JP2006278630A - Wafer transfer apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wafer transfer apparatus for conducting transfer in accordance with transfer profiles even when such transfer profiles are different. <P>SOLUTION: The wafer transfer apparatus 10 is constituted with a transfer apparatus 12 for extracting semiconductor wafers W from semiconductor wafer accommodating units 11A, 11B, and then transferring these wafers W and a mounting apparatus 15 for integrating the semiconductor wafers W and a ring frame RF. The mounting apparatus 15 includes a table 51 for supporting the semiconductor wafer W under the condition that any one of the front and rear surfaces thereof is selectively exposed, and thereby the semiconductor wafer W is transferred by attaching a mount tape to both semiconductor wafer W and ring frame RF. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a wafer transfer apparatus, and more particularly to a wafer transfer apparatus in which a semiconductor wafer and a ring frame can be integrated, that is, mounted in various transfer modes.

  In the semiconductor manufacturing process, a circuit surface is formed on the surface of a semiconductor wafer (hereinafter simply referred to as “wafer”), and then back grinding is performed so that a predetermined thickness is obtained, or before and after the back grinding process. Then, there is a dicing process that cuts the wafer into a predetermined size. In the dicing process, the wafer is arranged in the inner peripheral area of the ring frame, and the wafer and the ring frame are integrated by a mounting tape. In addition, a mounting process, a cleaning process opposite to the wafer circuit surface, a surface treatment process, and the like are employed.

  In Patent Document 1, a wafer supported by a predetermined support member is attached to the surface of a dicing tape attached to a ring frame, and then the wafer and the support member are separated and the wafer is attached to the ring frame side. A wafer transfer apparatus for transferring to a wafer is disclosed.

JP 2004-87660 A

  However, in the wafer transfer apparatus described in Patent Document 1, the back surface of the wafer is ground on the mount tape disposed in the inner peripheral region of the ring frame after grinding the back surface of the wafer attached with the circuit surface on the support member side. This is a dedicated wafer transfer apparatus that performs transfer by attaching a film, and is not a transfer apparatus that can adapt to various processing steps in the wafer manufacturing process.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and an object of the present invention is to provide a wafer transfer apparatus that can perform transfer according to various transfer modes. There is to do.

In order to achieve the above object, the present invention provides a wafer including a housing portion for housing a semiconductor wafer, a transport device for taking out and transporting the semiconductor wafer from the housing portion, and a mounting device for mounting the semiconductor wafer on a ring frame. In the transfer device,
The mounting device affixes a mounting tape to a table that supports the semiconductor wafer in a state in which either one of the front and back surfaces of the semiconductor wafer is selectively exposed, and a ring frame disposed around the semiconductor wafer and the semiconductor wafer. A tape supply unit,
The semiconductor wafer is mounted on a ring frame in accordance with a transfer mode determined in accordance with the type of the semiconductor wafer transferred onto the table.

In the present invention, the accommodating portion is constituted by a first accommodating portion that accommodates a semiconductor wafer and a second accommodating portion that accommodates a semiconductor wafer supported by a ring frame via a mount tape,
The transfer device is provided to selectively take out the semiconductor wafer and transfer it to the mount device.

  In addition, when a semiconductor wafer mounted on the ring frame is used as a transfer target, a cutting device that cuts a mounting tape around the semiconductor wafer to separate the semiconductor wafer and the ring frame; A configuration that further includes a frame transfer robot for mounting on the frame is employed.

  Furthermore, the semiconductor wafer is provided so that the front and back sides can be reversed via the transfer device.

  According to the present invention, whether the circuit surface is exposed or the wafer back surface is exposed can be selectively transferred to the ring frame. Therefore, for example, after performing the transfer in a state where the back surface of the wafer is exposed and the circuit surface is on the mounting tape side, the wafer is sent to another process for cleaning the wafer, and the wafer after the cleaning process is finished as a transfer target again. The wafer transfer apparatus can be used efficiently such that transfer can be performed on a separate ring frame so that the circuit surface appears on the surface side, followed by dicing.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic plan view of a wafer transfer apparatus according to this embodiment. In this figure, a wafer transfer apparatus 10 includes a storage section 11 that stores a wafer W, a transfer apparatus 12 that takes out the wafer W from the storage section 11 and transfers or transfers the wafer W, and an alignment apparatus 13 that positions the wafer W. An ultraviolet irradiating device 14 for irradiating the sheet affixed to the wafer W via an ultraviolet curable adhesive layer, an ultraviolet irradiating device 14 for mounting the wafer W on the ring frame RF, a sheet and the like from the wafer W. A peeling device 16 for peeling, and a control device and an operation panel (not shown) are provided.

