviolet irradiation part is provided in a vertical direction above the mount part overlapping with the mount part.

Description

Substrate processing system and substrate processing method

This disclosure relates to substrate processing systems and substrate processing methods.

Recently, in order to meet the demand for miniaturization and weight reduction of semiconductor devices, after forming elements, circuits, terminals, etc. on the first main surface of a substrate such as a semiconductor wafer, they are formed on a second main surface opposite to the first main surface of the substrate. The surface is ground to thin the substrate. Dicing is performed after or before thinning.

While processing such as thinning or dicing is performed, the first main surface of the substrate is protected with a protective tape. As a protective tape, one whose adhesive strength is reduced by irradiating ultraviolet rays is used. After the adhesive strength decreases, the protective tape can be easily peeled from the substrate by a peeling operation.

After irradiating ultraviolet rays to the protective tape and before peeling the protective tape from the substrate, the substrate is mounted on the frame through an adhesive tape different from the protective tape. The adhesive tape is mounted on the frame so as to cover the opening of the annular frame, and is bonded to the second main surface of the substrate at the opening of the frame.

The device of Patent Document 1 mounts the wafer on a frame via a processing unit that grinds the back side of the wafer, a UV irradiation unit that irradiates ultraviolet rays to a protective tape that protects the surface of the wafer, and an adhesive tape attached to the back side of the wafer. It has a mount part that peels the protective tape from the wafer.

Japanese Patent Publication No. 2002-343756

One aspect of the present disclosure provides a technology that can reduce the footprint of a substrate processing system when viewed in the vertical direction.

A substrate processing system according to an aspect of the present disclosure,

An ultraviolet irradiation unit that irradiates ultraviolet rays to the protective tape that protects the substrate,

a mount portion for mounting the substrate to a frame via an adhesive tape provided on a side opposite to the protective tape after ultraviolet irradiation with respect to the substrate;

a peeling portion that peels the protective tape from the substrate mounted on the frame via the adhesive tape;

The ultraviolet ray irradiation unit is provided to overlap the mount unit in a vertical direction above the mount unit.

According to one aspect of the present disclosure, the installation area of the substrate processing system can be reduced when viewed in the vertical direction.

1 is a perspective view showing a substrate before processing by a substrate processing system according to one embodiment.
Figure 2 is a perspective view showing a substrate after processing by a substrate processing system according to one embodiment.
3 is a plan view showing a substrate processing system according to one embodiment.
Figure 4 is a diagram showing a dicing unit according to one embodiment.
Figure 5 is a diagram showing the rough grinding part of the thinning part according to one embodiment.
Figure 6 is a diagram showing an ultraviolet ray irradiation unit according to one embodiment.
Figure 7 is a diagram showing a mount portion according to one embodiment.
Figure 8 is a diagram showing a peeling portion according to one embodiment.
Figure 9 is a diagram showing an ID attachment portion according to one embodiment.
10 is a flowchart of a substrate processing method according to one embodiment.
11 is a plan view showing main parts of a substrate processing system according to one embodiment.
Figure 12 is a side view showing a mount unit according to one embodiment, and an ultraviolet irradiation unit and a transmission unit provided above the mount unit overlapping with the mount unit.
Figure 13 is a side view showing a peeling portion and an ID attachment portion provided above the peeling portion and overlapping with the peeling portion according to one embodiment.
Figure 14 is a diagram showing the operation of the second sub-carrier according to one embodiment.
Fig. 15 is a side view showing the peeling portion according to the first modification and the ID attachment portion provided above the peeling portion and overlapping with the peeling portion.
16 is a plan view showing main parts of the substrate processing system according to the second modification.

Hereinafter, the presently disclosed embodiment will be described with reference to the drawings. In each drawing, identical or corresponding components are assigned identical or corresponding symbols and descriptions are omitted. In the following description, the X, Y, and Z directions are perpendicular to each other, the X and Y directions are horizontal, and the Z direction is vertical. The direction of rotation with the vertical axis as the center of rotation is also called the θ direction. In this specification, downward means downward in the vertical direction, and upward means upward in the vertical direction.

1 is a perspective view showing a substrate before processing by a substrate processing system according to one embodiment. The substrate 10 is, for example, a semiconductor substrate, a sapphire substrate, or the like. The first main surface 11 of the substrate 10 is divided into a plurality of streets formed in a grid shape, and elements, circuits, terminals, etc. are formed in advance in each divided area. By dividing the substrate 10 along a plurality of streets formed in a lattice shape, a chip 13 (see FIG. 2) is obtained.

A protective tape 14 is bonded to the first main surface 11 of the substrate 10. The protective tape 14 protects the first main surface 11 of the substrate 10 during processing such as dicing and thinning, and protects the first main surface 11 from elements, circuits, terminals, etc. previously formed on the first main surface 11. protect. The protective tape 14 covers the entire first main surface 11 of the substrate 10.

The protective tape 14 is composed of a sheet base material and an adhesive applied to the surface of the sheet base material. The adhesive may be cured when irradiated with ultraviolet rays, thereby reducing the adhesive strength. After the adhesive strength decreases, the protective tape 14 can be easily peeled from the substrate 10 by a peeling operation.

Figure 2 is a perspective view showing a substrate after processing by a substrate processing system according to one embodiment. The substrate 10 is diced and thinned, and then mounted on the frame 19 via adhesive tape 18. Additionally, the protective tape 14 shown in FIG. 1 is peeled off from the substrate 10 and removed.

The adhesive tape 18 is composed of a sheet base material and an adhesive applied to the surface of the sheet base material. The adhesive tape 18 is attached to the frame 19 so as to cover the opening of the annular frame 19, and is bonded to the substrate 10 at the opening of the frame 19. As a result, the substrate 10 can be transported while holding the frame 19, and the handling of the substrate 10 can be improved.

A die attach film (DAF) 15 may be provided between the adhesive tape 18 and the substrate 10, as shown in FIG. 2 . DAF 15 is an adhesive sheet for die bonding. DAF 15 is used for stacking chips 13, etc. DAF 15 may be either conductive or insulating.

The DAF 15 is formed smaller than the opening of the frame 19 and is provided inside the frame 19. DAF 15 covers the entire second major surface 12 of substrate 10. In addition, when the chip 13 is not laminated, the DAF 15 is unnecessary, so the substrate 10 may be mounted on the frame 19 with only the adhesive tape 18 interposed therebetween.

3 is a plan view showing a substrate processing system according to one embodiment. In Fig. 3, the loading cassette 35 and the unloading cassette 45 are cut apart to show the inside of the loading cassette 35 and the inside of the unloading cassette 45. In FIG. 3 , arrows indicate the movement directions of the substrate 10 and the frame 19 in the mount portion 500 and the peeling portion 600, etc.

The substrate processing system 1 includes dicing the substrate 10, thinning the substrate 10, irradiating the protective tape 14 with ultraviolet rays, mounting the substrate 10, and removing the protective tape 14 from the substrate 10. Various processes such as peeling and attaching ID to the frame 19 are performed.

