JP6408365B2 - Interval adjusting device and adjusting method - Google Patents

Description

  The present invention relates to an interval adjusting device and an adjusting method.

  Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) is cut into a predetermined shape and a predetermined size into a plurality of semiconductor chips (hereinafter sometimes simply referred to as “chips”). A separation method is known in which a sheet (adhesive sheet) is separated into pieces, and the sheet (adhesive sheet) is heated when the distance between the chips (pieces) is increased (see, for example, Patent Document 1).

JP 2004-146727 A

  However, in the conventional method as described in Patent Document 1, a difference occurs between the chips due to factors such as the material of the adhesive sheet and variations in heating. However, since the difference in such an interval is extremely small, each chip is assumed to have an equally wide interval, and the position derived by calculation (hereinafter, sometimes referred to as “theoretical position”) is used as a reference. Are transported by a transporting means such as a transporting device or a pick-up device, and mounted on an object to be mounted to form a product. As a result, the relative positional relationship between the chip and the mounted object in the product may be slightly shifted, the connection position of wire bonding may be shifted, or the positions of the terminals of the chip and the mounted object may be shifted. As a result, they cannot be connected to each other, and the yield of the product is lowered. Such a problem can occur not only in the manufacture of semiconductor devices but also in, for example, dense mechanical parts and fine decorative items.

  An object of the present invention is to provide an interval adjusting device and an adjusting method capable of making the intervals between the pieces into equal intervals as much as possible.

In order to achieve the above object, an interval adjusting device of the present invention is an interval adjusting device that adjusts an interval between a plurality of pieces attached on an adhesive sheet that can be expanded and contracted by a predetermined energy. an energy applying means for applying the predetermined energy to the sheet, and a measurable measuring means spacing of the strip-like body, said energy application device, based on the measurement result of said measuring means, said strip-like A configuration is adopted in which different amounts of the predetermined energy are applied to regions between the piece-like bodies in the adhesive sheet according to the interval between the bodies .

In this case, in the interval adjusting device of the present invention, the energy applying unit includes an energy applying member, and is provided so as to be able to scan the energy applying member along an interval line formed between the plurality of pieces. It is preferable.
In the interval adjusting device of the present invention, the plurality of pieces are formed from the plate-like member by applying a tension in at least one direction to the plate-like member on the adhesive sheet. It is preferable that a tension applying unit that applies tension to the sheet is provided.

On the other hand, the interval adjusting method of the present invention is an interval adjusting method for adjusting the interval between a plurality of pieces attached on an adhesive sheet that can be expanded and contracted by a predetermined energy. A step of measuring, and a step of applying a predetermined amount of the predetermined energy to a region between the piece-like bodies in the adhesive sheet based on the measurement result of the mutual interval. The structure of having is adopted.

  According to the present invention as described above, energy can be partially applied to the adhesive sheet to adjust the mutual spacing between the pieces, so that the mutual intervals between the pieces are made as equal as possible. can do.

  At this time, if the energy applying member is provided so as to be able to scan along the interval line, the intervals between the pieces can be made as equal as possible.

The side view of the space | interval adjustment apparatus which concerns on one Embodiment of this invention. FIG.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes within a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. And Furthermore, in the present embodiment, when viewed from the front side in FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis and “down” is the opposite direction, “ “Left” is the arrow direction of the X axis, “Right” is the opposite direction, “Front” is the arrow direction of the Y axis, and the “Rear” is the opposite direction in the front direction perpendicular to the paper surface in FIG.

  In FIG. 1, a gap adjusting device 10 is a device that widens the gap between chips CP as a plurality of pieces attached on an adhesive sheet AS that can be expanded and contracted by hot air or cold air as predetermined energy. Measuring means such as a tension applying means 20 for applying tension to the sheet AS, an energy applying means 30 for applying hot air or cold air to the adhesive sheet AS, and an optical sensor or camera (imaging means) capable of measuring the mutual distance between the chips CP. 40. The plurality of chips CP are formed from the wafer WF by applying a tension in at least one direction to the wafer WF as a plate-like member on the adhesive sheet AS. The wafer WF is separated into chips CP by a wafer cutting means such as a cutting blade or pressurized water, or can be separated into chips CP by a wafer weakening means such as a laser beam or a chemical solution. Thus, it is supported by a ring frame RF as a frame to be an integrated object WK. Moreover, in this embodiment, the adhesive sheet AS employs a property that expands when hot air is applied and contracts when cold air is applied.

