JP4643514B2 - Pasting device and pasting method - Google Patents

Description

  The present invention relates to a pasting apparatus and a pasting method for pasting a plate-like member such as a semiconductor wafer (hereinafter simply referred to as “wafer”) supported by a first support to a second support.

  For example, in Patent Document 1, as shown in FIGS. 1 and 2, a wafer (1) supported by a first support body including a first frame (4) and a first UV tape (3). Is disclosed in which a wafer (1) is pasted into a second support comprising a second frame (8) and a second UV tape (9).

  Moreover, in the replacement method of Patent Document 1, in order to perform replacement on the second support in a state where the chip interval of the wafer (1) supported on the first support is expanded as described above, The first support is put into an expanded state by stretching the first UV tape (3) of the first support using the stretching ring (7) (see FIG. 1 (d) of the same document), thereby the chip interval. The second UV tape (9), which is the second support, is attached to the wafer (1) in a state where a predetermined amount is expanded (see FIG. 1 (e) of the same document). Then, after releasing the expanded state of the first support, the first UV tape (3) of the first support is peeled off (see FIG. 2 (a) of the same document), and the replacement is completed. In the above description, the reference numerals in parentheses are those used in Patent Document 1.

  FIG. 13 shows a main part of a pasting apparatus that employs the same method as in Patent Document 1. In the pasting apparatus shown in the figure, in the expanded portion M2, the adhesive sheet 1B of the first support 1 is expanded as shown by a two-dot chain line in the figure, thereby increasing the distance between the chips C of the wafer W. The adhesive sheet 2B of the second support 2 is attached to the chip C in a state where the fixed amount is spread, and then the expanded state of the first support 1 is released, and then the adhesive sheet 1B is peeled off and replaced. It is supposed to be completed.

  However, according to the above-described conventional pasting device shown in Patent Document 1 and FIG. 13, when the expanded state of the first support 1 is released, the adhesive sheet 1B of the first support 1 is returned to its original state. Since the chip C is shrunk in order to return, the chip C is rolled over in a state where its lower part is scooped by the shrinking adhesive sheet 1B. Then, if the adhesive sheet 1B is peeled off in such a state, the chip C that has been laid down is peeled off without being transferred to the adhesive sheet 2B of the second support 2 or is attached in a tilted state. This causes the problem of frequent defective replacement. Such a defect appears more prominently in a chip having a higher height than the bottom.

Japanese Patent No. 3064979

  The present invention has been made in order to solve the above-described problems. The object of the present invention is to increase the interval between plate-like members such as wafers supported by the first support and formed into chips. It is in providing a rewriting apparatus and a renewal method suitable for preventing tipping of the chip and reducing renewal defects when reattaching to the support.

  In order to achieve the above object, a rewriting apparatus according to the present invention is a rewriting apparatus that remounts a plate-like member supported by a first support body into a second support body, Expanding means for expanding the chip support of the plate-like member by extending the support of 1 to an expanded state, supply means for supplying the second support, and a state in which the chip interval of the plate-like member is widened And bonding means for bonding the second support to the plate-like member, and peeling means for peeling the first support, wherein the bonding means is a second around the plate-like member. The first support is expanded after the first support and the second support are bonded to each other by a bonding member that bonds the first support and the first support. The first support is peeled off from the plate-like member. Is the fact characterized.

  In the pasting device of the present invention, the pasting member may consist of a press roller.

  The pasting apparatus of the present invention further includes a heating unit for heating the first support, and the first support is made of a heat-shrinkable adhesive sheet, and contracts by the heat of the heating unit. It may be configured so as to be released from the expanded state.

  In order to achieve the above-mentioned object, the renewal method of the present invention is a renewal method in which a plate-like member supported by a first support and formed into a chip is reattached to a second support, wherein the first The support of the plate-like member is expanded to expand the chip interval of the plate-like member. In this state, the second support is attached to the plate-like member, and the first support around the plate-like member is provided. After bonding the body and the second support, the first support is released from the expanded state, and the first support is peeled off from the plate-like member.

