JP2010283098A - Support member for plate-like member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a support member for a plate-like member capable of uniformly grinding the plate-like member such as a wafer to an extremely thin thickness by being stuck to the plate-like member, and capable of being easily released from the plate-like member without the use of large-scale equipment. <P>SOLUTION: The support member 10 includes a body 11 for supporting the semiconductor wafer W by being stuck to one surface of the semiconductor wafer W through a double-sided adhesive sheet A. A weak adhesion treatment surface 13 is formed t an outer edge side of a surface to which the double-sided adhesive sheet A is stuck in the body 11. The weak adhesion treatment surface 13 is formed of a protruded and recessed surface or formed by using a forming body 15 constituted by a member different from a member constituting the body 11. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a support member for a plate-like member, and more particularly to a support member for a plate-like member that is attached to the plate-like member so as to grind a plate-like member such as a semiconductor wafer extremely thinly and uniformly.

  Conventionally, a semiconductor wafer (hereinafter simply referred to as “wafer”) or the like is extremely thinned by grinding from the opposite side of the circuit surface. Since such grinding is performed until the wafer reaches several tens of μm, accurate grinding cannot be performed unless the wafer is supported on a smooth surface, so that the smooth surface is parallel to the front and back surfaces. A method using a formed support member such as an aluminum plate may be employed. Specifically, as disclosed in Patent Document 1, the wafer is supported by the support member by sticking the circuit surface of the wafer and the support member with an adhesive.

  Moreover, after finishing the grinding process, for example, the wafer is peeled from the support member by a method disclosed in Patent Document 2. In this document, a recess having a depth equal to the thickness of the support member is previously formed in the table. Then, after the support member to which the wafer is stuck is placed in the recess, the wedge-shaped piece member is slid on the table to insert the piece member between the wafer and the support member and peel to the outer edge side of the wafer. Form the opportunity to start.

JP 2002-76101 A JP 2004-356378 A

  However, when the wafer and the support member attached as in Patent Document 1 are peeled off as in Patent Document 2, a table having a concave portion formed with high accuracy, or a single member between the wafer and the support member is used. In order to insert the device, a device that operates with high accuracy is used.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and the purpose thereof is to attach it to a plate-like member such as a wafer and grind it extremely thinly and uniformly, and to peel it off from the plate-like member. In some cases, a support member for a plate-like member that can be easily peeled off without using a large-scale facility is provided.

In order to achieve the above object, the present invention provides a support member including a main body portion that supports the plate-like member by sticking to one surface of the plate-like member via an adhesive member.
A configuration is adopted in which a weakly bonded surface is formed at least on the outer edge side of the surface to which the adhesive member is attached in the main body.

  In the present invention, the weakly bonded surface can be formed by an uneven surface.

  In addition, the weakly bonded surface is formed by a formed body made of a member different from the members constituting the main body, and the formed body is detachably provided on the outer edge side of the main body. be able to.

  Furthermore, the main body may be configured using a material that can transmit energy rays.

  Moreover, the structure that the said weak adhesion process surface is formed in the same plane as the surface where the adhesive member in the said main-body part is affixed is employ | adopted preferably.

  According to the present invention, since the weakly bonded surface is formed on the outer edge side of the main body, the outer edge side of the support member is partially weakly bonded to the adhesive member, and peeling is performed using this weakly bonded region as a trigger. Can do. Thereby, it is possible to omit a large-scale apparatus for forming the trigger and a special process such as high-precision positioning, and it can be easily peeled from the plate-like member.

  Further, when the weak adhesion treatment surface is formed by the uneven surface, the weak adhesion treatment surface can be easily formed by partially processing the existing support member.

  Further, when the weakly bonded surface is formed by a formed body made of a member different from the member constituting the main body, and the formed body is detachably provided on the outer edge side of the main body, depending on the properties of the adhesive member Since the material of the formed body can be selected and replaced, versatility is improved.

  In addition, when the main body portion is made of a material that can transmit energy rays, an energy ray curable adhesive can be adopted for the adhesive member, and by irradiating the energy rays from the main body portion side, the adhesive member can be bonded. Since the force can be easily reduced, the ease of peeling can be improved.

  Furthermore, when the weak adhesion treatment surface and the pasting surface of the main body adjacent to this are formed in the same plane and no step is generated between them, the wafer is ground during the grinding process. The wafer can be ground extremely thinly and uniformly by preventing a grinding error of the wafer or applying a load to the wafer.

