JP2013175628A - Peeling device of jig for semiconductor wafer and handling method of semiconductor wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a peeling device of a jig for semiconductor wafer which can enhance rigidity of a semiconductor wafer while reducing manufacturing facility and cost, and can peel the jig for semiconductor wafer automatically from the peripheral edge of the semiconductor wafer.SOLUTION: The peeling device of a jig for semiconductor wafer comprises: a jig 10 for semiconductor wafer adhering to a semiconductor wafer 1; and a peeling device 30 for peeling the jig 10 for semiconductor wafer. The jig 10 for semiconductor wafer is formed of a base material layer 11 facing the peripheral edge on the rear surface of the semiconductor wafer 1, and an adhesive layer 15 laminated on the opposing surface 13 of the base material layer 11 and adhering peelably to the peripheral edge on the rear surface of the semiconductor wafer 1. The adhesive layer 15 adheres to the majority of the opposing surface, and the remainder 14 of the opposing surface is a peeling opportunity part 16 not having the adhesive layer 15. The peeling device 30 consists of a slide mechanism 34 which inserts a through terminal 39 into the peeling opportunity part 16, and a holding mechanism 40 for holding and raising the through terminal 39 projecting from the peeling opportunity part 16.

Description

  The present invention relates to a peeling device for a semiconductor wafer jig used in a semiconductor manufacturing process and a semiconductor wafer handling method.

  In order to adapt a conventional semiconductor wafer to a thin semiconductor package (not shown) in the back grinding process, the back surface is back grinded and supported on the adhesive tape of the carrier jig in the dicing process, and then the individual semiconductor chips are formed with a dicing blade. By separating, a large number of semiconductor chips are formed (see Patent Documents 1, 2, 3, and 4). In the semiconductor wafer back grinding process, the semiconductor wafer is thinly cut to a thickness of 100 μm or less, sometimes 30 to 50 μm by a rotating grindstone. However, this makes the semiconductor wafer very thin and brittle, which hinders handling and conveyance. There is a risk of coming.

  In view of this, in the past, (1) when a semiconductor wafer is back-ground, the inner region is back-ground while leaving the peripheral edge of the semiconductor wafer, and the remaining peripheral edge ensures the rigidity of the semiconductor wafer and bends. (2) A method for tightly attaching a rigidity securing ring to the peripheral edge of a semiconductor wafer and imparting rigidity to the semiconductor wafer by this rigidity securing ring to suppress and prevent bending has been proposed (see Patent Document 5). ).

JP 2009-260219 A JP 2009-164476 A Japanese Patent Laid-Open No. 2005-191039 Japanese Patent No. 4239974 JP 2011-159864 A

  However, when the method (1) is adopted, the strength of the semiconductor wafer can be improved and the warpage can be reduced. There will be a new problem that equipment and costs cannot be reduced.

  In the case of the method (2), although the problem (1) can be solved and it is very convenient, the rigidity securing ring is manufactured with an emphasis on imparting rigidity. It is unexpectedly difficult to remove the rigid securing ring in the close contact state from the part, and there may be a situation in which the work is delayed or complicated. Furthermore, when removing the rigidity securing ring from the peripheral edge of the semiconductor wafer, it is desirable to perform processing automatically and uniformly using a dedicated peeling device. However, there is no such peeling device. It is difficult to divert the equipment.

  The present invention has been made in view of the above, and can improve the rigidity of the semiconductor wafer, reduce the manufacturing equipment and cost, and automatically remove the semiconductor wafer jig from the peripheral portion of the semiconductor wafer. An object of the present invention is to provide a semiconductor wafer jig peeling apparatus and a semiconductor wafer handling method.

