JP2016122708A - Separation device and separation method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a separation device capable of significantly widening a mutual interval of chip pieces, and a separation method.SOLUTION: A separation device 10 is configured to widen the mutual interval of a plurality of chip pieces CP each formed from a tabular member WF by applying a tension to an adhesive sheet AS to which the tabular member WF is stuck. The separation device comprises: hold means 20 for holding a hold area AS2 outside of a stick area AS1 in which the tabular member WF is stuck, in the adhesive sheet AS; abutment means 30 including a plurality of edge formation members 33C of which the outer edges are made into edge parts 33B; and tension application means 40 by which the adhesive sheet AS is abutted to the edge formation members 33C and the hold means 20 and the abutment means 30 are relatively moved, thereby applying the tension to the adhesive sheet AS while folding an interval between the stick area AS1 and the hold area AS2 in the adhesive sheet AS at the edge parts 33B. The abutment means 30 is provided in such a manner that the edge formation members 33C can be separated from each other along a surface of the tabular member WF.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a separation device and a separation method.

  Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter sometimes simply referred to as a “wafer”) is cut into a predetermined shape and a predetermined size, and is divided into a plurality of semiconductor chips (pieces). For example, Patent Document 1 discloses an apparatus that widens the mutual space between bodies.

JP 2007-123658 A

  However, the conventional apparatus described in Patent Document 1 has a disadvantage that the interval between the strips cannot be increased to a width larger than the upper surface of the tape expansion means (contact means).

  An object of the present invention is to provide a separation device and a separation method that can greatly increase the interval between pieces.

  In order to achieve the above object, a separating apparatus according to the present invention is a separating apparatus that applies tension to an adhesive sheet to which a plate-like member is attached to increase the interval between a plurality of pieces formed from the plate-like member. The holding means for holding the holding area outside the sticking area to which the plate-like member is stuck in the adhesive sheet, and the contact means having a plurality of edge forming members whose outer edge parts are edge parts, The adhesive sheet is brought into contact with an edge forming member, and the holding means and the contact means are moved relative to each other to bend the gap between the pasting area and the holding area of the adhesive sheet at the edge portion. The abutment means employs a configuration in which the edge forming member is provided so as to be separated from each other along the surface of the plate-like member.

In the separation device according to the aspect of the invention, it is preferable that the abutting means is provided so that the edge portion can be moved outward from the inner edge portion of the holding means.
In the separation apparatus of the present invention, the separation device includes a measurement unit that measures a mutual interval between the pieces, and the contact unit moves the edge forming member for each part with respect to the adhesive sheet based on the measurement result of the measurement unit. It is preferable to be provided.

  On the other hand, the separation method of the present invention is a separation method in which a tension is applied to an adhesive sheet to which a plate-like member is affixed to widen the interval between a plurality of pieces formed from the plate-like member. A step of holding a holding region outside the pasting region to which the plate-like member is pasted in the sheet, and a plurality of edge forming members having outer edge portions as edge portions are brought into contact with the adhesive sheet, and the holding region and the edge A step of bending the portion between the pasting region and the holding region of the adhesive sheet by the edge portion by relatively moving the forming member, and applying tension to the adhesive sheet; and the edge forming member as the plate-like member And a step of separating them from each other along the surface.

According to the present invention as described above, the plurality of edge forming members whose outer edge portions are edge portions are provided so as to be separated from each other along the surface of the plate-like member. Can be greatly expanded.
Further, since the edge forming member is provided so as to be movable outward from the inner edge portion of the holding means, the mutual interval between the strips can be greatly increased.
Furthermore, if a tension is applied to each part based on the measurement result obtained by the measuring means, the mutual interval between the pieces can be finely adjusted for each part.

The side view which shows the separation apparatus which concerns on one Embodiment of this invention. Operation | movement explanatory drawing of the said separation apparatus.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes within a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. And Furthermore, in the present embodiment, when viewed from the front side in FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis and “down” is the opposite direction, “ “Left” is the arrow direction of the X axis, “Right” is the opposite direction, “Front” is the arrow direction of the Y axis, and the “Rear” is the opposite direction in the front direction perpendicular to the paper surface in FIG.