  The tension applying means 20 includes a pair of support members 21 in which grooves 21A capable of receiving the ring frame RF are formed, and a support surface 22A having a planar shape larger than the wafer WF when viewed from the top, that is, from the top. And a support table 22 that supports the wafer WF via the adhesive sheet AS, and a linear motion motor 23 as a drive device that supports the support member 21 by each output shaft 23A.

  The energy applying means 30 is provided above the support table 22 and is driven by a pair of linear motors 31 as a driving device extending in the front-rear direction and a slider 31A of the linear motor 31 and extending in the left-right direction. A linear motor 32 as an apparatus and an energy applying member 33 supported by a slider 32A of the linear motor 32 and capable of applying hot air or cold air are provided, and energy is applied along a spacing line LN formed between a plurality of chips CP. The member 33 is provided so as to be able to scan.

A procedure for increasing the mutual distance between the plurality of chips CP formed from the wafer WF in the distance adjusting apparatus 10 will be described.
First, as shown by a solid line in FIG. 1, a manual or unillustrated transport means such as an articulated robot or a belt conveyor transports the integrated object WK to the interval adjusting device 10 in which each member stands by at an initial position, and the ring frame RF is inserted into the groove 21A of the support member 21 and retracted. At this time, the measuring unit 40 and a positioning unit (not shown) that can move the integrated object WK cooperate to position the wafer WF and the support surface 22A of the support table 22.

  Next, when the tension applying means 20 drives the linear motion motor 23 and lowers the support member 21, the adhesive sheet AS comes into contact with the support table 22, and then, as shown by a two-dot chain line in FIG. The sheet AS is stretched to increase the interval between the chips CP, thereby forming the interval line LN. Then, the fact that the chip CP located on the outermost periphery has reached a predetermined position, that is, the predetermined positions (on the two opposite sides) of the wafer WF (chip CP group with the mutual interval widened) separated and expanded (see FIG. Hereinafter, when the measuring means 40 detects that the predetermined width of the two opposing sides is sometimes referred to as a “reference position”, the tension applying means 20 stops driving the linear motor 23. At the same time, the measuring means 40 measures the mutual interval between the chips CP.

  At this time, in addition to the four directions of + X axis direction, −X axis direction, + Y axis direction, and −Y axis direction, tension is also applied to the adhesive sheet AS, so that each chip CP is As shown in FIG. 2A, there is a case where a difference occurs between the interval between the inner chip CP and the outer chip CP, and each chip CP may not be arranged at a theoretical position. Also, depending on the magnitude of tension in each direction, the material of the adhesive sheet AS, etc., as shown in FIGS. 2 (B) and 2 (C), each chip CP has a difference in mutual spacing between the chips CP. In some cases, the chip CP cannot be placed at a theoretical position. Note that the theoretical position of each chip CP is obtained by subtracting the width of the reference position of the wafer WF before being spread from the width of the reference position of the wafer WF that has been singulated and widened, and the interval line at the reference position. This is the position of each chip CP when each chip CP is spread evenly by the value divided by the number of LNs.

  Therefore, the energy applying unit 30 partially applies hot air or cold air to the adhesive sheet AS based on the measurement result of the measuring unit 40. That is, the energy applying means 30 drives the linear motors 31 and 32 and the energy applying member 33 to apply hot air or cold air to the adhesive sheet AS while moving the energy applying member 33 along the interval line LN.

  Here, for example, as a result of measurement by the measuring means 40, it is detected that each chip CP has been expanded as shown in FIG. 2A, and the energy applying member 33 along the interval line LN indicated by the arrow LN1 in FIG. When moving the energy, the energy applying means 30 performs the following operation. In other words, the energy applying means 30 drives the linear motor 32 to move the energy applying member 33 at a constant speed from the left end portion of the chip CP group having a wide interval to the right end portion of the chip CP group. At this time, the energy application means 30 drives the energy application member 33, blows hot air having a temperature higher than the ambient temperature at the left end of the chip CP group, and the temperature of the hot air gradually increases toward the center of the chip CP group. The temperature is controlled so as to decrease (for example, close to the atmospheric temperature), while the temperature of the hot air (for example, from the atmospheric temperature) increases from the center of the chip CP group toward the right end of the chip CP group. Temperature control is performed so that it gradually rises. Thereby, the mutual space | interval of each chip | tip CP which became small toward the left-right both ends is expanded with a hot air.

