JP7434463B2 - Substrate transfer system and substrate transfer method - Google Patents

Description

The present disclosure relates to a substrate transport system and a substrate transport method.

In recent years, in order to meet the demand for smaller and lighter semiconductor devices, after forming elements, circuits, terminals, etc. on the first main surface of a substrate such as a semiconductor wafer, a second main surface of the substrate opposite to the first main surface is formed. 2. The main surface is ground to reduce the thickness of the substrate. Dicing is performed after or before thinning.

During processing such as thinning and dicing, the first main surface of the substrate is protected with a protective tape. As the protective tape, one whose adhesive strength is reduced by irradiation with ultraviolet rays is used. After the adhesive strength decreases, the protective tape can be easily peeled off from the substrate by a peeling operation.

After the protective tape is irradiated with ultraviolet rays and before the protective tape is peeled off from the substrate, the substrate is attached to the frame via an adhesive tape different from the protective tape. The adhesive tape is attached to the frame so as to cover the opening of the annular frame, and is bonded to the second main surface of the substrate at the opening of the frame.

The apparatus of Patent Document 1 includes a processing section that grinds the back surface of the wafer, a UV irradiation section that irradiates ultraviolet rays to a protective tape that protects the front surface of the wafer, and a frame that frames the wafer through an adhesive tape that is attached to the back surface of the wafer. The wafer has a mount section for attaching the protective tape to the wafer, and a peeling section for peeling off the protective tape from the wafer.

Japanese Patent Application Publication No. 2002-343756

One aspect of the present disclosure provides a technique that improves the utilization rate of a main transport section.

In the present invention, the configuration described in the claims is adopted.

According to one aspect of the present disclosure, the operating rate of the main transport section can be improved.

FIG. 1 is a perspective view showing a substrate before being processed by a substrate processing system according to an embodiment. FIG. 2 is a perspective view of a substrate after processing by a substrate processing system according to one embodiment. FIG. 3 is a plan view of a substrate processing system according to one embodiment. FIG. 4 is a diagram illustrating a dicing section according to one embodiment. FIG. 5 is a diagram illustrating a rough grinding section of a thinning section according to one embodiment. FIG. 6 is a diagram showing an ultraviolet irradiation unit according to one embodiment. FIG. 7 is a diagram illustrating a mount according to one embodiment. FIG. 8 is a diagram illustrating a peeling section according to one embodiment. FIG. 9 is a diagram showing an ID pasting section according to one embodiment. FIG. 10 is a flowchart of a method for processing a substrate according to one embodiment. FIG. 11 is a plan view showing essential parts of a substrate processing system according to one embodiment. FIG. 12 is a side view showing a mount part, and an ultraviolet irradiation part and a delivery part provided above the mount part to overlap with the mount part, according to one embodiment. FIG. 13 is a side view showing a peeling part and an ID pasting part provided above the peeling part and overlapping with the peeling part, according to one embodiment. FIG. 14 is a diagram illustrating the operation of the second sub-transport unit according to one embodiment. FIG. 15 is a side view showing a peeling part according to a first modification and an ID pasting part provided above the peeling part and overlapping with the peeling part. FIG. 16 is a plan view showing main parts of a substrate processing system according to a second modification.

Embodiments of the present disclosure will be described below with reference to the drawings. In each drawing, the same or corresponding configurations are given the same or corresponding symbols, and the description thereof will be omitted. In the following description, the X direction, Y direction, and Z direction are mutually perpendicular directions, the X direction and Y direction are horizontal directions, and the Z direction is vertical direction. The direction of rotation about the vertical axis is also called the θ direction. In this specification, below means vertically downward, and upward means vertically upward.

FIG. 1 is a perspective view showing a substrate before being processed by a substrate processing system according to an embodiment. The substrate 10 is, for example, a semiconductor substrate, a sapphire substrate, or the like. The first main surface 11 of the substrate 10 is divided into a plurality of streets formed in a grid pattern, and elements, circuits, terminals, etc. are formed in advance in each divided area. Chips 13 (see FIG. 2) are obtained by dividing the substrate 10 along a plurality of streets formed in a grid pattern.

A protective tape 14 is bonded to the first main surface 11 of the substrate 10 . The protective tape 14 protects the first main surface 11 of the substrate 10 during processing such as dicing and thinning, and protects elements, circuits, terminals, etc. formed on the first main surface 11 in advance. Protective tape 14 covers the entire first main surface 11 of substrate 10 .

The protective tape 14 is composed of a sheet base material and an adhesive applied to the surface of the sheet base material. The adhesive may be one that cures when exposed to ultraviolet light and reduces its adhesive strength. After the adhesive strength decreases, the protective tape 14 can be easily peeled off from the substrate 10 by a peeling operation.

FIG. 2 is a perspective view of a substrate after processing by a substrate processing system according to one embodiment. The substrate 10 is diced into a thin plate, and then attached to a frame 19 via an adhesive tape 18. Note that the protective tape 14 shown in FIG. 1 is peeled off from the substrate 10 and removed.

The adhesive tape 18 is composed of a sheet base material and an adhesive applied to the surface of the sheet base material. The adhesive tape 18 is attached to the frame 19 so as to cover the opening of the annular frame 19, and is bonded to the substrate 10 at the opening of the frame 19. Thereby, the substrate 10 can be transported while holding the frame 19, and the handling of the substrate 10 can be improved.

A DAF (Die Attach Film) 15 may be provided between the adhesive tape 18 and the substrate 10, as shown in FIG. DAF15 is an adhesive sheet for die bonding. The DAF 15 is used for stacking the chips 13 and the like. The DAF 15 may be either conductive or insulating.

The DAF 15 is formed smaller than the opening of the frame 19 and is provided inside the frame 19. DAF 15 covers the entire second main surface 12 of substrate 10 . Note that if the chips 13 are not stacked, the DAF 15 is not required, and the substrate 10 may be attached to the frame 19 only via the adhesive tape 18.

FIG. 3 is a plan view of a substrate processing system according to one embodiment. In FIG. 3, the carry-in cassette 35 and the carry-out cassette 45 are cut away to illustrate the interior of the carry-in cassette 35 and the carry-out cassette 45. In FIG. 3, arrows indicate moving directions of the substrate 10 and frame 19 in the mount section 500, the peeling section 600, and the like.

The substrate processing system 1 performs various processes such as dicing the substrate 10, thinning the substrate 10, irradiating the protective tape 14 with ultraviolet rays, mounting the substrate 10, peeling the protective tape 14 from the substrate 10, and attaching an ID to the frame 19. conduct.

The substrate processing system 1 includes a control section 20, a carry-in section 30, a carry-out section 40, a main transport path 50, a main transport section 58, and various processing sections. Although the processing section is not particularly limited, for example, a dicing section 100, a thinning section 200, an ultraviolet irradiation section 400, a mounting section 500, a peeling section 600, and an ID pasting section 700 are provided.