  The accommodating portion 11 includes a first accommodating portion 11A and a second accommodating portion 11B, and the first accommodating portion 11A is provided as a first elevating table provided so as to be movable along the direction orthogonal to the paper surface in FIG. 20 and a first case 21 that is placed on the first lifting table 20 and accommodates the wafer W therein, and the second accommodating portion 11B includes the first lifting table 20 and the first lifting table 20. The second elevating table 22 and the second case 23 are configured in the same manner as the first case 21.

  As shown in FIG. 2A, the first storage portion 11A stores a wafer W to which a protective sheet S is attached via an ultraviolet curable pressure-sensitive adhesive layer. Note that the first accommodating portion 11A may accommodate only the wafer W in a state where the protective sheet S is not attached. On the other hand, as shown in FIGS. 2B to 2E, the second accommodating portion 11B accommodates wafers W of various types having different mounting structures integrated with the ring frame RF by the mounting tape MT. It has come to be. Here, the hatched portion shown in the wafer W in FIG. 2 indicates the circuit surface side.

  As shown in FIGS. 3 and 4, the transfer device 12 is connected to a robot main body 31 having an elevating body 30 that can move in the vertical direction (Z-axis direction), and an upper end of the elevating body 30. The joint mechanism 32 is provided so as to be rotatable inside, and a suction arm 34 supported at the tip of the joint mechanism 32. In the present embodiment, the joint mechanism 32 includes first to third joint arms 32A, 32B, and 32C, which are connected to each other so as to be rotatable in a plane.

  The suction arm 34 is supported by the distal end of the third joint arm 32C, and is connected to an arm main body 35 rotatably provided in a plane, and one end side of the arm main body 35 via a bearing 35A. The branched arm 36 and a straight arm 37 connected to the other end side via a bearing 35B. The branch arm 36 and the linear arm 37 are rotatably provided about the virtual center line along the extending direction of the arm body 35 via the bearings 35A and 35B. The branch arm 36 has a shape branched in a substantially U shape in a plan view, and the first suction portions 36A are provided at a total of four locations. On the other hand, one second suction portion 37 </ b> A is formed at the tip of the linear arm 37. The first suction unit 36A is configured to suck the surface of the ring frame RF, and the second suction unit 37A is configured to suck the substantial center of the wafer W. The first and second suction portions 36A and 37A are connected to a decompression device (not shown).

  The alignment device 13 includes a rotary table 40 for sucking and holding the wafer W, an orientation flat (not shown) formed on the outer periphery of the wafer W, a V notch, a V notch formed on the outer periphery of the ring frame, and a straight line. And a sensor 41 that detects the position of the wafer W and identifies the position of the wafer W.

  The ultraviolet irradiation device 14 includes a moving table 44 provided so as to be movable in the Y direction in FIG. 1 with the wafer W mounted thereon, and an ultraviolet irradiation unit 45 positioned above the moving table 44. When the table 44 passes under the ultraviolet irradiation unit 45, the ultraviolet curable pressure-sensitive adhesive layer of the sheet affixed to the wafer W is cured, the adhesive strength is lowered, and then the sheet can be peeled off. is there.

  The mount device 15 includes a table support 50, a rotary table 51 supported by the table support 50 and rotatably provided in a plane, and the table support 50 in the left-right direction (X direction in FIG. 1). ), The wafer W is transferred onto the rotary table 51 via the transfer device 12 when the guide rail 53 and the table support 50 that are movably guided along the horizontal axis are located at the initial position (solid line position in FIG. 1). On the other hand, a frame transfer robot 56 that takes out the ring frame RF from the frame stocker 54 and transfers the ring frame RF around the wafer W, and attaches the mount tape MT to the ring frame RF and the wafer W to attach the wafer W and the ring. It is comprised by the mount tape sticking unit 58 which integrates frame RF. The mount tape sticking unit 58 has substantially the same configuration as the tape sticking unit described in Japanese Patent Application No. 2004-133069 already filed by the present applicant.

  The peeling device 16 includes a table support 50 and a rotary table 51 that constitute a part of the mount device 15, and a tape peeling unit 60. The tape peeling unit 60 has substantially the same configuration as the tape peeling unit described in Japanese Patent Application No. 2004-133069.

