JP6468789B2 - Spacing device - Google Patents

Description

The present invention relates to a spacing equipment.

  Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter sometimes simply referred to as a wafer) is cut into a predetermined shape and a predetermined size and separated into a plurality of semiconductor chips (hereinafter sometimes simply referred to as chips). It has been practiced that the chips are separated from each other and the distance between the chips is increased before being mounted on a mounted object such as a lead frame or a substrate.

  As a separation method for widening the distance between chips (pieces), a frame support means (support means) for supporting a wafer (plate-like member) integrated with the frame via a film (adhesive sheet), and a film surface It is known to move the support mechanism (separation table) relative to each other (for example, see Patent Document 1). In such a method of widening the distance between the chips, for example, tension in two directions of the X-axis direction and the Y-axis direction is applied to the adhesive sheet, for example, it is detected that the chip located at the outermost circumference has reached a predetermined position. The operation of expanding the interval is completed when the means detects.

JP 2012-204747 A

However, in the conventional method as described in Patent Document 1, since two directions of tension are applied to the adhesive sheet at a time, the chips move in the two combined directions, and the intervals between the chips are increased. Differences are likely to occur. However, since such a difference in distance is extremely small, each chip is assumed to have an evenly expanded distance, and is transported based on a position derived by calculation (hereinafter sometimes referred to as a theoretical position). The product is transported by a transporting means such as a device or a pick-up device, and mounted on an object to be mounted to form a product. As a result, the relative positional relationship between the chip and the mounted object in the product may be slightly shifted, the connection position of wire bonding may be shifted, or the positions of the terminals of the chip and the mounted object may be shifted. As a result, the electrical connection between them cannot be obtained and the yield of the product is reduced.
Such a problem can occur not only in the manufacture of semiconductor devices but also in, for example, dense mechanical parts and fine decorative items.

An object of the present invention is to prevent the position of each piece from shifting from the theoretical position as much as possible when the interval between a plurality of pieces formed from a plate-like member is widened. It is to provide the separation equipment.

In order to achieve the above-mentioned object, the separation device of the present invention applies a tension in at least two directions intersecting each other to the plate-like member on the adhesive sheet, so that a plurality of pieces formed from the plate-like member are formed. A separation device for widening a mutual interval, wherein the first region and the second region facing each other in the adhesive sheet are supported by a first support unit and a second support unit, respectively, and the first and second support units are A first tension applying means for applying a tension in the one direction to the adhesive sheet by relatively moving in one of the directions, and a third support and a third area facing each other in the adhesive sheet. And second support means for applying tension to the adhesive sheet in the other direction by relatively moving the third and fourth support means in the other direction of the two directions. equipped with a door, the 1, second, third, fourth support means, wherein each within a predetermined plane formed by the two directions provided rotatably, the first in the first tensioning means, said second support means Relative movement in one direction and rotation of the first and second support means within the predetermined plane, and then relative movement of the third and fourth support means in the other direction by the second tension applying means the moved, and the third, fourth Ru support means is rotated in the predetermined plane, it adopts a configuration that.

At this time, in the separation device of the present invention, when applying tension in the one direction by the first tension applying unit, the separating device has an other direction shrinkage preventing unit that prevents the adhesive sheet from contracting in the other direction. preferable.
Moreover, in the separation apparatus of the present invention, it is preferable that the separation device includes a one-way shrinkage prevention unit that prevents the adhesive sheet from shrinking in the one direction when the second tension applying unit applies the tension in the other direction. .

  According to the present invention as described above, in order to spread the adhesive sheet separately step by step in one direction and the other direction, the piece-like body is in a state where the distance between the pieces is exactly widened in one direction. The distance between each other can be accurately widened in the other direction, and it becomes difficult for one state to move in the two combined directions. Thereby, when the space | interval of the several piece body formed from a plate-shaped member is expanded, it can prevent as much as possible that the position of each piece body will shift | deviate from a theoretical position.