The substrate processing system 1 includes a control unit 20, an loading unit 30, an unloading unit 40, a main transport path 50, a main transport unit 58, and various processing units. The processing unit is not particularly limited, but includes, for example, a dicing unit 100, a thinning unit 200, an ultraviolet irradiation unit 400, a mount unit 500, a peeling unit 600, and an ID attachment unit 700.

The control unit 20 is composed of, for example, a computer, and as shown in FIG. 3, it includes a CPU (Central Processing Unit) 21, a storage medium 22 such as memory, an input interface 23, and an output interface ( 24). The control unit 20 performs various controls by causing the CPU 21 to execute a program stored in the storage medium 22. Additionally, the control unit 20 receives signals from the outside through the input interface 23 and transmits signals to the outside through the output interface 24.

The program of the control unit 20 is stored in an information storage medium and installed from the information storage medium. Examples of information storage media include hard disks (HD), flexible disks (FD), compact disks (CD), magnet optical disks (MO), and memory cards. Additionally, the program may be downloaded from a server via the Internet and installed.

The loading unit 30 is where the loading cassette 35 containing the substrate 10 before processing is loaded from the outside. The loading cassette 35 accommodates a plurality of substrates 10 before being mounted on the frame 19 via, for example, an adhesive tape 18 at intervals in the Z direction.

In order to store a plurality of substrates 10 at intervals in the Z direction, the loading cassette 35 has a pair of horizontally arranged storage plates 36 at intervals in the Z direction. As shown in FIG. 3, the pair of storage plates 36 support both ends of the substrate 10 in the Y direction.

The loading cassette 35 may store the substrate 10 horizontally with the protective tape 14 facing upward in order to prevent deformation, such as peeling, of the protective tape 14. The substrate 10 taken out from the loading cassette 35 is flipped upside down and then transported to a processing unit such as the dicing unit 100.

The loading section 30 is provided with a placement plate 31 on which the loading cassette 35 is placed. A plurality of arrangement plates 31 are provided in a row in the Y direction. Additionally, the number of placement plates 31 is not limited to that shown.

The unloading unit 40 carries out the unloading cassette 45 containing the processed substrate 10 to the outside. The unloading cassette 45 accommodates a plurality of substrates 10 mounted on the frame 19 via, for example, adhesive tape 18 at intervals in the Z direction.

In order to store a plurality of substrates 10 at intervals in the Z direction, the unloading cassette 45 has a pair of horizontally arranged storage plates 46 at intervals in the Z direction. As shown in FIG. 3, the pair of storage plates 46 support both ends of the frame 19 in the Y direction.

The carrying out unit 40 is provided with a placement plate 41 on which the carrying out cassette 45 is placed. A plurality of arrangement plates 41 are provided in a row in the Y direction. Additionally, the number of placement plates 41 is not limited to that shown.

The main transport path 50 is a passage through which the main transport unit 58 transports the substrate 10 to the loading unit 30, the carrying out unit 40, and a plurality of processing units, and extends, for example, in the Y direction. . A Y-axis guide 51 extending in the Y direction is provided in the main transport path 50, and the Y-axis slider 52 can move along the Y-axis guide 51.

The main transport unit 58 holds the substrate 10 and moves along the main transport path 50 to transport the substrate 10. The main transport unit 58 may hold the substrate 10 via the frame 19. The main transport unit 58 vacuum-adsorbs the substrate 10 and the frame 19, but may also electrostatically adsorb the substrate 10 and the frame 19. The main conveyance unit 58 includes the Y-axis slider 52 as a conveyance body and the like, and moves along the Y direction. The main transport unit 58 can move not only in the Y direction but also in the X, Z, and θ directions.

The main transport unit 58 may have a plurality of holding units that hold the substrate 10. A plurality of holding parts are arranged at intervals in the Z direction. A plurality of holding units may be used separately depending on the processing stage of the substrate 10.

For example, the main transport unit 58 includes a first holding unit used to take out the substrate 10 from the loading cassette 35, and a substrate 10 whose strength has been reduced by processing such as dicing or thinning. ) has a second holding portion used for conveyance. The second holding portion may be used to transport the substrate 10 before it is mounted on the frame 19. In this case, the main transport unit 58 may further include a third holding part used to transport the substrate 10 after being mounted on the frame 19. The third holding portion holds the substrate 10 via the frame 19.

The loading section 30, the carrying out section 40, and a plurality of processing sections are provided adjacent to the main conveying path 50 when viewed in the vertical direction. For example, the longitudinal direction of the main conveyance path 50 is the Y direction. On one side of the main conveyance path 50 in the In addition, on the side opposite to the 700) is prepared adjacent to it. The peeling portion 600 and the ID attaching portion 700 are stacked in the Z direction, and the ID attaching portion 700 is provided above the peeling portion 600 to overlap the peeling portion 600. Additionally, a mount portion 500 is provided adjacent to one end of the main conveyance path 50 in the Y direction. The mount unit 500 and the ultraviolet irradiation unit 400 are stacked in the Z direction, and the ultraviolet irradiation unit 400 is provided above the mount unit 500 to overlap with the mount unit 500.

According to this embodiment, the loading unit 30 and a plurality of processing units are provided adjacent to the main conveying path 50. For this reason, the main transfer unit 58 can deliver the substrate 10 to the loading unit 30 and a plurality of processing units. As a result, the main transport unit 58 can be made multi-functional, the work load of the main transport unit 58 can be increased, and the operation rate of the main transport unit 58 can be improved.

Moreover, according to this embodiment, the carrying out part 40 is also provided adjacent to the main conveying path 50. For this reason, the main transfer unit 58 can deliver the substrate 10 to the transfer unit 40 . As a result, the main transport unit 58 can be made more multifunctional, the work load of the main transport unit 58 can be further increased, and the operation rate of the main transport unit 58 can be further improved. In addition, since a plurality of processing units and a carrying out unit 40 are provided adjacent to the main transport path 50, if an abnormality occurs in the substrate 10 in one processing unit, the defective substrate 10 is transferred to another processing unit. It can be quickly returned to the delivery unit 40 without being returned to .

Additionally, the arrangement and number of processing units are not limited to those shown in FIG. 3 and can be selected arbitrarily. Additionally, a plurality of processing units may be arranged in arbitrary units, distributed or integrated. Hereinafter, each processing unit will be described.

Figure 4 is a diagram showing a dicing unit according to one embodiment. The dicing unit 100 performs dicing of the substrate 10 . In this specification, dicing of the substrate 10 means processing to divide the substrate 10 into a plurality of chips 13, dividing the substrate 10, and creating a starting point for division in the substrate 10. Including forming. The dicing unit 100 includes, for example, a dicing table 110, a substrate processing unit 120, and a moving mechanism unit 130.

The dicing table 110 holds the substrate 10 with a protective tape 14 interposed therebetween. For example, the dicing table 110 faces the second main surface 12 of the substrate 10 upward and maintains the substrate 10 horizontally. As the dicing table 110, for example, a vacuum chuck is used, but an electrostatic chuck or the like may be used.