The control unit 20 is composed of, for example, a computer, and includes a CPU (Central Processing Unit) 21, a storage medium 22 such as a memory, an input interface 23, and an output interface 24, as shown in FIG. The control unit 20 performs various controls by causing the CPU 21 to execute programs stored in the storage medium 22. Further, the control unit 20 receives signals from the outside through the input interface 23 and transmits signals to the outside through the output interface 24.

The program of the control unit 20 is stored in an information storage medium and installed from the information storage medium. Examples of information storage media include hard disks (HD), flexible disks (FD), compact disks (CD), magnetic optical desks (MO), and memory cards. Note that the program may be downloaded from a server via the Internet and installed.

A carry-in cassette 35 containing substrates 10 before processing is carried into the carry-in section 30 from the outside. The carry-in cassette 35 stores a plurality of substrates 10 at intervals in the Z direction before being attached to the frame 19 via, for example, an adhesive tape 18.

In order to store a plurality of substrates 10 at intervals in the Z direction, the carry-in cassette 35 has a plurality of pairs of storage plates 36 arranged horizontally at intervals in the Z direction. The pair of storage plates 36 support both ends of the substrate 10 in the Y direction, as shown in FIG.

The carry-in cassette 35 may store the substrate 10 horizontally with the protective tape 14 facing upward in order to suppress deformation such as curling of the protective tape 14 . The substrate 10 taken out from the carry-in cassette 35 is turned upside down and then transported to a processing section such as the dicing section 100.

The carry-in section 30 includes a mounting plate 31 on which a carry-in cassette 35 is placed. A plurality of mounting plates 31 are provided in a row in the Y direction. Note that the number of mounting plates 31 is not limited to what is illustrated.

The carry-out section 40 is a part in which a carry-out cassette 45 containing the processed substrates 10 is carried out to the outside. The carry-out cassette 45 stores a plurality of substrates 10, which have been attached to the frame 19 via, for example, an adhesive tape 18, at intervals in the Z direction.

The carry-out cassette 45 has a plurality of pairs of storage plates 46 arranged horizontally at intervals in the Z direction in order to store a plurality of substrates 10 at intervals in the Z direction. As shown in FIG. 3, the pair of storage plates 46 support both ends of the frame 19 in the Y direction.

The carry-out section 40 includes a mounting plate 41 on which a carry-out cassette 45 is placed. A plurality of mounting plates 41 are provided in a row in the Y direction. Note that the number of mounting plates 41 is not limited to what is illustrated.

The main transport path 50 is a path through which the main transport section 58 transports the substrate 10 to the loading section 30, the unloading section 40, and a plurality of processing sections, and extends, for example, in the Y direction. A Y-axis guide 51 extending in the Y direction is provided on the main conveyance path 50, and a Y-axis slider 52 is movable along the Y-axis guide 51.

The main transport section 58 holds the substrate 10 and moves along the main transport path 50 to transport the substrate 10. The main transport section 58 may hold the substrate 10 via the frame 19. The main transport section 58 vacuum-chucks the substrate 10 and the frame 19, but may also electrostatically chuck them. The main transport section 58 includes a Y-axis slider 52 as a transport base, and moves along the Y direction. The main transport section 58 is movable not only in the Y direction but also in the X direction, Z direction, and θ direction.

The main transport section 58 may have a plurality of holding sections that hold the substrates 10. The plurality of holding parts are provided in line at intervals in the Z direction. The plurality of holding parts may be used depending on the processing stage of the substrate 10.

For example, the main transport section 58 includes a first holding section used for taking out the substrate 10 from the loading cassette 35, and a second holding section used for transporting the substrate 10 whose strength has been reduced due to processing such as dicing or thinning. has. The second holding section may be used to transport the substrate 10 before it is mounted on the frame 19. In this case, the main transport section 58 may further include a third holding section used for transporting the substrate 10 after being mounted on the frame 19. The third holding section holds the substrate 10 via the frame 19.

The carry-in section 30, the carry-out section 40, and the plurality of processing sections are provided adjacent to the main transport path 50 when viewed in the vertical direction. For example, the longitudinal direction of the main conveyance path 50 is the Y direction. The carry-in section 30 and the carry-out section 40 are provided adjacent to each other on one side of the main conveyance path 50 in the X direction (the left side in FIG. 3, hereinafter also referred to as the "front side"). Further, on the opposite side in the X direction of the main conveyance path 50 (the right side in FIG. 3, hereinafter also referred to as the "rear side"), a dicing section 100, a thinning section 200, a peeling section 600, and an ID pasting section 700 are adjacent to each other. provided. The peeling part 600 and the ID pasting part 700 are stacked in the Z direction, and the ID pasting part 700 is provided above the peeling part 600 so as to overlap with the peeling part 600. Furthermore, a mount section 500 is provided adjacent to one end of the main transport path 50 in the Y direction. The mount section 500 and the ultraviolet irradiation section 400 are stacked in the Z direction, and the ultraviolet irradiation section 400 is provided above the mount section 500 so as to overlap with the mount section 500 .

According to this embodiment, the carry-in section 30 and the plurality of processing sections are provided adjacent to the main transport path 50. Therefore, the main transport section 58 can deliver the substrate 10 to the carry-in section 30 and the plurality of processing sections. Thereby, the main transport section 58 can be made multi-functional, the workload of the main transport section 58 can be increased, and the operating rate of the main transport section 58 can be improved.

Further, according to this embodiment, the unloading section 40 is also provided adjacent to the main transport path 50. Therefore, the main transport section 58 can deliver the substrate 10 to the unloading section 40. Thereby, the main transport section 58 can be further multifunctional, the workload of the main transport section 58 can be further increased, and the operating rate of the main transport section 58 can be further improved. Furthermore, since a plurality of processing sections and the unloading section 40 are provided adjacent to the main transport path 50, if an abnormality occurs in the substrate 10 in one processing section, the substrate 10 with the abnormality can be transferred to the other processing section. It can be quickly transported to the unloading section 40 without having to be transported to another location.

Note that the arrangement and number of processing units are not limited to the arrangement and number shown in FIG. 3, and can be arbitrarily selected. Further, the plurality of processing units may be arranged in arbitrary units, distributed or integrated. Each processing section will be explained below.

FIG. 4 is a diagram illustrating a dicing section according to one embodiment. The dicing unit 100 performs dicing of the substrate 10. In this specification, dicing of the substrate 10 refers to processing for dividing the substrate 10 into a plurality of chips 13, and includes dividing the substrate 10 and forming starting points for division on the substrate 10. The dicing section 100 includes, for example, a dicing table 110, a substrate processing section 120, and a moving mechanism section 130.

Dicing table 110 holds substrate 10 with protective tape 14 interposed therebetween. For example, dicing table 110 holds substrate 10 horizontally with second main surface 12 of substrate 10 facing upward. For example, a vacuum chuck is used as the dicing table 110, but an electrostatic chuck or the like may also be used.