In order to solve the above-mentioned problems, the present invention is an apparatus comprising a semiconductor wafer jig that removably adheres to a semiconductor wafer to give rigidity, and a peeling device that peels the semiconductor wafer jig. ,
The semiconductor wafer jig includes an endless base material layer facing the peripheral edge of one surface of the semiconductor wafer, and an adhesive layer that is provided on the opposing surface of the base material layer and adheres detachably to the peripheral surface of the one surface of the semiconductor wafer. Including, laminating the adhesive layer on most of the opposing surface of the base material layer, and forming the remainder of the opposing surface in a peeling trigger part where the adhesive layer does not exist,
The peeling device includes a slide mechanism that inserts a through terminal into a peeling trigger part of a semiconductor wafer jig adhered to a peripheral edge of one surface of a semiconductor wafer, and a protruding part of a through terminal protruding from the peeling trigger part of the semiconductor wafer jig. And a holding mechanism for holding and pulling up.

In addition, a peeling opportunity part can be dividedly formed between the opposing surface remaining part of a base material layer, and the edge part of an adhesion layer.
Moreover, an adhesion layer can be formed in a substantially C shape, and the both ends of this adhesion layer can be made to oppose through the remainder of an opposing surface.
Moreover, an adhesive layer can be divided | segmented into plurality and the both ends of these some adhesive layers can also be made to oppose through the remainder of an opposing surface.

Further, the peeling device includes an arm that rotates downward when approaching the semiconductor wafer and rotates upward when separated from the semiconductor wafer,
The slide mechanism includes a first actuator installed on the arm, a slide connected to the first actuator and capable of facing one side of the semiconductor wafer, and a semiconductor wafer jig peeled off supported by the slide. A flexible through-terminal that can face the trigger part, and when the arm approaches the semiconductor wafer, the first actuator is driven to slide the slider from the inner side to the outer side in the width direction of one side of the semiconductor wafer. it can.

  In addition, the holding mechanism includes a support that is directed downward from the arm when the arm approaches the semiconductor wafer, a second actuator that moves up and down along the support, and a semiconductor actuator that is attached to the second actuator. A bracket that makes the clamping part face the protruding part of the penetrating terminal protruding from the peeling trigger part of the jig, a third actuator installed in the bracket, and a driving part of the third actuator, It is preferable to include a sandwiching element that sandwiches the protruding portion of the penetrating terminal therebetween.

  In addition, each of the first and third actuators is an air cylinder, the first air cylinder is installed sideways on the arm, and its piston rod is directed toward the holding mechanism. The piston rod of this first air cylinder is connected to the semiconductor Connect the opposite slider to the one side of the wafer via a gap from above, install the third air cylinder vertically on the bracket, and point the piston rod toward the clamping part of the bracket. It is possible to connect a holding element facing the holding part of the bracket from above to the piston rod.

Further, in the present invention, in order to solve the above problems, a semiconductor wafer jig is peelably adhered to a semiconductor wafer, and after the semiconductor wafer is subjected to a predetermined treatment, the semiconductor wafer jig is peeled off. A handling method,
The semiconductor wafer jig includes an endless base material layer facing the peripheral edge of one surface of the semiconductor wafer, and an adhesive layer that is provided on the opposing surface of the base material layer and adheres detachably to the peripheral surface of the one surface of the semiconductor wafer. Including, laminating the adhesive layer on most of the opposing surface of the base material layer, and forming the remainder of the opposing surface in a peeling trigger part where the adhesive layer does not exist,
The semiconductor wafer jig is peeled off by the semiconductor wafer jig peeling device according to any one of claims 1 to 4.

  Here, the semiconductor wafer in the claims is not particularly limited to the φ150, 200, 300, 450 mm type or the like. One side of the semiconductor wafer may be the front surface or the back surface of the semiconductor wafer. The base material layer and the adhesive layer may have the same thickness or width, or may have different thicknesses and widths. The base material layer and the adhesive layer may be formed integrally or separately. The base material layer is mainly formed in a ring shape, but when a flat orientation flat is formed on the peripheral edge of the semiconductor wafer, the base material layer is formed in a shape along the peripheral edge of the semiconductor wafer.

