JP2013197118A - Sheet pasting apparatus and sheet pasting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet pasting apparatus and a sheet pasting method by which size of the apparatus can be suppressed and time for setting can be shortened.SOLUTION: A sheet pasting apparatus includes: drawing out means 2 for drawing out a raw sheet RS; cutting means 4 for forming a cut that extends from a first release sheet RL1 side to a second release sheet RL2 side on the wound out raw sheet RS, forming an adhesive sheet of a predetermined shape inside the cut on a strip adhesive sheet AS and forming a first release sheet cut portion inside the cut on the first release sheet RL1; first releasing means 5 for releasing the first release sheet cut portion from the raw sheet RS; pressing means 6 for abutting a first adhering surface AD1 of the adhesive sheet, exposed by releasing the first release sheet cut portion, to a wafer WF to adhere the first adhering surface; and second releasing means 8 for releasing the adhered adhesive sheet from the raw sheet RS to the wafer WF.

Description

  The present invention relates to a sheet sticking apparatus and a sheet sticking method for sticking an adhesive sheet to an adherend.

Conventionally, in a semiconductor manufacturing process, an adhesive sheet such as a protective sheet, a mounting sheet, a dicing tape, or a die bonding tape is attached to the surface of a semiconductor wafer (hereinafter simply referred to as “wafer”) as an adherend. A sticking device is known (see, for example, Patent Document 1).
In the configuration of Patent Document 1, the release sheet temporarily attached to one surface of the adhesive sheet is peeled off from the adhesive sheet by abruptly turning back with the release roller provided in the middle of feeding, and wound around the release material winding portion via the guide roller. take. And the structure which cut | disconnects the adhesive sheet of the state in which the peeling sheet was peeled to the outer shape of a wafer, and affixed on the back surface of a wafer is taken. That is, a configuration is adopted in which the release sheet on one side is previously peeled from the adhesive sheet, and the adhesive sheet is cut and pasted in a state where the adhesive surface is exposed.

JP 2002-367931 A

However, as in Patent Document 1, when one of the release sheets is previously peeled from the adhesive sheet and the adhesive sheet is cut with the adhesive surface exposed, a roller group is required for peeling and peeling the release sheet. For this reason, there is a problem that the configuration of the apparatus becomes complicated, the entire apparatus becomes large, and it takes time to set the sheet.
In addition, since the release sheet is peeled from the adhesive sheet and the adhesive sheet is conveyed in a state where the adhesive surface is exposed, the time for the adhesive surface to be exposed becomes longer, and impurities such as dust adhere to the adhesive surface, There is also a problem that this impurity is mixed with the adherend.
Further, since the release sheet on one side of the entire surface is peeled from the adhesive sheet, an adhesive sheet that saves more space than the adherend surface of the adherend is formed, and the adhesive sheet is pressed from the other surface side. When affixing, there is also a problem that the adhesive sheet outside the cut is also affixed to the adherend surface.

An object of the present invention is to provide a sheet sticking apparatus and a sheet sticking method that suppress an increase in size and do not take time for setting.
Another object is to provide a sheet sticking apparatus and a sheet sticking method that can prevent impurities from being mixed between an adhesive sheet and an adherend.
Furthermore, another object is that when an adhesive sheet smaller than the adherend surface of the adherend is applied to the adherend, the adhesive sheet portion located outside the adhesive sheet is attached to the adherend surface. It is in providing the sheet sticking apparatus and sheet sticking method which are not.

  In order to achieve the above object, in the sheet sticking device of the present invention, the belt-like first release sheet and the second release sheet are temporarily attached to the first adhesive surface and the second adhesive surface of the belt-like adhesive sheet, respectively. An unrolling means for unwinding the original fabric, and a notch reaching the second release sheet from the first release sheet side is formed in the unrolled original fabric, and an adhesive sheet having a predetermined shape is formed on the strip-shaped adhesive sheet inside the notch A cutting means for forming a first release sheet cutting portion on the first release sheet inside the cut, a first peeling means for peeling the first release sheet cutting portion from the original fabric, and the first A pressing means that presses and adheres the first adhesive surface of the adhesive sheet that is exposed by peeling the release sheet cutting portion to the adherend, and peels the adhesive sheet that is stuck to the adherend from the original fabric Second to And a releasing means employs the configuration that.