  In addition, when the energy applying member 33 is moved along the interval line LN indicated by the arrow LN2 in the same figure, the energy applying means 30 drives the linear motor 32 in the same manner as described above, from the front end of the chip CP group. The energy applying member 33 is moved at a constant speed over the rear end of the chip CP group. At this time, the energy application means 30 drives the energy application member 33, blows hot air having a temperature higher than the ambient temperature at the front end of the chip CP group, and the temperature of the hot air gradually increases toward the center of the chip CP group. The temperature control is performed so that the temperature of the hot air gradually increases from the center of the chip CP group toward the rear end of the chip CP group.

  When the interval between the central chips CP in the chip CP group is too wide and is in the state of FIG. 2A, for example, the energy applying member 33 along the interval line LN indicated by the arrow LN1 in FIG. , The energy applying means 30 is arranged so that the temperature of the cold air decreases from the left end of the chip CP group toward the center of the chip CP group (for example, from the ambient temperature). Temperature control is performed so that the temperature of the cold air increases from the center of the chip CP group toward the right end of the chip CP group (for example, finally reaches the ambient temperature).

  Such control of the energy applying means 30 is the same in the arrangement of the chips CP as shown in FIGS. 2B and 2C. Hot air is used in a portion where the distance between the chips CP is narrow, and the distance between the chips CP is wide. In the part, control is performed to blow cool air onto the adhesive sheet AS, and finally, as shown in FIG. 2 (D), the chips CP are arranged at theoretical positions (the mutual intervals between the chips CP are equal). To do).

  Thereafter, a transport means (not shown) such as a transport device or a pickup device holds and transports each chip CP with reference to a theoretical position, and mounts the chip CP on a mounted object such as a lead frame or a substrate. Thereafter, when the transfer of all the chips CP is completed, the tension applying means 20 drives the linear motion motor 23 to return the support member 21 to the initial position, and then the transfer means transfers the integrated object WK from which the chips CP has been removed. Thereafter, the same operation as described above is repeated.

  According to the embodiment as described above, the mutual distance between the chips CP can be adjusted by partially applying hot air or cold air to the adhesive sheet AS, so that the mutual distance between the chips CP is as equal as possible. Can be.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

The support member 21 may be configured to support the ring frame RF and the adhesive sheet AS by chuck means such as a mechanical chuck and a chuck cylinder, decompression means (not shown) such as a decompression pump and a vacuum ejector, and an adhesive and magnetic force.
The support member 21 may be configured to support the adhesive sheet AS when the integrated member is composed of the adhesive sheet AS and the wafer WF.

  The tension applying means 20 may move the support table 22 while fixing the support member 21, or may move both the support member 21 and the support table 22.

The energy imparting means 30 can impart various energies such as hot water, cold water, infrared rays, ultraviolet rays, and electromagnetic waves such as microwaves, and can be appropriately selected depending on the characteristics of the adhesive sheet AS.
The energy applying means 30 may apply only hot air or cold air to the adhesive sheet AS, may apply a gas obtained by mixing hot air and cold air to the adhesive sheet AS, or energy other than hot air and cold air. In the case of applying the pressure, only the energy for stretching or shrinking the adhesive sheet AS may be applied. For example, hot air and ultraviolet light may be applied simultaneously, or cold water, electromagnetic waves, and cold air may be applied simultaneously. Different types of energy may be applied simultaneously.
The energy applying means 30 may apply energy only to a portion where the mutual distance between the chips CP is narrow or wide, and may not apply energy to other than the narrow portion or wide portion. In this case, the energy applying member 33 may not be provided so as to be able to scan along the interval line LN.
The application region to which the energy application unit 30 applies energy may include the interval line LN, and may be an application region EA1 that does not include the chip CP, as illustrated in the symbol AA in FIG. May be an application area EA2 including a plurality of chips CP, an application area EA3 including a plurality of chips CP, or an application area EA4 including a plurality of interval lines LN and a plurality of chips CP.
The energy application means 30 makes the output of the energy application member 33 (the amount of energy per unit time of hot air or cold air) constant, and slows down the speed at which the energy application member 33 is scanned, whereby a predetermined region of the adhesive sheet AS. The amount of energy applied to the adhesive sheet AS may be reduced by increasing the amount of energy applied to the sheet and increasing the scanning speed, or the scanning speed may be constant and the air volume increased. Thus, the amount of energy applied to the predetermined region of the adhesive sheet AS may be reduced by increasing the amount of energy applied to the predetermined region of the adhesive sheet AS and decreasing the air volume.
The energy applying means 30 may be configured by the same device as the energy applying member 33 provided in the support table 22 and capable of applying energy from the support surface 22A.
The energy application means 30 may fix the energy application member 33 and move the support member 21, the support table 22, and the linear motor 23, or the energy application member 33, the support member 21, the support table 22, and the linear motion All of the motor 23 may be moved. When all of the energy applying member 33, the support member 21, the support table 22, and the linear motor 23 are moved, the energy applying member 33 is moved only along the X axis, and the support member 21, the support table 22, and the linear motor 23 are moved. The energy may be applied along the grid-like interval line LN by moving only along the Y axis or by rotating the support member 21, the support table 22, and the linear motion motor 23.
The energy applying unit 30 may partially apply energy to the adhesive sheet to which tension is applied by a device other than the interval adjusting device 10 based on the measurement result of the measuring unit 40. In this case, tension is applied. The means 20 is not necessary.
The energy applying unit 30 may collectively apply energy to a part of the plurality of chips CP group in which the mutual intervals are widened without causing the energy applying member 33 to scan along the interval line LN. .