  In FIG. 1 and FIG. 2A, the separating device 10 is a chip as a plurality of pieces formed from the wafer WF by applying tension to the adhesive sheet AS to which the wafer WF as a plate-like member is attached. A separation device for widening the mutual interval between CPs, a holding means 20 for holding a holding area AS2 outside the sticking area AS1 to which the wafer WF is stuck on the adhesive sheet AS, and a plurality of edge portions 33B. The abutting means 30 having the edge forming member 33C and the adhesive sheet AS are brought into contact with the edge forming member 33C, and the holding means 20 and the abutting means 30 are moved relative to each other to thereby apply the pasting area AS1 on the adhesive sheet AS. Light for measuring the mutual distance between the tip CP and the tension applying means 40 for applying tension to the adhesive sheet AS by bending the edge portion 33B with the holding region AS2. And a measuring means 50 such as a sensor or an imaging device. The wafer WF is separated into chips CP by a wafer cutting means such as a cutting blade or pressurized water, or can be separated into chips CP by a wafer weakening means such as a laser beam or a chemical solution. And is supported by a ring frame RF as a frame member to form an integrated object WK.

  The holding means 20 includes a pair of support members 21 formed with grooves 21A that can receive the ring frame RF. In the present embodiment, the ring frame RF is a member constituting the holding means 20.

  The contact means 30 includes four linear motors 32 as drive devices supported on a base plate 31 and a separation table 33 supported by a slider 32A of each linear motor 32. Each spacing table 33 includes an upright portion 33A extending in the vertical direction, and an edge formation in which the arc-shaped outer edge portion is formed as an edge portion 33B extending outward from the upper end of the upright portion 33A in the surface direction of the wafer WF. And a member 33C.

  The tension applying means 40 includes a linear motion motor 41 as a pair of drive devices that support the support member 21 with the respective output shafts 41 </ b> A and are supported on the lower surface of the base plate 31.

A procedure for increasing the interval between the plurality of chips CP formed from the wafer WF in the spacing device 10 will be described.
First, with respect to the separating device 10 in which each member indicated by a solid line in FIG. 1 stands by at an initial position, a conveying means (not shown) such as a human hand or an articulated robot or a belt conveyor conveys the integrated object WK, and FIG. As shown, the ring frame RF is inserted into the groove 21A of the support member 21, positioned, and then retracted.

  Next, the tension applying means 40 drives the linear motor 41 to lower the support member 21. Thereby, the space between the pasting area AS1 and the holding area AS2 in the adhesive sheet AS is bent at the edge portion 33B, tension is applied to the adhesive sheet AS, and the mutual interval between the chips CP is increased. Here, as shown by the two-dot chain line on the left side in FIG. 1, when the chip CP located at the outermost edge of the group of chips CP with the increased mutual distance reaches the vicinity of the edge portion 33B, the mutual distance between the chips CP is desired. Even if it is less than this value, the mutual interval cannot be increased further. Therefore, the contact means 30 drives the linear motor 32 to separate the edge portion 33B, that is, the separation table 33 from each other along the surface of the wafer WF. Based on the measurement result of the measuring means 50, the contact means 30 stops driving the linear motor 32 when the mutual distance between the chips CP reaches a desired value. At this time, the contact means 30 has the edge portion 33B outside the inner edge portion of the ring frame RF or the inner edge portion of the support member 21 as shown by the two-dot chain line on the right side in FIG. 1 and FIG. Can be arranged in the direction.