  In addition, when the relative movement in one direction, the adhesive sheet is prevented from shrinking in the other direction, or when the relative movement in the other direction is prevented, the adhesive sheet is prevented from contracting in one direction. It is possible to further prevent the position of the piece from shifting from the theoretical position.

It is a side view of the separation apparatus which concerns on one Embodiment of this invention, and is AA-AA cross-section BB arrow directional view and CC-CC cross-section DD arrow directional view of FIG. The top view of the separation apparatus of FIG. (A), (B) is a mode figure of the adhesive sheet which provided tension | tensile_strength with the separation apparatus of this embodiment.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes within a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. And Furthermore, in the present embodiment, when viewed from the front side in FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis and “down” is the opposite direction, “ “Left” is the arrow direction of the X axis, “Right” is the opposite direction, “Front” is the arrow direction of the Y axis, and the “Rear” is the opposite direction in the front direction perpendicular to the paper surface in FIG.

  In FIG. 1 and FIG. 2, the separation device 10 applies a tension in the X-axis direction and the Y-axis direction as at least two directions intersecting each other to a rectangular wafer WF as a plate-like member on the adhesive sheet AS, thereby A separation device for widening the distance between chips CP as a plurality of pieces formed from WF, wherein the first region AS1 and the second region AS2 facing each other in the adhesive sheet AS are respectively separated by a first support means 20 and a first 2 is supported by the support means 30, and the first and second support means 20 and 30 are relatively moved in the X-axis direction as one of the two directions to apply tension in the X-axis direction to the adhesive sheet AS. The first tension applying means 40 and the third area AS3 and the fourth area AS4 facing each other in the adhesive sheet AS are supported by the third support means 50 and the fourth support means 60, respectively. 3. Second tension applying means 70 for applying relative tension to the adhesive sheet AS in the Y-axis direction by relatively moving the fourth support means 50, 60 in the Y-axis direction as the other of the two directions; When applying tension in the X-axis direction by the first tension applying means 40, the Y-axis direction shrinkage preventing means 80 as second-direction shrinkage preventing means for preventing the adhesive sheet AS from shrinking in the Y-axis direction, and second tension application When the tension in the Y-axis direction is applied by the means 70, the X-axis direction shrinkage prevention means 90 is provided as a one-way shrinkage prevention means for preventing the adhesive sheet AS from shrinking in the X-axis direction.

The wafer WF can be separated into chips CP by a wafer cutting means such as a cutting blade or pressurized water, or can be separated into chips CP by a wafer weakening means such as a laser beam or a chemical solution. Is affixed to be an integrated object WK.
The adhesive sheet AS extends from each apex AP of the polygonal surrounding area AC surrounding the adherend pasting area AW to which the wafer WF is stuck, to the outer edge direction of the adhesive sheet AS, and is in four directions with respect to the surrounding area AC. A non-interfering cut CU that prevents tension from being applied in the direction in which the tension is combined, and first to fourth areas AS1 to AS4 extending from each side of the surrounding area AC to both sides in the X axis direction and both sides in the Y axis direction. And is formed in a cross shape in plan view.

  The first and second support means 20 and 30 include lower gripping members 22 and 32 supported by the output shafts 21A and 31A of the linear motion rotation motors 21 and 31 as drive devices, and the lower gripping members 22 and 32, respectively. And upper gripping members 24 and 34 supported by output shafts 23A and 33A of rotation motors 23 and 33 as drive devices supported on the upper surface of the motor.

  The first tension applying means 40 includes a linear motor 41 as a drive device provided in a pair in the left-right direction, and supports the linearly-rotating motors 21 and 31 by respective sliders 42.

  The third and fourth support means 50 and 60 include support plates 52 and 62 supported by the output shafts 51A and 61A of linear motion rotation motors 51 and 61 as drive devices, and Y on each of the support plates 52 and 62. Supported by linear motors 53 and 63 (63 not shown) as drive devices supported via the lower part of the axial direction shrinkage prevention means 80 and their output shafts 53A and 63A (63A not shown). The lower grip bars 54 and 64 (64 is not shown), the rotation motors 55 and 65 as driving devices supported on the upper surfaces of the support plates 52 and 62, and the output shafts 55A and 65A. Supported by linear motion motors 57 and 67 as drive devices supported via the moving arms 56 and 66 and the upper portion of the Y-axis direction shrinkage prevention means 80 and their output shafts 57A and 67A (67A not shown). Gripped on top Over 58, 68 (68 not shown) and a.