At this time, in the sheet sticking device of the present invention, the cutting means has a cutting blade and a cutting blade holding means for holding the cutting blade, and the cutting blade holding means is provided with the first peeling means. It is preferable.
In the sheet sticking device of the present invention, it is preferable that the first peeling means peels the first release sheet cutting portion formed by the cutting means from a part of the outer edge.

  On the other hand, the sheet sticking method of the present invention includes a step of feeding an original fabric in which the first strip-like release sheet and the second release sheet are temporarily attached to the first and second adhesive surfaces of the strip-like adhesive sheet, respectively. , Forming an incision reaching the second release sheet from the first release sheet side in the unrolled raw fabric, forming an adhesive sheet of a predetermined shape on the belt-like adhesive sheet inside the notch, and A step of forming a first release sheet cut portion on the inner first release sheet, a step of peeling the first release sheet cut portion from the original fabric, and the first release sheet cut portion being peeled and exposed. Adopting a configuration comprising: a step of pressing and adhering the first adhesive surface of the adhesive sheet to an adherend; and a step of peeling the adhesive sheet attached to the adherend from the original fabric. Yes.

According to the present invention as described above, since it is not necessary to peel the entire first release sheet from the original fabric, equipment such as a guide roller for peeling and winding the first release sheet is not required. The configuration can be simplified, the size of the apparatus can be suppressed, and the time required for setting can be reduced.
Moreover, in order to stick an adherend after peeling only the 1st peeling sheet cutting | disconnection part from an original fabric, without conveying a strip | belt-shaped adhesive sheet in the state which peeled the 1st peeling sheet from the original fabric, the 1st adhesive surface is The time to be exposed can be shortened, and impurities can be prevented from being mixed between the adhesive sheet and the adherend.
Furthermore, when the adhesive sheet is attached to the adherend, the first adhesive surface located outside the adhesive sheet is covered with the first release sheet, so that the adhesive sheet is smaller than the adherend surface of the adherend. When sticking, it can prevent that the 1st adhesive surface located in the outer side of the said adhesive sheet sticks to a to-be-adhered surface.

Furthermore, if the first peeling means is provided in the cutting blade holding means, the cutting part can be peeled off immediately after the cutting is formed by the cutting means, and the processing time can be shortened. Moreover, the structure of an apparatus can be simplified by integrating the equipment used at the time of notch formation, and the equipment used for a 1st peeling means.
Moreover, a 1st peeling sheet cutting | disconnection part can be smoothly peeled by peeling a 1st peeling sheet cutting | disconnection part from some outer edges of an adhesive sheet.

The side view of the sheet sticking apparatus which concerns on one Embodiment of this invention. (A), (B) is operation | movement explanatory drawing of the sheet sticking apparatus of FIG. (C), (D) is operation | movement explanatory drawing of the sheet sticking apparatus of FIG. (A), (B) is a fragmentary sectional view of the modification of the sheet sticking apparatus of FIG.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, without giving a reference figure, for example, when showing directions such as up, down, left, right, near side, and back, all of FIG. 1 is viewed from a normal direction. , And the top, bottom, left, and right directions are directions parallel to the paper surface, and the front and back directions are directions orthogonal to the paper surface.
In FIG. 1, the original fabric RS has a strip-like adhesive sheet AS having a first adhesive surface AD1 on one surface and a second adhesive surface AD2 on the other surface, and a belt-like shape temporarily attached to the first adhesive surface AD1. First release sheet RL1 and a belt-like second release sheet RL2 temporarily attached to the second adhesive surface AD2. The wafer WF is a semiconductor wafer having a back surface WF2 (upper surface) as a deposition surface and a circuit formed on the front surface WF1 (lower surface).
The first release sheet RL1 temporarily attached to the first adhesive surface AD1 is set so as to be more easily peeled off from the belt-like adhesive sheet AS than the second release sheet RL2 temporarily attached to the second adhesive surface AD2. .