The direction of tension applied to the wafer WF may be one direction or three or more directions, and a support unit and a tension applying unit may be provided in accordance with the number of the directions.
The shape of the plate member or piece may be other shapes such as a circle, an ellipse, a polygon such as a triangle or a quadrangle.
In addition to the ring frame, the frame may be a non-circular frame (the outer periphery is not connected), a polygon other than a circle, or a polygon such as a triangle or a rectangle, or an oval.
The interval line LN may be a curve or a line shape such as a polygonal line.

  Further, the material, type, shape and the like of the adhesive sheet AS in the present invention are not particularly limited. For example, the adhesive sheet AS may be a circle, an ellipse, a triangle, a polygon more than a pentagon, and other shapes. Also, the adhesive sheet AS is, for example, a single layer having only an adhesive layer, having an intermediate layer between the base material and the adhesive layer, or having a cover layer on the upper surface of the base material. Further, it may be a so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer, and the double-sided adhesive sheet has a single-layer or multi-layer intermediate layer, It may be a single layer or multiple layers without any. Furthermore, as a plate-shaped member, for example, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, an information recording substrate such as a circuit board or an optical disk, a glass plate, a steel plate, a ceramic, a wooden plate, a resin plate, or any other member Can also be used as a target, and the piece may be a piece that is a piece. Note that the adhesive sheet AS may be replaced with a functional or application reading, and may be any sheet such as a protective sheet, a dicing tape, a die attach film, a die bonding tape, a film, a tape, or the like.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, the measuring means is not limited insofar as it can measure the distance between the flakes in light of the common general technical knowledge at the time of filing and is within the technical scope (other means). And description of the process is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 ... Space | interval adjustment apparatus 20 ... Linear motion motor (tension provision means)
DESCRIPTION OF SYMBOLS 30 ... Energy provision means 33 ... Energy provision member 40 ... Measurement means AS ... Adhesive sheet CP ... Chip (piece-shaped body)
LN ... interval line WF ... wafer (plate-like member)

Claims (4)

An interval adjusting device that adjusts the mutual interval between a plurality of pieces attached on an adhesive sheet that can be expanded and contracted by a predetermined energy,
Energy applying means for applying the predetermined energy to the adhesive sheet;
Measuring means capable of measuring the interval between the pieces,
The energy applying unit applies a predetermined amount of the predetermined energy to a region between the piece bodies in the adhesive sheet based on a measurement result of the measurement unit. An interval adjusting device characterized by the above.   The said energy provision means is provided with the energy provision member, The said energy provision member is provided so that a scan is possible along the space | interval line formed between these several piece-like bodies. Spacing adjustment device. The plurality of pieces are formed from the plate member by applying a tension in at least one direction to the plate member on the adhesive sheet,
The distance adjusting device according to claim 1, further comprising a tension applying unit that applies tension to the adhesive sheet. An interval adjustment method for adjusting an interval between a plurality of pieces attached on an adhesive sheet that can be expanded and contracted by a predetermined energy,
Measuring the spacing between the pieces,
And a step of applying a predetermined amount of the predetermined energy to a region between the piece bodies in the adhesive sheet based on the measurement result of the mutual interval. An interval adjustment method characterized by the above.

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