  The base material layer does not particularly ask whether transparent, opaque, translucent, colored, or flexible. The adhesive layer and the peeling trigger part do not ask a plurality. Further, the peeling apparatus can be provided with a suction table that detachably holds the semiconductor wafer. The slide mechanism and holding mechanism of the peeling device can be operated using a cam mechanism, a link mechanism, various gear mechanisms, a screw mechanism, a motor, a cylinder, and the like. Weak adhesion can be imparted to opposing surfaces of the holding mechanism and the holding element which face each other. Furthermore, the predetermined processing applied to the semiconductor wafer corresponds to at least stress relief, PVD, CVD, back grinding, dicing, and the like.

  According to the present invention, when the semiconductor wafer jig is peeled off from one side of the semiconductor wafer by the peeling device, the through terminal of the slide mechanism approaches and faces the one side of the semiconductor wafer, and the semiconductor wafer jig is peeled off. A penetration terminal is inserted into the trigger part from the inside and penetrates, and the penetration terminal protrudes from the peeling trigger part of the semiconductor wafer jig. When the protruding portion of the through terminal protrudes from the peeling trigger portion of the semiconductor wafer jig, the holding mechanism rises across the protruding portion of the through terminal, and the through terminal is pulled up to peel the semiconductor wafer jig from the semiconductor wafer. The trigger part and the like are partially peeled, and then the semiconductor wafer jig is completely peeled from the semiconductor wafer.

  According to the present invention, the rigidity of a semiconductor wafer can be improved, manufacturing equipment and cost can be reduced, and the semiconductor wafer jig can be automatically removed from the peripheral portion of the semiconductor wafer. is there.

  According to the second aspect of the present invention, if the slide mechanism and the holding mechanism are installed on the arm, the slide mechanism and the holding mechanism can be brought close to each other and separated from the semiconductor wafer. . In addition, when the arm approaches the semiconductor wafer, the first actuator is driven to slide the slider from the inside to the outside of one side of the semiconductor wafer, so a through terminal is inserted into the peeling trigger part of the semiconductor wafer jig. The projecting portion of the penetrating terminal can be projected outward from the peeling trigger portion of the semiconductor wafer jig to facilitate the peeling operation.

  According to the third aspect of the present invention, the third actuator of the holding mechanism is driven, and the clamper clamps the penetrating terminal of the slide mechanism with the clamping part of the bracket, and the second actuator is raised. Since the through terminals restrained in this manner are pulled up, the semiconductor wafer jig can be automatically peeled from the semiconductor wafer after the peeling trigger part of the semiconductor wafer jig and its periphery are partially peeled from the semiconductor wafer.

  Furthermore, according to the invention of claim 4, since each of the first and third actuators is an air cylinder, the output can be easily adjusted, and the speed relating to sliding and clamping can be adjusted steplessly. High-speed operation can also be realized. In addition, the influence of the temperature and humidity around the apparatus is small, the peeling mechanism can be simplified, and environmental pollution around the semiconductor wafer can be reduced.

1 is an overall explanatory view schematically showing an embodiment of a semiconductor wafer jig peeling apparatus and a semiconductor wafer handling method according to the present invention. It is a perspective explanatory view showing typically the relation between the semiconductor wafer and the semiconductor wafer jig in the embodiment of the semiconductor wafer jig peeling apparatus and the semiconductor wafer handling method according to the present invention. It is front explanatory drawing which shows typically the relationship between the semiconductor wafer and the jig | tool for semiconductor wafers in embodiment of the peeling apparatus of the jig | tool for semiconductor wafers concerning this invention, and the handling method of a semiconductor wafer. It is a back surface explanatory view showing typically the semiconductor wafer jig in the embodiment of the semiconductor wafer jig peeling device and the semiconductor wafer handling method according to the present invention. It is principal part explanatory drawing which shows typically the holding mechanism in embodiment of the peeling apparatus of the jig | tool for semiconductor wafers concerning this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. A semiconductor wafer jig peeling apparatus in this embodiment adheres to a thin semiconductor wafer 1 in a peelable manner as shown in FIGS. The semiconductor wafer jig 10 for providing rigidity and the peeling device 30 for automatically peeling the adhered semiconductor wafer jig 10 are provided.

