JP2007311570A - Replacing device and replacing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a replacing device and a replacing method which effectively reduce the winding of a first support for supporting a plate member such as semiconductor wafer, etc. in an expanded state when the support is released from the expanded state for replacing the plate member to a second support, this preventing the trouble due to the winding. <P>SOLUTION: The method comprises supporting a chip-like wafer W with a first thermally shrinkable support 1, adhering a second support 2 to the wafer W after being expanded, and heating the first support 1 by a heating means 29 to release the support 1 from the expanded state while the support 1 shrinks by the heat. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a pasting apparatus and a pasting method for pasting a plate-like member such as a semiconductor wafer (hereinafter simply referred to as “wafer”) supported by a first support to a second support.

  This kind of rewriting apparatus is described in Patent Document 1, for example. As shown in FIGS. 1 and 2, the pasting apparatus of the same document is a plate-like member supported by a first support member composed of a first frame (3) and a first UV tape (4). Specifically, it is an apparatus for pasting the wafer (1) to a second support member comprising a second frame (8) and a second UV tape (9). In the state of the chip formed in the dicing process, the chip is supported by the first support member.

  Moreover, in the pasting apparatus of patent document 1, in order to perform pasting to the 2nd support member in the state which expanded the chip | tip space | interval of the wafer (1) supported by the 1st support member as mentioned above, The first supporting member is expanded by stretching the first UV tape (4) of the first supporting member using the stretching ring (7) (see FIG. 1 (d) of the same document), and thereby the chip interval. The second UV tape (9) of the second support member is attached to the chip in a state in which is expanded by a predetermined amount (see FIG. 1 (e) of the same document). Thereafter, in the pasting apparatus of the same document, after the expanded state of the first support member as described above is released, the first UV tape (4) of the first support member is peeled off (FIG. 2 of the same document). (Refer to (a)), the replacement is completed. In the above description, the reference numerals in parentheses are those used in Patent Document 1.

  FIG. 12 shows a main part of a rewriting apparatus that employs the same method as in Patent Document 1. In the pasting device M in the figure, in the expanded part M2, the adhesive sheet 1B of the first support member 1 is stretched as shown by a two-dot chain line in the figure to bring the first support member 1 into an expanded state. The adhesive sheet 2B of the second support member 2 is attached to the chip C in a state where the distance between the chips C of the wafer W is widened by a predetermined amount, and then the expanded state of the first support member 1 as described above is released. After that, the adhesive sheet 1B of the first support member 1 is peeled off to complete the replacement.

  However, in the conventional pasting apparatus shown in Patent Document 1 and FIG. 12 described above, since the first support member 1 is in the expanded state and the chip interval is widened, when the expanded state is released. The first adhesive sheet 1 </ b> B that has been stretched up to that point is not shrunk, and the undulation U as shown in FIG. 12 occurs. When such a swell U is formed, the first adhesive sheet 1B adheres to the adhesive surface of the adhesive sheet 2B of the second support member 2, and the first adhesive sheet 1B that is no longer needed is peeled off. In addition, the second adhesive sheet 2B is broken, or the chip C is detached from the second adhesive sheet 2B by being forcibly peeled, or the chip C is damaged.

Japanese Patent No. 3064979

  The present invention has been made to solve the above problems, and the object is to replace a plate-like member such as a wafer supported by the first support with the second support. An object of the present invention is to provide a rewriting apparatus and a renewing method that can effectively reduce the swell generated in the first support member released from the expanded state and prevent problems caused by the swell.

  In order to achieve the above-mentioned object, the rewriting device of the present invention is supported by the first support body that can be thermally contracted, and in the rewriting device that replaces the chip-like plate-like member with the second support material, Expanding means for extending the chip interval of the plate-like member by extending the first support body to an expanded state, supply means for supplying the second support member, and widening the chip interval of the plate-like member Bonding means for bonding the second support to the plate-shaped member in a state where the second support is bonded, and peeling means for peeling the first support from the plate-shaped member after bonding the second support. And heating means for heating the first support, wherein the first support is released from the expanded state while being contracted by the heat of the heating means. .

  In the above-described pasting device of the present invention, the heating means may be, for example, a hot air blower.

