JP5775745B2 - Peeling device - Google Patents

Description

The present invention relates to a stripping equipment.

2. Description of the Related Art Conventionally, there has been used an apparatus for manufacturing chips by dicing a semiconductor wafer (hereinafter referred to as “wafer”) attached to a first tape, and then transferring these chips to a second tape (for example, Patent Documents). 1).
In the apparatus described in Patent Document 1, after manufacturing a chip by dicing a wafer integrated with a first frame via a first UV tape, the chip is attached to a second UV tape to which a second frame is attached. Then, the first UV tape is peeled from the chip by pulling one end side of the first UV tape in the surface direction of the first UV tape.

JP 11-67697 A

  However, in the apparatus described in Patent Document 1, after the second UV tape is applied to the chip, the top and bottom of the first frame and the second frame are further switched, and the first UV tape is peeled off on the spot. There is a problem that the processing capability for peeling the first UV tape is not improved, and as a result, the manufacturing efficiency of the semiconductor device cannot be improved.

An object of the present invention is to provide a release equipment capable of improving the processing performance with a simple structure.

In order to achieve the object, the peeling device of the present invention has a first surface that is attached to one surface of the first adhesive sheet and supported by the frame member, and a second surface that is one of the second adhesive sheets. A peeling device for peeling the first adhesive sheet from a plate-like member affixed to a surface, the second sheet supporting the second adhesive sheet with a support surface in contact with the other surface side of the second adhesive sheet A supporting means; a moving means capable of moving the second sheet supporting means in a direction parallel to the first surface of the plate-like member; and applying a peeling force to the first adhesive sheet in a direction away from the plate-like member. Possible peeling force applying means, and the peeling force applying means includes a wedge portion whose thickness increases in the moving direction of the second sheet support means by the moving means, and the moving direction side with respect to the wedge portion. Displacement means provided on the front In write Mukoto enters between the wedge portion of the second adhesive sheet and the frame member supported on said second sheet supporting means during movement by said moving means, spaced said frame member from said second adhesive sheet In this case , a configuration is adopted in which the separated frame member is forcibly displaced in a direction in which the displacement means separates from the plate member .

Another stripping equipment of the present invention, the first surface is supported affixed to one surface and the frame members of the first adhesive sheet, second surface affixed to one surface of the second adhesive sheet A peeling device for peeling the first adhesive sheet from the plate-shaped member, wherein the second adhesive sheet is supported by a support surface in contact with the other surface of the second adhesive sheet; , A moving means capable of moving the second sheet supporting means in a direction parallel to the first surface of the plate-like member, and a peeling capable of giving a peeling force to the first adhesive sheet in a direction away from the plate-like member. A force imparting means, and the peeling force imparting means is provided on the moving direction side with respect to the wedge portion, and a wedge portion whose thickness increases in the moving direction of the second sheet supporting means by the moving means. First conveying means, and the wedge portion is The frame member is separated from the second adhesive sheet by entering between the second adhesive sheet supported by the second sheet supporting means being moved by the moving means and the frame member. A configuration is adopted in which the first conveying means is configured to convey the frame member in a direction gradually separating from the plate-like member.

Still another stripping equipment of the present invention, the first surface is supported by the one frame member is affixed to the surface of the first adhesive sheet, the second surface is one surface of the second adhesive sheet A peeling device for peeling the first adhesive sheet from the affixed plate-like member, wherein the second sheet supporting means supports the second adhesive sheet with a support surface in contact with the other surface side of the second adhesive sheet. A moving means capable of moving the second sheet supporting means in a direction parallel to the first surface of the plate-like member; and a peeling force can be applied to the first adhesive sheet in a direction away from the plate-like member. Peeling force applying means, and the peeling force applying means is provided on the moving direction side with respect to the wedge portion, the wedge portion increasing in thickness in the moving direction of the second sheet supporting means by the moving means. Second conveying means, and the wedge Parts By enters between the second the second adhesive sheet supported on the sheet supporting means during movement between the frame member by the moving means, is separated the frame member from the second adhesive sheet, wherein so as to maintain a state where the second adhesive sheet is moved in the same direction as the moving direction of the plate-like member, adopting the configuration of the second conveying means is arranged to convey the second adhesive sheet doing.