The substrate processing unit 120 performs dicing of the substrate 10 held on the dicing table 110, for example. The substrate processing unit 120 includes, for example, a laser oscillator 121 and an optical system 122 that irradiates the substrate 10 with a laser beam from the laser oscillator 121. The optical system 122 includes a condenser lens that condenses the laser beam from the laser oscillator 121 toward the substrate 10 .

The moving mechanism section 130 relatively moves the dicing table 110 and the substrate processing section 120. The moving mechanism section 130 is configured with, for example, an XYZθ stage that moves the dicing table 110 in the X direction, Y direction, Z direction, and θ direction.

The control section 20 controls the substrate processing section 120 and the moving mechanism section 130 to perform dicing of the substrate 10 along the streets of the substrate 10. As shown in FIG. 4, a modified layer 2 that serves as a starting point for fracture may be formed inside the substrate 10, or a laser-processed groove may be formed on the laser irradiated surface (for example, the upper surface in FIG. 4) of the substrate 10. good. The laser-processed groove may or may not penetrate the substrate 10 in the thickness direction.

When forming the modified layer 2 inside the substrate 10, a laser beam that is transparent to the substrate 10 is used. The modified layer 2 is formed, for example, by locally melting and solidifying the inside of the substrate 10. On the other hand, when forming a laser-processed groove on the laser-irradiated surface of the substrate 10, a laser beam that is absorbent to the substrate 10 is used.

In this embodiment, the substrate processing section 120 includes a laser oscillator 121 that irradiates the substrate 10 with a laser beam, but it may also include a cutting blade that cuts the substrate 10 or forms scribe grooves on the surface of the substrate 10. It may have a scrubber that forms.

Note that although the dicing section 100 is provided as a part of the substrate processing system 1 in this embodiment, it may be provided outside the substrate processing system 1. In this case, the substrate 10 is diced and then carried into the carrying-in section 30 from the outside, taken out from the carrying-in cassette 35 in the carrying-in section 30, and carried to the thinning section 200 instead of the dicing section 100.

The thinning unit 200 (see FIG. 3) processes the second main surface 12 of the diced substrate 10, which is opposite to the first main surface 11 protected by the protective tape 14, to thin the substrate 10. become

When the starting point of division is formed in the dicing section 100, processing stress is applied to the substrate 10 in the thinning section 200, so that cracks develop in the board thickness direction from the starting point of division, and the substrate 10 is divided into a plurality of chips 13. be done.

Further, when forming the modified layer 2 inside the substrate 10 in the dicing section 100, the modified layer 2 is removed by thinning the substrate 10 in the thinning section 200.

For example, as shown in FIG. 3, the thinning section 200 includes a rotating table 201, a chuck table 202, a rough grinding section 210, a finishing grinding section 220, and a damaged layer removing section 230.

The rotary table 201 is rotated around the center line of the rotary table 201. A plurality of (for example, four in FIG. 3) chuck tables 202 are arranged at equal intervals around the rotation center line of the rotary table 201.

The plurality of chuck tables 202 rotate together with the rotary table 201 around the center line of the rotary table 201. The center line of the rotary table 201 is vertical. Every time the rotary table 201 rotates, the chuck table 202 facing the rough grinding section 210, the finish grinding section 220, and the damaged layer removing section 230 is changed.

Each chuck table 202 holds the substrate 10 via the protective tape 14. Chuck table 202 holds substrate 10 horizontally with second main surface 12 of substrate 10 facing upward. As the chuck table 202, for example, a vacuum chuck is used, but an electrostatic chuck or the like may also be used.

FIG. 5 is a diagram illustrating a rough grinding section of a thinning section according to one embodiment. The rough grinding section 210 performs rough grinding of the substrate 10. The rough grinding section 210 includes a rotary grindstone 211, as shown in FIG. 5, for example. The rotary grindstone 211 is rotated about its centerline and lowered to process the upper surface (that is, the second main surface 12) of the substrate 10 held by the chuck table 202.

The finish grinding section 220 performs finish grinding of the substrate 10. The configuration of the finish grinding section 220 is almost the same as the configuration of the rough grinding section 210. However, the average grain size of the abrasive grains of the rotary whetstone in the finish grinding section 220 is smaller than the average grain size of the abrasive grains of the rotary whetstone in the rough grinding section 210.

Damaged layer removing section 230 removes a damaged layer formed on second main surface 12 of substrate 10 by grinding such as rough grinding or finish grinding. For example, the damaged layer removing unit 230 supplies a processing liquid to the substrate 10 to perform a wet etching process to remove the damaged layer. Note that the method for removing the damaged layer is not particularly limited.

Note that the plate thinning section 200 may include a polishing section that polishes the substrate 10. The configuration of the polishing section is almost the same as the configuration of the rough grinding section 210. Examples of polishing the substrate 10 include CMP (Chemical Mechanical Polishing). Further, the thinned portion 200 may have a gettering portion that forms gettering sites (for example, crystal defects or distortions) that capture impurities. Although the number of chuck tables 202 is four in FIG. 3, it may be changed as appropriate depending on the number of types of processing. Furthermore, one processing unit (for example, the damaged layer removal unit 230) may perform multiple types of processing (for example, damage layer removal and gettering site formation).

FIG. 6 is a diagram showing an ultraviolet irradiation unit according to one embodiment. The ultraviolet irradiation unit 400 irradiates the protective tape 14 that protects the diced and thinned substrate 10 with ultraviolet rays. The adhesive of the protective tape 14 can be cured by irradiation with ultraviolet rays, and the adhesive strength of the protective tape 14 can be reduced. After the adhesive strength decreases, the protective tape 14 can be easily peeled off from the substrate 10 by a peeling operation.

The ultraviolet irradiation unit 400 has a UV lamp 410 inside a casing into which the substrate 10 protected with the protective tape 14 is carried. The UV lamp 410 irradiates the protective tape 14 with ultraviolet light from the side opposite to the substrate 10 with the protective tape 14 as a reference.

FIG. 7 is a diagram illustrating a mount according to one embodiment. In FIG. 7, the two-dot chain line shows the state of the adhesive tape 18 and the DAF 15 after they are mounted. The mount unit 500 attaches the substrate 10 to the frame 19 via an adhesive tape 18 provided on the opposite side of the substrate 10 to the protective tape 14 after irradiation with ultraviolet rays. The adhesive tape 18 is attached to the frame 19 so as to cover the opening of the annular frame 19, and is bonded to the substrate 10 at the opening of the frame 19.

The mount unit 500 may attach the diced and thinned substrate 10 to the frame 19 via only the adhesive tape 18, but in FIG. Installing. The DAF 15 is formed smaller than the opening of the frame 19 and is provided inside the frame 19. DAF 15 covers the entire second main surface 12 of substrate 10 .

The mount unit 500 includes, for example, a mount table 510 that holds the substrate 10 and the frame 19, and a laminating roller 520 that attaches the substrate 10 to the frame 19 held by the mount table 510 via an adhesive tape 18. .