  The warm air blowing device that can be employed in the re-stamping device of the present invention may be configured such that the warm air that is blown out rotates in a predetermined direction, and the first support is heated evenly by the rotating warm air.

  In order to achieve the above object, the renewal method of the present invention is supported by a heat-shrinkable first support, and in a renewal method in which a plate-like plate member is rewritten to a second support, The chip support of the plate-like member is widened by stretching the first support to be in an expanded state, and in this state, the second support is bonded to the plate-like member, and then the first support Is released from the expanded state while being contracted by the heat of the heating means, and then the first support is peeled off from the plate-like member.

  In the replacement method of the present invention, the heating means may be, for example, a hot air blower.

  The warm air blower that can be employed in the re-stamping method of the present invention may be configured such that the warm air that is blown out rotates in a predetermined direction, and the first support is heated evenly by the rotating warm air.

  In the present invention, a configuration is adopted in which the first support is released from the expanded state while being contracted by the heat of the heating means. For this reason, it is possible to effectively eliminate the undulation of the first support, and to solve problems such as breaking the second support due to the undulation, dropping of the chip, and damage. An effect is obtained.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a front view of a pasting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is an enlarged side view of an expanding portion constituting the pasting apparatus of FIG. 1, and FIG. FIG. 5 is an explanatory view of the first support and the second support, and FIG. 5 is an explanatory diagram of the first support and the second support.

  1 replaces a wafer (plate member) W (hereinafter referred to as “first wafer body W1”) supported by a first support 1 as shown in FIGS. 5 (a) and 5 (b). (C) (d) is a device for attaching to the second support 2 (hereinafter, the wafer W supported by the second support 2 is referred to as "second wafer body W2"), The wafer W before being replaced is formed into chips by a dicing process in the previous process, and is supported by the first support 1 in a state of a plurality of chips C.

  The first support 1 has a heat-shrinkable adhesive sheet 1B bonded to the ring frame 1A with the adhesive, and the second support 2 has the adhesive sheet 2B similarly bonded to the ring frame with the adhesive. The structure is bonded to 2A.

  As shown in FIGS. 1 and 2, the present rewriting apparatus M includes a transport unit M <b> 1, an expand unit M <b> 2, a second support body supply unit M <b> 3, and a separation unit M <b> 4.

  The transfer unit M1 includes a wafer cassette mounting table 43, an articulated robot 17, and a ring frame mounting table 26. A plurality of first wafer bodies W1 are stored in the wafer cassette 3 and mounted on the wafer cassette mounting table 43. Has been. The articulated robot 17 takes out the first wafer bodies W1 one by one by means of the suction arm 17A provided on the free end side thereof and conveys them to the expanding unit M2.

  The expanding unit M2 includes a ring frame holding unit 7 that receives the first wafer body W1 conveyed by the articulated robot 17, an expand table 6 attached to the apparatus frame 5, and the ring frame holding unit 7 by a screw shaft 11. It is comprised by the raising / lowering means 8 which raises / lowers, and the heating means 29. FIG. Among these components, the ring frame holding unit 7, the expanding table 6 and the lifting / lowering means 8 constitute the expanding means 4.

  As shown in FIG. 3, the ring frame holding part 7 has an inward holding groove 9, and the ring frame 1 </ b> A of the first wafer body W <b> 1 is inserted inside the holding groove 9. The space between the chips C of the wafer W is increased by lowering the elevating means 8 disposed on both sides of the expand table 6.

  As shown in FIG. 3, the elevating means 8 includes a screw shaft 11 penetrating the apparatus frame 5 in the vertical direction, a pulley 12 rotatably attached to the lower surface of the apparatus frame 5 by a bearing portion 13, and an output shaft. The pulse motor 15 includes a driving pulley 16 and an endless belt 14 wound around the pulleys 12 and 16. The pair of ring frame holding portions 7 are fixed to the upper end portion of the screw shaft 11. As a result, the screw shaft 11 and the ring frame holding portion 7 move up and down by the rotation of the pulse motor 15, and the adhesive sheet 1B of the first wafer body W1 is stretched by a predetermined amount, so that the distance between the chips C of the wafer W is increased. ing. Further, the spread amount of the tip C interval is monitored by a camera or the like (not shown), and the descending of the ring frame holding unit 7 is stopped when the tip C interval becomes a predetermined amount. In the present embodiment, the adhesive (not shown) of the adhesive sheet 1B is an ultraviolet curing type, and before the operation of increasing the distance between the chips C starts, the adhesive is irradiated with ultraviolet rays by an ultraviolet irradiation device (not shown). The adhesive strength is reduced.

