JP6349193B2 - Sheet peeling apparatus and peeling method - Google Patents

Description

The present invention relates to a sheet peeling apparatus and a peeling how.

  2. Description of the Related Art Conventionally, a sheet peeling apparatus that peels an adhesive sheet attached to an adherend is known (see, for example, Patent Documents 1 and 2).

JP 2005-175253 A JP 2010-165901 A

However, the sheet peeling apparatus described in Patent Document 1 requires a peeling adhesive sheet for peeling the adhesive sheet from the adherend, and thus has a disadvantage that running cost increases.
Moreover, since the sheet peeling apparatus described in Patent Document 2 is configured to adsorb the edge of the adhesive sheet with the suction pad and peel it from the adherend, when the adhesive sheet is lifted by the suction force, By trying to deform into a conical shape following the shape of the suction pad, air does not enter between the adherend and the adhesive sheet, and air does not enter between the adherend and the support surface that supports the adherend. In some cases, the adherend is lifted together with the adhesive sheet and may be damaged.

An object of the present invention is to provide a sheet peeling apparatus and a peeling how it is possible to reduce the running cost.
Another object of the present invention, upon the release of the adhesive sheet is to provide a sheet peeling apparatus and a peeling how it is possible to prevent the adherend is damaged lifted together with the adhesive sheet.

The sheet peeling apparatus according to the present invention forms a peeling start part that forms a peeling start part partially peeled from the adherend on the adhesive sheet by rolling up the end of the adhesive sheet affixed to the adherend. And a gripping means for gripping the peeling start portion, wherein the peeling start portion forming means is provided with a hook portion that hooks up an end portion of the adhesive sheet, and the gripping means forms the peeling start portion. The peeling start portion can be gripped by means, and the adhesive sheet is peeled from the adherend by the relative movement of the adherend and the gripping means.

In the sheet peeling apparatus of the present invention, the hook portion is provided on the opposite side of the base end side with respect to the high rigidity portion and a high rigidity portion provided on the base end side, and is more rigid than the high rigidity portion. It is preferable to have a low low rigidity portion .

In the sheet peeling method of the present invention, the end of the adhesive sheet affixed to the adherend is hooked by the peeling start portion forming means and lifted up to start peeling, in which the adhesive sheet is partially peeled from the adherend. A step of forming a part, a gripping step of gripping the peeling start portion by a gripping means, and a step of peeling the adhesive sheet from the adherend by relative movement of the adherend and the gripping means. In the gripping step, the peeling start portion is gripped by the gripping means and the peeling start portion forming means .

According to the present invention as described above, the end portion of the adhesive sheet is hooked and rolled up, so that it is not necessary to use an adhesive sheet for peeling, and the running cost can be reduced.
In addition, since the adhesive sheet is not adsorbed and peeled off, it is possible to prevent the adherend from being lifted together with the adhesive sheet and damaged.

In addition, if a high-rigidity portion and a low-rigidity portion are provided in the hook portion, only the low-rigidity portion can be set to contact the adherend, and even if the adherend attacks the adherend, Damage to the body can be reduced. In addition, even when the adhesive sheet cannot be rolled up at the low-rigidity portion, the adhesive sheet can be rolled up at the high-rigidity portion, so that the peeling start portion can be reliably formed on the adhesive sheet.
Further, if the gripping means can grip the peeling start part with the peeling start part forming means, the peeling start part can be gripped by the extension of the operation of forming the peeling start part by the peeling start part forming means. The processing capacity per hour can be improved.

The side view of the sheet peeling apparatus which concerns on one Embodiment of this invention. Operation | movement explanatory drawing of the sheet peeling apparatus of FIG. The partial side view of the sheet peeling apparatus which concerns on the modification of this invention

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the following, without giving a reference figure, for example, when directions such as up, down, left, right, or near side, back side are shown, all of FIG. The top, bottom, left, and right directions are parallel to the page, the front is the front direction perpendicular to the page, and the back is the back direction perpendicular to the page. To do.

  In FIG. 1, the sheet peeling apparatus 10 lifts up the end of the adhesive sheet AS attached to the wafer WF as an adherend, whereby the peeling start part AS1 that partially peels from the wafer WF to the adhesive sheet AS. (Refer to FIG. 2) and a peeling start portion forming means 20 for forming the peeling start portion AS1 and a gripping means 30 for gripping the peeling start portion AS1, and the wafer WF and the gripping means 30 move relative to each other, so that the adhesive sheet AS is removed from the wafer WF. Is provided to be peelable. In the present embodiment, the wafer WF is transported by the moving means 40, so that the wafer WF and the gripping means 30 are relatively moved. Moreover, the peeling start part formation means 20 is the peeling start part formation apparatus of this invention.