The mount table 510 holds the frame 19 and the substrate 10 arranged in the opening of the frame 19 in parallel. Frame 19 and substrate 10 may be held horizontally. The upper surface of the frame 19 and the upper surface of the substrate 10 may have a height difference comparable to the thickness of the DAF 15. Note that when the DAF 15 is not used, the upper surface of the frame 19 and the upper surface of the substrate 10 may be arranged on the same plane.

The adhesive tape 18 and the like are supplied wound around a core, and are used by being pulled out from the core. The adhesive tape 18 passes between the laminating roller 520 and the substrate 10 while clinging to the laminating roller 520 due to tension, and is laminated on the substrate 10. Further, the adhesive tape 18 passes between the laminating roller 520 and the frame 19 while clinging to the laminating roller 520 due to tension, and is laminated on the frame 19.

As shown in FIG. 7, the mount section 500 attaches the adhesive tape 18 to the frame 19 and the substrate 10 in sequence from one end of the frame 19 to the other end. This makes it possible to suppress air entrapment. Furthermore, since the substrate 10 is held flat while the adhesive tape 18 is bonded to the substrate 10, damage to the substrate 10 can be suppressed.

FIG. 8 is a diagram illustrating a peeling section according to one embodiment. In FIG. 8, the two-dot chain line indicates the state before the protective tape 14 is peeled off. The peeling unit 600 peels the protective tape 14 from the substrate 10 attached to the frame 19 via the adhesive tape 18. The protective tape 14 that is no longer needed can be removed. The peeling unit 600 includes, for example, a peeling table 610 and a peeling roller 620.

The protective tape 14 passes between the peeling roller 620 and the substrate 10 while clinging to the peeling roller 620 due to tension, and is peeled off from the substrate 10. During this time, the peeling table 610 holds the substrate 10 and the frame 19 flat via the adhesive tape 18 or the like. The protective tape 14 peeled off from the substrate 10 is wound around a winding core (not shown).

As shown in FIG. 8, the peeling unit 600 peels the protective tape 14 from the substrate 10 while sequentially deforming it from one end of the substrate 10 to the other end. Thereby, the protective tape 14 and the substrate 10 can be smoothly peeled off. Furthermore, since the substrate 10 is held flat while the protective tape 14 and the substrate 10 are peeled off, damage to the substrate 10 can be suppressed.

Note that the peeling unit 600 may peel the protective tape 14 and the substrate 10 in parallel.

FIG. 9 is a diagram showing an ID pasting section according to one embodiment. The ID pasting unit 700 reads the identification information 16 (see FIG. 2) on the board 10 from which the protective tape 14 has been peeled off, prints the read identification information 16 on a label 17 (see FIG. 2), and attaches the printed label 17 to the frame 19. Paste on. The identification information 16 is information for identifying the board 10, and is represented by numbers, letters, symbols, one-dimensional codes, two-dimensional codes, etc.

The ID pasting section 700 includes, for example, an ID pasting table 710, a reading device 720, and a label printing device 730. ID pasting table 710 holds substrate 10 and frame 19 via adhesive tape 18 or the like. The reading device 720 reads the identification information 16 formed on the substrate 10 in advance. The label printing device 730 prints the identification information 16 read by the reading device 720 on a label 17, and attaches the printed label 17 to the frame 19 using a laminator or the like. The identification information 16 printed on the label 17 and the identification information 16 previously formed on the substrate 10 may have the same content expressed in different formats, as shown in FIG.

Next, a substrate processing method using the substrate processing system 1 having the above configuration will be explained. FIG. 10 is a flowchart of a method for processing a substrate according to one embodiment.

As shown in FIG. 10, the substrate processing method includes a loading process S101, a dicing process S102, a thinning process S103, an ultraviolet irradiation process S104, a mounting process S105, a peeling process S106, an ID pasting process S107, and an unloading process. and step S108. These steps are performed under the control of the control unit 20. Note that the order of these steps is not limited to the order shown in FIG. 10. For example, a dicing step S102 may be performed after the thinning step S103.

In the carrying-in step S101, the main transport unit 58 takes out the substrate 10 from the carrying-in cassette 35 placed in the carrying-in part 30, and transports the taken-out substrate 10 to the dicing part 100.

In the dicing step S102, as shown in FIG. 4, the dicing unit 100 dices the substrate 10. While the substrate 10 is being diced, the first main surface 11 of the substrate 10 is protected with a protective tape 14 . The substrate 10 diced in the dicing section 100 is transported to the thinning section 200 by the main transport section 58 .

In the thinning step S103, as shown in FIG. 5, the thinning section 200 processes the second main surface 12 of the substrate 10 to thin the substrate 10. While the substrate 10 is being thinned, the first main surface 11 of the substrate 10 is protected with a protective tape 14. The substrate 10 thinned in the thinning section 200 is transported by the main transport section 58 to a delivery section 300, which will be described later, and then transported to the ultraviolet irradiation section 400 by a first sub-transport section 910, which will be described later.

In the ultraviolet irradiation step S104, as shown in FIG. 6, the ultraviolet irradiation unit 400 irradiates the protective tape 14 with ultraviolet rays. The adhesive of the protective tape 14 can be cured by irradiation with ultraviolet rays, and the adhesive strength of the protective tape 14 can be reduced. After the adhesive strength decreases, the protective tape 14 can be easily peeled off from the substrate 10 by a peeling operation.

Although the ultraviolet irradiation step S104 may be performed after the mounting step S105, in this embodiment, it is performed before the mounting step S105. This can prevent deterioration of the adhesive tape 18 bonded to the substrate 10 in the mounting step S105 due to ultraviolet irradiation. The substrate 10 with the protective tape 14 irradiated with ultraviolet rays in the ultraviolet irradiation section 400 is transported to the mount section 500 by a first sub-transport section 910, which will be described later.

In the mounting step S105, as shown in FIG. 7, the mount unit 500 mounts the diced and thinned substrate 10 onto the frame 19 via the adhesive tape 18. The mount unit 500 may attach the diced and thinned substrate 10 to the frame 19 via only the adhesive tape 18, but in this embodiment, the substrate 10 is attached to the frame 19 via the adhesive tape 18 and the DAF 15 that have been laminated in advance. Attach to. The substrate 10 mounted on the frame 19 via the adhesive tape 18 in the mount section 500 is transported to the peeling section 600 by a second sub-transport section 920, which will be described later.

In the peeling step S106, as shown in FIG. 8, the peeling unit 600 peels the protective tape 14 from the substrate 10 mounted on the frame 19 via the adhesive tape 18 by the mount unit 500. The protective tape 14 that is no longer needed can be removed. The substrate 10 from which the protective tape 14 has been peeled off in the peeling section 600 is transported to the ID pasting section 700 by a third sub-transport section 930, which will be described later.

In the ID pasting step S107, as shown in FIG. 9, the ID pasting unit 700 reads the identification information 16 (see FIG. 2) formed in advance on the substrate 10, and pastes the read identification information 16 onto the label 17 (see FIG. 2). The printed label 17 is attached to the frame 19.