  The heating means 29 is constituted by a hot air blower 30, and a plurality of hot air outlets 30 </ b> A are provided around the lower portion of the expand table 6 (see FIG. 4). Further, the outlet 30A is configured to be inclined in a predetermined direction, and the warm air blown from each outlet 30A rotates as indicated by arrows in FIG. 4, and the adhesive sheet 1B of the first wafer body W1 is rotated by the rotating hot air. It is designed to be heated evenly. Further, in the present embodiment, an annular partition wall 31 is provided from the viewpoint of efficiently heating the first support 1 by preventing the leakage of warm air and promoting rotation, and the partition wall 31 is used to expand the first One wafer body W1 was enclosed.

  As shown in FIGS. 1 and 2, the second support body supply unit M3 is disposed so as to partially cover the expanded unit M2, and includes a transport table 19, sheet pasting means 25, and second support. It is comprised by the body conveyance means 18.

  The upper surface of the transfer table 19 is a support surface capable of sucking and holding the ring frame 2A, and a lower portion of the second support transfer means 18 is provided on a rail 44 via a slider (not shown) attached to the lower surface. And the lower part of the sheet sticking means 25 are configured to be reciprocally movable. In this embodiment, the ring frame 2A is supplied from the ring frame mounting table 26 to the conveyance table 19 one by one by the articulated robot 17. In this state, the conveyance table 19 moves toward the sheet pasting means 25. The adhesive sheet 2B is pasted on the ring frame 2A by the sheet pasting means 25.

  In the sheet sticking means 25, as shown in FIG. 7, an original fabric T in which an adhesive sheet 2B is temporarily attached to a strip-shaped release sheet S is used, and the original fabric T is conveyed in the direction of the peel plate 27, The release sheet S is rapidly folded at the tip of the peel plate 27. As a result, the adhesive sheet 2B is fed out from the release sheet S, and the adhesive sheet 2B is attached to the ring frame 2A via the press roller 28 by moving the transport table 19 in conjunction with the feeding operation. The support 2 is formed.

  The second support transport means 18 is configured to attach the suction pad 20, the elevating cylinder 22 that moves the suction pad 20 in the Z-axis direction, the single-axis robot 21 that moves in the Y-axis direction, and the adhesive sheet 2B to the wafer W. The suction pad 20 holds the second support 2 formed on the transfer table 19 by suction, and waits with the chip C interval widened on the expand table 6. The second support 2 is adhered to the upper surface of the wafer W by the pressing plate 24 of the press cylinder 23 (see FIG. 3).

  As shown in FIG. 6, the first wafer body W <b> 1 with the second support 2 attached to the upper surface of the wafer W is a ring of the lifting / lowering means 8 substantially simultaneously with the heating of the adhesive sheet 1 </ b> B by the heating means 29. When the frame holding part 7 is raised, the adhesive sheet 1B of the first support 1 is released from the expanded state with thermal contraction. Therefore, the adhesive sheet 1B does not adhere to the adhesive sheet 2B of the second support 2. Thus, the first wafer body W1 to which the second support is attached is transferred to the separation unit M4 in order to separate the first support 1.

  As shown in FIGS. 1 and 2, the separating unit M4 includes a guide member 33, a wafer body transporting unit 45 for transporting the first and second wafer bodies, W1 and W2, a separation trigger forming unit 46, and a separating unit 47. It is constituted by.

  The guide member 33 has a groove 33 </ b> A continuous with the inward holding groove 9 of each ring frame holding portion 7, and is fixed to the apparatus frame 48 via a stand 49.