The substrate processing unit 120 performs dicing of the substrate 10 held on the dicing table 110, for example. The substrate processing unit 120 has, for example, a laser oscillator 121 and an optical system 122 that radiates a laser beam from the laser oscillator 121 to the substrate 10. The optical system 122 is composed of a condenser lens that focuses the laser beam from the laser oscillator 121 toward the substrate 10.

The moving mechanism unit 130 relatively moves the dicing table 110 and the substrate processing unit 120. The moving mechanism unit 130 is composed of, for example, an XYZθ stage that moves the dicing table 110 in the X direction, Y direction, Z direction, and θ direction.

The control unit 20 controls the substrate processing unit 120 and the moving mechanism unit 130 to dice the substrate 10 along the street of the substrate 10. As shown in FIG. 4, the modified layer 2, which becomes the starting point of fracture, may be formed inside the substrate 10, and a laser processing groove may be formed on the laser irradiated surface (for example, the upper surface in FIG. 4) of the substrate 10. You can form it. The laser processing groove may or may not penetrate the substrate 10 in the thickness direction.

When forming the modified layer 2 inside the substrate 10, a laser beam having transparency to the substrate 10 is used. The modified layer 2 is formed, for example, by locally melting and solidifying the inside of the substrate 10. On the other hand, when forming a laser processing groove on the laser irradiated surface of the substrate 10, a laser beam that has absorption properties with respect to the substrate 10 is used.

In addition, the substrate processing unit 120 has a laser oscillator 121 for irradiating a laser beam to the substrate 10 in the present embodiment, but may also have a cutting blade for cutting the substrate 10. You may have a scrubber that forms scribe grooves on the surface.

In addition, the dicing unit 100 is provided as a part of the substrate processing system 1 in this embodiment, but may be provided outside the substrate processing system 1. In this case, the substrate 10 is diced and then brought into the loading section 30 from the outside, taken out from the loading cassette 35 in the loading section 30, and replaced with the dicing section 100 by a thinning section ( 200).

The thinning section 200 (see FIG. 3) processes the second main surface 12 on the opposite side to the first main surface 11 of the diced substrate 10, which is protected by the protective tape 14. , the substrate 10 is thinned.

When forming the starting point of division in the dicing unit 100, processing stress acts on the substrate 10 in the thinning unit 200, so that cracks propagate from the starting point of division in the direction of the plate thickness, and the substrate 10 is divided into multiple pieces. It is divided into chips 13.

Additionally, when forming the modified layer 2 inside the substrate 10 in the dicing unit 100, the modified layer 2 is removed by thinning the substrate 10 in the thinning unit 200.

For example, as shown in FIG. 3, the thinning section 200 includes a rotation table 201, a chuck table 202, a rough grinding section 210, a finish grinding section 220, and a damage layer agent. Has rejection (230).

The rotary table 201 is rotated around the center line of the rotary table 201. Around the rotation center line of the rotary table 201, a plurality of chuck tables 202 (for example, four in FIG. 3) are arranged at equal intervals.

The plurality of chuck tables 202 rotate around the center line of the rotary table 201 together with the rotary table 201 . The center line of the rotary table 201 is vertical. Each time the rotary table 201 rotates, the chuck table 202 facing the rough grinding unit 210, the finish grinding unit 220, and the damage layer removal unit 230 changes.

Each chuck table 202 holds the substrate 10 with a protective tape 14 interposed therebetween. The chuck table 202 holds the substrate 10 horizontally with the second main surface 12 of the substrate 10 facing upward. As the chuck table 202, for example, a vacuum chuck is used, but an electrostatic chuck or the like may be used.

Figure 5 is a diagram showing the rough grinding part of the thinning part according to one embodiment. The rough grinding unit 210 performs rough grinding of the substrate 10. The rough grinding unit 210 has a rotating grindstone 211, for example, as shown in FIG. 5 . The rotary grindstone 211 is rotated and lowered about its center line to process the upper surface (that is, the second main surface 12) of the substrate 10 held by the chuck table 202.

The final grinding unit 220 performs final grinding of the substrate 10. The configuration of the finish grinding unit 220 is approximately the same as that of the rough grinding unit 210. However, the average particle diameter of the abrasive grains of the rotating grindstone of the finish grinding unit 220 is smaller than the average particle diameter of the abrasive particles of the rotating grindstone of the rough grinding unit 210.

The damage layer removal unit 230 removes the damage layer formed on the second main surface 12 of the substrate 10 by grinding, such as rough grinding and finish grinding. For example, the damage layer removal unit 230 supplies a processing liquid to the substrate 10 to perform a wet etching process to remove the damage layer. Additionally, the method of removing the damage layer is not particularly limited.

Additionally, the thinning unit 200 may have a polishing unit that polishes the substrate 10. The configuration of the polishing section is approximately the same as that of the rough grinding section 210. Examples of polishing of the substrate 10 include CMP (Chemical Mechanical Polishing). Additionally, the thinning portion 200 may have a gettering portion that forms a gettering site that captures impurities (for example, crystal defects or distortions). The number of chuck tables 202 is four in FIG. 3, but changes appropriately depending on the number of types of processing. Additionally, one processing unit (for example, the damage layer removal unit 230) may perform multiple types of processing (for example, damage layer removal and gettering site formation).

Figure 6 is a diagram showing an ultraviolet ray irradiation unit according to one embodiment. The ultraviolet irradiation unit 400 irradiates ultraviolet rays to the protective tape 14 that protects the diced and thinned substrate 10. The adhesive of the protective tape 14 may be hardened by irradiation of ultraviolet rays, which may reduce the adhesive force of the protective tape 14. After the adhesive strength decreases, the protective tape 14 can be easily peeled from the substrate 10 by a peeling operation.

The ultraviolet irradiation unit 400 has a UV lamp 410 inside a housing into which the substrate 10 protected with the protective tape 14 is loaded. The UV lamp 410 irradiates the protective tape 14 with ultraviolet rays from the side opposite to the substrate 10 with the protective tape 14 as a reference.

Figure 7 is a diagram showing a mount portion according to one embodiment. In Fig. 7, the two-dash chain line indicates the state after mounting the adhesive tape 18 and the DAF 15. The mount unit 500 mounts the substrate 10 to the frame 19 via an adhesive tape 18 provided on the opposite side of the substrate 10 from the protective tape 14 after irradiation with ultraviolet rays. The adhesive tape 18 is attached to the frame 19 so as to cover the opening of the annular frame 19, and is bonded to the substrate 10 at the opening of the frame 19.

The mount unit 500 may mount the diced and thinned substrate 10 to the frame 19 via only the adhesive tape 18, but in FIG. 7, the previously laminated adhesive tape 18 and DAF 15 are used. ) is mounted on the frame (19). The DAF 15 is formed smaller than the opening of the frame 19 and is provided inside the frame 19. DAF 15 covers the entire second major surface 12 of substrate 10.

