JP5654311B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sticking method for sticking a base sheet having a predetermined shape to one surface of an adherend via a double-sided adhesive member.

  Conventionally, in a grinding process of a wafer (adhered body), a surface protection sheet in which an adhesive member (adhesive layer) is continuously provided along an outer edge region of a base sheet is used (for example, Patent Documents). 1). In the surface protection sheet of Patent Document 1, before laminating the adhesive member on the base material sheet, an opening is formed by punching in a substantially circular shape so as to surround the circuit formation region of the wafer, and this opening is formed. It is manufactured by laminating an adhesive member on a base sheet.

JP 2005-123382 A

  However, in the method as disclosed in Patent Document 1, since the adhesive member that is punched and removed is processed as waste, a large amount of waste is generated. For example, when an annular adhesive member having an outer diameter of 200 mm and an inner diameter of 190 mm is formed using a square adhesive member having a side of 200 mm, a circular portion having an outer diameter of 190 mm and a hole having a diameter of 200 mm are opened. The outer portion will be discarded, and 90% or more of the prepared adhesive member will be discarded.

  The objective of this invention is providing the sheet sticking apparatus and sticking method which can reduce the generation amount of a waste material.

In order to achieve the above object, the sheet sticking device of the present invention is a sheet sticking device for sticking a base material sheet having a predetermined shape to one surface of an adherend via a double-sided adhesive member, The belt is formed in a band shape having a width so that the pasted area does not overlap when stuck to the one surface in an annular form, and the double-sided adhesive member is fed out to the one surface of the adherend. A first sticking means for sticking a double-sided adhesive member in a ring; and a second sticking means for sticking the base sheet larger than the annular inner edge shape to the double-sided adhesive member attached to the adherend , The first sticking means can absorb the deviation in the length direction of the double-sided adhesive member and connect the sticking start edge and the sticking end edge of the double-sided adhesive member to the adherend, and can be connected to each other. Ru comprising a cutting means for cutting the cut, gutter It has adopted the configuration.

At this time, the sheet sticking apparatus of the present invention includes a support means for supporting the adherend, and a moving means for relatively moving the support means and the first sticking means in correspondence with the annular shape . 1 sticking means, the double-sided adhesive member outer edge that are provided to be affixed to the annular equal to the outer edge shape of the base sheet, it is preferable.
In the sheet sticking device of the present invention, the cutting means may be configured such that the sticking start edge and the sticking end edge of the double-sided adhesive member with respect to the adherend are inclined with respect to the uneven shape or the width direction of the double-sided adhesive member. It is preferable to be provided so as to be cut .
Further, in the sheet sticking device of the present invention, a base-side peeling member is temporarily attached to the adhesive surface to which the base sheet is stuck in the double-sided adhesive member, and the first sticking means is attached to the double-sided adhesive member. It is preferable that a base material side peeling unit for peeling the base material side peeling member before the base material sheet is attached is provided.

On the other hand, the sheet sticking method of the present invention is a sheet sticking method in which a base sheet having a predetermined shape is stuck to one surface of an adherend via a double-sided adhesive member, wherein the double-sided adhesive member is the one side surface When the material is affixed in a ring shape, it is formed in a band shape having a width so that the affixed region does not overlap , and the application start edge and the application end edge of the double-sided adhesive member with respect to the adherend The adhesive member can absorb the shift in the length direction, cut into cuts that can be connected to each other, feed out the double-sided adhesive member, and annularly place the double-sided adhesive member on one surface of the adherend A configuration is adopted in which the base sheet larger than the annular inner edge shape is pasted on the double-sided adhesive member stuck on the adherend.

  According to the present invention as described above, the belt-like double-sided adhesive member having a width so that the pasted areas do not overlap when pasted on the adherend is annularly pasted on one surface of the adherend. Therefore, the double-sided adhesive member need not be manufactured by punching so as to surround, for example, a circuit forming region of the adherend. For this reason, since the part which is pierced and discarded from a strip | belt-shaped double-sided adhesive member does not generate | occur | produce, a waste amount can be reduced and it can suppress using a double-sided adhesive member wastefully.