In the carry-out step S108, the main conveyance unit 58 conveys the substrate 10 from the ID pasting unit 700 to the carry-out unit 40, and stores the substrate 10 inside the carry-out cassette 45 in the carry-out unit 40. The carry-out cassette 45 is carried out from the carry-out section 40 to the outside. The substrate 10 carried out to the outside together with the carry-out cassette 45 is picked up chip by chip 13. In this way, the chip 13 is manufactured.

FIG. 11 is a plan view showing essential parts of a substrate processing system according to one embodiment. FIG. 12 is a side view showing a mount part, and an ultraviolet irradiation part and a delivery part provided above the mount part to overlap with the mount part, according to one embodiment. FIG. 13 is a side view showing a peeling part and an ID pasting part provided above the peeling part and overlapping with the peeling part, according to one embodiment. In FIGS. 11 to 13, arrows indicate moving directions of the substrate 10 and frame 19 in the mount section 500, peeling section 600, and the like.

The substrate processing system 1 includes a mount section 500. As shown in FIG. 12, the mounting section 500 includes, for example, a mounting table 510, a laminating roller 520, a mounting table guide 530, a frame supply section 540, and a frame conveyance section 550.

As shown in FIG. 11, the mount table guides 530 extend in the X direction, and are provided in pairs at intervals in the Y direction. The mount table 510 is movable along a pair of mount table guides 530. As a drive source for moving the mount table 510, for example, a servo motor is used.

As shown in FIG. 12, a laminating roller 520 is provided above the rear end of the mount table guide 530, and a frame supply section 540 is provided below the front end of the mount table guide 530. A frame cassette 541 containing the frame 19 before mounting the board 10 is carried into the frame supply unit 540 from the outside. The frame cassette 541 stores a plurality of frames 19 side by side in the Z direction. Note that the frame cassette 541 may not be provided, and a worker may set the frame 19 in the frame supply section 540. A plurality of frames 19 may be set in the frame supply unit 540 in multiple batches.

As shown in FIG. 3, the carry-in section 30 and the carry-out section 40 are provided on one side (front side) in the width direction of the main conveyance path 50, and the mount section 500 is provided adjacent to one longitudinal end of the main conveyance path 50. good. In this case, as shown in FIG. 12, the frame cassette 541 may be loaded into the frame supply section 540 from the front side. Unprocessed articles (substrate 10 and frame 19) are carried in from the front side, and processed articles (frame 19 with substrate 10 attached) are carried out from the front side. Loading and unloading of goods can be concentrated at the front, improving maintenance and transport efficiency.

The frame transport section 550 takes out the frame 19 from the frame cassette 541 placed in the frame supply section 540 and places the taken out frame 19 on the mount table 510. The frame transport unit 550 is disposed, for example, between a pair of mount table guides 530 when viewed in the Z direction, and is movable in the Z direction. For example, a servo motor is used as a drive source for moving the frame transport section 550.

The frame transport section 550 has a suction section 559 that suctions the frame 19. For example, a plurality of suction sections 559 are provided at intervals in the X direction, and suck both ends of the frame 19 in the X direction. The suction portion 559 has a suction hole. The gas in the suction hole is sucked by a suction source such as a vacuum pump. By activating the suction source to generate negative pressure in the suction unit 559, the frame conveyance unit 550 vacuum-suctions the frame 19. On the other hand, by stopping the operation of the suction source and opening the suction hole to the atmosphere, the frame transport section 550 releases the vacuum suction of the frame 19. Positive pressure may be generated in the frame transport section 550 when vacuum suction is released. In this specification, negative pressure refers to a pressure lower than atmospheric pressure, and positive pressure refers to a pressure higher than atmospheric pressure.

The mount table 510 receives the frame 19 from the frame transport unit 550 at the end of the mount table guide 530 on the main transport path 50 side (front side). Specifically, first, the frame transport unit 550 is raised from the position shown by the solid line in FIG. 12 to the position shown by the two-dot chain line in FIG. It passes through in the Z direction. At this time, the mount table 510 is waiting at a retracted position that does not prevent the frame transport section 550 from rising. Thereafter, when the mount table 510 is moved directly below the frame transport section 550, the frame transport section 550 is lowered, and the frame 19 held by the frame transport section 550 is placed on the mount table 510.

Thereafter, the mount table 510 is moved in the X direction (rear side) away from the main transport path 50, and while being moved directly below the laminating roller 520, the mount table 510 removes the substrate from the first sub-transport section 910, which will be described later. Receive 10. The substrate 10 is placed in the opening of the frame 19, and the mount table 510 holds the substrate 10 via the protective tape 14.

Thereafter, the mount table 510 is further moved in the X direction (backward) away from the main conveyance path 50 and moved directly below the laminating roller 520. The laminating roller 520 bonds the adhesive tape 18 to the frame 19 placed on the mount table 510 and the substrate 10 placed in the opening of the frame 19, as shown in FIG. The adhesive tape 18 is provided on the opposite side (upper side) of the protective tape 14 with respect to the substrate 10.

The substrate processing system 1 includes an ultraviolet irradiation section 400. As shown in FIGS. 11 and 12, the ultraviolet irradiation section 400 is provided above the mount section 500 and overlaps with the mount section 500. For example, the ultraviolet irradiation unit 400 is provided overlapping the pair of mount table guides 530 when viewed in the Z direction.

Since the ultraviolet irradiation unit 400 and the mount unit 500 are stacked in the Z direction, the substrate processing system 1 is stacked as viewed in the Z direction, compared to a case where the ultraviolet irradiation unit 400 and the mount unit 500 are provided side by side when viewed in the Z direction. The installation area can be reduced. Further, the flow of transporting the substrate 10 from the ultraviolet irradiation section 400 to the mounting section 500 is good.

The substrate processing system 1 may include a delivery section 300 that receives the diced and thinned substrate 10 from the main transport section 58 (see FIG. 3). The delivery section 300 receives the substrate 10 from the main transport section 58, and delivers the received substrate 10 to a first sub-transport section 910, which will be described later.

The delivery section 300 is adjacent to the main conveyance path 50 as shown in FIG. 11 and is provided above the mount section 500 so as to overlap the mount section 500 as shown in FIG. For example, the delivery section 300 is provided overlapping the pair of mount table guides 530 when viewed in the Z direction. When the mount section 500 is provided adjacent to the end of the main transport path 50 in the Y direction, the delivery section 300 is also provided adjacent to the end of the main transport path 50 in the Y direction.

Since the delivery part 300 and the mount part 500 are stacked in the Z direction, the installation of the substrate processing system 1 is easier when seen in the Z direction than when the mount part 500 and the delivery part 300 are provided side by side when seen in the Z direction. Area can be reduced. Further, the transfer section 300 can be arranged at the same height as the ultraviolet irradiation section 400, and the transfer section 300 can be arranged next to the ultraviolet irradiation section 400, so that the flow of conveying the substrate 10 from the transfer section 300 to the ultraviolet irradiation section 400 is good.

