JP2005332931A - Wafer mounter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wafer mounter with which the surface and the rear face of a wafer mounted on a frame are reversed and the wafer can automatically be re-mounted on the frame. <P>SOLUTION: A frame separation means 57 separating the wafer W which is mounted on an annular first frame F1 through a first pressure sensitive adhesive sheet S from the first frame F1 by sticking the first pressure sensitive sheet S to one face side, and a frame mounting means 50 mounting the wafer on an annular second frame F2 through a second pressure sensitive adhesive sheet ES by sticking the second pressure sensitive sheet ES to the other face of the wafer W, are arranged on the wafer mounter 10. The surface and the rear face of the wafer W mounted on the frame are reversed and the wafer can automatically be remounted on the different frame. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a wafer mounter that is used in a process of manufacturing a chip such as a semiconductor device or an electronic component and mounts a wafer on which a semiconductor device or an electronic component is formed on a ring-shaped frame via an adhesive sheet. It is.

  In semiconductor manufacturing processes, etc., wafers with semiconductor devices or electronic parts formed on the surface are subjected to electrical tests in the probing process and then divided into individual chips (also called dies or pellets) in the dicing process. The individual chips are then die bonded to the component base in a die bonding process. After die bonding, wire bonding is performed, and after wire bonding, resin molding is performed to obtain a finished product such as a semiconductor device or an electronic component.

  After the probing process, as shown in FIG. 8, the back surface of the wafer is adhered to an adhesive sheet S (also referred to as a dicing sheet or dicing tape) S having a thickness of about 100 μm and having an adhesive layer formed on one side. Mounted on a ring-shaped frame F. In this state, the wafer W is transferred in the dicing process, between the dicing process and the die bonding process, and in the die bonding process.

  By the way, in recent years, an ultra-thin IC chip incorporated in a thin IC card represented by a smart card has been required. Such an ultra-thin IC chip is manufactured by dividing an ultra-thin wafer W of 100 μm or less into individual chips.

  For this reason, after the probing process, the back surface of the wafer W is ground and processed into an extremely thin wafer of 100 μm or less before dicing.

  Against this background, as shown in FIG. 9, in the conventional chip manufacturing method for semiconductor devices and electronic components, first, the surface of the wafer W on which a large number of semiconductor devices and electronic components are formed is protected. For this purpose, a protective sheet sticking step is performed in which a protective sheet (also referred to as a protective tape) having an adhesive on one side is attached to the wafer surface (step S101). Next, a back surface grinding step is performed in which the wafer W is ground from the back surface and processed to a predetermined thickness (step S103).

  After the back surface grinding process, a frame mounting process for attaching the wafer W to the dicing frame F using a dicing sheet (also referred to as dicing tape) S having an adhesive on one side is performed, and the wafer W and the dicing frame F is integrated (step S105). Next, in this state, a protective sheet peeling process is performed in which the wafer W is adsorbed on the dicing sheet S side and the protective sheet attached to the surface is peeled off (step S107).

  The wafer W from which the protective sheet has been peeled is conveyed to the dicing saw together with the frame F, and is cut into individual chips T by a diamond blade that rotates at high speed. Alternatively, a laser beam having a focused point is incident on the inside of the wafer W, a modified region by multiphoton absorption is formed inside the wafer, and the wafer is divided into individual chips T by a laser dicing apparatus that divides the chips into individual chips T. (Step S109). Since the divided individual chips T remain affixed to the dicing sheet S and remain in the wafer state, here, for convenience, the aggregate of the chips T that have maintained the wafer state is also referred to as the wafer W. I will call it.

  Next, the dicing sheet S is radially expanded in the expanding process to widen the intervals between the individual chips T (step S111), and mounted on a package substrate such as a lead frame in the chip mounting process (step S113).

In the frame mounting process of step S105, an adhesive sheet is placed on the back surface of the wafer W and the back surface of the ring-shaped frame F disposed outside the outer periphery of the wafer W with the main surface side of the wafer W to which the protective sheet is attached facing up. A wafer mounter (see, for example, Patent Documents 1 and 2) in which S is attached and the wafer W is mounted on the frame F is used.
JP-A-6-181197 JP 2002-353296 A

  Incidentally, in recent years, the number of wafers W on which ТEG (Test Elementary Group; test patterns for evaluating and managing processes and devices) is formed on the street of the main surface of the wafer has increased. In the case of such a wafer W, when dicing from the main surface side of the wafer, in the dicing by the dicing blade, the metal film forming ТEG causes clogging of the dicing blade, and the chip T is chipped or chipped at the time of cutting. Further, in laser dicing, when laser light is incident from the wafer main surface side, ТEG becomes a barrier and cannot be diced well, and since the dicing sheet S is pasted on the back side of the wafer W, the dicing sheet S is also attached from the back side. There was a problem that dicing did not work well.