The mount unit 500 includes, for example, a mount table 510 holding the substrate 10 and the frame 19, and an adhesive tape 18 for the frame 19 held on the mount table 510. It has a laminating roller 520 on which the substrate 10 is interposed.

The mount table 510 maintains the frame 19 and the substrate 10 disposed in the opening of the frame 19 in parallel. The frame 19 and the substrate 10 may be held horizontally. The upper surface of the frame 19 and the upper surface of the substrate 10 may have a height difference equal to the thickness of the DAF 15. Additionally, when the DAF 15 is not used, the upper surface of the frame 19 and the upper surface of the substrate 10 may be disposed on the same plane.

The adhesive tape 18 and the like are supplied wound around a core and used by being pulled out from the core. The adhesive tape 18 is laminated on the substrate 10 by passing between the laminating roller 520 and the substrate 10 while sticking to the laminating roller 520 by tension. Additionally, the adhesive tape 18 adheres to the laminating roller 520 by tension and passes between the laminating roller 520 and the frame 19 to be laminated on the frame 19.

As shown in FIG. 7 , the mount unit 500 sequentially bonds the adhesive tape 18 to the frame 19 and the substrate 10 from one end of the frame 19 to the other end. Thereby, the entry of air, etc. can be suppressed. Additionally, since the substrate 10 is kept flat while the adhesive tape 18 is bonded to the substrate 10, damage to the substrate 10 can be suppressed.

Figure 8 is a diagram showing a peeling portion according to one embodiment. In Fig. 8, the two-dashed chain line represents the state before peeling of the protective tape 14. The peeling unit 600 peels the protective tape 14 from the substrate 10 mounted on the frame 19 via the adhesive tape 18. The unnecessary protective tape 14 can be removed. The peeling unit 600 includes, for example, a peeling table 610 and a peeling roller 620.

The protective tape 14 is peeled from the substrate 10 by passing between the peeling roller 620 and the substrate 10 while sticking to the peeling roller 620 by tension. In the meantime, the peeling table 610 holds the substrate 10 and the frame 19 flat through the adhesive tape 18 or the like. The protective tape 14 peeled from the substrate 10 is wound around a winding core (not shown).

The peeling unit 600 peels the protective tape 14 from the substrate 10 while sequentially deforming it from one end of the substrate 10 toward the other end, as shown in FIG. 8 . Thereby, the protective tape 14 and the substrate 10 can be peeled off smoothly. Additionally, since the substrate 10 is kept flat while the protective tape 14 and the substrate 10 are peeled, damage to the substrate 10 can be suppressed.

Additionally, the peeling unit 600 may peel the protective tape 14 and the substrate 10 in parallel.

Figure 9 is a diagram showing an ID attachment portion according to one embodiment. The ID attaching unit 700 reads the identification information 16 (see FIG. 2) of the substrate 10 from which the protective tape 14 has been peeled, and attaches the read identification information 16 to the label 17 (see FIG. 2). (refer to) and attach the printed label (17) to the frame (19). Identification information 16 is information that identifies the substrate 10 and is represented by numbers, letters, symbols, one-dimensional codes, two-dimensional codes, etc.

The ID attaching unit 700 includes, for example, an ID attaching table 710, a reading device 720, and a label printing device 730. The ID attachment table 710 holds the substrate 10 and the frame 19 through an adhesive tape 18 or the like. The reading device 720 reads the identification information 16 previously formed on the substrate 10 . The label printing device 730 prints the identification information 16 read by the reading device 720 on a label 17, and attaches the printed label 17 to the frame 19 using a laminator or the like. The identification information 16 printed on the label 17 and the identification information 16 previously formed on the substrate 10 may represent the same content in different formats, as shown in FIG. 2 .

Next, a substrate processing method using the substrate processing system 1 configured above will be described. 10 is a flowchart of a substrate processing method according to one embodiment.

As shown in FIG. 10, the substrate processing method includes an loading process (S101), a dicing process (S102), a thinning process (S103), an ultraviolet irradiation process (S104), a mounting process (S105), and a peeling process. (S106), ID attachment process (S107), and carrying out process (S108). These processes are performed under control by the control unit 20. Additionally, the order of these processes is not limited to the order shown in FIG. 10. For example, the dicing process (S102) may be performed after the thinning process (S103).

In the loading process (S101), the main transfer unit 58 takes out the substrate 10 from the loading cassette 35 placed in the loading unit 30, and transfers the taken out substrate 10 to the dicing unit 100. do.

In the dicing process (S102), the dicing unit 100 dices the substrate 10, as shown in FIG. 4 . While dicing of the substrate 10 is performed, the first major surface 11 of the substrate 10 is protected with a protective tape 14. The substrate 10 diced in the dicing unit 100 is transported to the thinning unit 200 by the main transport unit 58 .

In the thinning process (S103), as shown in FIG. 5, the thinning unit 200 processes the second main surface 12 of the substrate 10 to thin the substrate 10. While thinning of the substrate 10 is performed, the first major surface 11 of the substrate 10 is protected with a protective tape 14. The substrate 10 thinned in the thinning unit 200 is transported by the main transport unit 58 to the transfer unit 300, which will be described later, and then is sent to the ultraviolet irradiation unit ( 400).

In the ultraviolet ray irradiation process (S104), as shown in FIG. 6, the ultraviolet irradiation unit 400 irradiates the protective tape 14 with ultraviolet rays. The adhesive of the protective tape 14 can be hardened by irradiation of ultraviolet rays, which can reduce the adhesive force of the protective tape 14. After the adhesive strength decreases, the protective tape 14 can be easily peeled from the substrate 10 by a peeling operation.

The ultraviolet irradiation process (S104) may be performed after the mounting process (S105), but in this embodiment, it is performed before the mounting process (S105). As a result, it is possible to prevent deterioration of the adhesive tape 18 bonded to the substrate 10 in the mounting process (S105) due to ultraviolet irradiation. The substrate 10 with the protective tape 14 irradiated with ultraviolet rays in the ultraviolet irradiation unit 400 is transported to the mount unit 500 by the first sub-transport unit 910, which will be described later.

In the mounting process (S105), as shown in FIG. 7, the mount unit 500 mounts the diced and thinned substrate 10 on the frame 19 via the adhesive tape 18. The mount unit 500 may mount the diced and thinned substrate 10 to the frame 19 via only the adhesive tape 18, but in this embodiment, the pre-laminated adhesive tape 18 and the DAF 15 ) is mounted on the frame (19). In the mount unit 500, the substrate 10 mounted on the frame 19 via the adhesive tape 18 is transported to the peeling unit 600 by the second sub-transfer unit 920, which will be described later.

In the peeling process (S106), as shown in FIG. 8, the peeling portion 600 separates the protective tape from the substrate 10 mounted on the frame 19 via the adhesive tape 18 by the mount portion 500. (14) is peeled off. The unnecessary protective tape 14 can be removed. The substrate 10 from which the protective tape 14 has been peeled in the peeling unit 600 is transported to the ID attaching unit 700 by a third sub-transfer unit 930, which will be described later.