  The wafer body transfer means 45 includes a single-axis robot 40 that slides the upper and lower cylinders 41 in the X-axis direction, and a pair of claws 42A and 42B that move up and down by the upper and lower cylinders 41. The pair of claws 42A, The claw interval of 42B is provided slightly wider than the outer diameter of the ring frames 1A and 2A. When the pair of claws 42A and 42B are moved above the expanded table 6 by the single-axis robot 40, the upper and lower cylinders 41 are lowered, and the expanded state is released between the claws 42A and the claws 42B. The first wafer body W1 to which the body 2 is attached enters. When the single-axis robot 40 moves in the X-axis direction, the first wafer body W1 to which the second support body 2 is attached is guided by the guide member 33 and above the separating means 47. Will come to be located.

  As shown in FIGS. 8 and 9, the separation trigger forming means 46 is constituted by a rotary actuator 36 having a peeling spatula 35 attached to the tip of the rotating shaft 34, and two points shown in FIG. The spatula 35 enters between the first support body 1 and the second support body 2 by moving from the position of the chain line to the position indicated by the solid line. Then, by rotating the spatula 35 in the direction of the adhesive sheet 1B by the rotary actuator 36, a part of the adhesive sheet 1B is peeled off from the ring frame 1A, and a part of the adhesive sheet 1B is formed as the separation trigger part 50.

  The separating means 47 includes a chuck cylinder 38 having a chuck 37 that holds the separation trigger portion 50 formed by the separation trigger forming means 46, and a single-axis robot 39 that moves the chuck cylinder 38 in the X-axis direction. When the single axis robot 39 moves in the direction of arrow b shown in FIG. 8 with the chuck 37 gripping the separation trigger 50, the adhesive sheet 1B of the first support 1 is separated from the ring frame 1A. The

  Next, the overall operation of the pasting apparatus configured as described above will be briefly described with reference to FIGS. 1, 3, 6, and 8.

  In the pasting apparatus M of the present invention, first, the articulated robot 17 takes out the first wafer body W1 from the wafer cassette 3 and transfers it to the expanding unit M2. The transferred first wafer body W1 is placed and set on the expand table 6 with the ring frame 1A inserted into the holding groove 9 of the ring frame holding unit 7. Then, when the ring frame holding part 7 is lowered as shown in FIG. 3 via the elevating means 8, the adhesive sheet 1B of the first support 1 is stretched to be in an expanded state, and is chipped by a camera or the like (not shown). The spread amount of the C interval is monitored, and when the tip C interval reaches a predetermined amount, the lowering of the ring frame holding unit 7 is stopped.

  Thereafter, the second support 2 having the adhesive sheet 2B attached on the ring frame 2A by the sheet attaching means 25 of the second support supply part M3 is chipped by the second support conveying means 18 as described above. The second support 2 is supplied onto the wafer W with the C interval widened, and the supplied second support 2 is attached to the wafer W by the pressing plate 24 of the press cylinder 23.

  Next, the ring frame holding part 7 is lifted as shown in FIG. 6 via the lifting / lowering means 8 so that the expanded state of the first support 1 is released. At this time, hot air blows out from the blowout port 30A of the hot air blower 30, and the adhesive sheet 1B of the first support 1 is released from the expanded state while being contracted by the heat of the hot air. For this reason, since the adhesive sheet 1B of the first support 1 contracts greatly due to the synergistic effect of the elastic restoring force of the sheet itself and the heat of the warm air, no swell occurs.

  After the operation for releasing the expanded state of the first support 1 is completed as described above, the claws 42A and 42B sandwich the first wafer body W1 to which the second support 2 is attached. Then, it is conveyed to above the separating means 47 through the operation of the single-axis robot 40.

  Thereafter, as shown in FIG. 8, the spatula 35 enters between the first support 1 and the second support 2 and the rotary shaft 34 of the rotary actuator 36 rotates, so that the spatula 35 is separated from the separation trigger portion. 50 is formed. The chuck 37 holds the separation trigger 50 and the single-axis robot 39 moves, whereby the adhesive sheet 1B of the first support 1 is peeled off, and the wafer W is supported by the second support 2. The second wafer body W2 is formed and the replacement is completed. The peeled adhesive sheet 1B is collected by a collecting means (not shown) as waste waste.

  Thereafter, the second wafer body W2 and the ring frame 1A of the first support 1 from which the adhesive sheet 1B has been peeled are returned in the direction of the expanding table 6 while being sandwiched between the claws 42A and 42B, and the articulated robot 17, the second wafer body W2 is stored in a predetermined position of the transferred wafer cassette 3, and the ring frame 1A is stored in a ring frame collection box (not shown).