  The sheet sticking apparatus 1 forms a feed means 2 for feeding the original fabric RS, and a cut C (see FIG. 2) reaching the second release sheet RL2 from the first release sheet RL1 side to the fed original fabric RS. The adhesive sheet AS1 (see FIG. 2) having a predetermined shape is formed on the belt-like adhesive sheet AS inside, and the first release sheet cutting portion RL1A (see FIG. 2) is formed on the first release sheet RL1 inside the notch C. The cutting means 4, the first peeling means 5 for peeling the first release sheet cutting portion RL1A from the original fabric RS, and the first adhesive surface AD1 of the adhesive sheet AS1 which is exposed after the first peeling sheet cutting portion RL1A is peeled off A pressing unit 6 that presses and sticks to the wafer WF and a second peeling unit 8 that peels the adhesive sheet AS1 attached to the wafer WF from the original fabric RS are provided.

  The feeding means 2 is driven by a rotation motor 21 as a drive device, and supports and supports a wound original fabric RS, a guide roller 26 that guides the original fabric RS in the left direction, and an original The used original fabric RS1 and the first release sheet cutting portion RL1A separated from the anti-RS are driven by a guide roller 29 that guides the used original fabric RS1 upward, and a rotation motor 30 as a driving device, and the used original fabric And a collection roller 31 for collecting RS1.

  The cutting means 4 includes a linear motion motor 41 as a driving device, a holding table 43 as a cutting blade holding means supported at the tip of the output shaft 42 of the linear motion motor 41, and a notch C held by the holding table 43. A cutting blade 44 to be formed, a linear motion motor 45 as a drive device, and a pressing plate 47 supported by an output shaft 46 of the linear motion motor 45 are provided. The cutting blade 44 is formed in an annular shape in plan view smaller than the shape of the wafer WF.

  The first peeling means 5 was peeled off from a plurality of suction holes (not shown) provided on the upper surface 431 of the holding table 43 and suction means 51 such as a suction pump or a vacuum ejector for generating suction force in the suction holes. A discard device (not shown) for discarding the first release sheet cutting portion RL1A.

  The pressing means 6 is a linear motor 64 as a driving device disposed above a table TB conveyed in the left-right direction by a linear motor LM as a driving device, and a driving device supported by a slider 65 of the linear motor 64. A linear motor 61 and a pressing roller 63 rotatably supported by a bracket 62 supported by an output shaft 61A of the linear motor 61 are provided.

  The second peeling means 8 includes a rotation motor 84 as a driving device supported by a slider 66 of a linear motor 64 as a driving device, a first peeling roller 81 supported by an output shaft 84A of the rotation motor 84, And a second peeling roller 82 that sandwiches the used raw material RS1 between the first peeling roller 81 and the first peeling roller 81.

In the sheet sticking apparatus 1 described above, as a procedure for sticking the adhesive sheet AS1 to the wafer WF, first, as shown by a solid line in FIG.
Next, as shown in FIG. 2A, the cutting means 4 drives the linear motion motor 41 and the linear motion motor 45 to raise the holding table 43 and lower the pressing plate 47, whereby the original fabric RS The cutting blade 44 is inserted into the first release sheet RL1 side, and a cut C that penetrates the first release sheet RL1 and the strip-shaped adhesive sheet AS and does not penetrate the second release sheet RL2 is formed. Thus, the adhesive sheet AS1 having a predetermined shape is formed on the belt-like adhesive sheet AS positioned inside the cut C, and the first release sheet cutting portion RL1A is formed on the first release sheet RL1 positioned inside the cut C. In addition, adhesive sheet surrounding part AS2 and 1st peeling sheet surrounding part RL1B which comprise used raw fabric RS1 are formed in strip | belt-shaped adhesive sheet AS and 1st peeling sheet RL1 which are located in the outer side of the notch | incision C, respectively.
Next, as shown in FIG. 2B, the first peeling means 5 drives the suction means 51 and sucks the first release sheet cutting portion RL1A through the plurality of suction holes. Then, the linear motion motor 41 and the linear motion motor 45 are driven to lower the holding table 43 and raise the pressing plate 47, whereby the first release sheet cutting portion RL1A is released from the adhesive sheet AS1. At this time, since the first release sheet RL1 is set to be more easily peeled off from the belt-like adhesive sheet AS than the second release sheet RL2, the adhesive sheet AS1 is not peeled off from the second release sheet RL2. And after the 1st peeling means 5 stops the drive of the suction means 51, the discard means which is not shown in figure is driven, and 1st peeling sheet cutting | disconnection part RL1A is discarded. As a result, the first adhesive surface AD1 of the adhesive sheet AS1 is exposed.