  The second tension applying means 70 includes a linear motor 71 as a driving device provided in a pair in the front-rear direction, and supports the linearly-rotating motors 51 and 61 by respective sliders 72.

  The Y-axis direction shrinkage prevention means 80 includes a plurality of lower rollers 82 rotatably supported on a frame 81 supported on each of the support plates 52 and 62, and a frame 83 supported on each of the rotating arms 56 and 66, respectively. And a plurality of upper rollers 84 supported rotatably.

  The X-axis direction shrinkage prevention means 90 is rotatable to a lower linear motion motor 91 as a driving device supported by each slider 43 of each linear motor 41 and a frame 92 supported by each output shaft 91A. A plurality of lower rollers 93 supported, a linear motor 94 (not shown on the right side) as a driving device provided in a pair in the left-right direction above the first and second support means 20 and 30, and each of them. A linear motor 96 (right side not shown) supported by a slider 95 (right side not shown) and a frame 97 (right side not shown) supported by each output shaft 96A (right side not shown) are rotatably supported. And a plurality of upper rollers 98 (not shown on the right side).

A procedure for increasing the interval between the plurality of chips CP formed from the wafer WF in the spacing device 10 will be described.
First, as shown by a solid line in FIG. 1, a manual or unillustrated transport means such as a multi-joint robot or a belt conveyor transports the integrated object WK to the separation device 10 in which each member stands by at the initial position, and the adhesive sheet AS. The first to fourth areas AS1 to AS4 are placed on the lower gripping members 22 and 32 and the lower roller 82 of the Y-axis direction shrinkage prevention means 80. Next, the first and second support means 20 and 30 drive the rotation motors 23 and 33, and as shown in FIG. 2, the first and second regions AS1 and AS2 are divided into the lower gripping members 22 and 32 and the upper gripping member. Grip with 24, 34. Further, the third and fourth support means 50, 60 drive the rotation motors 55, 65, and as shown in the figure, the third area AS3 and the fourth area AS4 are arranged above the Y-axis direction shrinkage prevention means 80, It is gripped by the lower rollers 82 and 84.

  Thereafter, the first tension applying means 40 drives each linear motor 41, and as shown in FIG. 3A, the first support means 20 and the second support means 30 are moved in the + X axis direction and the −X axis direction, respectively. The adhesive sheet AS is moved and stretched in the X-axis direction. Thereby, the mutual space | interval of the X-axis direction of the some chip | tip CP formed from the wafer WF is expanded. At this time, since the third and fourth areas AS3 and AS4 are gripped by the upper and lower rollers 82 and 84, the surrounding area AC is allowed to extend in the X-axis direction, but the Y-axis direction is allowed to extend. Shrinkage is restricted, and each chip CP moves only in the X-axis direction. When the detection means (not shown) such as an optical sensor or an imaging means detects that the chips CP located on both sides in the X-axis direction have reached a predetermined position, the first tension applying means 40 drives each linear motor 41. Stop. At this time, the first and second support means 20 and 30 drive the linear motion rotation motors 21 and 31 and rotate the output shafts 21A and 31A within a predetermined plane to perform the swinging motion. The extending directions of the first and second regions AS1 and AS2 can be adjusted in the front-rear direction, so that the extension in the X-axis direction can be prevented from becoming uneven.