  According to the present invention as described above, the peeling force applying means enters between the second adhesive sheet being moved by the moving means and the frame member, and separates the frame member from the second adhesive sheet. While moving between processes, the first adhesive sheet can be peeled from the plate-like member. That is, since the movement of the plate-like member and the peeling of the first adhesive sheet can be performed simultaneously, it is not necessary to stop the plate-like member in order to peel off the first adhesive sheet, and the first adhesive sheet is removed per unit time. The processing capability for peeling can be improved, and as a result, the manufacturing efficiency of the semiconductor device can be improved. Also, if the peeling force applying means is installed in the movement path of the plate-like member and is provided so as to enter between the second adhesive sheet and the frame member, peeling can be performed with a simple configuration, and the apparatus can be enlarged and controlled. Can be prevented from becoming complicated.

At this time, peel force applying means, as long as it has a wedge portion displacement means, it can be separated from larger frame member. Therefore, not only the peeling force generated by the separation due to the wedge portion entering between the second adhesive sheet and the frame member but also the peeling force generated by the separation by the displacement means can be applied to the first adhesive sheet. The adhesive sheet can be peeled more reliably.

Further, if the peeling force applying means includes the first conveying means, the friction generated by the peeling force applying means entering between the second adhesive sheet and the frame member is reduced, and the first adhesive sheet is smoothly smoothed. Peeling can be performed.
Further, if the peeling force applying means has the second conveying means, the second adhesive sheet can be kept in the same direction as the moving direction of the plate-like member, so that it is affixed to the second adhesive sheet. The plate member is not displaced in the direction in which the peeling force of the first adhesive sheet is applied. Therefore, the frame member can be reliably separated, and the first adhesive sheet can be reliably peeled off.

1 is an overall view of a peeling apparatus according to an embodiment of the present invention. The top view which looked at a part of peeling apparatus of FIG. 1 from the upper surface. (A), (B), (C) is operation | movement explanatory drawing of a peeling apparatus. The elements on larger scale of the peeling apparatus which concerns on the modification of this invention. The top view which looked at some peeling apparatuses of FIG. 4 from the top. The elements on larger scale of the peeling apparatus which concerns on another modification of this invention. (A), (B), (C) is operation | movement explanatory drawing of the peeling apparatus of FIG.

Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
Further, in the present embodiment, unless otherwise specified, terms indicating directions such as “up”, “down”, “left”, and “right” are used with reference to FIG.
In FIG. 1, the peeling device 1 has a first surface W1 attached to one surface (upper surface) of the first adhesive sheet S1 and supported by a first ring frame RL1 as a frame member, and a second surface W2 The first adhesive sheet S1 is peeled off from the wafer W as a plate-like member attached to one surface (lower surface) of the second adhesive sheet S2, and the other surface (upper surface) side of the second adhesive sheet S2 is removed. A second sheet supporting means 2 for supporting the second adhesive sheet S2 with the supporting surface 21 in contact; a moving means 3 capable of moving the second sheet supporting means 2 in a direction parallel to the first surface W1 of the wafer W; Peeling force applying means 5 capable of applying a peeling force in a direction away from the wafer W to the adhesive sheet S1 and a collecting means 6 for collecting the wafer W from which the first adhesive sheet S1 has been peeled are provided.

  Note that an adhesive layer AD1 is provided on one surface of the first adhesive sheet S1, the wafer W and the first ring frame RL1 are attached to the adhesive layer AD1, and the second adhesive sheet S2 An adhesive layer AD2 is provided on one surface, and the wafer W and the second ring frame RL2 are attached to the adhesive layer AD2.

  The second sheet support means 2 is configured to be capable of sucking and supporting the second adhesive sheet S2 through a suction hole (not shown) provided in the planar support surface 21 by a pressure reduction means such as a pressure reduction pump or a vacuum ejector (not shown). ing.

  The moving means 3 includes a linear motor 31 which is a driving device, and the second sheet supporting means 2 is supported by the slider 32.