  For this reason, after the backside grinding of the wafer W, it is necessary to mount the wafer W on the frame F with the backside of the wafer W facing up and dice from the backside of the wafer W. In this case, in order to use the conventional chip mounter (die bonder) as it is in the chip mounting process, the wafer W diced from the back side while mounted on the frame F is turned upside down, and the main surface is turned up to the frame F. It must be remounted.

  However, the wafer mounters described in Patent Documents 1 and 2 automatically mount the wafer W not mounted on the frame F on the frame F, and reverse the front and back of the wafer W already mounted on the frame F. The frame F could not be automatically remounted.

  For this reason, the front and back of the wafer W must be reversed and remounted on the frame F manually after the dicing process, which requires a lot of work and a risk of accidentally damaging the wafer W during the work. .

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a wafer mounter capable of automatically remounting a wafer mounted on a frame by reversing the front and back of the wafer.

  In order to achieve the above object, the present invention provides a wafer mounter in which a wafer is mounted on a ring-shaped frame arranged outside the wafer via an adhesive sheet, and the first adhesive sheet is attached to one surface side. And a frame separating means for separating the wafer mounted on the ring-shaped first frame through the first adhesive sheet from the first frame, and a second adhesive sheet on the other surface of the wafer. Frame mounting means for attaching to and mounting on a ring-shaped second frame via the second adhesive sheet.

  According to the present invention, the frame separating means for separating the old frame from the wafer mounted on the frame on one surface side, and the adhesive sheet is attached to the other surface of the wafer separated from the old frame to form a new frame. Since the frame mounting means for mounting is provided, the front and back of the wafer mounted on the frame can be reversed and remounted on another frame automatically. Therefore, even a wafer diced from the back side can be chip-mounted using a conventional chip mounter (die bonder) as it is.

  Further, according to the present invention, one surface of the wafer is a main surface on which a circuit pattern is formed, and a protective sheet for protecting the surface is attached to the main surface and mounted on the second frame. An additional requirement is that sheet peeling means for peeling the protective sheet from the main surface of the wafer is provided.

  According to this additional requirement, since a sheet peeling means for peeling the protective sheet from the main surface of the wafer is provided, a dedicated protective sheet peeling device is not required.

  In the present invention, the wafer is a wafer diced into individual chips in a state of being integrated with the first frame via the first adhesive sheet, and the second adhesive sheet is extended. Accordingly, it is an additional requirement that an expanding means is provided for enlarging the distance between individual chips of the wafer mounted on the second frame.

  According to this additional requirement, since the wafer mounter is provided with expanding means for expanding the distance between individual chips of the wafer, adjacent chips interfere with each other due to vibration during the transfer to the chip mounting process. It is possible to prevent fine cracks from occurring at the edge portion of the chip.

  In addition, the present invention has an additional requirement that an expansion holding means for holding an expanded state in which a distance between individual chips of the wafer is enlarged is provided. According to this, since the expanded state in which the interval between the individual chips is expanded is maintained, it is not necessary to take measures for preventing interference between adjacent chips during the conveyance.

  Furthermore, the present invention has an additional requirement that the first frame and the second frame are of the same type. According to this, since the first frame and the second frame are of the same type, the conventional conveying means is used as it is in the dicing apparatus, between the dicing apparatus and the die bonder (chip mounter), and in the die bonder (chip mounter). Can be transported by frame.

  As described above, according to the wafer mounter of the present invention, the front and back of the wafer mounted on the frame can be reversed and automatically mounted on another frame. Therefore, even a wafer diced from the back side can be chip-mounted using a conventional chip mounter as it is.

  Hereinafter, preferred embodiments of a wafer mounter according to the present invention will be described in detail with reference to the accompanying drawings. In each figure, the same number or symbol is attached to the same member. In each figure, the thickness of the wafer or sheet is shown to be extremely thick so that it can be easily understood, but the actual thickness is about 100 μm.

  FIG. 1 is a plan view showing a wafer mounter according to the present invention. The wafer mounter 10 includes an input cassette elevator 81A, an empty frame cassette elevator 82A, an output cassette elevator 83A, conveyor belt units 84, 84, 84, a frame separating means 57, a frame mounting means 50, a reversing section 40 in FIG. The sheet peeling unit 60, the expanding unit 30, the expanding holding unit 15 shown in FIG.

