JP4746012B2 - Pasting device and pasting method - Google Patents

Description

  The present invention relates to a sticking apparatus and a sticking method, and more particularly to a sticking apparatus and a sticking method that can improve the positional accuracy between a plate-like member to which an adhesive sheet is stuck and a frame.

  In general, a semiconductor wafer (hereinafter simply referred to as “wafer”) is integrated with a ring frame through an adhesive sheet in order to ensure the handling of the wafer when performing backside grinding and other various processes. It is. Such integration of the wafer and the ring frame is performed by placing the wafer on the inner table, placing the ring frame on the outer table located on the outer peripheral side of the wafer, and supplying an adhesive sheet on the upper surface of the wafer. (For example, refer to Patent Document 1).

JP 2006-5080 A

  However, in Patent Document 1, both the inner table and the outer table cannot be moved in the wafer surface direction. For this reason, after the wafer is placed on the inner table, if the wafer is unintentionally misaligned, the misalignment cannot be eliminated.

  Incidentally, a protective sheet is attached to the circuit surface of the wafer, and the adhesive sheet is attached to the opposite surface of the circuit surface. When this adhesive sheet is affixed, there arises a disadvantage that the protective sheet protruding from the outer edge of the wafer becomes easy to adhere to the adhesive sheet. In particular, if the protective sheet is cut along the outer edge of a wafer whose outer periphery is chamfered into a substantially semicircular curved surface in a cross-sectional view, and the back grinding is performed to make the wafer extremely thin, the protrusion is increased. The inconvenience will be revealed. As a result, when the protective sheet is peeled off from the wafer, the peeling cannot be performed, or the adhesive sheet and the wafer are pulled by the peeling pulling force, and the wafer is damaged.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and its purpose is to improve the positional accuracy between a plate-like member such as a wafer and a frame when an adhesive sheet is applied. It is in providing the sticking apparatus and sticking method which can be performed.
Another object of the present invention is to provide a sticking device that can prevent the protective sheet and the adhesive sheet attached to the plate-like member from adhering against each other.

In order to achieve the above object, the present invention provides a first support means for supporting a plate-like member having a sheet affixed to one surface thereof from the sheet side in a state of protruding from the outer edge , and a second support for supporting the frame. A supporting means, a moving means for relatively moving the first and second supporting means, and an adhesive sheet attached to the other surface of the plate-like member supported by the first supporting means to attach the plate-like member. In a pasting device comprising a pasting means for mounting on a frame ,
The moving means is provided so as to be relatively movable in a direction along the surface of the plate-like member. When the plate-like member is placed, the moving means is external to the frame supported by the second support means in a plan view. The first support means is positioned, and when the adhesive sheet is stuck by the sticking means, the relative positions of the first and second support means are provided so as to be positioned ,
Said second supporting means, when sticking the adhesive sheet by said sticking unit, Ru furnished with the contact preventing means for preventing contact between the adhesive sheet and the sheet adopts a configuration that.

  The moving means is provided with first and second support means so as to be relatively movable in the thickness direction of the plate-like member so that the surface of the plate-like member and the surface of the frame are located on substantially the same plane. It is also possible to adopt a configuration that can be used.

Furthermore, the present invention places the plate-like member on the first support means outside the frame supported by the second support means when viewed in plan,
Thereafter, the first and second support means are moved relative to each other in the direction along the surface of the plate-like member , the sheet stuck to one surface of the plate-like member and protrudes from the outer edge of the plate-like member, and an adhesive sheet The contact prevention means is disposed so as to prevent contact with the first support means, the first support means and the second support means are positioned, and then the adhesive sheet is attached to the other surface of the plate-like member supported by the first support means. Is used, and the plate-like member is mounted on the frame .

  According to the present invention, since the first and second support means can be moved in the surface direction of the plate-like member by the moving means, after the plate-like member such as a wafer is supported by the first support means, Position adjustment of the plate-shaped member and the frame supported by the second support means can be performed. As a result, the positional accuracy between the wafer and the frame integrated by the adhesive sheet can be kept good, and as a result, the accuracy of the post-process can be improved and the quality can be improved.

  In addition, since contact prevention means for preventing contact between the protective sheet and the like attached to the wafer and the adhesive sheet is provided, it is possible to prevent the sheet protruding from the outer edge of the wafer from contacting and adhering to the adhesive sheet. Can do. As a result, the sheet can be easily peeled off from the wafer without difficulty, and it is possible to avoid the inconvenience of the wafer being damaged by pulling the adhesive sheet or the wafer at the time of peeling.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the present specification and claims, the “plan view” means a case of looking down from the upper surface in the Z-axis direction as shown in FIG.

FIG. 1 shows a schematic front view of a sticking device according to an embodiment of the present invention. 2 is a schematic perspective view of the main part of FIG. 1, and FIG. 3 is a plan view of FIG.
In these drawings, a bonding apparatus 10 includes a first support means 11 that supports a wafer W transferred from a wafer stocker (not shown) with a circuit surface (front surface) facing down, and a first support means 11 that supports a ring frame RF. Two supporting means 12, a moving means 13 for relatively moving the first and second supporting means 11 and 12, and an adhesive sheet S on the upper surface (back surface) of the wafer W supported by the first supporting means 11. Affixing means 15 for affixing and mounting the wafer W on the ring frame RF is provided. Note that the wafer W in the present embodiment is intended for a wafer W to which a protective sheet PS for protecting the circuit surface (surface) is previously attached, but is not limited thereto.