For example, as shown in FIG. 11, a delivery section 300, an ultraviolet irradiation section 400, and a laminating roller 520 are arranged in this order from the front side to the rear side when viewed in the Z direction. Therefore, the flow of the substrate 10 from the delivery section 300 to the ultraviolet irradiation section 400 until it is placed on the mount table 510 can be improved, and the transport efficiency of the substrate 10 can be improved.

The delivery unit 300 may also serve as an alignment unit that acquires information used to align the mounting position of the board 10 with respect to the frame 19. As a result, the position of the substrate 10 may be shifted due to, for example, the transfer of the substrate 10 between the thinning section 200 and the main transfer section 58, the transfer of the substrate 10 between the main transfer section 58 and the transfer section 300, etc. Additionally, the position of the substrate 10 in the X direction, Y direction, and θ direction can be corrected. The correction is performed so that the center of the opening of the frame 19 and the center of the substrate 10 coincide with each other, and the orientation of the substrate 10 with respect to the frame 19 is in a predetermined direction.

As shown in FIG. 12, the delivery unit 300 includes, for example, a delivery table 310 that holds the substrate 10, an imaging unit 320 that captures an image of the substrate 10 held by the delivery table 310, and a rotation unit that rotates the delivery table 310. It has a rotation drive section 330. For example, a vacuum chuck is used as the transfer table 310, but an electrostatic chuck or the like may also be used. The imaging unit 320 is provided above the transfer table 310, for example, and captures an image of the substrate 10 held on the transfer table 310 from above. The rotation drive unit 330 changes the imaging position of the substrate 10 held by the transfer table 310 by rotating the transfer table 310.

The delivery unit 300 converts the image of the substrate 10 captured by the imaging unit 320 into an electrical signal and transmits it to the control unit 20 . The control unit 20 detects the position of the substrate 10 held on the delivery table 310 by performing image processing on the image of the substrate 10 captured by the imaging unit 320. The detection methods include a method of matching the pattern of the substrate 10 (for example, a divided pattern) with a reference pattern, a method of determining the center point of the substrate 10 and the direction of the substrate 10 from a plurality of points on the outer circumference of the substrate 10, etc. Known methods are used. The orientation of the substrate 10 is detected from the position of a notch formed on the outer periphery of the substrate 10. Instead of notches, orientation flats may be used. Thereby, the control unit 20 can grasp the position of the substrate 10 in the coordinate system fixed to the delivery table 310.

Positioning of the substrate 10 in the θ direction is performed, for example, by rotating the transfer table 310. On the other hand, the alignment of the substrate 10 in the X direction and the alignment of the substrate 10 in the Y direction is performed after the holding of the substrate 10 by the transfer table 310 is released. This is done during transportation to. For example, the X-direction alignment of the substrate 10 and the Y-direction alignment of the substrate 10 are performed when the first sub-transport section 910 (described later) receives the substrate 10 from the transfer table 310, or when the first sub-transport section 910 receives the substrate 10 from the transfer table 310. This is done when handing over to the mount table 510. As a result, the mounting position of the substrate 10 is aligned with respect to the mount table 510, and in turn, the mounting position of the substrate 10 with respect to the frame 19 is aligned.

The substrate processing system 1 includes a peeling section 600. As shown in FIG. 13, the peeling unit 600 includes, for example, a peeling table 610, a peeling roller 620, and a peeling table guide 630.

As shown in FIG. 11, the peeling table guides 630 extend in the X direction, and are provided as a pair at intervals in the Y direction. The peeling table 610 is movable along a pair of peeling table guides 630. As a drive source for moving the peeling table 610, for example, a servo motor is used.

As shown in FIG. 13, the peeling table 610 receives the frame 19 from a second sub-transport unit 920, which will be described later, at the center of the peeling table guide 630 in the X direction. The substrate 10 is attached to the frame 19 in advance with an adhesive tape 18 interposed therebetween. The peeling table 610 holds the substrate 10 and the frame 19 via the adhesive tape 18.

Thereafter, the peeling table 610 is moved in the X direction (rear side) away from the main conveyance path 50 and moved directly below the peeling roller 620. The peeling roller 620 peels the protective tape 14 from the substrate 10 while sequentially deforming it from one end of the substrate 10 to the other end, as shown in FIG.

The substrate processing system 1 may include an ID pasting section 700. As shown in FIGS. 11 and 13, the ID pasting section 700 is provided adjacent to the main transport path 50. The main transport section 58 transports the frame 19 to which the ID pasting section 700 has pasted the label 17 from the ID pasting section 700 to the unloading section 40 and stores it in the unloading cassette 45 placed in the unloading section 40 .

In the substrate processing system 1, as shown in FIGS. 11 and 13, the ID pasting section 700 may be provided above the peeling section 600 so as to overlap the peeling section 600. For example, the ID pasting section 700 is provided overlapping the pair of peeling table guides 630 when viewed in the Z direction.

Since the peeling section 600 and the ID pasting section 700 are stacked in the Z direction, the substrate processing system 1 is stacked when viewed in the Z direction, compared to a case where the peeling section 600 and the ID pasting section 700 are provided side by side when viewed in the Z direction. The installation area can be reduced. Further, the flow of conveying the substrate 10 from the peeling section 600 to the ID pasting section 700 is good.

As shown in FIG. 11 etc., the substrate processing system 1 includes a main transport section 58 (see FIG. 3), a first sub-transport section 910, a second sub-transport section 920, and a third sub-transport section 930. You may do so. The main transport section 58 transports the substrate 10 from the carry-in section 30 to the delivery section 300 via the dicing section 100 and the thinning section 200. The first sub-transport unit 910 transports the substrate 10 from the delivery unit 300 to the mount unit 500 via the ultraviolet irradiation unit 400. The second sub-transport section 920 transports the substrate 10 from the mount section 500 to the peeling section 600, and also turns the substrate 10 upside down. The third sub-transport unit 930 transports the substrate 10 from the peeling unit 600 to the ID pasting unit 700. The main transport section 58 transports the substrate 10 from the ID pasting section 700 to the unloading section 40 .

The first sub-transport unit 910 is movable in the X direction and the Z direction. For example, as shown in FIG. 11, an X-axis guide 911 is fixed to the mount section 500. A Z-axis guide 913 is fixed to an X-axis slider 912 that is moved in the X direction along an X-axis guide 911. A first sub-transport section 910 is fixed to a Z-axis slider 914 that moves in the Z direction along a Z-axis guide 913. Note that the first sub-transport unit 910 may be further movable in the Y direction in order to align the substrate 10 in the Y direction.

The first sub-transport unit 910 attracts the substrate 10. The first sub-transport section 910 may have a suction surface larger than the main surface (for example, the second main surface 12) of the substrate 10 in order to suppress deformation and damage of the substrate 10. The entire second main surface 12 of the substrate 10 can be held flat, and deformation and damage of the substrate 10 can be suppressed.