At this time, based on the measurement result of the measuring means 50, when there is a place where the mutual distance between the chips CP is deviated from a predetermined distance, the contact means 30 drives the linear motor 32 and the part with respect to the adhesive sheet AS. Separately, the spacing table 33 can be moved to perform the operation of widening the mutual spacing between the chips CP as much as possible. That is, for example, when the mutual interval between the chips CP in the right portion shown in FIG. 2B is narrower (larger) than the predetermined interval, the contact means 30 sets the mutual interval between the chips CP in the right portion in FIG. The linear motor 32 corresponding to the right part is driven so as to expand (shrink). Further, as in the present embodiment, when the two left and right portions of the ring frame RF are held by the holding means 20 and the distance between the chips CP is increased, the front and rear portions of the ring frame RF that are not supported by the holding means 20 are Tend to bend easily. For this reason, since the spread in the front-rear direction of the central portion in the chip CP group with the increased mutual spacing is reduced, the contact means 30 increases the mutual spacing of the chips CP in the front-rear direction of the central portion. The linear motor 32 corresponding to the part may be driven. It should be noted that which of the linear motors 32 is driven by the contact means 30 can be arbitrarily determined based on the experience value of the user when the mutual distance between the chips CP is increased or decreased. Also, the user can arbitrarily determine the location where the measuring means 50 measures the mutual distance between the chips CP.

  Thereafter, a conveying means (not shown) such as a conveying device or a pickup device holds and conveys each chip CP and mounts it on a mounted object such as a lead frame or a substrate. Thereafter, after the transfer of all the chips CP is completed, the tension applying means 40 and the contact means 30 drive the linear motion motor 41 and the linear motor 32 to return the support member 21 and the separation table 33 to the initial positions. The conveying means collects the integrated object WK from which the chip CP has been removed, and thereafter the same operation as described above is repeated.

  According to the embodiment as described above, the plurality of edge forming members 33C whose outer edge portions are the edge portions 33B are provided so as to be separated from each other along the surface of the wafer WF. It can be expanded more.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

The holding means 20 may be configured to support the adhesive sheet AS with chuck means such as a mechanical chuck or a chuck cylinder, decompression means (not shown) such as a decompression pump or a vacuum ejector, or an adhesive or magnetic force.
The holding unit 20 may directly support the adhesive sheet AS attached to the wafer WF without using the ring frame RF. In this case, the integrated object WK may or may not have the ring frame RF.
The place where the holding means 20 supports the adhesive sheet AS may be one place or three places or more.
The holding means 20 may be one body or three or more bodies.

The shape of each edge portion 33B of the contact means 30 may be an arc shape, an elliptical arc shape, a linear shape, or a shape obtained by appropriately combining these shapes, and the planar shape of the edge formed by the edge portion 33B is a circle. , Any shape such as an ellipse, a triangle or a polygon more than a quadrangle, a geometric shape, etc., a shape having a similar relationship larger than the planar shape of a plate-like body, or a shape not having a similar relationship .
The contact means 30 may not be able to apply tension to the adhesive sheet AS for each part.
The length measurement and fine adjustment of the mutual distance between the chips CP by the contact means 30 may be performed without being based on the measurement result of the measurement means 50, for example, based on the output value of the linear motor 32 or the slider 32A. Based on the position, the user may measure the mutual distance.
The separation table 33 may be two or three, or five or more, and the linear motor 32 may be provided according to the number.
The abutting means 30 may be configured to abut the edge portion 33B on the affixing surface to which the wafer WF is affixed. For example, the edge portion 33B is formed by a linear member without providing a surface parallel to the XY plane. A spacing table can be employed. In the case of only the edge portion 33B having no surface parallel to the XY plane, the ring frame RF of the integrated object WK that is inverted upside down with respect to the above embodiment is inserted into the groove 21A of the support member 21, and the wafer is The distance between the chips CP can be widened with WF on the lower side.

The tension applying unit 40 may move the contact unit 30 while fixing the holding unit 20, or may move both the holding unit 20 and the contact unit 30.
The tension applying means 40 stops the driving of the linear motor 41 when the chip CP located at the outermost edge of the chip CP group with the increased mutual spacing reaches the vicinity of the edge portion 33B. The linear motor 32 may be driven to increase the mutual distance between the chips CP, or the contact means 30 may drive the linear motor 32 without stopping the driving of the linear motion motor 41 to increase the mutual distance between the chips CP. Alternatively, the chip CP positioned at the outermost edge of the group of chips CP with the increased mutual spacing may be linked to the contact means 30 before the chip CP located in the vicinity of the edge portion 33B to increase the mutual distance between the chips CP.
The measuring means 50 may be omitted.