  As shown in FIGS. 1 to 3, the semiconductor wafer 1 is made of, for example, a planar circular silicon wafer having a diameter of 200 mm, a circuit pattern is formed on the surface, and the back surface is back-ground by a general-purpose back-grinding device (not shown). Thus, the thickness is reduced to 100 μm or less. This semiconductor wafer 1 has a substantially semi-circular or V-shaped notch 2 for facilitating discrimination and alignment of the crystal direction at the peripheral edge, a back grind treatment on the back surface, and a porous hole connected to a vacuum pump 21. The semiconductor wafer jig 10 is peeled after being horizontally sucked and held on the quality suction table 20.

  As shown in FIGS. 1 to 4, the semiconductor wafer jig 10 is laminated on the base layer 11 facing the thin semiconductor wafer 1 and the facing surface 13 of the base layer 11, and the back surface periphery of the semiconductor wafer 1. A pair of adhesive layers 15 that adhere to the two portions are provided in a two-layer structure, the pair of adhesive layers 15 are laminated on most of the facing surface 13 of the base material layer 11, and the remaining portion 14 other than most of the facing surface 13 is not It forms in a pair of peeling trigger part 16 which has adhesion. The base material layer 11 and the pair of adhesive layers 15 are formed so that the base material layer 11 and each adhesive layer 15 have the same width, or the width of the base material layer 11 is slightly wider than the width of each adhesive layer 15. The

  The base material layer 11 is formed in a thin planar ring shape with a predetermined material, and a plurality of fixing holes 12 for positioning and fixing the semiconductor wafer 1 during processing are formed at predetermined intervals in the circumferential direction. Opposite the periphery. The material of the base material layer 11 is not particularly limited. For example, silicon, glass epoxy resin, glass cloth composite material, carbon fiber reinforced plastic, liquid crystal polymer, polyether ether ketone, polyether imide, polyimide, Examples include metals (aluminum, SUS, tungsten, iron-nickel alloys (42 alloy, etc.)), other alloys, and the like.

  The base material layer 11 is formed to have the same diameter as the semiconductor wafer 1 or a slightly larger diameter. When the base layer 11 has the same diameter as the semiconductor wafer 1, the outer peripheral edge is aligned with the peripheral edge of the semiconductor wafer 1, and when the diameter is slightly larger than the semiconductor wafer 1, the outer peripheral edge is The semiconductor wafer 1 is opposed so as to follow the outer portion within 3 mm from the peripheral edge of the back surface. When the base material layer 11 is formed to have a diameter slightly larger than that of the semiconductor wafer 1, the peripheral edge of the semiconductor wafer 1 that has been thinly cut and becomes brittle is effectively protected, and subsequent handling and transportation are facilitated. Can do.

  The pair of adhesive layers 15 are each formed in a thin planar substantially semicircular arc shape having a thickness of 200 μm or less (for example, about 100 μm) with a predetermined material having weak adhesiveness, and are opposed to the rear peripheral edge of the semiconductor wafer 1. It is laminated and adhered to the flat facing surface 13 of the material layer 11 and detachably adhered to the peripheral edge of the back surface of the semiconductor wafer 1.

  The material of each pressure-sensitive adhesive layer 15 is not particularly limited, and examples thereof include pressure-sensitive adhesives such as silicone rubber and fluororubber, which have a peel strength that decreases at about 60 ° C. and is excellent in heat resistance. The pressure-sensitive adhesive surface that adheres to the peripheral edge of the back surface of the semiconductor wafer 1 of each pressure-sensitive adhesive layer 15 can be roughly formed by a transfer method using a mold, addition of a filler, or the like as necessary.

  The average surface roughness (arithmetic surface roughness) Ra of the pressure-sensitive adhesive surface is preferably in the range of 0.5 to 5 μm in order to facilitate the positioning operation with respect to the semiconductor wafer 1 and ensure reliable adhesion. Such a pair of adhesive layers 15 is laminated and adhered to most of the facing surface 13 of the base material layer 11, and both end portions face each other through a gap in the remaining portion 14 other than most of the facing surface 13.