The peeling force applying means 5 is supported by a frame (not shown), and as shown in FIG. 2, two peeling force applying means 5 are provided with substantially the same dimensions as the inner diameter R of the first ring frame RL1.
In FIG. 1, the peeling force applying means 5 is integrally formed with a wedge-shaped wedge portion 51 whose thickness increases in the moving direction of the second adhesive sheet S <b> 2 (from right to left) and on the left side of the wedge portion 51. And a flat plate portion 52 whose thickness does not change from right to left.
Then, the peeling force applying means 5 enters between the second ring frame RL2 and the first ring frame RL1 being moved by the moving means 3, and the first ring frame RL1 is moved to the second ring by the inclined surface 512 of the wedge portion 51. By guiding in a direction away from the frame RL2, a peeling force from the wafer W is applied to the first adhesive sheet S1.

  The collection unit 6 is supported by a frame (not shown) and is provided on the left side of the peeling force application unit 5. The collection unit 6 is a rotation motor 61 that is a driving device, a rotation shaft 62 attached to the output shaft of the rotation motor 61, and a support A holding arm 64 supported by a rotating shaft 62 via a member 63 and an output shaft 66 of a linear motor 65 which is a driving device provided at both ends of the holding arm 64 are supported by suction means such as a suction pump (not shown). A suction pad 67 communicated with the mounting table 68 is provided below the holding arm 64.

  In the peeling apparatus 1 described above, as a procedure for peeling the first adhesive sheet S1 from the wafer W, the second adhesive sheet S2 is sucked and held on the support surface 21 by the second sheet support means 2 as shown in FIG. Then, a gap is formed between the first ring frame RL1 and the second ring frame RL2 due to the weight of the first ring frame RL1. When this gap is not formed, the first ring frame RL1 is sucked or grasped and pulled down to forcibly form a gap between the first ring frame RL1 and the second ring frame RL2. You may employ | adopt a forced gap formation means (illustration omitted).

Next, when the leading end in the moving direction of the second sheet support means 2 fixed to the slider 32 by driving the linear motor 31 moves to the position indicated by 2A in FIG. 1, as shown in FIG. The tip 511 of the applying means 5 enters between the moving second ring frame RL2 and the first ring frame RL1. Then, when the movement of the second sheet supporting means 2 is continued and the tip in the moving direction moves to the position indicated by 2B in FIG. 1, the inclined surface of the peeling force applying means 5 as shown in FIG. The first ring frame RL1 gradually moves along the direction 512 away from the second ring frame RL2. Along with this separation, the first adhesive sheet S1 is pulled downward, and this becomes a peeling force, and peeling from the wafer W is started.
Then, when the tip of the second sheet supporting means 2 in the moving direction passes through the wedge portion 51 and reaches the flat plate portion 52 as shown by 2C in FIG. 1, as shown in FIG. The first adhesive sheet S1 is peeled off from the first ring frame RL, and the first ring frame RL1 and the first adhesive sheet S1 are collected by a collecting unit (not shown). 3A, 3 </ b> B, and 3 </ b> C are views of the peeling device 1 as viewed from the upstream side in the moving direction of the second sheet support means 2 toward the downstream side.

  After that, when the driving of the linear motor 31 continues and the second sheet support means 2 reaches above the collecting means 6, the suction pad 67 rises by the driving of the linear motor 65 and comes into contact with the second ring frame RL2. While the suction is started, the suction holding of the second sheet support means 2 is released. Then, after the second sheet supporting means 2 is returned to the initial position, the rotation of the wafer W is rotated 180 degrees by driving the rotation motor 61, and the suction pad 67 is moved downward to release the suction. Thereby, the wafer W supported by the second ring frame RL2 via the second adhesive sheet S2 is placed on the placement table 68.