Further, if the moving means for moving the first sticking means and the supporting means for supporting the adherend is provided, the double-sided adhesive member is annularly attached to the adherend without changing the feeding direction of the double-sided adhesive member. Can be affixed.
Then, if the extended double-sided adhesive member is cut with a cutting means into a length that can be attached in an annular shape and attached to the adherend, the length of the double-sided adhesive member attached to the adherend is different. Even in this case, one type of double-sided adhesive member can be used.
Moreover, the base material side peeling member is temporarily attached to the adhesive surface to which the base material sheet in the double-sided adhesive member is attached, and the base material side peeling member is attached to the base material side before the base material sheet is attached to the double side adhesive member. If it is set as the structure which peels with a peeling means, troubles, such as a foreign material adhering to the adhesion surface of a double-sided adhesive member and adhesive force falling, can be prevented.

The side view of the sheet sticking apparatus which concerns on embodiment of this invention. (A), (B) is operation | movement explanatory drawing of a sheet sticking apparatus. (A), (B) is operation | movement explanatory drawing of a sheet sticking apparatus.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Further, in the embodiment, unless otherwise specified, terms indicating directions such as “up”, “down”, “left”, and “right” are used with reference to FIG.
In FIG. 1, a sheet sticking apparatus 1 is affixed by sticking a double-sided adhesive tape S as a double-sided adhesive member annularly along the outer edge of one surface of a wafer W as an adherend. The substrate sheet BS is pasted on S. The wafer W is formed, for example, in a disk shape (in the case of the present embodiment, a diameter of 300 mm), and a plurality of bumps W3 are provided at predetermined intervals in the inner region W2 excluding the outer edge portion W1 on one surface thereof. (See FIG. 2A). The double-sided adhesive tape S has a predetermined width that is smaller than the radius of the wafer W, that is, a predetermined width that does not overlap when the wafer W is affixed annularly (in this embodiment, 3 mm). Width), the first release sheet RL1 is temporarily attached to one of the adhesive surfaces, and is prepared in advance as an adhesive original fabric R1 in which the second release sheet RL2 as a substrate-side release member is temporarily attached to the other adhesive surface. Has been. Furthermore, the base material sheet BS is preliminarily cut into a shape having a size substantially equal to the outer shape of the wafer W, and is prepared in advance as a base material raw material R2 temporarily attached to the third release sheet RL3 at a predetermined interval. ing. In addition, as the base material sheet BS, one temporarily attached to the third release sheet RL3 by so-called pseudo adhesion can be used.

  The sheet sticking apparatus 1 includes a first sticking means 2 for sticking the double-sided adhesive tape S to the wafer W, a second sticking means 3 for sticking the base sheet BS to the double-sided adhesive tape S attached to the wafer W, and the wafer W. A support table 4 as a support means for supporting the moving table 5 and a moving means 5 for moving the support table 4 relative to the first and second sticking means 2 and 3.

  The first pasting means 2 includes a first feeding means 21 that feeds the adhesive raw fabric R1, a base material-side peeling means 22 that peels the second release sheet RL2 from the fed adhesive raw fabric R1, and a first adhesive double-sided adhesive tape S. First release plate 23 for peeling release sheet RL1, cutting means 24 for cutting double-sided adhesive tape S after peeling of second release sheet RL2, and first press for pressing double-sided adhesive tape S against wafer W for pasting And a roller 25. In addition, each structure of the 1st sticking means 2 is supported by the baseplate which is not shown in figure.

The first feeding means 21 is driven by a support roller 211 that winds and supports the original film R1, two guide rollers 212 and 213 that guide the original film R1, and a rotation motor 214 as a drive device. A pinch roller 216 that sandwiches the first release sheet RL1 between the roller 215 and the drive roller 215, and a collection roller 217 that is driven by a driving device (not shown) and collects the first release sheet RL1 are provided.
The base material side peeling means 22 is provided in the lower left direction of the guide roller 213, and guides the second release sheet RL2 of the adhesive raw fabric R1 in the upper left direction (a direction orthogonal to the fed adhesive raw material R1). And a collection roller 222 that is driven by a driving device (not shown) and collects the second release sheet RL2.