In the ID attachment process (S107), as shown in FIG. 9, the ID attachment unit 700 reads the identification information 16 (see FIG. 2) previously formed on the substrate 10, and reads the read identification information 16. is printed on the label 17 (see FIG. 2), and the printed label 17 is attached to the frame 19.

In the carrying out process (S108), the main transport unit 58 transports the substrate 10 from the ID attaching unit 700 to the carrying out part 40, and the inside of the carrying out cassette 45 in the carrying out part 40 The substrate 10 is stored in . The carrying out cassette 45 is carried out from the carrying out unit 40. The substrate 10 carried out to the outside together with the unloading cassette 45 is picked up for each chip 13. In this way, the chip 13 is manufactured.

11 is a plan view showing main parts of a substrate processing system according to one embodiment. Figure 12 is a side view showing a mount unit according to one embodiment, and an ultraviolet irradiation unit and a transmission unit provided above the mount unit overlapping with the mount unit. Figure 13 is a side view showing a peeling portion and an ID attachment portion provided above the peeling portion and overlapping with the peeling portion according to one embodiment. 11 to 13, arrows indicate the movement directions of the substrate 10 and the frame 19 in the mount portion 500 and the peeling portion 600, etc.

The substrate processing system 1 includes a mount unit 500 . As shown in FIG. 12, the mount unit 500 includes, for example, a mount table 510, a laminating roller 520, a mount table guide 530, a frame supply unit 540, and a frame transport unit. Has wealth (550).

As shown in FIG. 11, the mount table guide 530 extends in the X direction and is provided in pairs at intervals in the Y direction. The mount table 510 can be moved along the pair of mount table guides 530. As a drive source for moving the mount table 510, a servo motor is used, for example.

As shown in FIG. 12, a laminating roller 520 is provided above the rear end of the mount table guide 530, and a frame supply unit 540 is provided below the front end of the mount table guide 530. It is prepared. The frame supply unit 540 is a frame cassette 541 containing the frame 19 before mounting the substrate 10 is brought in from the outside. The frame cassette 541 accommodates a plurality of frames 19 arranged in the Z direction. Additionally, the frame cassette 541 does not need to be present, and the worker may set the frame 19 in the frame supply unit 540. The frames 19 may be divided into multiple sheets and set in the frame supply unit 540.

As shown in FIG. 3 , an loading portion 30 and an unloading portion 40 are provided on one side (front side) in the width direction of the main conveying path 50, and the mount portion 500 is provided along the length of the main conveying path 50. It may be provided adjacent to one end of the direction. In this case, as shown in FIG. 12, the frame cassette 541 may be loaded into the frame supply unit 540 from the front. The unprocessed article (substrate 10 and frame 19) is brought in from the front side, and the processed article (frame 19 on which the substrate 10 is mounted) is taken out from the front side. The loading and unloading of goods can be concentrated at the front, improving maintenance and transport efficiency.

The frame transport unit 550 takes out the frame 19 from the frame cassette 541 placed in the frame supply unit 540, and places the taken out frame 19 on the mount table 510. The frame transport unit 550 is disposed between a pair of mount table guides 530 when viewed in the Z direction, for example, and is movable in the Z direction. As a driving source for moving the frame transport unit 550, a servo motor or the like is used, for example.

The frame transport unit 550 has an adsorption unit 559 that adsorbs the frame 19. The suction portions 559 are provided in plurality at intervals in the X direction, for example, and adsorb both ends of the frame 19 in the X direction. The suction part 559 has a suction hole. The gas in the suction hole is sucked into a suction source such as a vacuum pump, for example. By operating the suction source to generate negative pressure in the suction section 559, the frame transport section 550 vacuum-adsorbs the frame 19. Meanwhile, by stopping the operation of the suction source and opening the suction hole to the atmosphere, the frame transport unit 550 releases the vacuum suction of the frame 19. When vacuum suction is released, positive pressure may be generated in the frame transport unit 550. In this specification, negative pressure is a pressure lower than atmospheric pressure, and positive pressure is a pressure higher than atmospheric pressure.

The mount table 510 receives the frame 19 from the frame transport unit 550 at the end of the mount table guide 530 on the main transport path 50 side (front side). Specifically, first, the frame transport unit 550 is raised from the position indicated by the solid line in FIG. 12 to the position indicated by the two-dot chain line in FIG. 12, and a pair of mount table guides 530 provided at intervals in the Y direction are raised. passes in the Z direction. At this time, the mount table 510 is standing by at a retracted position that does not impede the raising of the frame transport unit 550. Afterwards, when the mount table 510 is moved directly below the frame transport unit 550, the frame transport unit 550 is lowered, and the frame 19 held by the frame transport unit 550 is mounted. It is placed on the table 510.

After this, the mount table 510 is moved in the The substrate 10 is received from 910. The substrate 10 is placed in the opening of the frame 19, and the mount table 510 holds the substrate 10 via the protective tape 14.

After this, the mount table 510 is further moved in the As shown in FIG. 7, the laminating roller 520 bonds the adhesive tape 18 to the frame 19 placed on the mount table 510 and the substrate 10 placed in the opening of the frame 19. do. The adhesive tape 18 is provided on the opposite (upper side) side of the substrate 10 from the protective tape 14 .

The substrate processing system 1 includes an ultraviolet irradiation unit 400. As shown in FIGS. 11 and 12 , the ultraviolet irradiation unit 400 is provided above the mount unit 500 to overlap with the mount unit 500 . For example, the ultraviolet irradiation unit 400 is provided to overlap a pair of mount table guides 530 when viewed in the Z direction.

Since the ultraviolet irradiation unit 400 and the mount unit 500 are stacked in the Z direction, when viewed in the Z direction, compared to the case where the ultraviolet irradiation unit 400 and the mount unit 500 are arranged horizontally, when viewed in the Z direction, When doing so, the installation area of the substrate processing system 1 can be reduced. Additionally, it becomes a flow for transporting the substrate 10 from the ultraviolet irradiation unit 400 to the mount unit 500.

The substrate processing system 1 may be provided with a transfer unit 300 that receives the diced and thinned substrate 10 from the main transfer unit 58 (see FIG. 3). The transfer unit 300 receives the substrate 10 from the main transfer unit 58 and delivers the received substrate 10 to the first sub-transfer unit 910, which will be described later.

The delivery section 300 is provided adjacent to the main conveyance path 50 as shown in FIG. 11 and above the mount section 500 as shown in FIG. 12 , overlapping with the mount section 500 . For example, the transmission unit 300 is provided to overlap a pair of mount table guides 530 when viewed in the Z direction. When the mount unit 500 is provided adjacent to the Y-direction end of the main transport path 50, the delivery unit 300 is also provided adjacent to the Y-direction end of the main transport path 50.