  According to the present invention, as described above, the first support is released from the expanded state after the first support and the second support in the peripheral portion of the plate-like member formed into chips are bonded together. Since the configuration is adopted, the contraction of the portion supporting the chip in the entire first support due to the expansion opening is suppressed by the second support, and the lower part of the chip is not scooped. Can be effectively prevented, and defective replacement can be reduced.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a front view of a pasting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is an enlarged side view of an expanding portion constituting the pasting apparatus of FIG. 1, and FIG. FIG. 5 is an explanatory diagram of the first support and the second support, and FIG.

  As shown in FIGS. 5A and 5B, the transfer device M of the present invention uses a wafer (plate-like member) W (hereinafter referred to as “first wafer body W1”) supported by the first support 1. (C) (d) is a device for attaching to the second support 2 (hereinafter, the wafer W supported by the second support 2 is referred to as "second wafer body W2"), The wafer W before being replaced is formed into chips by a dicing process in the previous process, and is supported by the first support 1 in a state of a plurality of chips C.

  The first support 1 has a structure in which a heat-shrinkable adhesive sheet 1B is bonded to the ring frame 1A by the adhesive, and the second support 2 is similarly bonded to the adhesive sheet 2B. The structure is bonded to the ring frame 2A with an agent.

  1 and 2, as shown in FIGS. 1 and 2, the transfer device M includes a conveying unit M1, an expanding unit M2 (expanding unit), a second support supply unit M3 (supplying unit), and a sheet bonding unit M4 ( It is comprised by the bonding means) and the sheet | seat peeling part M5 (peeling means).

  The transfer unit M1 includes a wafer cassette mounting table 43, an articulated robot 17, and a ring frame mounting table 26. A plurality of first wafer bodies W1 are stored in the wafer cassette 3 and mounted on the wafer cassette mounting table 43. Is placed. The articulated robot 17 takes out the first wafer bodies W1 one by one from the wafer cassette 3 by the suction arm 17A provided on the free end side thereof, and transports them to the expanding unit M2.

  The expanded portion M2 includes the ring frame holding portion 7 that receives the first wafer body W1 conveyed by the articulated robot 17, the expand table 6 attached to the apparatus frame 5, and the screw shaft 11 to thereby form the ring frame holding portion. 7 includes an elevating means 8 for elevating and lowering 7 and a heating means 29. Among these components, the ring frame holding unit 7, the expanding table 6 and the lifting / lowering means 8 constitute the expanding means 4.

  As shown in FIG. 3, the ring frame holding part 7 has an inward holding groove 9, and the ring frame 1 </ b> A of the first wafer body W <b> 1 is inserted inside the holding groove 9. The space between the chips C of the wafer W is increased by lowering the elevating means 8 disposed on both sides of the expand table 6.

  As shown in FIG. 3, the elevating means 8 includes a screw shaft 11 penetrating the apparatus frame 5 in the vertical direction, a pulley 12 rotatably attached to the lower surface of the apparatus frame 5 by a bearing portion 13, and an output shaft. A pulse motor 15 having a driving pulley 16 and an endless belt 14 wound around the pulleys 12 and 16 are configured, and the pair of ring frame holding portions 7 are fixed to the upper end portion of the screw shaft 11. . As a result, the screw shaft 11 and the ring frame holding portion 7 move up and down by the rotation of the pulse motor 15, and the adhesive sheet 1B of the first wafer body W1 is stretched by a predetermined amount, so that the distance between the chips C of the wafer W is increased. ing. Further, the spread amount of the tip C interval is monitored by a camera or the like (not shown), and the descending of the ring frame holding unit 7 is stopped when the tip C interval becomes a predetermined amount. In the present embodiment, the adhesive (not shown) for the adhesive sheet 1B of the first wafer body W1 is an ultraviolet curable adhesive, and the portion to which the wafer W has been previously applied is irradiated with ultraviolet rays, and the adhesive strength. Is stored and supplied in the wafer cassette 3 in a lowered state. Thereby, the chip C can be easily peeled from the adhesive sheet 1B. However, the portion adhering to the ring frame 1A is not sufficiently irradiated with ultraviolet rays because of the expansion before the pickup process.