The first sub-transport unit 910 is configured with a porous chuck, for example, and has a porous body. The gas in the pores of the porous body is sucked by a suction source such as a vacuum pump. By activating the suction source to generate negative pressure in the first sub-transport unit 910, the first sub-transport unit 910 vacuum-chucks the substrate 10. On the other hand, the first sub-transport section 910 releases the vacuum suction of the substrate 10 by stopping the operation of the suction source and opening the pores of the porous body to the atmosphere. Positive pressure may be generated in the first sub-transport section 910 when vacuum suction is released.

The first sub-transport section 910 transports the substrate 10 from the delivery section 300 to the mount section 500 via the ultraviolet irradiation section 400 by holding the substrate 10 and moving in the X direction and the Z direction. For example, the substrate 10 is lifted from the transfer table 310, passed over the UV lamp 410, and lowered onto the mounting table 510. As a drive source for moving the first sub-transport unit 910, a servo motor or the like is used, for example.

The first sub-transport unit 910 holds the substrate 10 from above with the protective tape 14 facing down, and moves in the X direction above the UV lamp 410 extending in the Y direction. The dimension of the UV lamp 410 in the Y direction is larger than the diameter of the substrate 10 so that the UV lamp 410 can irradiate the entire protective tape 14 in the Y direction. The speed at which the first sub-transport section 910 passes over the UV lamp 410 is set so that the adhesive force of the protective tape 14 can be sufficiently reduced.

According to this embodiment, since the substrate 10 is held by the first sub-transport section 910 while the protective tape 14 is irradiated with ultraviolet rays, another substrate 10 can be held and transported by the main transfer section 58. Therefore, the efficiency of transporting the substrate 10 in the entire substrate processing system 1 can be improved, and the processing speed of the substrate 10 in the entire substrate processing system 1 can be improved.

The second sub-transport unit 920 is movable in the Y direction and the Z direction. For example, as shown in FIG. 12, a Y-axis guide 921 is fixed to the mount section 500 and the peeling section 600. The Y-axis guide 921 is provided across both the mount section 500 and the peeling section 600 when viewed in the Z direction. A Z-axis guide 923 is fixed to a Y-axis slider 922 that is moved in the Y direction along a Y-axis guide 921 . A reversing section 925 is fixed to a Z-axis slider 924 that moves in the Z direction along a Z-axis guide 923. The reversing section 925 holds the second sub-conveying section 920 so as to be able to be reversed vertically around a reversing shaft 926 . Although the axial direction of the reversal shaft 926 is the Y direction in this embodiment, it may be the X direction.

The second sub-transport section 920 has a suction section 929 that suctions the frame 19. A plurality of suction parts 929 are provided at intervals in the axial direction (for example, the Y direction) of the reversing shaft 926 (see FIG. 14), and suction both ends of the frame 19 in the Y direction. The suction portion 929 has a suction hole. The gas in the suction hole is sucked by a suction source such as a vacuum pump. By activating the suction source to generate negative pressure in the second sub-transport unit 920, the second sub-transport unit 920 vacuum-suctions the frame 19. On the other hand, the second sub-transport unit 920 releases the vacuum suction of the frame 19 by stopping the operation of the suction source and opening the suction hole to the atmosphere. Positive pressure may be generated in the second sub-transport section 920 when vacuum suction is released.

FIG. 14 is a diagram illustrating the operation of the second sub-transport unit according to one embodiment. In FIG. 14, arrows indicate the direction of movement of the substrate 10 and frame 19 from the mount section 500 to the peeling section 600. The second sub-transport unit 920 transports the substrate 10 attached to the frame 19 via the adhesive tape 18 from the mount unit 500 to the peeling unit 600 by holding the frame 19 and moving in the Y direction and the Z direction. . As a drive source for moving the second sub-transport unit 920, a servo motor or the like is used, for example.

After the second sub-transport unit 920 lifts the frame 19 from the mount table 510, it is moved by the reversing unit 925, for example, from the position shown by the solid line in FIG. 14 to the position shown by the dashed line in FIG. As a result, the substrate 10 attached to the frame 19 via the adhesive tape 18 is turned upside down. Thereafter, the second sub-transport unit 920 places the frame 19 on the peeling table 610 as shown by the two-dot chain line in FIG. The peeling table 610 holds the center portion of the frame 19 in the Y direction so as not to interfere with the plurality of suction parts 929 provided at intervals in the axial direction of the reversing shaft 926 (in the Y direction in this embodiment).

According to this embodiment, the substrate 10 is turned upside down by the reversing section 925 during the process of being transported from the mount section 500 to the peeling section 600. Thereby, the arrangement of the adhesive tape 18 and the protective tape 14 provided with the substrate 10 in between can be reversed. Specifically, an adhesive tape 18 is placed on the lower side of the substrate 10, and a protective tape 14 is placed on the upper side of the substrate 10. Since the protective tape 14 is disposed on the opposite side of the peeling table 610 with respect to the substrate 10, it can be easily peeled off from the substrate 10.

The third sub-transport unit 930 is movable in the X direction and the Z direction. For example, as shown in FIG. 11, an X-axis guide 931 is fixed to the peeling section 600. A Z-axis guide 933 is fixed to an X-axis slider 932 that is moved in the X direction along an X-axis guide 931. A third sub-transport unit 930 is fixed to a Z-axis slider 934 that moves in the Z direction along a Z-axis guide 933. Note that the third sub-transport unit 930 may be further movable in the Y direction in order to align the substrate 10 in the Y direction.

The third sub-transport section 930 has a suction section 939 that suctions the frame 19. For example, a plurality of suction sections 939 are provided at intervals in the X direction, and suck both ends of the frame 19 in the X direction. The suction part 939 has a suction hole. The gas in the suction hole is sucked by a suction source such as a vacuum pump. By activating the suction source to generate negative pressure in the third sub-transport section 930, the third sub-transport section 930 vacuum-sucks the frame 19. On the other hand, the third sub-transport unit 930 releases the vacuum suction of the frame 19 by stopping the operation of the suction source and opening the suction hole to the atmosphere. Positive pressure may be generated in the third sub-transport section 930 when vacuum suction is released.

The third sub-transport unit 930 holds the frame 19 and moves in the X and Z directions to transport the substrate 10 attached to the frame 19 via the adhesive tape 18 from the peeling unit 600 to the ID pasting unit 700. do. For example, the substrate 10 is lifted from the peeling table 610 and lowered onto the ID pasting table 710. As a drive source for moving the third sub-transport unit 930, a servo motor or the like is used, for example.

In the first modified example described below, unlike the above embodiment, there is no third sub-transport section 930, and the main transport section 58 plays the role of the third sub-transport section 930. That is, the main transport section 58 transports the substrate 10 from the peeling section 600 to the ID pasting section 700. The differences will be mainly explained below.

FIG. 15 is a side view showing a peeling part according to a first modification and an ID pasting part provided above the peeling part and overlapping with the peeling part. In FIG. 15, arrows indicate moving directions of the substrate 10 and frame 19 in the peeling section 600 and the like. As shown in FIG. 15, the peeling section 600 is provided adjacent to the main transport path 50.