The shape of the plate-like member or piece-like body may be other shapes such as a circle, an ellipse, a triangle, or a polygon more than a quadrangle.
In addition to the ring frame, the frame member may have other shapes such as a non-circular frame (the outer periphery is not connected), a polygon other than a circle, a polygon such as a triangle or a rectangle, and an ellipse.

  Further, the material, type, shape and the like of the adhesive sheet AS in the present invention are not particularly limited. For example, the adhesive sheet AS may be a circle, an ellipse, a triangle or a polygon more than a quadrangle, and other shapes. Also, the adhesive sheet AS is, for example, a single layer having only an adhesive layer, having an intermediate layer between the base material and the adhesive layer, or having a cover layer on the upper surface of the base material. Further, it may be a so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer, and the double-sided adhesive sheet has a single-layer or multi-layer intermediate layer, It may be a single layer or multiple layers without any. Furthermore, as a plate-shaped member, for example, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, an information recording substrate such as a circuit board or an optical disk, a glass plate, a steel plate, a ceramic, a wooden plate, a resin plate, or any other member Can also be used as the object, and the piece may be any piece as long as they are separated. Note that the adhesive sheet AS may be replaced with a functional or application reading, and may be any sheet such as a protective sheet, a dicing tape, a die attach film, a die bonding tape, a film, a tape, or the like.

The means in the present invention is not limited in any way as long as the operations and functions described for these means can be achieved, and moreover, the means in the present invention are not limited to the structure of the simple embodiment described in the above embodiment. Absent. For example, if the holding means can hold the holding area outside the sticking area where the plate-like member is stuck on the adhesive sheet, it is in the technical scope in light of the common general technical knowledge at the beginning of the application. There is no limitation at all (the description of other means is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to the above, it is possible to adopt a combination of them directly or indirectly (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 ... Separating device 20 ... Holding means 30 ... Contact means 33B ... Edge part 33C ... Edge forming member 40 ... Tension applying means 50 ... Measuring means AS ... Adhesive sheet AS1 ... Adhering area AS2 ... Holding area CP ... Chip (strip-shaped body) )
WF ... Wafer (plate member)

Claims (4)

A separation device that applies tension to the adhesive sheet to which the plate-like member is attached to widen the interval between a plurality of pieces formed from the plate-like member,
Holding means for holding a holding region outside the pasting region to which the plate-like member is pasted in the adhesive sheet;
A contact means having a plurality of edge forming members whose outer edge portions are edge portions;
The adhesive sheet is brought into contact with an edge forming member, and the holding means and the contact means are moved relative to each other to bend the gap between the pasting area and the holding area of the adhesive sheet at the edge portion. A tension applying means for applying tension to the
The said contact means is provided so that the said edge formation member can be mutually spaced apart along the surface of the said plate-shaped member, The separation apparatus characterized by the above-mentioned.   The spacing device according to claim 1, wherein the abutting means is provided so that the edge portion can move outward from the inner edge portion of the holding means. Comprising a measuring means for measuring the distance between the pieces,
The spacing according to claim 1 or 2, wherein the abutting means is provided such that an edge forming member can be moved for each part with respect to the adhesive sheet based on a measurement result of the measuring means. apparatus. A separation method that applies tension to the adhesive sheet to which the plate-like member is attached to increase the interval between the plurality of pieces formed from the plate-like member,
Holding the holding region outside the pasting region to which the plate-like member is pasted in the adhesive sheet;
A plurality of edge forming members whose outer edge portions are edge portions are brought into contact with the adhesive sheet, and the holding area and the edge forming member are moved relative to each other, so that the area between the pasting area and the holding area in the adhesive sheet is reduced. Bending the edge part to apply tension to the adhesive sheet;
And a step of separating the edge forming members from each other along the surface of the plate-like member.

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