Since the transmission unit 300 and the mount unit 500 are stacked in the Z direction, when viewed in the Z direction, compared to the case where the mount unit 500 and the transmission unit 300 are arranged horizontally, when viewed in the Z direction, When doing so, the installation area of the substrate processing system 1 can be reduced. In addition, the delivery unit 300 can be placed at the same height as the ultraviolet irradiation unit 400, and the delivery unit 300 can be placed next to the ultraviolet irradiation unit 400, so that the ultraviolet irradiation unit ( 400) becomes a flow for transporting the substrate 10.

For example, as shown in FIG. 11, when viewed in the Z direction, a transmission unit 300, an ultraviolet ray irradiation unit 400, and a laminating roller 520 are arranged in this order from the front to the rear. . For this reason, the flow of the substrate 10 from the transfer unit 300 through the ultraviolet irradiation unit 400 until it is placed on the mount table 510 can be improved, and the transport efficiency of the substrate 10 can be improved. there is.

The transmission unit 300 may also serve as an alignment unit that acquires information used for positional adjustment of the mounting position of the substrate 10 with respect to the frame 19. As a result, for example, the transfer of the substrate 10 between the thinning unit 200 and the main transfer unit 58, and the transfer of the substrate 10 between the main transfer unit 58 and the transfer unit 300. When the substrate 10 is displaced due to transfer or the like, the position of the substrate 10 in the X direction, Y direction, or θ direction can be corrected. The calibration is performed so that the center of the opening of the frame 19 coincides with the center of the substrate 10, and the orientation of the substrate 10 with respect to the frame 19 is in a predetermined direction.

As shown in FIG. 12, the transfer unit 300 captures, for example, a transfer table 310 holding the substrate 10 and an image of the substrate 10 held by the transfer table 310. It has a unit 320 and a rotation drive unit 330 that rotates the transfer table 310. As the transfer table 310, for example, a vacuum chuck is used, but an electrostatic chuck or the like may be used. The imaging unit 320 is provided, for example, above the transfer table 310 and captures an image of the substrate 10 held on the transfer table 310 from above. The rotation drive unit 330 changes the imaging position of the substrate 10 held by the transfer table 310 by rotating the transfer table 310 .

The transmission unit 300 converts the image of the substrate 10 captured by the imaging unit 320 into an electrical signal and transmits it to the control unit 20 . The control unit 20 detects the position of the substrate 10 held on the transfer table 310 by performing image processing on the image of the substrate 10 captured by the imaging unit 320 . The detection method includes a method of matching a pattern (for example, a division pattern) of the substrate 10 and a reference pattern, and a method of matching the center point of the substrate 10 and the substrate 10 from a plurality of points on the outer circumference of the substrate 10. Known methods such as a method of finding the direction of are used. The direction of the substrate 10 is detected by the position of a notch formed on the outer periphery of the substrate 10, etc. Instead of notches, orientation flats may be used. As a result, the control unit 20 can determine the position of the substrate 10 in the coordinate system fixed to the transfer table 310.

Position adjustment of the substrate 10 in the θ direction is performed, for example, by rotating the transfer table 310. On the other hand, the This is done while conveying from 300 through the ultraviolet irradiation unit 400 to the mount unit 500. For example, the X-direction position adjustment of the substrate 10 and the Y-direction position adjustment of the substrate 10 are performed when the first sub-transfer unit 910, described later, receives the substrate 10 from the transfer table 310. , or when the first sub-transfer unit 910 delivers the substrate 10 to the mount table 510. Thereby, position adjustment of the placement position of the board|substrate 10 with respect to the mount table 510 is performed, and further, position adjustment of the mounting position of the board|substrate 10 with respect to the frame 19 is performed.

The substrate processing system 1 includes a peeling unit 600 . As shown in FIG. 13 , the peeling unit 600 has, for example, a peeling table 610, a peeling roller 620, and a peeling table guide 630.

As shown in FIG. 11, the peeling table guide 630 extends in the X direction and is provided in pairs at intervals in the Y direction. The peeling table 610 can be moved along the pair of peeling table guides 630. As a drive source for moving the peeling table 610, a servo motor is used, for example.

As shown in FIG. 13 , the peeling table 610 is located at the center of the peeling table guide 630 in the The substrate 10 is previously mounted on the frame 19 through an adhesive tape 18. The peeling table 610 holds the substrate 10 and the frame 19 via the adhesive tape 18.

After this, the peeling table 610 is moved in the The peeling roller 620 peels the protective tape 14 from the substrate 10 while sequentially deforming it from one end side of the substrate 10 toward the other end side, as shown in FIG. 8 .

The substrate processing system 1 may be provided with an ID attachment portion 700. As shown in FIGS. 11 and 13 , the ID attachment portion 700 is provided adjacent to the main conveyance path 50 . The main transfer unit 58 transports the frame 19 to which the ID attaching unit 700 has attached the label 17 from the ID attaching unit 700 to the carrying out unit 40. It is stored in the placed take-out cassette (45).

In the substrate processing system 1, as shown in FIGS. 11 and 13, the ID attachment portion 700 may be provided above the peeling portion 600, overlapping with the peeling portion 600. For example, the ID attachment portion 700 is provided to overlap a pair of peeling table guides 630 when viewed in the Z direction.

Since the peeling portion 600 and the ID attaching portion 700 are stacked in the Z direction, when viewed in the Z direction, compared to the case where the peeling portion 600 and the ID attaching portion 700 are arranged horizontally, the In view of this, the installation area of the substrate processing system 1 can be reduced. Additionally, the flow of transferring the substrate 10 from the peeling unit 600 to the ID attaching unit 700 is good.

As shown in FIG. 11 and the like, the substrate processing system 1 includes a main transfer unit 58 (see FIG. 3), a first sub-transfer unit 910, a second sub-transfer unit 920, and a third sub-transfer unit 58 (see FIG. 3). A sub-carrying unit 930 may be provided. The main transport unit 58 transports the substrate 10 from the loading unit 30 to the transfer unit 300 via the dicing unit 100 and the thinning unit 200. The first sub-transfer unit 910 transports the substrate 10 from the transfer unit 300 to the mount unit 500 via the ultraviolet ray irradiation unit 400. The second sub-transfer unit 920 transfers the substrate 10 from the mount unit 500 to the peeling unit 600 and also inverts the substrate 10 up and down. The third sub-transfer unit 930 transports the substrate 10 from the peeling unit 600 to the ID attaching unit 700. The main transport unit 58 transports the substrate 10 from the ID attaching unit 700 to the carrying unit 40 .

The first sub-carrying unit 910 can move in the X and Z directions. For example, as shown in FIG. 11, the X-axis guide 911 is fixed to the mount unit 500. A Z-axis guide 913 is fixed to the X-axis slider 912 that moves in the X direction along the X-axis guide 911. The first sub-carrying unit 910 is fixed to the Z-axis slider 914 that moves in the Z direction along the Z-axis guide 913. Additionally, the first sub-carrying unit 910 may be further movable in the Y direction in order to adjust the Y direction position of the substrate 10.