  The input cassette elevator 81A accommodates a large number of wafers W that are diced and separated into individual chips T while mounted on the first frame F1 via a dicing sheet S that is a first adhesive sheet. An input cassette 81 is placed.

  On the empty frame cassette elevator 82A, an empty frame cassette 82 in which a large number of empty second frames F2 on which no wafers W are mounted is placed.

  In addition, the output cassette elevator 83A stores a large number of wafers W that are inverted from the first frame F1 to the second frame F2 through the expanded sheet ES that is the second adhesive sheet and mounted again. An output cassette 83 is placed.

  The input cassette elevator 81A, the empty frame cassette elevator 82A, and the output cassette elevator 83A are positioned and driven in the vertical direction by motor-driven ball screws (not shown).

  The input cassette elevator 81A, the empty frame cassette elevator 82A, and the output cassette elevator 83A are each provided with a conveyor belt unit 84, and the conveyor belt unit 84 takes out and stores the frame F with respect to each cassette. . The frame F is taken out in order from the bottom of the cassette, and when the frame F is stored, it is stored in order from the top of the cassette.

  In the reversing unit 40, the reversing suction table 41 that sucks the second frame F2 on which the wafer W is mounted is rotated 180 ° while being sucked, and the frame F2 is reversed. This inversion operation is performed by a motor drive (not shown).

  The transfer means 70 is composed of an articulated robot arm, sucks each frame F with four suction disks 71, 71,... Provided at the tip, and transports each frame F to each part of the wafer mounter 10. The multi-joint robot arm is rotated by a motor (not shown) provided at each joint, and conveys each frame F to the destination.

  FIG. 2 shows the frame mounting means 50. In FIG. 2A, the protective sheet PS is attached to the surface of the circuit pattern WP, and the wafer W mounted on the first frame F1 through the dicing sheet S as the first adhesive sheet is still in the first frame F1. FIG. 2B shows a state in which the wafer W separated from the first frame F1 is mounted on the second frame F2 via the expanded sheet ES that is the second adhesive sheet. It represents.

  The frame mounting means 50 sucks and places the wafer W, and a suction table 51 that can move up and down, a frame clamper 51A that sucks and places the first frame F1, and descends and rotates in the vicinity of the outer periphery of the wafer W to rotate the dicing sheet S. Cutter (frame separating means) 57, frame holder 59 for placing the second frame F 2, supply reel 52, take-up reel 53, guide rollers 54 and 55, press roller 56, outer periphery of the second frame F 2 The cutter 58 is pressed near the inside and rotates to cut the expanded sheet ES.

  The supply reel 52, the take-up reel 53, the guide rollers 54 and 55, the press roller 56, and the cutter 58 are attached to a unit base (not shown), and move to an upper position of the suction table 51 and a retracted position retracted horizontally therefrom. It has come to be.

  FIG. 3A shows the sheet peeling means 60. The sheet peeling means 60 includes a suction table 61, a frame clamper 61A, a supply reel 62 and a take-up reel 63 shown in FIG. 1, a peeling sheet RS, a press roller (not shown), an ultraviolet irradiation device (not shown), and the like.

  After the release sheet RS is attached to the sheet to be peeled, the take-up reel 63 moves obliquely upward, and the sheet to be peeled is pulled up together with the release sheet RS to be peeled off.

  4, 5, and 6 are cross-sectional views showing the expanding means 30. The expand means 30 is an expand holding means attached to the base 11 via the base 11, the telescopic table 12 mounted on the base 11 and the frame chuck 13, the chuck stage 14 attached to the telescopic table 12, and the holder 16. It has a hot air jet tube 15 and the like.

  A porous member 14A is embedded in the upper surface of the chuck stage 14, and the porous member 14A is connected to a vacuum pump 23 via an electromagnetic valve 21B and a regulator 22B, and holds the wafer W together with the expanded sheet ES by suction. ing.

  A porous member 13A is also embedded in the upper surface of the frame chuck 13, and the porous member 13A is connected to the vacuum pump 23 via the electromagnetic valve 21A and the regulator 22A, and adsorbs the second frame F2 together with the expanded sheet ES. It comes to hold.

  The telescopic table 12 is vertically expanded and contracted by a driving means (not shown), and moves the wafer W on the chuck stage 14 together with the expanded sheet ES.