  The first support means 11 includes a mounting surface 17 which is connected to a pump or the like (not shown) and has a plurality of suction holes for sucking the wafer W on the upper surface. An alignment sensor 19 including a V-notch or orientation flat of the wafer W, a camera for detecting the outer periphery of the wafer, and the like is provided at a position adjacent to the first support means 11.

  The second support means 12 includes a downward U-shaped upper table 20 on which the ring frame RF is placed, and a lower table 21 that supports the upper table 20. Further, the upper table 20 has a step portion 22 along the inner periphery of the ring frame RF on the upper surface, and the ring frame RF placed by the step portion 22 can be positioned and fixed. A protrusion 24 constituting contact prevention means is provided inside the stepped portion 22, and the protrusion 24 has a shape with a sharp inner edge on a cross-sectional view and is substantially circular in plan view. A hole 25 is formed, and the diameter of the hole 25 is set to be slightly larger than the diameter of the wafer W. The lower table 21 is provided with a slider 27. The slider 27 moves on a guide rail 28 laid in the X-axis direction via a driving means (not shown), so that the second support means 12 becomes the X-axis. It can move back and forth in the direction. In addition, since the adhesive sheet S is affixed on the upper surface of the protrusion 24, the peeling process is performed.

  The moving means 13 is provided below the first supporting means 11 and rotates the first supporting means 11 in the XY plane, and below the rotating moving body 30. The Z-axis moving body 31 is provided, and the XY-axis moving body 32 is provided between the lower side of the Z-axis moving body 31 and the lower table 21. The movement of the XY axis moving body 32 in the X axis direction is performed by a slider 41, a rail 42 and a single axis robot 43 provided on the lower table 21. Accordingly, the moving means 13 moves the first support means 11 in the surface direction (X-axis direction, Y-axis direction) of the wafer W, moves in the thickness direction (Z-axis direction) of the wafer W, and the wafer W. It is possible to rotate in the plane. With such a configuration, the first support means 11 is moved between the inner side and the outer side of the upper table 20, and when viewed in plan as shown in FIG. The first support means 11 can be moved to the outside. A known unit using a single-axis robot, various motors, cylinders, ball screws, linear guides, etc. is employed as a mechanism for driving the movement of each moving body 30, 31, and 32 in the Y-axis direction. The first support means 11 can be positioned at any position in each direction.

  The affixing means 15 includes a support shaft 35 that supports an unrollable sheet R wound around the release sheet RL in a roll shape, and a peel that peels the adhesive sheet S from the release sheet RL. A plate 36, a press roller 37 that presses the adhesive sheet S against the upper surface of the wafer W, and a driving roller that gives a repetitive output to the original fabric R, are provided so as to be movable in the Z-axis direction via a driving means (not shown). 38 and a pinch roller 39, a winding shaft 40 for winding the release sheet RL, and a frame body F that integrally supports these members. The adhesive sheet S is formed by laminating a die bonding sheet (not shown) substantially corresponding to the shape of the inner peripheral opening of the ring frame RF on the mounting sheet attached to the ring frame RF. The wafer W is mounted on the ring frame RF via the die bonding sheet by the heating means (not shown). Note that the adhesive sheet S is not limited to the configuration described above, and may be an adhesive sheet having another adhesive layer such as a dicing sheet or a mounting sheet.

  Next, the positioning of the wafer W and the sheet sticking operation will be described. Here, as shown in FIG. 1, it is assumed that in the sticking means 15, the work of wrapping the original fabric R is completed, and the system for sticking the adhesive sheet S to the wafer W is ready. . Further, it is assumed that the ring frame RF is placed on the upper table 20 by a conveying means (not shown), and the ring frame RF is positioned and fixed by the step portion 22.

  In a state where the first support means 11 is moved to the left side of the upper table 20 via the moving means 13, the wafer W is transferred onto the mounting surface 17 by a transfer means (not shown). Next, the above-described pump (not shown) is operated to adsorb the wafer W onto the mounting surface 17, and then move the wafer W via the rotary moving body 30 and the XY axis moving body 32 and the V notch The outer periphery of the wafer W is detected by the sensor 19, and the position of the wafer W is recognized. At this time, the thickness of the wafer W including the protective sheet PS is also recognized. Thereafter, the first support means 11 is moved into the upper table 20 via the XY axis moving body 32. At this time, based on the detection data of the sensor 19, the first support means 11 is moved and positioned by the XY axis moving body 32 so that the center of the ring frame RF and the center of the wafer W coincide. In addition, the rotary moving body 30 performs positioning so that the V notch is positioned in a predetermined direction, and the Z-axis moving body 31 places the upper surface of the wafer W and the upper surface of the ring frame RF on substantially the same plane. Positioning is performed as follows. As a result, the wafer W is positioned in the hole 25, and the protrusion 24 is positioned above the protective sheet PS protruding from the outer edge of the wafer W.