The first sub-carrier 910 adsorbs the substrate 10. The first sub-carrying unit 910 may have an adsorption surface larger than the main surface (for example, the second main surface 12) of the substrate 10 in order to prevent deformation and damage of the substrate 10. The entire second main surface 12 of the substrate 10 can be maintained flat, and deformation and damage of the substrate 10 can be suppressed.

The first sub-carrying unit 910 is made of, for example, a porous chuck and has a porous body. The gas in the holes of the porous body is sucked in by a suction source such as a vacuum pump, for example. By operating the suction source to generate negative pressure in the first sub-carrying unit 910, the first sub-carrying unit 910 vacuum-adsorbs the substrate 10. Meanwhile, by stopping the operation of the suction source and opening the hole of the porous material to the atmosphere, the first sub-carrying unit 910 releases the vacuum suction of the substrate 10. When vacuum suction is released, positive pressure may be generated in the first sub-carrying unit 910.

The first sub-transfer unit 910 holds the substrate 10 and moves it in the Send it back to For example, the substrate 10 is lifted from the transfer table 310, passes above the UV lamp 410, and is placed on the mount table 510. As a driving source for moving the first sub-carrying unit 910, a servo motor or the like is used, for example.

The first sub-transport unit 910 holds the substrate 10 from above with the protective tape 14 facing downward, and moves in the X direction above the UV lamp 410 extending in the Y direction. The Y-direction dimension of the UV lamp 410 is larger than the diameter of the substrate 10 so that the UV lamp 410 can irradiate the entire Y-direction of the protective tape 14. The speed at which the first sub-carrying unit 910 passes over the UV lamp 410 is set to sufficiently reduce the adhesive force of the protective tape 14.

According to this embodiment, since the substrate 10 is held by the first sub-transfer unit 910 while the protective tape 14 is irradiated with ultraviolet rays, the other substrates 10 are held by the main transfer unit 58. You can return it. For this reason, the transport efficiency of the substrate 10 in the entire substrate processing system 1 can be improved, and the processing speed of the substrate 10 in the entire substrate processing system 1 can be improved.

The second sub-carrying unit 920 can move in the Y and Z directions. For example, as shown in FIG. 12, the Y-axis guide 921 is fixed to the mount portion 500 and the peeling portion 600. The Y-axis guide 921 is provided across both the mount portion 500 and the peeling portion 600 when viewed in the Z direction. A Z-axis guide 923 is fixed to the Y-axis slider 922 that moves in the Y direction along the Y-axis guide 921. The inversion portion 925 is fixed to the Z-axis slider 924 that moves in the Z direction along the Z-axis guide 923. The inversion unit 925 holds the second sub-carrying unit 920 so that it can be flipped up and down around the inversion axis 926. The axial direction of the inversion axis 926 is the Y direction in this embodiment, but may be the X direction.

The second sub-carrying unit 920 has an adsorption unit 929 that adsorbs the frame 19. A plurality of adsorption units 929 are provided at intervals in the axial direction (for example, Y direction) of the inversion axis 926 (see FIG. 14), and adsorb both ends of the frame 19 in the Y direction. The suction part 929 has a suction hole. The gas in the suction hole is sucked into a suction source such as a vacuum pump, for example. By operating the suction source to generate negative pressure in the second sub-carrying unit 920, the second sub-carrying unit 920 vacuum-suctions the frame 19. Meanwhile, by stopping the operation of the suction source and opening the suction hole to the atmosphere, the second sub-carrying unit 920 releases the vacuum suction of the frame 19. When vacuum suction is released, positive pressure may be generated in the second sub-carrying unit 920.

Figure 14 is a diagram showing the operation of the second sub-carrier according to one embodiment. In FIG. 14 , arrows indicate the direction of movement of the substrate 10 and the frame 19 from the mount unit 500 to the peeling unit 600. The second sub-carrying unit 920 maintains the frame 19 and moves in the Y and Z directions, thereby attaching the substrate 10 mounted on the frame 19 via the adhesive tape 18 to the mount unit 500. ) is conveyed to the peeling unit 600. As a driving source for moving the second sub-carrying unit 920, a servo motor or the like is used, for example.

After lifting the frame 19 from the mount table 510, the second sub-carrying unit 920 moves the inversion unit 925 from the position indicated by the solid line in FIG. 14 to the position indicated by the dot-and-dash line in FIG. 14. moved to location. As a result, the substrate 10 mounted on the frame 19 through the adhesive tape 18 is flipped up and down. After this, the second sub-transport unit 920 places the frame 19 on the peeling table 610, as indicated by the two-dot chain line in FIG. 14 . The peeling table 610 is located at the center of the frame 19 in the Y direction so as not to interfere with the plurality of suction parts 929 provided at intervals in the axial direction of the inversion axis 926 (the Y direction in this embodiment). maintain

According to this embodiment, the substrate 10 is flipped up and down by the inversion section 925 during the process of being transported from the mount section 500 to the peeling section 600. As a result, the arrangement of the adhesive tape 18 and the protective tape 14 provided across the substrate 10 can be reversed. Specifically, an adhesive tape 18 is disposed on the lower side of the substrate 10, and a protective tape 14 is disposed on the upper side of the substrate 10. Since the protective tape 14 is disposed on the side opposite to the peeling table 610 with respect to the substrate 10, it is easy to peel from the substrate 10.

The third sub-carrying unit 930 can move in the X and Z directions. For example, as shown in FIG. 11, the X-axis guide 931 is fixed in the peeling portion 600. A Z-axis guide 933 is fixed to the X-axis slider 932 that moves in the X direction along the X-axis guide 931. The third sub-carrying unit 930 is fixed to the Z-axis slider 934 that moves in the Z direction along the Z-axis guide 933. Additionally, the third sub-carrying unit 930 may be further movable in the Y direction in order to adjust the Y direction position of the substrate 10.

The third sub-carrying unit 930 has an adsorption unit 939 that adsorbs the frame 19. The suction portions 939 are provided in plurality, for example, at intervals in the X direction, and adsorb both ends of the frame 19 in the X direction. The suction part 939 has a suction hole. The gas in the suction hole is sucked into a suction source such as a vacuum pump, for example. By operating the suction source to generate negative pressure in the third sub-carrying unit 930, the third sub-carrying unit 930 vacuum-suctions the frame 19. Meanwhile, by stopping the operation of the suction source and opening the suction hole to the atmosphere, the third sub-carrying unit 930 releases the vacuum suction of the frame 19. When vacuum suction is released, positive pressure may be generated in the third sub-carrying unit 930.

The third sub-transport unit 930 holds the frame 19 and moves it in the ) is conveyed to the ID attachment unit 700. For example, the substrate 10 is lifted from the peeling table 610 and placed on the ID attaching table 710. As a driving source for moving the third sub-carrying unit 930, a servo motor or the like is used, for example.