  According to the embodiment as described above, the peeling force applying means 5 enters between the moving second ring frame RL2 and the first ring frame RL1, and applies the peeling force to the first adhesive sheet S1, so that the wafer The movement of W and the peeling of the first adhesive sheet S1 can be performed at the same time, and the processing capability of peeling the first adhesive sheet S1 per unit time can be improved. Further, since the peeling force applying means 5 is installed in the moving path of the wafer W and is provided so as to enter between the second ring frame RL2 and the first ring frame RL1, the apparatus has a simple configuration and can be increased in size. In addition, the control is not complicated.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, as shown in FIGS. 4 and 5, the peeling force applying means 5 </ b> A may be composed of a wedge portion 51 and a displacement means 53 </ b> A disposed on the left side of the wedge portion 51. The displacement means 53A includes a linear motor 531A and a displacement member 533A supported by the output shaft 532A of the linear motor 531A.
Then, after separating the first ring frame RL1 from the second ring frame RL2 by the wedge portion 51, the peeling force applying means 5A moves the displacement member 533A by the linear motion motor 531A as shown by a two-dot chain line in FIG. Moving downward, the first ring frame RL1 is forcibly displaced downward, and the first ring frame RL1 is further separated from the second ring frame RL2.

  Further, as shown in FIG. 6, the peeling force applying means 5B has a wedge part 51B having a length smaller than the wedge part 51, a first conveying means 54B provided on the left side of the wedge part 51B, and the first conveying means 54B. You may comprise with the 2nd conveyance means 55B provided in the upper side of the conveyance means 54B.

  The first transport means 54B transports the first ring frame RL1 gradually away from the wafer W, and includes a pulley 541B adjacent to the wedge portion 51B, a pulley 542B disposed on the left side of the pulley 541B, These pulleys 541B and 542B are configured to include an endless belt 543B wound around the pulleys 541B and 542B, and a rotation motor 544B that is a driving device that rotationally drives the pulley 542B. The lower inclined surface 545B in FIG. 6 formed by the endless belt 543B is provided along the extending direction of the inclined surface 512B of the wedge portion 51B. A displacement member 56B that displaces the pulley 542B in a direction away from the second ring frame RL2 may be provided. The displacement member 56B includes a rotation shaft 561B and a linear motor 562B supported by the rotation shaft 561B, and an output shaft 563B of the linear motor 562B is connected to the rotation motor 544B.

  The second transport means 55B transports the second ring frame RL2 in the same direction as the movement direction of the wafer W, and includes a pulley 551B adjacent to the wedge portion 51B and a pulley 552B disposed on the left side of the pulley 551B. The endless belt 553B is wound around the pulleys 551B and 552B, and the rotation motor 554B is a driving device that rotationally drives the pulley 552B. The upper support surface 555B in FIG. 6 formed by the endless belt 553B is provided along the extending direction of the upper surface 513B of the wedge portion 51B.

As shown in FIG. 7 (A), the peeling force applying means 5B is configured such that the second conveying means 55B uses the second ring frame RL2 separated from the first ring frame RL1 by the wedge part 51B as the second sheet support means 2. With this movement, the sheet is sequentially supported by the support surface 555B and conveyed from the pulley 551B toward the pulley 552B so as to be sandwiched between the support surface 555B and the support surface 21 of the second sheet support means 2.
On the other hand, the first conveying means 54B separates the first ring frame RL1 from the second ring frame RL2 by the wedge part 51B, and then, as shown in FIG. 7B, the first conveying means 54B uses the endless belt 543B of the first conveying means 55A. The first ring frame RL1 is transported in a direction gradually away from the wafer W along the inclined surface 545B. Then, as shown in FIG. 7C, when the first ring frame RL1 is transported to the lower side of the pulley 542B, the first adhesive sheet S1 is peeled off from the wafer W and the first ring frame RL1 is transported. finish. At this time, the displacement member 56B can be displaced so as to drive the linear motor 562B and push the pulley 542B downward, and the first ring frame RL1 is further separated from the second ring frame RL2. Thus, the first adhesive sheet S1 can be reliably peeled off.

In the embodiment, the second ring frame RL2 is provided, but the second ring frame RL2 may not be provided.
Further, the second sheet supporting means 2 is stopped and the peeling force applying means 5, 5A, 5B is moved, or both the second sheet supporting means 2 and the peeling force applying means 5, 5A, 5B are moved. In this case, the first adhesive sheet S1 may be peeled from the wafer W.
The plate-like member may be a wafer W that has not been diced.