  Thereafter, the first tension applying means 40 and the X-axis direction shrinkage preventing means 90 drive the linear motors 41 and 94, respectively, and as shown in FIG. 3B, the extended first area AS1 and second area Lower and upper rollers 93 and 98 are arranged above and below AS2, respectively. Next, the X-axis direction shrinkage prevention means 90 drives the linear motion motors 91 and 96, and the extended first area AS1 and second area AS2 are gripped by the lower and upper rollers 93 and 98, respectively (FIG. 1). (See the part indicated by the two-dot chain line on the middle right). Thereafter, the third and fourth support means 50, 60 drive the linear motion motors 53, 63, 57, 67, and the third area AS3 and the fourth area respectively at the lower grip bars 54, 64 and the upper grip bars 58, 68. Hold AS4. The first and second support means 20 and 30 drive the rotation motors 23 and 33 to grip the first area AS1 and the second area AS2 with the lower gripping members 22 and 32 and the upper gripping members 24 and 34. To release.

  Next, the second tension applying means 70 drives each linear motor 71 and moves the third support means 50 and the fourth support means 60 in the + Y axis direction and the −Y axis direction, respectively, as shown in FIG. Then, the adhesive sheet AS is stretched in the Y-axis direction. Thereby, the mutual space | interval of the Y-axis direction of the some chip | tip CP formed from the wafer WF is also expanded. At this time, since the first and second areas AS1 and AS2 are gripped by the lower and upper rollers 93 and 98, the surrounding area AC is allowed to extend in the Y-axis direction, but in the X-axis direction. The extension is restricted, and each chip CP moves only in the Y-axis direction. Then, when detection means (not shown) such as an optical sensor or an imaging means detects that the chips CP located on both sides in the Y-axis direction have reached a predetermined position, the second tension applying means 70 drives each linear motor 71. Stop. At this time, the third and fourth support means 50, 60 drive the linear motion rotation motors 51, 61, and rotate the output shafts 51A, 61A within a predetermined plane to perform the swinging motion. The extending direction of the third and fourth regions AS3 and AS4 can be adjusted in the left-right direction, and the uneven extension in the Y-axis direction can be prevented.

  Thereafter, a transport means (not shown) such as a transport device or a pickup device holds and transports each chip CP with reference to a theoretical position, and mounts the chip CP on a mounted object such as a lead frame or a substrate. Thereafter, when the transfer of all the chips CP is completed, each means drives each drive device, and after each member of the separation device 10 is returned to the initial position, the transfer means transfers the integrated object WK from which the chips CP has been removed. Thereafter, the same operation as described above is repeated.

  According to the embodiment as described above, it is possible to prevent the position of each chip CP from deviating from the theoretical position as much as possible when the interval between the plurality of chips CP formed from the wafer WF is widened. it can.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description limited to the shape, material, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such is included in this invention.

  The first to fourth support means 20, 30, 50, 60 are used to hold the adhesive sheet AS by chuck means such as a mechanical chuck or a chuck cylinder, decompression means (not shown) such as a decompression pump or vacuum ejector, adhesive, magnetic force, etc. The structure which supports may be sufficient.

  One of the pair of first tension applying means 40 may be fixed and the other may be moved, or the other may be fixed and one may be moved. Also, one of the pair of second tension applying means 70 may be fixed and the other may be moved, or the other may be fixed and one may be moved.

The one-way shrinkage prevention means and the other-direction shrinkage prevention means may be composed of a plurality of pulleys and a belt wound around the pulleys, or may be composed of rubber or resin that extends in the same manner as the adhesive sheet. Good.
One-way shrinkage prevention means and other-direction shrinkage prevention means may be omitted.
The other-direction shrinkage prevention means may be omitted and only the one-way shrinkage prevention means may be provided, or the one-way shrinkage prevention means may be eliminated and only the other-direction shrinkage prevention means may be provided.
The one-way shrinkage prevention means and the other-direction shrinkage prevention means are provided with lower and upper rollers 93, 98, 82, 84, driving devices that rotate and drive pulleys and belts, and rubber or resin that stretches in the same manner as the adhesive sheet. In this case, the adhesive sheet AS can be more efficiently prevented from shrinking in the X-axis direction and the Y-axis direction, and the first and second tension applying means 40 can be provided. , 70 can also reduce the tension pulling the adhesive sheet AS.
The shape of the plate-like member or piece-like body may be, for example, a circle, an ellipse, a triangle, a polygon more than a pentagon, or any other shape.
Tensions in three or more directions intersecting each other may be applied to the plate-like member via the adhesive sheet, and the number of supporting means and tension applying means can be determined by the number of directions in which tension is applied.