  As shown in FIG. 3 and FIG. 4, each peeling trigger part 16 is partitioned and formed as a gap between the remaining part 14 of the facing surface 13 and both ends of the pair of adhesive layers 15, and adheres from the semiconductor wafer 1. This is a trigger when the jig 10 is peeled off. In each peeling trigger part 16, the fixing hole 12 of the base material layer 11 is selectively positioned as a working mark.

  As shown in FIG. 1 and FIG. 5, the peeling device 30 includes an arm 31 that can be moved up and down to approach or separate from the semiconductor wafer 1 set on the suction table 20, and a fixed semiconductor wafer 1. When the arm 31 approaches, the slide mechanism 34 for inserting the through-terminal 39 into one peeling trigger part 16 of the semiconductor wafer jig 10 adhered to the peripheral edge of the back surface of the semiconductor wafer 1 and the one protruding trigger part 16 project from the one peeling trigger part 16 And a holding mechanism 40 that holds and pulls up the penetrating terminal 39.

  As shown in FIG. 1, the arm 31 of the peeling device 30 is bent, for example, in an inverted L shape, and its short side portion 32 is rotatably supported adjacent to the vicinity of the suction table 20, and the long side portion 33. Is positioned above the suction table 20 and swings downward when approaching the semiconductor wafer 1, and upward reference when separating from the semiconductor wafer 1. Swing back to position.

  The arm 31 is pivotally supported so as to be rotatable at least in the vertical direction, and is supported so as to be slidable or rotatable in the lateral direction (for example, the back direction in FIG. 1) as necessary. A slide mechanism 34 is installed near the center of the long side 33 of the arm 31, and a holding mechanism 40 is installed near the tip of the long side 33 of the arm 31.

  As shown in FIG. 1, the slide mechanism 34 includes a slide air cylinder 35 installed on the arm 31, a slide 38 connected to the slide air cylinder 35 and capable of facing the back surface of the semiconductor wafer 1, A through terminal 39 supported by the slider 38 is provided.

  The sliding air cylinder 35 is installed in the lateral direction near the lower surface of the center of the long side portion 33 of the arm 31, and the reciprocating piston rod 36 is directed toward the holding mechanism 40. A tool 37 is mounted, and a slider 38 facing the back surface of the semiconductor wafer 1 from above via a slight gap is connected to the lower part of the mounting tool 37.

  The slider 38 is formed in a block shape, for example, and a flexible through terminal 39 is horizontally supported on the lower surface, and the through terminal 39 is connected to the peeling trigger portion 16 of the semiconductor wafer jig 10 on the inner peripheral surface. Opposite from the side. The through terminal 39 is formed in a long and slender flat tongue piece by a bendable leaf spring or the like that is thinner than the adhesive layer 15, for example. To penetrate.

  As shown in FIGS. 1 and 5, the holding mechanism 40 includes a support column 41 that extends downward from the arm 31 and is adjacent to the suction table 20 when the arm 31 approaches the semiconductor wafer 1. An actuator 43 that moves up and down, a bracket 45 attached to the actuator 43, a chuck air cylinder 48 installed in the bracket 45, and the chucking air cylinder 48 are driven between the clamping portion 47 of the bracket 45. And a pinching element 50 for pinching the tip, which is a protruding portion of the through terminal 39.

  The support column 41 extends downward from the distal end of the long side portion 33 of the arm 31, and a support plate 42 projects from the lower side toward the suction table 20, and the long side of the support plate 42 and the arm 31 is formed. An actuator 43 is disposed between the unit 33 and the actuator 33. The actuator 43 includes, for example, a ball screw 44 that is vertically supported between the support plate 42 and the long side portion 33 of the arm 31, and a nut (not shown) is rotatably fitted to the fixed ball screw 44. The nut functions by moving up and down along the vertical direction of the column 41 by rotating with a drive of a hollow motor or the like.

  The bracket 45 is bent, for example, in an L shape, and its long side portion 46 is attached to the actuator 43, and the lower short side portion projects toward the suction table 20, and this short side portion defines the clamping portion 47. The tip of the penetrating terminal 39 that is formed and protrudes from the peeling trigger part 16 of the semiconductor wafer jig 10 faces from below.