  The heating means 29 is constituted by a hot air blower 30, and a plurality of hot air outlets 30 </ b> A are provided around the lower portion of the expand table 6 (see FIG. 4). Further, the outlet 30A is configured to be inclined in a predetermined direction, and the warm air blown from each outlet 30A rotates as indicated by arrows in FIG. 4, and the adhesive sheet 1B of the first wafer body W1 is rotated by the rotating hot air. Heats evenly and evenly. Further, in the present embodiment, an annular partition wall 31 is provided from the viewpoint of efficiently heating the first support 1 by preventing the leakage of warm air and promoting rotation, and the partition wall 31 is used to expand the first One wafer body W1 was configured to surround the outer periphery.

  As shown in FIGS. 1 and 2, the second support body supply unit M3 is disposed so as to partially cover the expanded unit M2, and includes a transport table 19, sheet pasting means 25, and second support. It is comprised by the body conveyance means 18.

  The transport table 19 has an upper surface as a support surface capable of sucking and holding the ring frame 2A, and the second support through a slider (not shown) attached to the lower surface and a track rail 44 of the slider. The lower part of the body conveying means 18 and the lower part of the sheet sticking means 25 are configured to be reciprocally movable. In the present embodiment, the ring frame 2A is supplied one by one onto the conveyance table 19 from the ring frame mounting table 26 by the articulated robot 17, and in this state, the conveyance table 19 moves toward the sheet pasting means 25, The adhesive sheet 2B is stuck on the ring frame 2A by the sheet sticking means 25.

  In the sheet sticking means 25, as shown in FIG. 12, an original fabric T in which an adhesive sheet 2B is temporarily attached to a strip-shaped release sheet RL is used, and the original fabric T is conveyed in the direction of the peel plate 27, and the peel plate 27 The release sheet RL is folded back sharply at the tip of. As a result, the adhesive sheet 2B is fed out from the release sheet RL, and the conveying roller 19 is moved in conjunction with the feeding operation, so that the press roller 28 presses and adheres the adhesive sheet 2B to the ring frame 2A. By such a series of operations, the sheet sticking means 25 forms the second support 2.

  The second support transport means 18 includes a suction pad 20, a lifting cylinder 22 that moves the suction pad 20 in the Z-axis direction, and a single-axis robot 21 that moves in the Y-axis direction. The suction pad 20 sucks and holds the second support body 2 formed in step S2, and the second support body 2 is placed on the first wafer body W1 waiting on the expanded table 6 in a state where the chip C interval is widened. Transport.

  The sheet bonding part M4 is provided between the suction pads 20 constituting the second support conveying means 18, and a press roller 23A as a bonding member and a pressing force in the Z-axis direction against the press roller 23A. And a cylinder 23C that moves the press roller 23A in the Y-axis direction. The second support 2 conveyed onto the first wafer body W1 is placed on the upper surface of the wafer W by the press roller 23A. Affix (see FIG. 3). In the present embodiment, as a specific configuration example of the press roller 23A, an elastically deformable roller longer than the spread width of the entire chip C is adopted, and simultaneously with the application of the second support 2 to the upper surface of the wafer W, The adhesive sheets 1B and 2B of the first and second supports 1 and 2 around the wafer W are bonded to each other (see FIG. 6).

  After completion of the pasting and pasting, the first wafer body W1 having the second support 2 stuck on the upper surface of the wafer W is heated by the heating means 29 as shown in FIG. At substantially the same time, the ring frame holding part 7 is raised, so that the adhesive sheet 1B of the first support 1 is released from the expanded state with thermal contraction. Thereafter, the first wafer body W1 to which the second support is affixed is transferred to the sheet peeling unit M5 in order to peel the first support 1.

  As shown in FIGS. 1 and 2, the sheet peeling unit M5 includes a guide member 33, a wafer body transport means 45 for transporting the first wafer body W1 and the second wafer body W2, an ultraviolet irradiation means 48, and a peeling trigger. The forming unit 46 and the separating unit 47 are included.

  The guide member 33 has a groove 33 </ b> A continuous with the inward holding groove 9 of each ring frame holding portion 7, and is fixed to the apparatus frame 49 via a stand 50.