  A cutting device 65 is disposed at a side position of the frame stocker 54. The cutting device 65 includes a cutter holder 66 provided so as to be able to advance and retreat toward the rotary table 51, and a cutter 67 supported by the cutter holder 66. This cutting device 65 is used when the wafer W integrated with the ring frame RF taken out from the second accommodating portion 11B via the mount tape MT is transferred to another ring frame RF. It is. That is, the cutter 67 is located between the wafer W and the ring frame RF, and the rotary table 51 rotates to cut the mount tape MT, so that the wafer W and the ring frame RF are separated. At this time, the separated ring frame RF is transferred as an unnecessary ring frame to the stocker 70 via the transfer device 12 and collected, while the wafer W is left on the rotary table and is passed through the frame transfer robot 56. And transferred to a new ring frame RF to be transferred.

  A first wafer transfer unit 75 is disposed at a side position of the mount tape attaching unit 58. The first wafer transfer unit 75 accommodates the single-axis robot 77 that sucks and transfers the ring frame RF of the wafer W integrated with the ring frame, and accommodates the integrated wafer W in the stocker 80. A slide cylinder 81 is used. The stocker 80 has the same structure as that of the first accommodating portion 11B.

  A second wafer transfer unit 90 having a configuration substantially the same as that of the first wafer transfer unit 75 is disposed at a side position of the tape peeling unit 60. The second wafer transfer unit 90 accommodates a single-axis robot 92 that sucks and transfers the ring frame RF of the wafer W integrated with the ring frame, and accommodates the integrated wafer W in the stocker 93. A slide cylinder 94 is used. The stocker 93 has the same structure as that of the first accommodating portion 11B.

  In the present embodiment, the first wafer transfer unit 75 is transferred with the wafer W and the ring frame RF integrated with the circuit surface being the lower surface side, while the second wafer transfer unit 75 is transferred. A unit in which the wafer W and the ring frame RF are integrated is transferred to the mounting unit 90 in a state where the circuit surface is on the upper surface side. However, it is not always necessary to provide the second wafer transfer unit 90 as long as the first wafer transfer unit 75 has an action substitutability.

  Next, a wafer transfer procedure according to this embodiment will be described.

As shown in FIG. 2 (A), when an object having a protective sheet S attached to the circuit surface of the wafer W is transferred to the ring frame RF, the circuit surface is on the upper surface side, Can be transferred in either state. At this time, there are a case where the protective sheet S is stuck and a case where the protective sheet S is stuck and a case where peeling is performed. These selections can be handled by inputting the sheet sticking state of the wafer to be loaded and the sheet sticking state after transfer to a control device (not shown) by an operation panel (not shown).
Specifically, the center of the wafer W is sucked through the second suction portion 37 </ b> A in the linear arm 37 of the transfer device 12, taken out from the first storage portion 11 </ b> A, and positioned through the alignment device 13. Later, the adhesive strength of the protective sheet S is reduced by the ultraviolet irradiation device 14. Here, when the protective sheet S does not have an ultraviolet curable adhesive, the ultraviolet irradiation device 14 can also pass.

  The wafer W that has been irradiated with ultraviolet rays is transferred via the transfer device 12 onto the rotary table 51 that constitutes the mount device 15 so that the protective sheet S is positioned downward. The ring frame RF is transferred from the frame stocker 54 to the rotary table 51 via the frame transfer robot 56 so as to be positioned around the wafer W.

  Next, the table support 50 is moved to the mount tape attaching unit 58 side, and the mount tape MT is attached to the upper surface of the ring frame RF and the wafer W, whereby the wafer W and the ring frame RF can be integrated. After this integration is performed, the table support 50 returns to the initial position, the frame transfer robot 56 sucks and lifts the upper surface of the ring frame RF, and the transport device 12 passes through the suction portion 36A of the branch arm 36. Then, the lower surface side of the ring frame RF is sucked and received, and is placed on the turntable 51 again with the surface of the protective sheet S turned up by the rotation of the bearing 35A so as to reverse the front and back of the wafer W. And the table support body 50 moves to the tape peeling unit 60 side, the protection sheet S is peeled from the surface of the wafer W, and a transfer state as shown in FIG. It is housed in the stocker 93 via the wafer transfer unit 90. Here, in the case of integration while keeping the protective sheet S attached, that is, to transfer to the state shown in FIG. 2A-2, the table support 50 moves to the tape peeling unit 60 side. It is only necessary to store in the stocker 80.