  If necessary, a plurality of guide bars (not shown) are slidably inserted into the long side portion 46 of the bracket 45, and the guide bars are vertically disposed between the long side portion 33 of the arm 31 and the support plate 42 of the support column 41. It is pivoted on. Further, a rubber sheet, an adhesive sheet, or the like having weak adhesiveness is laminated on the facing surface of the sandwiching portion 47 facing the through terminal 39 as necessary.

  The chucking air cylinder 48 is installed vertically on the long side portion 46 of the bracket 45, and the reciprocating piston rod 49 is directed toward the clamping portion 47 of the bracket 45. The sandwiching element 50 facing from above is connected to the sandwiching part 47. The sandwiching element 50 is formed on a flat plate or the like of various shapes, and a weak adhesive rubber sheet, an adhesive sheet, or the like is laminated on an opposing surface facing the sandwiching portion 47 as necessary.

  In the above configuration, when rigidity is given to the back-ground thin semiconductor wafer 1 having a thickness of 100 μm or less, the back surface of the thin semiconductor wafer 1 that has been back-ground is used as the upper surface, and the semiconductor is formed on the periphery of the back surface of the semiconductor wafer 1. The pressure-sensitive adhesive layer 15 of the wafer jig 10 is pressed by a roller or the like and is detachably adhered without a gap (see FIG. 2). At this time, the outer peripheral edge of the semiconductor wafer jig 10 can be positioned on the peripheral edge of the semiconductor wafer 1, and the peeling trigger part 16 of the semiconductor wafer jig 10 can be opposed to the notch 2 of the semiconductor wafer 1.

  Next, when the semiconductor wafer jig 10 is to be peeled off from the peripheral edge of the back surface of the semiconductor wafer 1 with the peeling device 30, first, the arm 31 of the peeling device 30 swings downward from the reference position and its long side The portion 33 is brought close to the semiconductor wafer 1 from above, and the slider 38 and the through terminal 39 of the slide mechanism 34 are opposed to the back surface of the semiconductor wafer 1 surrounded by the semiconductor wafer jig 10 with a slight gap ( (See FIG. 1).

  At this time, the slider 38 and the through terminal 39 of the slide mechanism 34 are located between the center of the back surface of the semiconductor wafer 1 and the semiconductor wafer jig 10, and the through terminal 39 peels off the semiconductor wafer jig 10. Face the opportunity 16 with a gap.

  The holding mechanism 40 is positioned in the lateral direction of the suction table 20, and the holding portion 47 and the holding element 50 of the bracket 45 are opposed to each other with a gap, and this gap is located on the extension line of the peeling trigger portion 16. When the gap between the holding part 47 and the holding element 50 of the bracket 45 is not properly opposed to the extension line of the peeling trigger part 16, the actuator 43 of the holding mechanism 40 is driven up and down by detection of a sensor (not shown), The position of the bracket 45 is finely adjusted.

  Next, the slide air cylinder 35 is driven to cause the piston rod 36 to protrude horizontally, and the slider 38 slides horizontally from the radial inner side to the outer side of the back surface of the semiconductor wafer 1 to peel off the semiconductor wafer jig 10. The penetration terminal 39 is gradually inserted into the trigger part 16 and penetrates. The tip of the through terminal 39 protrudes outside from the peeling trigger part 16 of the semiconductor wafer jig 10 and is sandwiched between the sandwiching part 47 of the bracket 45 and the sandwiching element 50 via a gap.

  When a sensor (not shown) detects that the penetrating terminal 39 has entered the gap between the holding portion 47 and the holding element 50 of the bracket 45, the chuck air cylinder 48 of the holding mechanism 40 is driven to project the piston rod 49 downward. Then, the holding element 50 is lowered and the tip of the penetrating terminal 39 is pressed and held between the holding part 47 of the bracket 45 (see FIG. 5).