The first release plate 23 is provided in a posture inclined in the lower left direction, and the first release sheet RL1 extending from the guide roller 213 is folded back toward the drive roller 215, whereby the double-sided adhesive tape S is removed from the first release sheet RL1. It comes to peel.
The cutting means 24 is provided in the lower left direction of the base material side peeling means 22 and so as to face the first peeling plate 23. The cutting means 24 advances and retreats with respect to the first release plate 23 to cut only the double-sided adhesive tape S in the original adhesive R1 from which the second release sheet RL2 has been released.
The first pressing roller 25 is made of an elastically deformable member such as rubber or resin, and is rotatably supported by a base plate (not shown). The first pressing roller 25 may be made of silicon rubber or fluororesin so that the double-sided adhesive tape S does not adhere.

The second sticking means 3 includes a second feeding means 31 that feeds the base material roll R2, a second peeling plate 32 that peels the base sheet BS from the third peeling sheet RL3 of the fed base material R2, and a base And a second pressing roller 33 for pressing and sticking the material sheet BS to the double-sided adhesive tape S. In addition, each structure of the 2nd sticking means 3 is also supported by the baseplate which is not shown in figure.
The second feeding means 31 has the same configuration as that of the first feeding means 21, and supports a support roller 311, two guide rollers 312 and 313 that support the base material roll R <b> 2, and a drive device. A driving roller 315 driven by the rotation motor 314, a pinch roller 316, and a recovery roller 317 that rotates and recovers the third release sheet RL3 by a driving device (not shown) are provided.
The second release plate 32 is provided in a posture inclined in the lower left direction, and peels the base sheet BS from the third release sheet RL3 by the same action as the first release plate 23.
The second pressing roller 33 is made of an elastically deformable member such as rubber or resin, and is rotatably supported by a base plate (not shown).

The support table 4 is formed in a substantially plate shape on which the wafer W can be placed. The support table 4 has a function of sucking and holding the wafer W.
The moving means 5 includes an X-axis slider 52 that can move in the X-axis direction (left-right direction) by driving an X-axis robot 51 as a drive device, and a Y-axis robot as a drive device provided on the X-axis slider 52. The Y-axis slider 54 that can move in the Y-axis direction (the direction orthogonal to the plane of FIG. 1) by driving 53 and the drive that rotates the rotary shaft 55 that is fixed on the Y-axis slider 54 and extends in the Z-axis direction (vertical direction). And a rotary motor 56 as a device. The support table 4 is fixed to the upper end of the rotating shaft 55. The rotary motor 56 is provided such that its output shaft can be moved up and down.

In the sheet sticking apparatus 1 described above, a procedure for sticking the double-sided adhesive tape S to the wafer W and integrating the wafer W and the base sheet BS will be described.
First, the leading end sides of the first and second release sheets RL1 and RL2 are wound around the collection rollers 217 and 222, and the leading end of the double-sided adhesive tape S is positioned on the leading end side of the first release plate 23. In addition, the adhesive original fabric R1 is set. Further, the base material R2 is set so that the leading end side of the third release sheet RL3 is wound around the collection roller 317 and the leading end side of the base sheet BS is positioned on the leading end side of the second release plate 32. Keep it.

Then, the support table 4 is moved below the first sticking means 2 by the moving means 5 in a state where the first and second feeding means 21 and 31 are not driven. Specifically, when the wafer W is disk-shaped, the first pressing roller 25 is provided at the substantially center in the left-right direction of the wafer W and on the outer edge portion W1 on the upper side in FIG. 2A (back side in FIG. 1). The support table 4 is moved so as to be positioned.
Thereafter, when the first original feeding means 21 is driven to feed out the original adhesive R1, the second release sheet RL2 of the original adhesive R1 is peeled from the double-sided adhesive tape S by the guide roller 221 and is rotated to the collecting roller 222 that is driven to rotate. Collected. Further, the first release sheet RL1 of the original adhesive R1 after the second release sheet RL2 is peeled off is peeled off from the double-sided adhesive tape S by being folded back by the first release plate 23.