  On the other hand, when the wafer W and the ring frame RF are integrated in a state where the circuit surface is the lower surface side, the wafer W is transferred onto the rotary table 51 so that the protective sheet S is on top. Then, the protective sheet S is peeled off by the tape peeling unit 60, the mounting tape sticking unit 58 sticks the mounting tape MT to the ring frame RF and the wafer W in that state, and the stocker 80 is connected via the first wafer transfer unit 75. If it is accommodated, transfer can be performed in a state as shown in FIG. In the case of integration with the protective sheet S being adhered as described above, if the table support 50 is accommodated in the stocker 80 without moving to the tape peeling unit 60 side, FIG. Transfer can be performed in the state shown in FIG. After that, the wafer W accommodated in the stocker 80 is subjected to cleaning processing, edge processing, surface processing, and the like in separate steps.

Next, when a wafer with a circuit surface mounted downward as shown in FIG. 2E is transferred upside down, the wafer W is placed on the storage portion 11B and the branch arm 36 of the transfer device 12 is moved. The ring frame is adsorbed via the first adsorbing portion 36A, and is transferred onto the rotary table 51 via the alignment device 13 and the ultraviolet irradiation device 14 so that the mount tape MT is located downward via the conveying device 12. . Therefore, the wafer W and the ring frame RF are separated by the rotation of the cutter 67 of the cutting device 65 and the table 51. The separated ring frame RF is transferred to the stocker 70 via the transfer device 12, and the wafer W left on the rotary table is transferred to the new ring frame RF via the frame transfer robot 56. It is transferred so that it may be located around. Then, the table support 50 moves to the mount tape attaching unit 58 side, attaches the mount tape MT to the ring frame RF and the upper surface of the wafer W, and then the wafer W is turned over at the initial position. Then, the table support 50 is moved to the tape peeling unit 60 side, and the mount tape MT that has been pasted and cut is peeled off from the surface of the wafer W, and a circuit as shown in FIG. The surface is in an upward state and is accommodated in the stocker 93 via the second wafer transfer unit 90.

  Therefore, according to such an embodiment, the state of the wafer put into the wafer transfer apparatus 10 as shown in FIGS. 2A to 2E, and FIGS. ) -1 can be transferred in various states by inputting the post-transfer state shown in -1 to an operation panel (not shown). Here, description of the transfer procedure for each of them is omitted, but by selectively programming the wafer transfer path described above, a single wafer transfer apparatus can be used while in the wafer manufacturing process. The effect that the transfer corresponding to various needs can be performed is obtained. Further, in the transfer device 12, transfer when the wafer W and the ring frame RF are integrated can be performed by suction by the first suction unit 36A, whereas when the wafer W is a single unit, the second suction unit 37A. Therefore, it is possible to avoid the necessity of using a separate transfer device.

As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
That is, the present invention has been illustrated and described mainly with respect to specific embodiments, but the shape, position, or position of the above-described embodiments can be reduced without departing from the scope of the technical idea and object of the present invention. With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

1 is a plan view of a wafer transfer apparatus according to an embodiment. (A)-(E) is explanatory drawing which shows a wafer transfer aspect. The schematic perspective view of a conveying apparatus. The side view of a conveying apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Wafer transfer apparatus 11 Housing | casing part 11A 1st accommodating part 11B 2nd accommodating part 12 Conveyance apparatus 15 Mount apparatus 31 Robot main body 34 Adsorption arm 36A 1st adsorption | suction part 37A 2nd adsorption | suction part W Semiconductor wafer MT Mount tape RF ring frame

Claims (4)

In a wafer transfer apparatus comprising: a housing portion that houses a semiconductor wafer; a transport device that takes out and transports the semiconductor wafer from the housing portion; and a mount device that mounts the semiconductor wafer on a ring frame.
The mounting device affixes a mounting tape to a table that supports the semiconductor wafer in a state in which either one of the front and back surfaces of the semiconductor wafer is selectively exposed, and a ring frame disposed around the semiconductor wafer and the semiconductor wafer. A tape supply unit,
A wafer transfer apparatus, wherein the semiconductor wafer is mounted on a ring frame in accordance with a transfer mode determined according to a type of the semiconductor wafer transferred onto the table. The accommodating portion is configured by a first accommodating portion that accommodates a semiconductor wafer and a second accommodating portion that accommodates a semiconductor wafer supported on a ring frame via a mount tape,
2. The wafer transfer apparatus according to claim 1, wherein the transfer device selectively takes out the semiconductor wafer and transfers it to the mount device. When a semiconductor wafer mounted on the ring frame is to be transferred, a cutting device for cutting the mounting tape around the semiconductor wafer to separate the semiconductor wafer and the ring frame, and the semiconductor wafer in a separate ring frame 3. The wafer transfer apparatus according to claim 2, further comprising a frame transfer robot for mounting. 4. The wafer transfer apparatus according to claim 1, wherein the semiconductor wafer is provided so that its front and back sides can be reversed via the transfer device.

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