  Next, the actuator 43 is driven to raise the bracket 45, the tip of the penetrating terminal 39 is bent and pulled up, and the penetrating terminal 39 comes into pressure contact with the remaining portion 14 of the facing surface 13 that defines the peeling trigger part 16. The peeling trigger part 16 of the semiconductor wafer jig 10 and its periphery are gradually peeled off. At this time, the nut screwed to the ball screw 44 rotates to raise the bracket 45, so that high feed accuracy can be realized.

  After that, the arm 31 swings and returns to the original upward direction and is separated from the semiconductor wafer 1, and the semiconductor wafer jig 10 is completely separated from the semiconductor wafer 1 with the separation of the arm 31. . At this time, if the characteristic of the adhesive layer 15 whose peel strength decreases at about 60 ° C., the semiconductor wafer jig 10 can be easily removed.

  According to the above configuration, the strength of the semiconductor wafer 1 can be increased by adhering the semiconductor wafer jig 10 along the periphery of the back-ground thin semiconductor wafer 1. Warping and bending can be effectively suppressed and prevented, and subsequent handling and transportation can be facilitated. Therefore, it is not necessary to back grind the inner region while leaving the peripheral portion of the semiconductor wafer 1, and a dedicated device can be reliably omitted, so that significant reduction in manufacturing equipment and cost can be expected.

  Further, since there is no adhesive layer 15 that obstructs the peeling trigger part 16 and there is only a gap that facilitates the penetration of the through terminal 39, the semiconductor wafer jig that is in close contact with the peripheral edge of the semiconductor wafer 1. 10 can be removed easily and safely, and the risk of work delays and complications can be effectively eliminated. This effect is very significant when the semiconductor wafer 1 and the semiconductor wafer jig 10 have the same diameter.

  Further, since the dedicated peeling device 30 is used, the semiconductor wafer jig 10 can be automatically and uniformly removed from the peripheral portions of the semiconductor wafers 1 while ensuring safety. Moreover, since an air cylinder is used, the output required for peeling can be easily adjusted, the speed can be adjusted steplessly, and high speed operation can be expected. In addition, there is little influence of temperature, humidity, etc., the mechanism can be simplified, and environmental pollution is very low.

  In addition, the semiconductor wafer jig 10 is not fixed to the peripheral edge of the back surface of the semiconductor wafer 1 with an adhesive so that it cannot be peeled off. The application | coating operation | work becomes unnecessary and it does not lead to a delay and complication of an operation | work. Furthermore, the semiconductor wafer jig 10 can be reused without being discarded for each operation.

  In the above embodiment, the adhesive layer 15 of the semiconductor wafer jig 10 is adhered to the peripheral edge of the back surface of the semiconductor wafer 1, but the adhesive layer 15 of the semiconductor wafer jig 10 is adhered to the peripheral edge of the semiconductor wafer 1. A circuit pattern or the like may be formed on the back surface of the semiconductor wafer 1. Further, the surface of the remaining portion 14 of the base material layer 11 may be colored, or the inner peripheral edge of the remaining portion 14 may be cut out to facilitate visual recognition of the peeling trigger portion 16.

  Further, the adhesive layer 15 is divided into a plurality of parts (for example, divided into three parts, four parts, etc.), and the plurality of adhesive layers 15 are abutted via gaps. Also good. Further, although the arm 31 of the peeling device 30 can swing in the vertical direction, it can be moved up and down. Further, the slide air cylinder 35 and the chuck air cylinder 48 can be replaced with hydraulic cylinders, respectively, so that output and speed control can be facilitated.

  In the above embodiment, the slide 38 is slid by driving the slide air cylinder 35. However, the slide 38 can be slid using a rack and pinion or a linear motor. In the above embodiment, the nut is rotatably fitted to the fixed ball screw 44 of the holding mechanism 40. However, the bracket 45 of the holding mechanism 40 may be moved up and down by rotating the ball screw 44 by driving a motor or the like. Is possible. Furthermore, the bracket 45 of the holding mechanism 40 may be moved up and down by using a rack and pinion or a linear motor instead of the ball screw 44 and the nut.

  The semiconductor wafer jig peeling apparatus and the semiconductor wafer handling method according to the present invention can be used, for example, in the field of semiconductor manufacturing.