  The hot air injection pipe 15 that is an expanding holding means is a ring-shaped pipe connected to a hot air source, and injects hot air upward from a large number of injection ports 15A, 15A,.

  The expanded sheet ES is a heat-shrinkable pressure-sensitive adhesive sheet, and its base material is a polyolefin-based plastic. It shrinks when heat of 115 ° C or higher is applied, and the shrinkage ratio is -15% or more in terms of the length change rate. Is used. In addition to polyolefin, it can be appropriately selected from plastics such as polyvinyl chloride, polyester and polystyrene.

  The hot-air spray tube 15 that is an expanding holding means irradiates the portion of the expanded sheet ES after the expansion where the wafer W is not attached, with hot air, and thermally expands the expanded sheet ES in that portion to maintain the expanded state.

  Next, the operation of the wafer mounter 10 configured as described above will be described. First, a protective sheet PS is affixed to the circuit pattern WP formed on the main surface, and the wafer W mounted with the back face up on the first frame F1 via the dicing sheet S is stored in the input cassette 81. And input into the input cassette elevator 81A.

  Next, the input cassette elevator 81A is lowered, and the lowermost wafer W in the input cassette 81 is pulled out by the transfer belt unit 84 together with the first frame F1. The extracted wafer W is transported to the frame mounting means 50 with the first frame F1 being sucked by the suction disk 71 of the transport means 70.

  In the frame mounting means 50, first, as shown in FIG. 2A, the wafer W is sucked and placed on the suction table 51 with the back side up, and the first frame F1 is a frame clamper 51A provided on the suction table 51. To be adsorbed. In this state, the cutter 57 as the frame separating means descends and makes one round along the outer periphery of the wafer W, and the dicing sheet S is cut. Thereby, the wafer W is separated from the first frame.

Next, as shown in FIG. 2B, the suction table 51 is lifted while the wafer W is sucked and placed, and the upper surface of the second frame F2 held by the frame holder 59 and the rear surface of the wafer W are the same. Position it so that it is at the height. The second frame F2 is previously transported from the empty frame cassette 82 to the frame holder 59 by the transport means 70, and stands by on the frame holder 59.

  On the other hand, the expanded sheet ES, which is a second adhesive sheet configured to be unwound from the supply reel 52 and taken up by the take-up reel 53 via the guide rollers 54 and 55, moves from the retracted position to above the suction table 51. To do.

  The expand sheet ES has an ultraviolet curable adhesive on the pasting surface, and rolls in the lateral direction while pressing the press roller 56 downward, thereby forming the back surface of the wafer W and the upper surface of the second frame F2. Expand sheet ES is affixed.

  Thereafter, the cutter 58 is rotated once while being pressed against the expanded sheet ES to cut the expanded sheet ES along the vicinity of the outer periphery of the second frame F <b> 2, and the remaining expanded sheet ES is wound around the take-up reel 23. In this state, the wafer W is reversed and attached to the second frame F2 via the expanded sheet ES, and is integrated.

  Note that it is preferable that the first frame F1 and the second frame F2 are frames of the same type and size, because the frame can be transported between the dicing device and the die bonder, and inside the die bonder using an existing transport device. is there.

  The wafer W that has been reversed and attached to the second frame F <b> 2 is transferred to the reversing unit 40 by the transfer means 70. Here, the wafer W is reversed with the main surface side to which the protective sheet PS is attached facing upward by the 180 ° rotation of the reversing suction table 41. Next, the sheet is conveyed to the sheet peeling means 60 by the conveying means 70.

  In the sheet peeling apparatus 60, the wafer W is sucked and placed on the suction table 61 with the protective sheet PS and dicing sheet S side up, and the expanded sheet ES attached to the back side down, and the second frame F2 is It is sucked by a frame clamper 61A provided on the suction table 61.

  Next, ultraviolet rays are irradiated from the dicing sheet S side on the main surface side of the wafer W by an ultraviolet irradiation device (not shown). Since UV transmissive resin is used for the protective sheet PS, the UV curable pressure-sensitive adhesive layer formed on the protective sheet PS is cured, and the adhesive force with the wafer W is reduced.

  Here, when the release sheet RS is attached to the dicing sheet S on the main surface side of the wafer W and the release sheet RS is pulled up in the direction indicated by the hatching arrow in FIG. 3A, the dicing sheet S and the protective sheet PS are peeled off. It is peeled off from the wafer W while being stuck to the sheet RS. As a result, as shown in FIG. 3B, the wafer W is in a state of being integrated with the second frame F2, with the circuit pattern WP side up, the expand sheet ES being attached to the back surface.