In the first modification below, unlike the above embodiment, there is no third sub-transportation unit 930, and the main transport unit 58 plays the role of the third sub-transportation unit 930. That is, the main transport unit 58 transports the substrate 10 from the peeling unit 600 to the ID attaching unit 700. Hereinafter, the differences will mainly be explained.

Fig. 15 is a side view showing the peeling portion according to the first modification and the ID attachment portion provided above the peeling portion and overlapping with the peeling portion. In FIG. 15 , arrows indicate the movement direction of the substrate 10 and the frame 19 in the peeling portion 600 and the like. As shown in FIG. 15 , the peeling portion 600 is provided adjacent to the main conveyance path 50 .

The peeling table 610 receives the frame 19 from the second sub-transfer unit 920 at the center portion of the peeling table guide 630 in the X direction. The substrate 10 is previously mounted on the frame 19 through an adhesive tape 18. The peeling table 610 holds the substrate 10 and the frame 19 via the adhesive tape 18.

After this, the peeling table 610 is moved in the The peeling roller 620 peels the protective tape 14 from the substrate 10 while sequentially deforming it from one end side of the substrate 10 toward the other end side, as shown in FIG. 8 .

After this, the peeling table 610 is moved in the The frame 19 is transferred to the main transfer unit 58 (see FIG. 3). The main transport unit 58 moves in the Z direction and the X direction while holding the frame 19, thereby placing the frame 19 on the ID attachment table 710.

According to this modification, unlike the above embodiment, there is no third sub-carrying unit 930, and the main transporting unit 58 plays the role of the third sub-carrying unit 930. That is, the main transport unit 58 transports the substrate 10 from the peeling unit 600 to the ID attaching unit 700. As a result, the main transport unit 58 can be made multi-functional, the work load of the main transport unit 58 can be increased, and the operation rate of the main transport unit 58 can be improved.

In the second modified example below, unlike the above embodiment and the first modified example, there is no first sub-carrying unit 910, and the main transporting unit 58 plays the role of the first sub-carrying unit 910. . That is, the main transport unit 58 transports the diced and thinned substrate 10 to the ultraviolet irradiation unit 400 and the mount unit 500 in this order. In this modification, since there is no first sub-transfer unit 910, there is no need for a transfer unit 300 that relays the substrate 10 from the main transfer unit 58 to the first sub-transfer unit 910. Hereinafter, the differences will mainly be explained.

16 is a plan view showing main parts of the substrate processing system according to the second modification. In FIG. 16 , arrows indicate the movement directions of the substrate 10 and the frame 19 in the mount portion 500 and the peeling portion 600, etc. As shown in FIG. 16 , the ultraviolet irradiation unit 400 and the mount unit 500 are provided adjacent to the main conveyance path 50 . When the mount portion 500 is provided adjacent to one end of the main conveyance path 50 in the Y direction, the ultraviolet irradiation portion 400 is also provided adjacent to one end of the main conveyance path 50 in the Y direction.

The main transport unit 58 (see FIG. 3) holds the substrate 10 and moves it in the Y and Z directions, thereby transporting the substrate 10 to the ultraviolet irradiation unit 400 and the mount unit 500 in this order. do. The main transport unit 58 is first inserted into the ultraviolet irradiation unit 400 from the main transport path 50.

The main transport unit 58 holds the substrate 10 from above with the protective tape 14 facing downward, and moves above the UV lamp 410 extending in the X direction in the Y direction. The X-direction dimension of the UV lamp 410 is larger than the diameter of the substrate 10 so that the UV lamp 410 can irradiate the entire X-direction of the protective tape 14. The speed at which the main conveyance unit 58 passes over the UV lamp 410 is set so as to sufficiently reduce the adhesive force of the protective tape 14.

Next, the main transport unit 58 is pulled out from the ultraviolet irradiation unit 400 to the main transport path 50, is lowered in the main transport path 50, and then is pulled out from the main transport path 50 to the mount unit 500. is inserted into After this, the main transfer unit 58 is lowered inside the mount unit 500 and guides the substrate 10 to the mount table 510 .

The mount table 510 receives both the substrate 10 and the frame 19 at the end of the mount table guide 530 on the main transport path 50 side (front side). The mount table 510 may receive either the substrate 10 or the frame 19 first.

According to this modification, unlike the above-mentioned embodiment and the first modification example, there is no first sub-carrying unit 910, and the main carrying unit 58 plays the role of the first sub-carrying unit 910. That is, the main transport unit 58 transports the diced and thinned substrate 10 to the ultraviolet irradiation unit 400 and the mount unit 500 in this order. As a result, the main transport unit 58 can be made multi-functional, the work load of the main transport unit 58 can be increased, and the operation rate of the main transport unit 58 can be improved.

Above, embodiments of the substrate processing system and substrate processing method according to the present disclosure have been described, but the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope described in the patent claims. Naturally, they also fall within the technical scope of the present disclosure.

This application claims priority based on Japanese Patent Application No. 2017-163600, filed with the Japan Patent Office on August 28, 2017, and the entire contents of Japanese Patent Application No. 2017-163600 are incorporated into this application.

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Claims (18)

By bonding the adhesive tape to the substrate and frame,
A mount portion forming a fixture on which the substrate is mounted on the frame via the adhesive tape,
a loading section where an loading cassette containing the substrate before being mounted on the frame is loaded from the outside via the adhesive tape;
a carry-out unit where the carry-out cassette containing the substrate mounted on the frame via the adhesive tape is carried out to the outside;
In a substrate transport system that transports the substrate between processing units that perform processing that reduces the strength of the substrate,
a main conveying path installed adjacent to the loading section, the mounting section, the carrying out section, and the processing section when viewed in a vertical direction;
further comprising a main transport unit that holds the substrate and moves along the main transport path to transport the substrate,
A substrate transport system, wherein the main transport unit includes a first holding part used to take out the substrate from the loading cassette, and a second holding part used to transport the substrate that has been processed by the processing unit. . According to paragraph 1,
A substrate transport system, wherein the second holding unit is used to transport the substrate before being mounted on the frame. According to claim 1 or 2,
A substrate transport system, wherein the main transport unit further includes a third holding part used to transport the substrate after being mounted on the frame. By bonding the adhesive tape to the substrate and frame,
A mount portion forming a fixture on which the substrate is mounted on the frame via the adhesive tape,
a loading section where an loading cassette containing the substrate before being mounted on the frame is brought in from the outside via the adhesive tape;
a carry-out unit where the carry-out cassette containing the substrate mounted on the frame via the adhesive tape is carried out;
A substrate transport method for transporting the substrate between a processing unit that performs processing that reduces the strength of the substrate,
Further performing a substrate moving process of moving the main transport unit holding the substrate along a main transport path in which the loading unit, the mounting unit, the carrying unit, and the processing unit are installed adjacent to each other,
In the substrate moving process, the substrate is taken out from the loading cassette using a first holding unit, and the substrate processed by the processing unit is transported using a second holding unit. Return method. delete delete delete delete delete delete delete delete delete delete delete delete delete delete

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