Then, in a state where the end portion of the double-sided adhesive tape S is positioned on the upper surface of the wafer W, the double-sided adhesive tape S is pressed against and adhered to the wafer W by the first pressing roller 25, and the feeding of the original adhesive R1 is continued. As shown in FIG. 2A, the support table 4 is rotated by driving the rotation motor 56. Further, the double-sided adhesive tape S is cut by the cutting means 24 when the length of the double-sided adhesive tape S that has passed through the position facing the cutting means 24 becomes equal to the outer peripheral dimension of the wafer W while continuing to rotate. . And when all the cut | disconnected double-sided adhesive tapes S are affixed, the drive of the 1st delivery means 21 and the rotation motor 56 will be interrupted.
As described above, the belt-like double-sided adhesive tape S is affixed to the outer edge portion W1 of the wafer W in an annular shape whose outer edge shape is equal to the outer edge shape of the base sheet BS. In the case of this embodiment, the diameter of the wafer W is set to 300 mm, the width of the double-sided adhesive tape S is set to 3 mm, and the sticking is performed with a sufficiently large curvature with respect to the width of the double-sided adhesive tape S. The tape S is attached to the wafer W while being deformed, but is attached to the wafer W without any wrinkles.

  Next, when the X-axis robot 51 is driven to move the support table 4 in the direction of the second sticking means 3 and the left end of the wafer W has reached a predetermined position is detected by a sensor (not shown), the second extension The base material R2 is fed out by driving the means 31, and the base sheet BS is peeled from the third release sheet RL3. As shown in FIG. 2B, the peeled base sheet BS is a second pressing roller. At 33, the wafer W is pressed and pasted. Thereafter, the support table 4 is moved to the left by driving the X-axis robot 51, whereby the base sheet BS is attached to the double-sided adhesive tape S attached to the outer edge portion W1 of the wafer W. The BS is integrated with the double-sided adhesive tape S.

On the other hand, as shown in FIG. 3A, when the adherend is a deformed plate-like body WA, the support table 4 is driven by the rotation motor 56 while the double-sided adhesive tape S is fed out by the first sticking means 2. The belt-like double-sided adhesive tape S is deformed on the outer edge portion W1 of the deformed plate-shaped body WA by rotating and moving the X-axis robot 51 and the Y-axis robot 53 in the vertical and horizontal directions in FIG. Affixed in a ring.
Then, as shown in FIG. 3 (B), the rotary motor 56 is supported so that the deformed plate-like body WA is directed in the same direction as the base sheet BS fed from the second feeding means 31 by driving the moving means 5. By rotating the table 4 and driving the second sticking means 3 and the X-axis robot 51, the base sheet BS substantially equal to the outer diameter shape of the wafer W is stuck on the double-sided adhesive tape S.

According to this embodiment as described above, the following effects are obtained.
That is, since the double-sided adhesive tape S having a predetermined width smaller than the radius of the wafer W is fed out and stuck in a ring shape along the outer edge of the wafer W, the double-sided adhesive tape S to be discarded is not generated, and the amount of waste can be reduced.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description limited to the shape, material, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such is included in this invention.

That is, in the present embodiment, the following configuration may be used.
For example, without providing the cutting means 24, an adhesive raw fabric R1 in which a double-sided adhesive tape S having a length substantially equal to the outer peripheral dimension of the wafer W is temporarily attached to the first release sheet RL1 at a predetermined interval may be used. The cutting means 24 may employ other cutting equipment such as a laser.
Further, the second release sheet RL2 may not be provided on the adhesive raw fabric R1.
Further, the moving means 5 may not be provided with the Y-axis robot 53 and the Y slider 54.
Further, the first pasting means 2 and the second pasting means 3 may be moved without moving the support table 4.
Furthermore, the double-sided adhesive tape S may be one in which an adhesive layer is laminated on both sides of the base sheet, or only an adhesive layer without a base sheet.
In addition, as in the above-described embodiment, an item that is not attached with a sufficiently large curvature with respect to the width of the double-sided adhesive tape S may be attached to the adherend with a wrinkle sometimes. If the base sheet is only used as a cover material or does not hinder the processing of the adherend, the double-sided adhesive tape S may be attached to the adherend with wrinkles.
Furthermore, in order to increase the possibility of joining the sticking start end and the sticking end end of the double-sided adhesive tape S to the adherend, the cutting direction of the double-sided adhesive tape S by the cutting means 24 is set in the width direction of the double-sided adhesive tape S. Alternatively, it may be set to be inclined with respect to the surface, or may have an uneven shape or a saw blade shape. That is, when the cut end is set in parallel with the width direction of the double-sided adhesive tape S, if the sticking start end and the sticking end end are shifted in the length direction of the double-sided adhesive tape S, regardless of the amount of shift in the width direction, The sticking start end and the sticking end end cannot be joined. On the other hand, if the cut cut is inclined with respect to the width direction, has an irregular shape, or has a saw blade shape, the sticking start end and the sticking end end are shifted in the length direction of the double-sided adhesive tape S. Even in the case of being stuck, depending on the amount of shift in the width direction, the sticking start end and the sticking end end can be joined.