  Next, the wafer W is transferred to the expanding means 30 by the transfer means 70. In the expanding means 30, the wafer W is placed on the chuck stage 14 via the expanded sheet ES and the second frame F 2 is placed on the frame chuck 13. Here, the wafer W has already been diced and divided into individual chips.

  In this state, the electromagnetic valve 21A is operated to attract and fix the second frame F2 to the frame chuck 13. The wafer W remains mounted on the chuck stage 14 and is not attracted.

  Next, the expandable table 12 is extended upward, and the expanded sheet ES of the portion where the wafer W is adhered is lifted upward. As a result, the expanded sheet ES is stretched, and the interval between the individual chips T is expanded. FIG. 4 shows this state.

  Next, the electromagnetic valve 21B is operated, and the wafer W is attracted and fixed to the chuck stage 14 together with the expanded sheet ES. Thereby, the expanded state of the expanded sheet ES on the chuck stage 14 is maintained.

  From this state, the telescopic table 12 is retracted to the original position. Since the expanded sheet ES on the chuck stage 14 is adsorbed and fixed, a slack SA occurs in the expanded sheet ES between the second frame F2 and the chuck stage 14.

  Next, hot air is sprayed toward the slack SA of the expanded sheet ES from the spray ports 15A, 15A,... The temperature of the hot air is preferably about 120 °. Since the expanded sheet ES is a heat-shrinkable sheet, the slack SA portion contracts and the slack SA is eliminated.

  FIG. 5 shows a state in which a slack SA is formed on the expanded sheet ES between the second frame F2 and the chuck stage 14, and hot air is sprayed from the hot air jet pipe 15 to the slack SA portion.

  Here, the electromagnetic valves 21A and 21B are operated to release the adsorption of the wafer W and the second frame F2. Even after the suction of the wafer W is released, the loose sheet SA of the expanded sheet ES is contracted and eliminated, so that the expanded state of the expanded sheet ES is maintained and the interval between the individual chips T is kept enlarged. . FIG. 6 shows this state.

  Since the expanded state of the expanded sheet ES expanded in this way is maintained, and the interval between the individual chips T is expanded, the contact between the individual chips T is prevented, and the wafer W is provided for each second frame F2. It can be easily transported.

  Next, the wafer W is transferred by the transfer means 70 onto the transfer belt unit 84 connected to the output cassette, and is stored in the uppermost stage in the output cassette 83 by driving the transfer belt unit 84.

  Similarly, the wafer W in the input cassette 81 is separated from the first frame F1, mounted on the second frame F2 via the expanded sheet ES, reversed and remounted, reversed, and protected sheet PS. Is peeled and expanded, the expanded state is maintained, and sequentially stored in the output cassette 83.

  By using the wafer mounter 10 of the present invention, the semiconductor chip manufacturing process can be performed with a new process flow as shown in the flowchart of FIG. As shown in FIG. 7, in the flow of this new manufacturing process, first, in order to protect the pattern surface of the wafer W on which the circuit pattern is formed on the main surface side, a protective sheet PS is attached to the pattern surface (step S11). .

  The wafer W with the protective sheet PS attached to the main surface in step S11 is adsorbed to the rotating adsorption table of the back grinder with the protective sheet PS side down, ground with a grindstone that rotates the back surface, and has a predetermined thickness ( 100 μm or less), and then polished by a polishing head (not shown) while being held on the suction table, the work-affected layer formed during grinding is removed. (Step S13).

  Next, the wafer W is transferred to the frame mounter, mounted on the first frame F1 via the dicing sheet S with the back surface facing up, and integrated (step S15).

  A large number of wafers W integrated with the first frame F1 are stored in a cassette and put into a laser dicing apparatus. In the laser dicing apparatus, the wafer W is aligned from the back surface using infrared rays, laser light having a condensing point is incident on the inside of the wafer from the back surface, a modified region is formed inside the wafer, and the wafer W is cleaved ( Step S17).

  At this time, even if there is ТEG on the street of the main surface of the wafer, the laser light is incident from the back surface of the wafer W, so that the problem that the dicing cannot be performed successfully due to ТEG as a barrier is solved.

  Next, the laser-diced wafer W is transferred to the wafer mounter 10 of the present invention, first separated from the first frame (step S19) as shown in FIG. 2, and then the second sheet via the expanded sheet ES. The front and back sides of the frame F2 are reversed and pasted to be integrated (step S21).