  In addition, the weak adhesion processing surface in this invention means the processing surface to which an adhesive member is hard to adhere | attach compared with the other surface located in the same plane, or does not adhere | attach at all.

The front view in the state where the supporting member concerning an embodiment was stuck on the wafer. The bottom view of a supporting member. The schematic sectional drawing of the support member which shows an example of the weak adhesion process surface. The schematic sectional drawing of the supporting member which shows the other example of the weak adhesion process surface. (A)-(C) are operation | movement explanatory drawings which peel a support member from a double-sided adhesive sheet.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 to 4, the support member 10 is attached to the upper surface of the wafer W as a plate-like member in FIG. 1 via a double-sided adhesive sheet A as an adhesive member, and supports the wafer W. . The double-sided adhesive sheet A includes an outer edge having a planar shape substantially the same as the planar portion of the upper surface of the wafer W in FIG. A circuit surface is formed on the upper surface in FIG. 1 of the wafer W, and the lower surface side in the drawing is ground to several tens of μm by a pre-process grinding apparatus or the like. For the adhesive layer of the double-sided adhesive sheet A, an energy ray curable adhesive can be used, whereby the adhesive force disappears by irradiating the energy ray and curing the adhesive layer before peeling. It can reduce and it can make it easy to insert the piece member mentioned later. In the case of this embodiment, the adhesive layer of the double-sided adhesive sheet A is an ultraviolet curable adhesive layer.

  The support member 10 includes a main body 11 having an outer edge shape of a size that protrudes from the outer edge of the double-sided adhesive sheet A and the outer edge of the wafer W. The main body 11 can be bonded to the double-sided adhesive sheet A, and various plate-like members such as a glass plate having smooth surfaces formed in parallel on the front and back sides can be used. Moreover, when performing the energy ray irradiation, the main body 11 is preferably configured using a material that can transmit the energy ray. Here, a weak adhesion treatment surface 13 is formed on the surface of the main body 11 to which the double-sided adhesive sheet A is attached, that is, on the outer edge side of the lower surface in FIG.

  The weakly bonded surface 13 is formed in a loop shape over the entire periphery of the outer edge of the main body 11 as shown by a region B in FIG. 1 and a lattice line in FIG. It is provided in the area | region straddling the outer edge. Moreover, the weak adhesion process surface 13 is formed in the same plane as the lower surface in FIG. 1 of the main-body part 11, and the support member 10 is formed in the front and back in parallel with the smooth surface.

  Various configurations can be adopted as the weakly bonded surface 13 as long as the double-sided adhesive sheet A is difficult to be bonded or formed as a surface that is not bonded at all. Alternatively, a silicone resin coat may be formed. Further, as shown in FIG. 3, the weakly bonded surface-treated surface 13 may be formed by roughening the surface so that a large number of fine irregularities are formed on the main body 11. Further, as shown in FIG. 4, the weak adhesion treatment surface 13 may be formed by a lower surface in the drawing of a formed body 15 formed by a member different from the member constituting the main body portion 11. The formed body 15 is formed in a ring shape, and is detachably provided on the main body portion 11 by being fitted to the lower surface outer edge side of the main body portion 11. The formed body 15 is formed of a fluororesin or silicone resin, or has the same composition as that of the main body 11 and has a roughened surface so that a large number of fine irregularities are formed on the surface. The material of the double-sided adhesive sheet A, that is, a material that is difficult to adhere to the adopted double-sided adhesive sheet A or does not adhere at all can be selected and employed. Thereby, for example, every time the double-sided adhesive sheet A having different properties is employed, the formed body 15 can be replaced with a different material and used for the main body portion 11. Therefore, versatility is improved. Furthermore, the weakly bonded surface 13 and the formed body 15 can be colored in a color different from other regions, thereby preventing the double-sided adhesive sheet A from being attached with the front and back of the support member 10 being mistaken. .

  Next, a method for using the support member 10 will be described.

  One surface of the double-sided adhesive sheet A is affixed to the flat portion on the circuit surface side of the wafer W. This sticking may be performed manually or by a known sheet bonding apparatus or the like. And the supporting member 10 is affixed on the other surface of the double-sided adhesive sheet A in the same manner as described above. In this case, when the weakly bonded surface 13 is colored in a color different from other regions, it is possible to prevent a person who performs bonding from attaching the front and back of the support member 10 to the double-sided adhesive sheet A by mistake. it can. In addition, even when pasting with a known sheet bonding apparatus or the like, it is possible to prevent the support member 10 from being mistakenly pasted on the double-sided adhesive sheet A by using a color-detectable sensor or the like. At this time, the outer edge of the double-sided adhesive sheet A is configured to be within the weakly-adhesive treatment surface 13. The wafer W and the hard member P may be attached to the double-sided adhesive sheet 10 in a reduced-pressure atmosphere including a vacuum. In this case, air bubbles can be prevented from being mixed between the double-sided adhesive sheet 10 and the wafer W or the hard member P.