The application state of the double-sided adhesive tape S may be selected according to the purpose. For example, the double-sided adhesive tape S may be attached to the disc-shaped wafer W in an annular shape whose outer edge shape is smaller than the outer edge shape of the wafer W. However, it may be attached in a polygonal shape or an irregular shape. Further, the outer edge shape of the base sheet BS may be larger than the annular inner edge shape formed by the double-sided adhesive tape S on the wafer W, and may have an outer edge shape larger than the annular outer edge shape. .
Further, the adherend is not limited to the semiconductor wafer W, and other adherends such as a glass plate, a steel plate, pottery, a wooden plate, or a resin plate can be targeted. The semiconductor wafer W is a silicon semiconductor. It may be a wafer or a compound semiconductor wafer. The wafer W is not limited to the one on which the bumps are formed, and may be one in which a recess is formed in a region corresponding to the circuit formation region.
Furthermore, the drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 ... Sheet sticking apparatus 2 ... 1st sticking means 3 ... 2nd sticking means 4 ... Support table (support means)
DESCRIPTION OF SYMBOLS 5 ... Moving means 22 ... Base material side peeling means 24 ... Cutting means BS ... Base material sheet RL2 ... 2nd release sheet (base material side peeling member)
S: Double-sided adhesive tape (double-sided adhesive material)
W ... Wafer (Substrate)
WA ... deformed plate (adhered body)

Claims (4)

A sheet sticking device for sticking a base sheet of a predetermined shape to one surface of an adherend via a double-sided adhesive member,
The double-sided adhesive member is formed in a band shape having such a width that the pasted area does not overlap when stuck on the one surface in an annular shape,
A first pasting means for feeding out the double-sided adhesive member and annularly pasting the double-sided adhesive member on one surface of the adherend;
A second sticking means for sticking the base sheet larger than the annular inner edge shape to the double-sided adhesive member stuck to the adherend ,
The first sticking means can absorb the shift in the length direction of the double-sided adhesive member and connect the end edge of the double-sided adhesive member to the adherend in the length direction. sheet sticking device characterized by Ru comprising a cutting means for cutting the such cut. A support means for supporting the adherend;
Moving means for relatively moving the support means and the first sticking means in correspondence with the annular shape ;
Said first bonding means, the sheet sticking apparatus according to claim 1, said double-sided adhesive member outer edge, characterized that you have provided to be affixed to the annular equal to the outer edge shape of the base sheet. The cutting means is provided so that the sticking start edge and the sticking end edge of the double-sided adhesive member to the adherend can be cut obliquely with respect to the concavo-convex shape or the width direction of the double-sided adhesive member. The sheet sticking device according to claim 1 or 2, wherein the sheet sticking device is characterized. A sheet sticking method for sticking a base sheet of a predetermined shape to one surface of an adherend via a double-sided adhesive member,
The double-sided adhesive member is formed in a band shape having such a width that the pasted area does not overlap when stuck on the one surface in an annular shape,
The sticking start edge and the sticking end edge of the double-sided adhesive member with respect to the adherend can absorb the deviation in the length direction of the double-sided adhesive member, and cut into cuts that can be connected to each other,
Unwinding the double-sided adhesive member, and affixing the double-sided adhesive member annularly on one surface of the adherend,
The sheet pasting method characterized by sticking the base sheet larger than the annular inner edge shape on the double-sided adhesive member stuck on the adherend.

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