  Next, as shown in FIG. 3A, the protective sheet PS is peeled off from the wafer W attached to the second frame F2, and the circuit pattern WP side is turned up as shown in FIG. 3B. Then, the expanded sheet ES is pasted on the back surface and integrated with the second frame F2 (step S23).

  Next, as shown in FIGS. 4, 5, and 6, the expanded sheet ES is stretched radially to increase the interval between the individual chips, and this expanded state is maintained (step S <b> 25). The processes from step 19 to step 25 are performed by the wafer mounter 10 of the present invention.

  Next, the wafer W is transferred to a die bonder, and the die bonder picks up individual chips T one by one with a collet and die-bonds (chip mounts) to a package substrate such as a lead frame (step S27).

  The above is the process flow of the new chip manufacturing method using the wafer mounter 10 of the present invention. Thus, since the wafer W is laser-diced, the chip T having no chipping or chipping can be manufactured even with an extremely thin wafer W of 100 μm or less. Further, since the laser beam is directly incident from the back surface of the wafer without using the sheet material, stable laser cleaving can be performed, and even the wafer W having the TEG formed on the street can be cleaved sufficiently.

  Further, in the wafer mounter 10 of the present invention, after the laser dicing, the front and back of the wafer W are reversed and pasted to another frame. Therefore, the existing transfer device is used in the dicing device, between the dicing device and the die bonder, and in the die bonder. Frame transport is possible.

  In the above-described embodiment, the dicing sheet S and the expanded sheet ES are different from each other. However, since the dicing sheet S generally has a good extensibility, the expanded sheet ES is used. A dicing sheet S may be used instead.

  The expanding means 30 is configured to move the wafer W up and down with the second frame F2 fixed, but it may be configured to move the second frame F2 up and down with the wafer W fixed.

  In addition, although a heat-shrinkable sheet is used for the expanded sheet ES and the expanded holding means 15 is configured to inject hot air to the expanded sheet ES, it is not limited to hot air, and an electrothermal heat plate or the like may be used. Further, the expanded sheet ES may be configured to mechanically hold the expanded state without using a heat-shrinkable sheet.

The top view showing embodiment of the wafer mounter based on this invention Conceptual diagram explaining frame mounting means Conceptual diagram explaining sheet peeling means Conceptual diagram explaining expanding means Conceptual diagram explaining the expansion holding means Conceptual diagram showing expanded holding state Flow chart showing new chip manufacturing process Perspective view showing wafer mounted on frame Flow chart representing conventional chip manufacturing process

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Wafer mounter, 15 ... Hot air injection pipe (expand holding means), 30 ... Expanding means, 40 ... Reversing part, 50 ... Frame mounting means, 57 ... Cutter (frame separating means), 60 ... Sheet peeling means, 70 ... Conveyance Means, ES ... expanded sheet (second adhesive sheet), F ... frame, F1 ... first frame, F2 ... second frame, PS ... protective sheet, RS ... release sheet, S ... dicing sheet (first sheet) Adhesive sheet, adhesive sheet), T ... chip, W ... wafer, WP ... circuit pattern

Claims (5)

In a wafer mounter that mounts a wafer on a ring-shaped frame disposed outside the wafer via an adhesive sheet,
A frame separating means for separating the wafer mounted on the ring-shaped first frame via the first pressure-sensitive adhesive sheet and having the first pressure-sensitive adhesive sheet attached to one surface side from the first frame;
Frame mounting means for attaching a second adhesive sheet to the other surface of the wafer and mounting the second adhesive sheet on a ring-shaped second frame via the second adhesive sheet. Mounter.   One surface of the wafer is a main surface on which a circuit pattern is formed, and a protective sheet for protecting the surface is attached to the main surface, from the main surface of the wafer mounted on the second frame, The wafer mounter according to claim 1, further comprising a sheet peeling means for peeling the protective sheet.   The wafer is a wafer diced into individual chips in a state of being integrated with the first frame via the first adhesive sheet, and the second adhesive sheet is extended by extending the second adhesive sheet. 3. The wafer mounter according to claim 1, further comprising an expanding means for expanding a distance between individual chips of the wafer mounted on the frame.   4. The wafer mounter according to claim 3, further comprising an expand holding means for holding an expanded state in which a distance between individual chips of the wafer is enlarged.   5. The wafer mounter according to claim 1, wherein the first frame and the second frame are the same type of frame. 6.

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