  The wafer body transfer means 45 includes an upper and lower cylinder 41, a single-axis robot 40 that slides the upper and lower cylinder 41 in the X-axis direction, and a pair of claws 42A and 42B that move up and down by the upper and lower cylinder 41. The distance between the pair of claws 42A, 42B is slightly wider than the outer diameter of the ring frames 1A, 2A. When the pair of claws 42A and 42B are moved above the expanded table 6 by the single-axis robot 40, the upper and lower cylinders 41 are lowered, and the expanded state is released between the claws 42A and the claws 42B. The first wafer body W1 to which the support body 2 is attached enters. When the single-axis robot 40 moves in the X-axis direction, the first wafer body W1 to which the second support body 2 is attached is guided by the guide member 33 and above the separating means 47. Will come to be located.

  As shown in FIGS. 8 and 9, the ultraviolet irradiation means 48 is provided so as to be movable on the curved rail 51 via a slider 51 and a curved rail 51 having substantially the same curvature as the outer peripheral arc of the adhesive sheet 1B. An ultraviolet irradiation device 53, and the ultraviolet irradiation device 53 moves on the curved rail 51 by a driving device (not shown) with a predetermined gap between the lower surface side of the adhesive sheet 1B. The part bonded to the ring frame 1A is partially irradiated with ultraviolet rays. In this configuration, the ultraviolet irradiation range S (the range indicated by the shaded area in FIG. 10) is around the range where the peeling trigger portion 55 as the initial peeling position is to be formed.

  As shown in FIGS. 10 and 11, the peeling trigger forming means 46 is constituted by a rotary actuator 36 having a peeling spatula 35 attached to the tip of the rotating shaft 34. Two points shown in FIG. The spatula 35 enters between the first support body 1 and the second support body 2 by moving from the position of the chain line to the position indicated by the solid line. Then, by rotating the spatula 35 in the direction of the adhesive sheet 1B by the rotary actuator 36, a part of the adhesive sheet 1B is peeled from the ring frame 1A to form a peeling trigger portion 55.

  The separating means 47 includes a chuck cylinder 38 having a chuck 37 that holds the peeling trigger portion 55 formed by the peeling trigger forming means 46, and a single-axis robot 39 that moves the chuck cylinder 38 in the X-axis direction. Then, the single-axis robot 39 moves in the direction of the arrow b shown in FIG. 11 with the chuck 37 holding the peeling trigger portion 55, so that the adhesive sheet 1B of the first support 1 is peeled from the ring frame 1A. .

  Next, the overall operation of the rewriting apparatus configured as described above will be described.

  In the pasting apparatus M of the present invention, first, the articulated robot 17 takes out the first wafer body W1 from the wafer cassette 3 and transports it to the expanding unit M2. The transferred first wafer body W1 is arranged and set on the expand table 6 in a state where the ring frame 1A is inserted into the holding groove 9 of the ring frame holding unit 7. Then, when the ring frame holding portion 7 is lowered as shown in FIG. 3 via the elevating means 8, the adhesive sheet 1B of the first support 1 is stretched to be in an expanded state, and the chip C is formed by a camera or the like (not shown). The amount of spread of the interval is monitored, and when the interval between the chips C reaches a predetermined amount, the descent of the ring frame holding unit 7 is stopped.

  After that, the second support 2 in which the adhesive sheet 2B is attached on the ring frame 2A is formed by the sheet attaching means 25 of the second support supply unit M3. And the 2nd support body 2 is supplied on the wafer W with which the space | interval of chip | tip C spread by the 2nd support body conveyance means 18, and the adhesive sheet 2B of the wafer W of the wafer W is provided by the press roller 23A of the sheet bonding part M4. At the same time as being attached to the upper surface, the adhesive sheets 1B and 2B around the wafer W are attached (see FIG. 6).

  Subsequently, the expanded state of the first support 1 is released by raising the ring frame holding part 7 as shown in FIG. At this time, hot air blows out from the blowout port 30A of the hot air blower 30, and the adhesive sheet 1B of the first support 1 is released from the expanded state while being contracted by the heat of the hot air.

  After the operation for releasing the expanded state of the first support 1 is completed as described above, the claws 42A and 42B sandwich the first wafer body W1 to which the second support 2 is attached. In this state, it is conveyed to above the separating means 47 through the operation of the single-axis robot 40.