There is no need for the non-interfering cut of the adhesive sheet.
When forming a non-interference notch, you may form after supporting an adhesive sheet with each support means.
The non-interference cut may be a single cut extending from each top AP in the direction of the outer edge of the adhesive sheet AS.
Cutting means such as an articulated robot having a cutter blade, a laser cutter, a thermal cutter, an air cutter, a compressed water cutter and the like can be used for forming the non-interference cut.

  Further, the material, type, shape and the like of the adhesive sheet AS in the present invention are not particularly limited. For example, the adhesive sheet AS may be a circle, an ellipse, a polygon such as a triangle or a rectangle, and other shapes. Also, the adhesive sheet AS is, for example, a single layer having only an adhesive layer, having an intermediate layer between the base material and the adhesive layer, or having a cover layer on the upper surface of the base material. Further, it may be a so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer, and the double-sided adhesive sheet has a single-layer or multi-layer intermediate layer, It may be a single layer or multiple layers without any. Furthermore, as a plate-shaped member, for example, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, an information recording substrate such as a circuit board or an optical disk, a glass plate, a steel plate, a ceramic, a wooden plate, a resin plate, or any other member Can also be used as a target, and the piece may be a piece that is a piece. Note that the adhesive sheet AS may be replaced with a functional or application reading, and may be any sheet such as a protective sheet, a dicing tape, a die attach film, a die bonding tape, a film, a tape, or the like.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, the first tension applying unit supports the first region and the second region facing each other in the adhesive sheet by the first supporting unit and the second supporting unit, respectively, and the first and second supporting units are supported in two directions. If it can be relatively moved in one direction to apply tension in the one direction to the adhesive sheet, it will be limited to the technical common sense at the beginning of the application and within the technical scope. There is no explanation of other means and processes.
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 ... Separating device 20 ... 1st support means 30 ... 2nd support means 40 ... 1st tension provision means 50 ... 3rd support means,
60: Fourth support means 70: Second tension applying means 80: Y-axis direction shrinkage prevention means (other-direction shrinkage prevention means)
90 ... X-axis direction shrinkage prevention means (unidirectional shrinkage prevention means)
AS ... Adhesive sheet AS1 ... 1st area AS2 ... 2nd area AS3 ... 3rd area AS4 ... 4th area CP ... Chip (piece-shaped body)
WF ... Wafer (plate member)

Claims (3)

A separation device that applies tension in at least two directions intersecting each other to the plate-like member on the adhesive sheet, and widens the interval between the plurality of pieces formed from the plate-like member,
The first region and the second region facing each other in the adhesive sheet are supported by the first support unit and the second support unit, respectively, and the first and second support units are relatively moved in one of the two directions. First tension applying means for applying tension in the one direction to the adhesive sheet;
The third region and the fourth region facing each other in the adhesive sheet are supported by the third support unit and the fourth support unit, respectively, and the third and fourth support units are moved relative to each other in the two directions. A second tension applying means for applying a tension in the other direction to the adhesive sheet,
The first, second, third, and fourth support means are provided so as to be rotatable within a predetermined plane formed in the two directions, respectively.
The first tension applying means relatively moves the first and second support means in the one direction , and the first and second support means are rotated in the predetermined plane, and then the second tension is applied. the grant means 3, the fourth support means are relatively moved in the other direction, and a feature that it is configured to so that by rotating said third and fourth support means within the predetermined plane Separation device.   2. The separation according to claim 1, further comprising an other-direction shrinkage preventing unit that prevents the adhesive sheet from shrinking in the other direction when the first tension applying unit applies the tension in the one direction. apparatus.   3. The unidirectional shrinkage preventing means for preventing the adhesive sheet from shrinking in the one direction when the second tension applying means applies tension in the other direction. The spacing device according to claim 1.

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