  The peeling start part forming means 20 includes a linear motor 21 as a driving device, a linear motor 22 as a driving device supported by the slider 21A of the linear motor 21, and an output shaft via a bracket 22B on the slider 22A of the linear motor 22. A rotation motor 23 as a driving device on which 23A is supported, and a moving body 24 supported by the rotation motor 23 main body are provided. The moving body 24 includes a columnar rotating body 25 and a plurality of hooking portions 26 that are supported on the outer peripheral surface of the rotating body 25 and hook up the adhesive sheet AS. The hooking portion 26 is provided on the base end side, that is, the high-rigidity portion 27 provided on the rotating body 25 side, and on the opposite side of the base-end side with respect to the high-rigidity portion 27, and has a lower rigidity than the high-rigidity portion 27. And a low-rigidity portion 28. The high-rigidity portion 27 is inclined in the rotation direction RD (clockwise rotation direction) of the rotating body 25 with respect to the radial direction of the rotating body 25, and the low-rigidity portion 28 is opposite to the rotation direction RD with respect to the high-rigidity portion 27. Bent in the direction. Note that the rigidity of the high-rigidity portion 27 and the low-rigidity portion 28 is set to be lower than that of the wafer WF and higher than that of the adhesive sheet AS. Further, the hardness of the high-rigidity portion 27 and the low-rigidity portion 28 is set to be lower than the hardness of the wafer WF and higher than the hardness of the adhesive sheet AS.

  The gripping means 30 is supported by a linear motion motor 31 as a driving device, an output shaft 31A of the linear motion motor 31, a first gripping member 32 that supports the linear motor 21 on the front surface, and a first gripping member A linear motion motor 33 as a driving device supported on the rear surface of 32, a second gripping member 34 supported by an output shaft 33A of the linear motion motor 33, and an optical sensor or camera for detecting the peeling start portion AS1. And the like detection means 35. The first and second gripping members 32 and 34 are provided with convex portions 32B and 34B that improve the frictional force with the adhesive sheet AS on the opposing surfaces 32A and 34A facing each other.

  The moving means 40 is supported by a slider 41A of a linear motor 41 as a driving device, and includes a table 42 having a support surface 42A that can suck and hold the wafer WF by a decompression means (not shown) such as a decompression pump or a vacuum ejector.

A procedure for peeling the adhesive sheet AS from the wafer WF in the above sheet peeling apparatus 10 will be described.
First, with respect to the sheet peeling apparatus 10 in the state indicated by the solid line in FIG. 1 in which the respective members are arranged at the initial positions, when the operator or a conveying means (not shown) places the wafer WF on the table 42, the moving means 40 is illustrated. The pressure reducing means that is not operated is driven, and the wafer WF is sucked and held by the support surface 42A. Next, the moving means 40 drives the linear motor 41 to move the table 42 to a predetermined position below the peeling start portion forming means 20 and the gripping means 30 as indicated by a two-dot chain line in FIG. Next, the gripping means 30 drives the linear motion motor 31 to lower the first gripping member 32, and the lower end portion of the first gripping member 32 approaches the adhesive sheet AS as indicated by a two-dot chain line in the figure. Let At this time, the lower end part of the 1st holding member 32 may contact | abut to adhesive sheet AS, and does not need to contact | abut. Next, the peeling start portion forming means 20 drives the linear motor 21 and moves so that the hook portion 26 located below the rotating body 25 is located on the right side of the adhesive sheet AS, as indicated by a two-dot chain line in FIG. The body 24 is moved.

  Next, the peeling start portion forming means 20 drives the linear motor 22 and the rotation motor 23 to move the moving body 24 to the left while rotating it in the RD direction, so that the low rigidity portion 28 becomes the end of the adhesive sheet AS. As shown in FIG. 2A, the end portion of the adhesive sheet AS is rolled up to form the peeling start portion AS1. Even if the end portion of the adhesive sheet AS cannot be lifted by the low-rigidity portion 28, the high-rigidity portion 27 contacts the end portion of the adhesive sheet AS by moving the moving body 24 further to the left. Therefore, as shown in FIG. 2B, the peeling start portion AS1 can be formed by rolling up the end portion of the adhesive sheet AS. If only the low-rigidity part 28 is set so as to contact the wafer WF, damage to the wafer WF can be reduced even if the hooking part 26 attacks the wafer WF. The high rigidity portion 27 may be set so as to contact the wafer WF.