  Thereafter, as shown in FIG. 3C, when the wafer WF placed on the table TB is transported and stops at the position indicated by the two-dot chain line in FIG. 1, the pressing means 6 is moved by the linear motor 61 and the linear motor. 64 is driven to lower the pressing roller 63 and to move the pressing roller 63 leftward. As a result, the adhesive sheet AS1 is pressed from the second release sheet RL2 side and attached to the wafer back surface WF2. In this way, by sticking the adhesive sheet AS1 to the wafer back surface WF2 while rolling the pressing roller 63, it is possible to apply the air while interposing between the wafer back surface WF2 and the adhesive sheet AS1. Thereafter, the pressing means 6 drives the linear motor 61 and the linear motor 64 to raise the pressing roller 63 and move the pressing roller 63 from the position indicated by the two-dot chain line in FIG. 1 to the position indicated by the solid line in FIG. . Here, when the adhesive sheet AS1 is affixed to the wafer WF, the adhesive sheet peripheral portion AS2 is covered with the first release sheet peripheral portion RL1B, so that the wafer back surface WF2 is formed on the wafer back surface WF2 as in the present embodiment. It is possible to prevent the adhesive sheet surrounding portion AS2 from being attached to the back surface WF2 when the so-called inner diameter attachment is performed to attach the smaller adhesive sheet AS1.

Next, as shown in FIG. 3D, the second peeling means 8 drives the rotation motor 84 and rotates the first peeling roller 81, and the pressing means 6 drives the linear motor 64, and the first The two peeling rollers 81 and 82 are moved from the position indicated by the two-dot chain line to the position indicated by the solid line in FIG. Thereby, the used original fabric RS1 is peeled from the adhesive sheet AS1, and only the adhesive sheet AS1 is attached to the wafer WF.
Next, the wafer WF to which the adhesive sheet AS1 is attached is transferred to the next processing step by a transfer means (not shown).
Then, after the table TB has moved to the position indicated by the solid line in FIG. 1, the pressing means 6 drives the linear motor 64 while the second peeling means 8 stops the first peeling roller 81, and the first and second peeling means. The rollers 81 and 82 are moved to a position indicated by a solid line in FIG. In synchronism with this movement, the feeding means 2 drives the rotation motor 21 and the rotation motor 30 to unwind the unused portion of the belt-like adhesive sheet AS from the support roller 22 and wind the used original fabric RS1 by the collection roller 31. take. Thereby, a new original fabric RS is supplied to a position facing the back surface WF2 of the wafer WF. Thereafter, the same operation as described above is repeated.

According to the embodiment as described above, the equipment for winding the first release sheet RL1 alone is not required, the configuration of the apparatus can be simplified, and the increase in the size of the apparatus can be suppressed. Moreover, the work time for setting the raw fabric RS in the apparatus can be shortened.
Furthermore, since only the first release sheet cutting portion RL1A is peeled from the raw fabric RS and the wafer WF is pasted, the time for the first adhesive surface AD1 to be exposed can be shortened, and the first adhesive surface of the adhesive sheet AS1. It is possible to suppress the adhesion of impurities to AD1.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

  Further, in the first peeling means 5, as shown in FIG. 4A, a holding plate 91A is provided on the output shaft 42, and linear motion motors 92A are provided on both left and right ends of the upper surface of the holding plate 91A. The holding table 43 may be provided on the output shaft 93A of the motor 92A. Then, the output amount of the output shaft 93A of the linear motor 92A is adjusted, and the first release sheet cutting portion RL1A is sequentially peeled so as to tilt the holding table 43, so that the outer edge of the first release sheet cutting portion RL1A is removed. The first release sheet cutting portion RL1A can be peeled from a part, and the first release sheet cutting portion RL1A can be smoothly peeled off.

Furthermore, as shown in FIG. 4B, a die cutting roller 94B as a cutting blade holding means provided so as to be rotatable by a rotation motor 95B as a driving device and movable in a horizontal direction by a linear motor (not shown), You may provide the cyclic | annular cutting blade 44B provided in the outer peripheral surface of the die-cut roller 94B, and the suction means (not shown) provided in the part enclosed by the cutting blade 44B in the die-cut roller 94B.
With such a configuration, by moving the die cut roller 94B to the right while rotating in the direction of the arrow, the cutting blade 44B forms a cut C in the belt-like adhesive sheet AS and the first release sheet RL1, and the first release sheet The cut portion RL1A can be sequentially peeled from a part of the outer edge by suction by the die cut roller 94B.
In addition, you may use an adhesive sheet instead of the suction means which provides a suction force to 1st peeling sheet cutting | disconnection part RL1A.