  Thus, the lower table 21 moves to the right side in FIG. 1 while maintaining the relative position between the wafer W and the ring frame RF. Then, the lower table 21 moves to a point where the left end of the ring frame RF in FIG. 4 is located on the right side of the tip of the peel plate 36, moves the press roller 37 down, and then moves back to the left side. In synchronization with this movement, the adhesive sheet S is applied to the upper surface of the wafer W under the pressing force of the press roller 37 while the adhesive sheet S is released from the release sheet RL. At this time, the ring frame RF is bonded by the adhesive of the adhesive sheet S, and the wafer W is heated by a heating means (not shown) built in the rotary moving body 30 and a die bonding sheet (not shown) stacked on the adhesive sheet S is heated. Then, the wafer W is bonded to the adhesive sheet S, and the wafer W is mounted on the ring frame RF. At this time, since the protrusion 24 is interposed between the protective sheet PS and the adhesive sheet S protruding from the outer edge of the wafer W, it is possible to prevent them from coming into contact with each other.

  Thus, the wafer W mounted on the ring frame RF by the adhesive sheet S is released from the suction by the first support means 11 and is accommodated in a wafer stocker or the like via a transfer means such as a robot (not shown). The supporting means 11 is returned to the position shown in FIG. 1 via the moving means 13 and waits for the transfer of a new wafer W to be the next object.

Therefore, according to such an embodiment, since the protective sheet PS and the adhesive sheet S can be prevented from adhering by the protrusion 24, the protective sheet PS can be smoothly peeled from the wafer W in a subsequent process, It becomes possible to prevent the wafer W from being cracked or damaged during the peeling.
Further, after the wafer W is supported by the first support means 11, the wafer W can be moved in the XYZ axial directions and rotated in the plane by the moving means 13, thereby positioning the wafer W. Therefore, even if the position of the wafer W is shifted unexpectedly after the wafer W is placed on the placement surface 17, it can be corrected without difficulty. Moreover, even if the clearance between the tip of the protrusion 24 and the wafer W or the first support means 11 is set small, they can be prevented from coming into contact with each other, and the area covering the protective sheet PS by the protrusion 24 can be as small as possible. Widely secureable.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the protrusion 24 can be variously changed as long as the contact between the protective sheet PS and the adhesive sheet S can be prevented, and the tip has a circular arc shape in a sectional view or a piece having a uniform vertical thickness. Or you may.

  Further, the moving means 13 is not limited to the illustrated configuration example, and both of them can be moved in order to change the relative positions of the first and second support means 11, 12, Various structures, such as providing only the moving means 12 movably, can be employed.

  The plate-like member in the present invention is not limited to the semiconductor wafer W, and other plate-like members such as a glass plate, a steel plate, or a resin plate can also be targeted. The semiconductor wafer can be a silicon wafer or a compound. It may be a wafer, and the frame is not limited as long as it is a frame in which other plate-like members such as the glass plate, steel plate, resin plate and the like are bonded by the adhesive sheet S.

The schematic front view of the sticking device concerning an embodiment. The principal part schematic perspective view of FIG. The top view of FIG. The principal part enlarged front view of the sticking apparatus at the time of sticking of an adhesive sheet.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sticking apparatus 11 1st support means 12 2nd support means 13 Moving means 15 Sticking means 24 Protrusion (contact prevention means)
PS Protective sheet RF Ring frame S Adhesive sheet W Wafer (plate member)

Claims (3)

A first support means for supporting a plate-like member having a sheet affixed on one surface thereof from the sheet side in a state of protruding from the outer edge, a second support means for supporting the frame, and the first and second A sticking means comprising a moving means for relatively moving the supporting means, and a sticking means for sticking an adhesive sheet to the other surface of the plate-like member supported by the first supporting means and mounting the plate-like member on the frame. In the device
The moving means is provided so as to be relatively movable in a direction along the surface of the plate-like member. When the plate-like member is placed, the moving means is external to the frame supported by the second support means in a plan view. The first support means is positioned, and when the adhesive sheet is stuck by the sticking means, the relative positions of the first and second support means are provided so as to be positioned ,
The affixing device, wherein the second supporting means includes a contact preventing means for preventing contact between the adhesive sheet and the sheet when the adhesive sheet is pasted by the pasting means. The moving means is provided such that the first and second support means can be moved relative to each other in the thickness direction of the plate member so that the surface of the plate member and the surface of the frame are located on substantially the same plane. The sticking device according to claim 1, wherein: Placing the plate-like member on the first support means outside the frame supported by the second support means when seen in plan view,
Thereafter, the first and second support means are moved relative to each other in the direction along the surface of the plate-like member , the sheet stuck to one surface of the plate-like member and protrudes from the outer edge of the plate-like member, and an adhesive sheet The contact prevention means is disposed so as to prevent contact with the first support means, the first support means and the second support means are positioned, and then the adhesive sheet is attached to the other surface of the plate-like member supported by the first support means. And attaching the plate-like member to a frame .

Images