  Furthermore, the types and materials of the first and second adhesive sheets S1, S2 in the present invention are not particularly limited, for example, those having an intermediate layer between the base sheet and the adhesive layers AD1, AD2, Three or more layers, such as having other layers, may be used. Further, the first and second adhesive sheets S1 and S2 may be protective sheets, dicing tapes, die attach films, other arbitrary sheets, films, tapes, and the like, adhesive sheets having arbitrary uses and shapes. Examples of semiconductor wafers include silicon semiconductor wafers and compound semiconductor wafers, and the plate-like members include not only optical disks, glass plates, steel plates, resin plates, and other members, but also members and articles of any form. Can be targeted.

  Further, the drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 ... Peeling device 2 ... 2nd sheet | seat support means 3 ... Moving means 5, 5A, 5B ... Peeling force provision means 53A ... Displacement means 54B ... 1st conveyance means 55B ... 2nd conveyance means RL1 ... 1st ring frame (frame member) )
RL2 ... second ring frame S1 ... first adhesive sheet S2 ... second adhesive sheet W ... wafer (plate-like member)
W1 ... 1st surface W2 ... 2nd surface

Claims (3)

From the plate-like member having the first surface attached to one surface of the first adhesive sheet and supported by the frame member, and the second surface attached to one surface of the second adhesive sheet, the first adhesive sheet A peeling device for peeling
Second sheet support means for supporting the second adhesive sheet with a support surface in contact with the other surface side of the second adhesive sheet;
Moving means capable of moving the second sheet supporting means in a direction parallel to the first surface of the plate-like member;
A peeling force imparting means capable of imparting a peeling force to the first adhesive sheet in a direction away from the plate-like member,
The peeling force applying means has a wedge portion whose thickness increases in the moving direction of the second sheet support means by the moving means, and a displacement means provided on the moving direction side with respect to the wedge portion, in write Mukoto enters between the second second adhesive sheet supported on the sheet supporting means during movement the frame member by the wedge portion is the moving means, the frame member from the second adhesive sheet A peeling apparatus configured to be separated and to forcefully displace the separated frame member in a direction in which the displacement means separates from the plate member . From the plate-like member having the first surface attached to one surface of the first adhesive sheet and supported by the frame member, and the second surface attached to one surface of the second adhesive sheet, the first adhesive sheet A peeling device for peeling
  Second sheet support means for supporting the second adhesive sheet with a support surface in contact with the other surface side of the second adhesive sheet;
  Moving means capable of moving the second sheet supporting means in a direction parallel to the first surface of the plate-like member;
  A peeling force imparting means capable of imparting a peeling force to the first adhesive sheet in a direction away from the plate-like member,
  The peeling force applying means includes a wedge portion whose thickness increases in the moving direction of the second sheet supporting means by the moving means, and a first conveying means provided on the moving direction side with respect to the wedge portion. And the wedge part enters between the second adhesive sheet supported by the second sheet supporting means being moved by the moving means and the frame member, so that the frame member is removed from the second adhesive sheet. A peeling apparatus configured to convey the separated frame member in a direction in which the first conveying unit gradually separates from the plate-like member. From the plate-like member having the first surface attached to one surface of the first adhesive sheet and supported by the frame member, and the second surface attached to one surface of the second adhesive sheet, the first adhesive sheet A peeling device for peeling
  Second sheet support means for supporting the second adhesive sheet with a support surface in contact with the other surface side of the second adhesive sheet;
  Moving means capable of moving the second sheet supporting means in a direction parallel to the first surface of the plate-like member;
  A peeling force imparting means capable of imparting a peeling force to the first adhesive sheet in a direction away from the plate-like member,
  The peeling force applying means includes a wedge portion whose thickness increases in the moving direction of the second sheet supporting means by the moving means, and a second conveying means provided on the moving direction side with respect to the wedge portion. And the wedge part enters between the second adhesive sheet supported by the second sheet supporting means being moved by the moving means and the frame member, so that the frame member is removed from the second adhesive sheet. The second conveying means is configured to convey the second adhesive sheet so as to be spaced apart and maintain the state in which the second adhesive sheet moves in the same direction as the movement direction of the plate-like member. A peeling device characterized by the above.

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