The peeling table 610 receives the frame 19 from the second sub-transport unit 920 at the center of the peeling table guide 630 in the X direction. The substrate 10 is attached to the frame 19 in advance with an adhesive tape 18 interposed therebetween. The peeling table 610 holds the substrate 10 and the frame 19 via the adhesive tape 18.

Thereafter, the peeling table 610 is moved in the X direction (rear side) away from the main conveyance path 50 and moved directly below the peeling roller 620. The peeling roller 620 peels the protective tape 14 from the substrate 10 while sequentially deforming it from one end of the substrate 10 to the other end, as shown in FIG.

Thereafter, the peeling table 610 is moved in the X direction (front side) so as to approach the main conveyance path 50, and at the end of the peeling table guide 630 on the main conveyance path 50 side (front side), the peeling table 610 is moved toward the main conveyance section 58 (see FIG. 3). ) hands over frame 19. The main transport unit 58 places the frame 19 on the ID pasting table 710 by moving in the Z direction and the X direction while holding the frame 19.

According to this modification, unlike the above embodiment, there is no third sub-transport section 930, and the main transport section 58 plays the role of the third sub-transport section 930. That is, the main transport section 58 transports the substrate 10 from the peeling section 600 to the ID pasting section 700. Thereby, the main transport section 58 can be made multi-functional, the workload of the main transport section 58 can be increased, and the operating rate of the main transport section 58 can be improved.

In the second modified example below, unlike the embodiment and the first modified example, there is no first sub-transport section 910, and the main transport section 58 plays the role of the first sub-transport section 910. That is, the main transport section 58 transports the diced and thinned substrate 10 to the ultraviolet irradiation section 400 and the mount section 500 in this order. In this modification, since there is no first sub-transport unit 910, there is no need for the transfer unit 300 that relays the substrate 10 from the main transport unit 58 to the first sub-transport unit 910. The differences will be mainly explained below.

FIG. 16 is a plan view showing main parts of a substrate processing system according to a second modification. In FIG. 16, arrows indicate moving directions of the substrate 10 and frame 19 in the mount section 500, the peeling section 600, and the like. As shown in FIG. 16, the ultraviolet irradiation section 400 and the mount section 500 are provided adjacent to the main transport path 50. When the mount section 500 is provided adjacent to one end of the main transport path 50 in the Y direction, the ultraviolet irradiation section 400 is also provided adjacent to one end of the main transport path 50 in the Y direction.

The main transport section 58 (see FIG. 3) holds the substrate 10 and moves in the Y direction and the Z direction, thereby transporting the substrate 10 to the ultraviolet irradiation section 400 and the mount section 500 in this order. The main conveyance section 58 is first inserted into the ultraviolet irradiation section 400 from the main conveyance path 50.

The main transport section 58 holds the substrate 10 from above with the protective tape 14 facing down, and moves in the Y direction above the UV lamp 410 extending in the X direction. The dimension of the UV lamp 410 in the X direction is larger than the diameter of the substrate 10 so that the UV lamp 410 can irradiate the entire protective tape 14 in the X direction. The speed at which the main transport section 58 passes over the UV lamp 410 is set so that the adhesive force of the protective tape 14 can be sufficiently reduced.

Next, the main transport section 58 is pulled out from the ultraviolet irradiation section 400 to the main transport path 50, lowered in the main transport path 50, and then inserted into the mount section 500 from the main transport path 50. Thereafter, the main transport section 58 is lowered inside the mount section 500 and transfers the substrate 10 to the mount table 510.

The mount table 510 receives both the substrate 10 and the frame 19 at the end of the mount table guide 530 on the main transport path 50 side (front side). The mount table 510 may receive either the substrate 10 or the frame 19 first.

According to this modification, unlike the embodiment and the first modification, there is no first sub-transport section 910, and the main transport section 58 plays the role of the first sub-transport section 910. That is, the main transport section 58 transports the diced and thinned substrate 10 to the ultraviolet irradiation section 400 and the mount section 500 in this order. Thereby, the main transport section 58 can be made multi-functional, the workload of the main transport section 58 can be increased, and the operating rate of the main transport section 58 can be improved.

Although the embodiments of the substrate processing system and substrate processing method according to the present disclosure have been described above, the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure.

This application claims priority based on Japanese Patent Application No. 2017-163600 filed with the Japan Patent Office on August 28, 2017, and the entire content of Japanese Patent Application No. 2017-163600 is incorporated into this application. do.

1 Substrate processing system 10 Substrate 14 Protective tape 18 Adhesive tape 19 Frame 20 Control section 30 Carrying-in section 35 Carrying-in cassette 40 Carrying-out section 45 Carrying-out cassette 50 Main transport path 58 Main transport section 100 Dicing section 200 Thinning section 300 Transfer section 400 Ultraviolet irradiation Section 500 Mounting section 600 Peeling section 700 ID pasting section 910 First sub-transport section 920 Second sub-transport section 930 Third sub-transport section

Claims (4)

By bonding an adhesive tape to the substrate and the frame, the substrate is attached to the frame via the adhesive tape and a mount part forming an attached object attached to the frame via the adhesive tape. a carry-in part into which a carry-in cassette containing the previous board is carried in from the outside; a carry-out part into which a carry-out cassette containing the board after being attached to the frame via the adhesive tape is carried out to the outside; In a substrate transport system that transports the substrate between a processing unit that performs processing that reduces the strength of the substrate,
a main conveyance path in which the loading section, the mounting section, the unloading section, and the processing section are provided adjacent to each other when viewed in a vertical direction;
further comprising a main transport section that holds the substrate and moves along the main transport path to transport the substrate,
The main transport section includes a first holding section used for taking out the substrate from the loading cassette, and a second holding section used for transporting a substrate whose strength has been reduced due to processing by the processing section. A board transport system featuring: 2. The substrate transport system according to claim 1, wherein the second holding section is used to transport the substrate before it is mounted on the frame. 3. The substrate transport system according to claim 1, wherein the main transport section further includes a third holding section used for transporting the substrate after it is mounted on the frame. By bonding an adhesive tape to the substrate and the frame, the substrate is attached to the frame via the adhesive tape and a mount part forming an attached object attached to the frame via the adhesive tape. a carry-in part into which a carry-in cassette containing the previous board is carried in from the outside; a carry-out part into which a carry-out cassette containing the board after being attached to the frame via the adhesive tape is carried out to the outside; In a substrate transport method for transporting the substrate between a processing unit that performs processing that reduces the strength of the substrate,
further performing a substrate moving step of moving a main transport section that holds the substrate along a main transport path in which the loading section, the mounting section, the unloading section, and the processing section are provided adjacent to each other;
In the substrate moving step, the substrate is taken out from the loading cassette using a first holding section, and the substrate whose strength has been reduced due to processing by the processing section is transferred using a second holding section. A method for transporting substrates.