  Thereafter, the wafer W is extremely thinly ground by a grinding device (not shown) from the opposite side of the circuit surface to a thickness of about 50 μm. At this time, since the support member 10 is configured by a plate-like member having a smooth surface formed in parallel on the front and back surfaces, it is possible to prevent the wafer W from having variations in thickness and grinding errors. Further, since the weakly bonded surface 13 is formed in the same plane as the lower surface in FIG. 1 of the main body 11 and no step is formed between them, the thickness of the wafer W caused by this step in the grinding process. Thus, it is possible to prevent a grinding error from occurring and a load applied to the wafer W to break it.

  After completion of the back surface grinding of the wafer W, as shown in FIG. 1, the wafer W is placed on the table T so that the grinding surface of the wafer W is on the lower side, and the suction means (not shown) of the table T is operated to move the wafer W. Adsorb and hold. Next, the adhesive of the double-sided adhesive sheet A is cured by irradiating ultraviolet rays from the support member 10 side, and the adhesive strength of the adhesive surface is lost or reduced. Next, as shown in FIG. 5A, the push-up pin LP is projected from the upper surface of the table T. As a result, the support member 10 in the region protruding from the outer edge of the double-sided adhesive sheet A is lifted, and a gap C that triggers peeling is formed between the double-sided adhesive sheet A and the weakly-adhesive treatment surface 13. From this state, a wedge-shaped piece member PL is inserted toward the gap C (see FIG. 5B), and further, the piece member PL is advanced to separate the double-sided adhesive sheet A and the support member 10 from each other. Is enlarged, and the support member 10 is peeled from the double-sided adhesive sheet A (see FIG. 5C).

  Therefore, according to such an embodiment, since the weak adhesion treatment surface 13 is provided on the outer edge side of the main body 11, even if a general-purpose table or the like is used, a gap C that triggers peeling is formed large. Peeling can be performed. As a result, the wafer W can be attached to the wafer W to be extremely thin and uniformly ground, and can be easily peeled off without using a large-scale facility when peeling from the wafer W.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the adhesive member in the present invention can be variously modified such as using an adhesive material or the like as long as the wafer W can be attached to the support member 10.

  Furthermore, the plate-like member in the present invention is not limited to a semiconductor wafer, and other plate-like members such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a wafer or a compound wafer.

  In the above embodiment, the case where the weak adhesion treatment surface 13 is provided only on one surface of the main body portion 11 is shown and described. However, the weak adhesion treatment surface 13 is also provided on the other surface of the main body portion 11 for support. The member 10 may be configured. In this case, it is not necessary to determine the front and back of the support member 10, and the work can be speeded up.

  In addition, the formation position of the weakly bonded surface 13 is not limited to the entire periphery of the outer edge of the main body 11, but may be provided on a part of the outer edge of the main body 11 or on the outer edge of the main body 11. It may be provided partially, for example, at predetermined intervals along.

DESCRIPTION OF SYMBOLS 10 Support member 11 Main-body part 13 Weak adhesion processing surface A Double-sided adhesive sheet (adhesive member)
W Semiconductor wafer (plate member)

Claims (5)

In a support member provided with a main body portion that supports the plate-like member by sticking to one surface of the plate-like member via an adhesive member,
A support member for a plate-like member, wherein a weak adhesion treatment surface is formed at least on the outer edge side of the surface to which the adhesion member is affixed in the main body.   The plate-shaped member support member according to claim 1, wherein the weakly bonded surface is formed by an uneven surface.   The weak adhesion treatment surface is formed of a formed body made of a member different from a member constituting the main body, and the formed body is detachably provided on the outer edge side of the main body. Item 3. A support member for a plate-like member according to item 1 or 2.   The support member for a plate-like member according to claim 1, 2 or 3, wherein the main body is made of a material that can transmit energy rays.   The plate-shaped member support member according to claim 1, 2, 3, or 4, wherein the weakly bonded surface is formed in the same plane as a surface to which the adhesive member in the main body is attached.

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