  In addition, the type and material of the belt-like adhesive sheet AS in the present invention are not particularly limited, and examples thereof include those having a first adhesive layer and a second adhesive layer on both surfaces of the base sheet, and a base sheet. It may be composed of only one adhesive layer with no adhesive, or it may have two or more substrate sheets. Moreover, what has an adhesive bond layer in one surface of a base material sheet may be used. In this case, the release sheet temporarily attached to the base sheet side can be exemplified by those adhered by pseudo adhesion or the like. Further, examples of the semiconductor wafer as the adherend include a silicon semiconductor wafer and a compound semiconductor wafer, and a circuit may be provided on the surface WF1, or may not be provided. The sheet to be affixed to such a semiconductor wafer is not limited to a protective sheet, a dicing tape, and a die attach film, and other arbitrary sheets, films, tapes, and the like can be used for arbitrary uses and shapes. Further, the adherend may be an optical disk substrate, and the adhesive sheet may have a resin layer constituting the recording layer. As described above, as an adherend, not only a glass plate, a steel plate, a resin plate, a substrate and the like, and other members, but also members and articles of any form can be targeted.

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

Furthermore, the wafer WF may be placed on the table TB so that the surface WF1 faces upward, and the adhesive sheet AS1 may be attached to the surface WF1.
Further, the shape of the cutting blade 44 may be the same shape as the wafer WF or may be large, and is not limited to a shape such as a square, a triangle, or an ellipse.

DESCRIPTION OF SYMBOLS 1 ... Sheet sticking apparatus 2 ... Feeding means 4 ... Cutting means 5 ... 1st peeling means 6 ... Pressing means 8 ... 2nd peeling means 43 ... Holding table (cutting blade holding means)
44, 44B ... Cutting blade 94B ... Die-cut roller (cutting blade holding means)
AD1 ... first adhesive surface AD2 ... second adhesive surface AS ... band-like adhesive sheet AS1 ... adhesive sheet C ... cut RL1 ... first release sheet RL1A ... first release sheet cut portion RL2 ... second release sheet RS ... raw fabric RS1 ... Used fabric WF ... Wafer (Substrate)

Claims (4)

A feeding means for feeding out the original fabric in which the belt-like first release sheet and the second release sheet are temporarily attached to each of the first adhesive surface and the second adhesive surface of the belt-like adhesive sheet;
A notch reaching the second release sheet from the first release sheet side is formed in the unrolled raw fabric, an adhesive sheet having a predetermined shape is formed on the belt-like adhesive sheet inside the cut, and the inside of the cut Cutting means for forming a first release sheet cutting portion on the first release sheet,
First peeling means for peeling the first release sheet cutting portion from the original fabric;
A pressing means for pressing and sticking the first adhesive surface of the adhesive sheet exposed by peeling the first release sheet cutting portion to an adherend;
A second peeling means for peeling the adhesive sheet affixed to the adherend from the original fabric;
A sheet sticking device comprising:   The sheet according to claim 1, wherein the cutting means includes a cutting blade and a cutting blade holding means for holding the cutting blade, and the cutting blade holding means is provided with the first peeling means. Pasting device.   The sheet sticking device according to claim 1 or 2, wherein the first peeling means peels the first release sheet cutting portion formed by the cutting means from a part of an outer edge. A step of feeding out the original fabric in which the first release sheet and the second release sheet are temporarily attached to the first adhesive surface and the second adhesive surface of the belt-like adhesive sheet,
A notch reaching the second release sheet from the first release sheet side is formed in the unrolled raw fabric, an adhesive sheet having a predetermined shape is formed on the belt-like adhesive sheet inside the cut, and the inside of the cut Forming a first release sheet cutting portion on the first release sheet;
Peeling the first release sheet cutting part from the original fabric;
A step of pressing and adhering the first adhesive surface of the adhesive sheet exposed by peeling off the first release sheet cutting portion to an adherend;
Peeling the adhesive sheet affixed to the adherend from the original fabric;
A sheet sticking method comprising:

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