DESCRIPTION OF SYMBOLS 1 Semiconductor wafer 10 Semiconductor wafer jig | tool 11 Base material layer 13 Opposing surface 14 Remaining part 15 Adhesive layer 16 Peeling trigger part 20 Suction table 30 Peeling device 31 Arm 34 Slide mechanism 35 Air cylinder for a slide (1st actuator, air cylinder)
36 piston rod 38 slider 39 penetrating terminal 40 holding mechanism 41 column 42 support plate 43 actuator (second actuator)
44 Ball screw 45 Bracket 47 Clamping part 48 Air cylinder for chuck (third actuator, air cylinder)
49 Piston rod 50

Claims (5)

A semiconductor wafer jig peeling apparatus comprising a semiconductor wafer jig that attaches to a semiconductor wafer in a peelable manner to give rigidity, and a peeling device that peels the semiconductor wafer jig,
The semiconductor wafer jig includes an endless base material layer facing the peripheral edge of one surface of the semiconductor wafer, and an adhesive layer that is provided on the opposing surface of the base material layer and adheres detachably to the peripheral surface of the one surface of the semiconductor wafer. Including, laminating the adhesive layer on most of the opposing surface of the base material layer, and forming the remainder of the opposing surface in a peeling trigger part where the adhesive layer does not exist,
The peeling device includes a slide mechanism that inserts a through terminal into a peeling trigger part of a semiconductor wafer jig adhered to a peripheral edge of one surface of a semiconductor wafer, and a protruding part of a through terminal protruding from the peeling trigger part of the semiconductor wafer jig. A peeling device for a semiconductor wafer jig comprising a holding mechanism for holding and pulling up. The peeling device includes an arm that rotates downward when approaching the semiconductor wafer and rotates upward when separated from the semiconductor wafer,
The slide mechanism includes a first actuator installed on the arm, a slide connected to the first actuator and capable of facing one side of the semiconductor wafer, and a semiconductor wafer jig peeled off supported by the slide. A flexible through-terminal that can face the trigger part, and when the arm approaches the semiconductor wafer, the first actuator is driven to slide the slider from the inner side to the outer side in the width direction of one side of the semiconductor wafer. 2. A peeling apparatus for a semiconductor wafer jig according to 1.   When the arm approaches the semiconductor wafer, the holding mechanism includes a support column that is directed downward from the arm, a second actuator that moves up and down along the support column, and a semiconductor wafer jig that is attached to the second actuator. Between the bracket holding portion facing the protruding portion of the penetrating terminal protruding from the peeling trigger portion, the third actuator installed on the bracket, and the holding portion of the bracket by driving the third actuator 3. A semiconductor wafer jig peeling apparatus according to claim 2, further comprising a sandwiching element for sandwiching the protruding portion of the through terminal.   Each of the first and third actuators is an air cylinder, and the first air cylinder is installed sideways on the arm and the piston rod is directed toward the holding mechanism. The piston rod of the first air cylinder is placed on the piston rod of the semiconductor wafer. Connect the opposite slider from above to one side through a gap, install the third air cylinder vertically on the bracket and point its piston rod toward the clamping part of the bracket. 4. The semiconductor wafer jig peeling apparatus according to claim 2, wherein a holding element facing the holding part of the bracket from above is connected to the rod. The semiconductor wafer jig is peelably adhered to the semiconductor wafer, and after the semiconductor wafer is subjected to a predetermined treatment, the semiconductor wafer jig is peeled off.
The semiconductor wafer jig includes an endless base material layer facing the peripheral edge of one surface of the semiconductor wafer, and an adhesive layer that is provided on the opposing surface of the base material layer and adheres detachably to the peripheral surface of the one surface of the semiconductor wafer. Including, laminating the adhesive layer on most of the opposing surface of the base material layer, and forming the remainder of the opposing surface in a peeling trigger part where the adhesive layer does not exist,
A semiconductor wafer handling method, wherein the semiconductor wafer jig is peeled off by the semiconductor wafer jig peeling device according to claim 1.

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