  As mentioned above, although embodiment of this invention was disclosed, this invention is not limited to this. For example, in the above-described embodiment, the wafer W is targeted as the plate-shaped member, but other plate-shaped members such as glass, a steel plate, or a resin plate can be used instead, and the wafer W is made of silicon. It may be a wafer or a compound wafer. Further, the plate-like member is not limited to a circular shape, and may be a polygonal shape.

  Moreover, in the said embodiment, although the warm air ventilation apparatus 30 was employ | adopted as the heating means 29 and the structure which overheats the 1st support body 1 with the warm air was adopted, far infrared rays and other You may comprise so that the 1st support body 1 may be heated with an energy ray.

  Furthermore, the adhesive sheet 2B of the second support 2 is not limited to a heat-shrinkable sheet like the adhesive sheet 1B, and may be any sheet that can support the wafer W.

  In this embodiment, a ring frame having the same form as the ring frame 1A of the first support 1 is used as the ring frame 2A of the second support 2, but the form of these two ring frames 1A and 2A is used. May be different.

  Further, in the present embodiment, the hot air outlet 30A is attached to the upper surface of the apparatus frame 5, but the present invention is not limited to this. For example, as shown in FIG. 10, a configuration in which the outlet 30A moves up and down following the up and down movement of the ring frame holding unit 7 may be adopted. According to this structure, since the space | interval from the blower outlet 30A to the 1st support body 1 is maintained by the predetermined distance, a 1st support body can be heated still more efficiently. Further, as shown in FIG. 11, the inclination of the outlet 30A can be changed in conjunction with the vertical movement of the ring frame holding portion 7.

The front view of the rewriting apparatus which is one Embodiment of this invention. FIG. 2 is a plan view of the pasting device in FIG. 1. The side surface enlarged view of the expand part which comprises the pasting apparatus of FIG. The plane enlarged view of the expanded part which comprises the re-spreading apparatus of FIG. Explanatory drawing of a 1st support body and a 2nd support body. Operation | movement explanatory drawing when releasing the expanded state of a 1st support body. Explanatory drawing which showed an example of the sheet sticking means. The partial enlarged front view which shows a separation trigger formation means. The top view which looked at the separation trigger formation means of FIG. 8 from the arrow a direction. Explanatory drawing of other embodiment of this invention. Explanatory drawing of other embodiment of this invention. Explanatory drawing of the conventional pasting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st support body 2 2nd support body 4 Expanding means 23 Press cylinder (bonding means)
29 Heating means 30 Hot air blower C Chip M Re-placement apparatus M3 Second support body supply part (supply means)
M4 separation part (peeling means)
W Wafer (plate member)

Claims (6)

In the rewriting apparatus which is supported by the first support body capable of heat shrinking and replaces the chip-like plate-like member with the second support body,
Expanding means for extending the chip interval of the plate-like member by extending the first support to be in an expanded state;
Supply means for supplying the second support;
Bonding means for bonding the second support to the plate member in a state where the chip interval of the plate member is widened;
A peeling means for peeling the first support after bonding the second support;
Heating means for heating the first support,
The pasting apparatus, wherein the first support is released from the expanded state while being contracted by heat of the heating means.   The said heating means consists of a warm air blower, The pasting apparatus of Claim 1 characterized by the above-mentioned.   The said hot air blower rotates by the warm air which blows off in a predetermined direction, and heats the said 1st support body with the rotating hot air equally, The rewriting apparatus of Claim 2 characterized by the above-mentioned. . In a renewal method in which the plate-like member supported by the first heat-shrinkable support and formed into a chip is reattached to the second support,
The chip support of the plate-like member is widened by stretching the first support to be in an expanded state, and in this state, the second support is bonded to the plate-like member, and then the first support Is released from the expanded state while being contracted by the heat of the heating means, and then the first support is peeled off from the plate-like member.   The said heating means consists of a warm air blower, The re-placement method of Claim 4 characterized by the above-mentioned. The said hot air blower rotates by the warm air which blows off in a predetermined direction, and heats the said 1st support body with the rotating hot air equally, The re-placement method of Claim 5 characterized by the above-mentioned. .

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