  Thereafter, when the peeling start part AS1 is detected by the detection means 35 by the movement of the moving body 24 to the left, the peeling start part forming means 20 drives the linear motor 22 as shown in FIG. Stop. Next, after the gripping means 30 drives the linear motion motor 33 and moves the second gripping member 34 to the left, the peeling start portion forming means 20 stops driving the rotation motor 23. Thereby, the peeling start part AS1 is gripped by the first and second gripping members 32,. At this time, since the convex portions 32B and 34B bite into the peeling start portion AS1, the frictional force between the first and second gripping members 32 and 34 and the adhesive sheet AS is improved, and the peeling start portion AS1 can be reliably held. it can. Then, the moving means 40 drives the linear motor 41, moves the table 42 to the right, peels the entire adhesive sheet AS from the wafer WF, and when the table 42 reaches a predetermined position, the moving means 40 moves the linear motor 41. Stop driving. Thereafter, after the moving unit 40 stops driving the decompression unit (not shown), the operator or the transfer unit (not shown) transfers the wafer WF to the next process.

  When the entire adhesive sheet AS is peeled from the wafer WF, the gripping means 30 drives the linear motion motor 33 to return the second gripping member 34 to the initial position with respect to the linear motion motor 33 and The adhesive sheet AS is dropped and accommodated in a sheet collecting means (not shown) such as a box or bag located below. Then, the peeling start part forming unit 20 and the gripping unit 30 drive the linear motors 21 and 22 and the linear motion motor 31 to return the moving body 24 and the first gripping member 32 to the initial positions, and thereafter the same operation is repeated. It is.

According to the embodiment as described above, since the end portion of the adhesive sheet AS is hooked and rolled up, it is not necessary to use the peeling adhesive sheet, and the running cost can be reduced.
Further, since the adhesive sheet AS is not adsorbed and peeled off, it is possible to prevent the wafer WF from being lifted together with the adhesive sheet AS and damaged.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

  For example, the hook portion may be a hook portion 26A as shown in FIG. The hook portion 26A is supported on the outer peripheral surface of the rotating body 25, the surface on the rotation direction RD side is a plane or arc surface along the radial direction of the rotation body 25, and the surface on the opposite direction side to the rotation direction RD is A low-rigidity portion 28A that is a curved surface that approaches a surface on the rotational direction RD side as the distance from the rotational body 25 increases, and a surface on the rotational direction RD side in the low-rigidity portion 28A. And a high-rigidity portion 27 </ b> A that extends to the middle of the low-rigidity portion 28 </ b> A. In the case of such a hooking portion 26A, the rigidity on the tip side is lower than that on the rotating body 25 side. Therefore, the high-rigidity portion 27A does not have to be composed of another member.

  The hook portion may be a hook portion 26B as shown in FIG. The hooking portion 26B is provided on the surface on the rotation direction RD side of the low rigidity portion 28B and the low rigidity portion 28B extending in the radial direction of the rotation body 25 from the outer peripheral surface of the rotation body 25. And a high-rigidity portion 27B extending from the surface side to the middle of the low-rigidity portion 28B. In the case of such a hooking portion 26A, the low-rigidity portion 28B and the high-rigidity portion 27B are arranged in the radial direction of the rotating body 25 as in the embodiment without partially forming the low-rigidity portion 28B as the high-rigidity portion 27B. You may divide by.

  The moving body may be a moving body 24A as shown in FIG. The moving body 24A spans a drive pulley 29A supported by the output shaft 23A of the rotation motor 23, a driven pulley 29B provided at a predetermined distance from the drive pulley 29A, and the drive pulley 29A and the driven pulley 29B. The endless belt 29 </ b> C and the hook portion 26 supported on the outer peripheral surface of the endless belt 29 </ b> C are supported by the slider 22 </ b> A of the linear motor 22. Also in this case, it is good also as above-mentioned hook part 26A, 26B instead of the hook part 26. FIG.

Friction with the adhesive sheet AS by roughening the surface or providing convex or concave portions on the contact surface side of the high rigidity portions 27, 27A, 27B and the low rigidity portions 28, 28A, 28B with the adhesive sheet AS. Frictional force improving means for improving the force may be provided. Such a frictional force improving means may be configured such that the high rigidity portions 27, 27A, 27B side and the low rigidity portions 28, 28A, 28B have different friction forces, or may be configured to have the same friction force. Good.
The high-rigidity portions 27, 27A, 27B and the low-rigidity portions 28, 28A, 28B may be composed of members such as rubber, resin, sponge, metal, cloth, paper, or a combination of them.
The high rigidity portions 27, 27A, 27B and the low rigidity portions 28, 28A, 28B may all be set higher than the rigidity and hardness of the wafer WF.
The high rigidity portions 27, 27A, 27B and the low rigidity portions 28, 28A, 28B may all be set lower than the rigidity and hardness of the adhesive sheet AS.
The high rigidity portions 27, 27A, 27B and the low rigidity portions 28, 28A, 28B may be set higher than the rigidity and hardness of the wafer WF and lower than the rigidity and hardness of the adhesive sheet AS.
One hook 26 may be provided.
The rotating body 25 may have another shape such as a disk shape or a polygonal column.
In the state of FIG. 2C, the peeling start portion forming means 20 rotates the moving body 24 until the peeling start portion AS1 is detected by the detecting means 35, that is, until the peeling start portion AS1 is formed. Alternatively, the moving body 24 may not be moved in the left-right direction, or the moving body 24 may be reciprocated in the left-right direction while rotating the moving body 24 from the state of FIG.