  Next, after the ultraviolet irradiation device 53 moves from the position of the two-dot chain line shown in FIG. 8 to the position shown by the solid line, it moves on the curved rail 51 via the slider 52, and the ring frame 1A in the entire adhesive sheet 1B. After partially irradiating the part adhering to the ultraviolet rays, it returns to the position of the original two-dot chain line.

  After that, as shown in FIG. 11, the spatula 35 enters between the first support 1 and the second support 2 and the rotary shaft 34 of the rotary actuator 36 rotates, so that the spatula 35 is peeled off. 55 is formed. Then, the chuck 37 holds the peeling trigger portion 55 and the single-axis robot 39 moves, whereby the adhesive sheet 1B of the first support 1 is peeled from the ring frame 1A, and the wafer W is peeled off from the second support 2 The second wafer body W2 is formed by the support, and the replacement is completed. The peeled adhesive sheet 1B is collected by a collecting means (not shown) as waste waste.

  Finally, the second wafer body W2 and the ring frame 1A of the first support 1 from which the adhesive sheet 1B has been peeled are returned in the direction of the expanding table 6 while being sandwiched between the claws 42A and 42B, and are articulated. The second wafer body W2 is stored in a predetermined position of the wafer cassette 3 that has been transferred by the robot 17, and the ring frame 1A is stored in a ring frame collection box (not shown). Then, the wafer cassette 3 storing the second wafer body W2 is transferred to the next process such as a chip mounting process (bonding process).

  As mentioned above, although embodiment of this invention was disclosed, this invention is not limited to this. For example, in the above-described embodiment, the wafer W is targeted as the plate-shaped member, but other plate-shaped members such as glass, a steel plate, or a resin plate can be used instead, and the wafer W is silicon. It may be a wafer or a compound wafer. Further, the plate-like member is not limited to a circular shape, and may be a polygonal shape.

The front view of the rewriting apparatus which is one Embodiment of this invention. FIG. 2 is a plan view of the pasting device in FIG. 1. The expanded side view of the expanded part which comprises the re-spreading apparatus of FIG. FIG. 2 is an enlarged plan view of an expanding part that constitutes the re-spreading apparatus of FIG. Explanatory drawing of a 1st support body and a 2nd support body. Operation | movement explanatory drawing when bonding a 1st support body and a 2nd support body. Operation | movement explanatory drawing when releasing the expanded state of a 1st support body. The enlarged front view of the sheet | seat peeling part which comprises the rewriting apparatus of FIG. The partially broken top view which looked at the 1st support body from the arrow d direction of FIG. The top view seen from the arrow a direction of FIG. The partial enlarged front view which shows a peeling trigger formation means. Explanatory drawing which showed an example of the sheet sticking means. Explanatory drawing of the conventional pasting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st support body 2 2nd support body 4 Expanding means 23A Press roller (bonding member)
23B Press device 29 Heating means C Chip M Pasting device M2 Expanding section (expanding means)
M3 Second support body supply section (supply means)
M4 sheet bonding part (bonding means)
M5 sheet peeling part (peeling means)
W Wafer (plate member)

Claims (4)

It is a rewriting device that renews a plate-like member supported by a first support body into a second support body,
Expanding means for expanding the chip support of the plate-like member by stretching the first support to be in an expanded state;
Supply means for supplying the second support;
Bonding means for bonding the second support to the plate member in a state where the chip interval of the plate member is widened;
Peeling means for peeling the first support,
The bonding means includes a bonding member for bonding the second support body and the first support body around the plate-shaped member, and the first support body and the second support body by the bonding member. After the pasting, the first support is released from the expanded state, and the first support is peeled off from the plate-like member.   The said pasting member consists of press rollers, The pasting apparatus of Claim 1 characterized by the above-mentioned. The re-spreading device further includes a heating means for heating the first support,
3. The sticking according to claim 1, wherein the first support is made of a heat-shrinkable adhesive sheet, and is released from an expanded state while being shrunk by heat of the heating means. Replacement device. It is a renewal method of reconstituting a plate-like member supported by a first support to a second support,
The chip support of the plate-like member is widened by stretching the first support to be in an expanded state. In this state, the second support is bonded to the plate-like member, and the first member around the plate-like member is attached. After bonding the first support and the second support, the first support is released from the expanded state, and the first support is peeled off from the plate member. Method.

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