The gripping means 30 may grip the peeling start part AS1 with a chuck cylinder as a driving device having a pair of gripping claws.
The gripping means 30 may be configured to be able to grip the peeling start portion AS1 with the first gripping member 32 and the moving body 24 of the peeling start portion forming means 20. In this case, the direct acting motor 33 and the second gripping member 34 can be omitted.
Even if the adhesive sheet AS is peeled from the wafer WF while a pressing means such as a roller or air spray is provided at the lower end of the first gripping member 32 and the adhesive sheet AS and the wafer WF are pressed against the table 42 by the pressing means. Good.

The moving means 40 may stop the wafer WF and move the gripping means 30, or may move both the wafer WF and the gripping means 30.
The moving unit 40 may be configured to hold the wafer WF by a chuck unit such as a mechanical chuck or a chuck cylinder, an electrostatic chuck, an adhesive, a magnetic force, or the like.
When the wafer WF is transferred by another apparatus, the moving unit 40 may be omitted.

  In order to make it easy to form the peeling start part AS1 or to make it easier to peel the adhesive sheet AS from the wafer WF, an adhesive strength lowering means for reducing the adhesive strength of the adhesive sheet AS is provided, and the adhesive strength of the adhesive sheet AS The adhesive sheet AS may be rolled up after lowering. By providing such an adhesive force lowering means, it is possible to prevent the adhesive sheet AS once lifted up from reattaching to the wafer WF. Such an adhesive force lowering unit may be configured to spray a fluid cooled or heated to the adhesive sheet AS so that the adhesive force is reduced according to the characteristics of the adhesive sheet AS, for example. As the adhesive strength reducing means, if the adhesive of the adhesive sheet AS is one whose adhesive strength is reduced by electromagnetic waves such as ultraviolet rays, infrared rays, X-rays, microwaves, etc., an electromagnetic wave irradiation device capable of irradiating those electromagnetic waves should be adopted. What is necessary is just to employ | adopt an appropriate thing according to the property, structure, etc. of the adhesive agent of adhesive sheet AS. In addition, the structure which reduces the adhesive force of the whole adhesive sheet AS may be sufficient as an adhesive force fall means, and the structure which reduces the adhesive force of a part of outer edge of the adhesive sheet AS or the whole may be sufficient as it.

  The material, type, shape and the like of the adhesive sheet AS and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS may be a circle, an ellipse, a polygon such as a triangle or a quadrangle, or other shapes, or may be an adhesive form such as pressure-sensitive adhesiveness or heat-sensitive adhesiveness. Such an adhesive sheet AS is, for example, a single layer having only an adhesive layer, a layer having an intermediate layer between the base material and the adhesive layer, and a cover layer on the upper surface of the base material. The above-described ones, and further, a so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer may be used, and the double-sided adhesive sheet has a single-layer or multi-layer intermediate layer, It may be a single layer or multiple layers without an intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, as long as the gripping means can grip the peeling start portion, it is not limited in any way as long as it is within the technical scope in light of the technical common sense at the time of filing (about other means and processes). Will be omitted).
The drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition, it is possible to adopt a combination of them directly or indirectly (some of them overlap with those exemplified in the embodiment).

10 Sheet peeling device 20 Peeling start portion forming means (peeling start portion forming device)
26 Hooking portion 27 High-rigidity portion 28 Low-rigidity portion 30 Holding means AS Adhesive sheet AS1 Peeling start portion WF Wafer (Substrate)

Claims (2)

A peeling start part forming means for forming a peeling start part partially peeled from the adherend on the adhesive sheet by rolling up the end of the adhesive sheet affixed to the adherend;
Gripping means for gripping the peeling start portion,
The peeling start portion forming means includes a hook portion that hooks up an end portion of the adhesive sheet,
The gripping means is provided so as to be able to grip the peeling start portion with the peeling start portion forming means,
A sheet peeling apparatus that peels the adhesive sheet from the adherend when the adherend and the gripping means move relative to each other. A step of forming a peeling start part partially peeled from the adherend on the adhesive sheet by hooking the edge of the adhesive sheet affixed to the adherend with the peeling start part forming means and rolling it up,
A gripping step of gripping the peeling start portion with a gripping means;
A step of peeling the adhesive sheet from the adherend by relative movement between the adherend and the gripping means ;
In the gripping step, the peeling start portion is gripped by the gripping means and the peeling start portion forming means .

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