JP2015082615A - Sheet sticking device and sheet sticking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet sticking device capable of forming a sticking sheet having a beautiful outer edge and quickly sticking the sheet to an adherend.SOLUTION: A sheet sticking device 1 comprises: supply means 3 for supplying an adhesive sheet AS to a position facing an adherend WF; cutting means 4 having a closed loop-like cutting blade 41 provided between the adhesive sheet AS supplied by the supply means 3 and the adherend WF; and cutting and pressing means 6 for forming a sticking sheet AS1 from the adhesive sheet AS by pressing the adhesive sheet AS against the cutting blade 41 by moving a pressing member to the adhesive sheet AS supplied by the supply means 3 from the opposite side of the cutting blade 41 toward the adherend WF side and sticking the sticking sheet AS1 to the adherend WF by pressing the sheet. The cutting blade 41 is formed so that the adhesive sheet AS pressed by the cutting and pressing means 6 does not simultaneously come into contact with the whole of a cutting edge 41C of the cutting blade 41.

Description

  The present invention relates to a sheet sticking apparatus and a sticking method.

  2. Description of the Related Art Conventionally, a sheet sticking apparatus for sticking an adhesive sheet to a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) in a semiconductor manufacturing process is known (see, for example, Patent Document 1). In this sheet sticking device, a pressing member positioned above the adhesive sheet is moved toward the adherend, so that the adhesive sheet is pressed against the cutting blade to form a sticking sheet, and the sticking sheet is attached. It is pressed against the body.

JP 2010-80838 A

  However, in the conventional apparatus described in Patent Document 1, since the adhesive sheet contacts the entire cutting edge at the same time, the force with which the adhesive sheet is pressed against the cutting edge is dispersed over the entire cutting edge, and a good cutting condition is obtained. In particular, if the adhesive of the adhesive sheet adheres to the cutting blade or the cutting blade is worn, the outer edge of the sticking sheet may not be cut cleanly, and the sticking applied to the adherend There are disadvantages in that air bubbles are present at the outer edge of the sheet, and that the outer edge is easily peeled off from the adherend.

  The objective of this invention is providing the sheet sticking apparatus and sticking method which can form the sheet | seat for sticking with a beautiful outer edge, and can affix it on a to-be-adhered body quickly.

  In order to achieve the above object, a sheet sticking apparatus of the present invention includes a supply unit that supplies an adhesive sheet to a position facing an adherend, and an adhesive sheet that is supplied by the supply unit and the adherend. A cutting means having a closed-loop cutting blade provided, and moving the adhesive sheet from the opposite side of the cutting blade toward the adherend side with respect to the adhesive sheet supplied by the supply means; A cutting pressing means that presses against the cutting blade to form a sticking sheet from the adhesive sheet, and presses and sticks the sticking sheet against the adherend. A configuration is adopted in which the pressed adhesive sheet is formed so as not to contact the entire cutting edge of the cutting blade at the same time.

At this time, in the sheet sticking device of the present invention, it is preferable that the cutting unit includes a vibration applying unit that applies vibration to the cutting blade.
Moreover, in the sheet sticking device of the present invention, the adhesive sheet is displaced together with the cutting and pressing means that is located on the opposite side of the cutting means with respect to the adhesive sheet supplied by the supplying means and is separated from the adherend. It is preferable that a displacement suppressing means for suppressing the above is provided.
Furthermore, in the sheet sticking device of the present invention, the cutting blade is formed in an annular shape, and the cutting means includes a rotating means for rotating the cutting blade along the ring of the cutting blade. Is preferred.

  On the other hand, the sheet sticking method of the present invention includes a step of supplying an adhesive sheet to a position facing an adherend, and affixing the supplied adhesive sheet against a closed loop cutting blade by a cutting pressing means and sticking from the adhesive sheet. A step of forming an adhesive sheet, and a step of pressing and sticking the sticking sheet to the adherend by the cutting and pressing means, and forming the sticking sheet from the adhesive sheet. A configuration is adopted in which a step of forming the sticking sheet by using a cutting blade provided so that the adhesive sheet pressed by is not simultaneously brought into contact with the entire cutting edge of the cutting blade is employed.

  According to the present invention as described above, the adhesive sheet can be formed on the entire cutting edge at the same time because the adhesive sheet can be formed while the force that the adhesive sheet is pressed against the cutting edge is concentrated on a part of the cutting edge. By abutting, the force with which the adhesive sheet is pressed against the blade edge is not dispersed throughout the blade edge, even if the adhesive is attached to the cutting blade or the cutting blade is worn, A sheet for sticking with a clean outer edge can be formed and quickly attached to the adherend.

At this time, if the cutting means includes vibration applying means, the adhesive sheet can be easily cut.
Furthermore, if the displacement suppressing means is provided, when the cutting and pressing means returns to the original position after the cutting and pressing operation, the cutting and pressing means remain fitted in the punching hole of the adhesive sheet in the adhesive sheet, and It is possible to prevent a problem that the unnecessary sheet formed by cutting the sticking sheet cannot be collected.
Moreover, if a rotation means is provided, it will become easy to cut | disconnect an adhesive sheet.

The side view of the sheet sticking apparatus which concerns on one Embodiment of this invention. The side view of the cutting | disconnection means which comprises the sheet sticking apparatus of FIG. The side view of the cutting blade which concerns on a modification.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this specification, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. To do. Furthermore, in the present embodiment, when viewed from the near side of FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis, “down” is the opposite direction, “ “Left” is the X-axis arrow direction, “Right” is the opposite direction, “Front” is the Y-axis arrow direction, and this is the front direction orthogonal to the page, and “Rear” is the opposite direction.

  In FIG. 1, a sheet sticking apparatus 1 includes a supporting means 2 for supporting a wafer WF as an adherend, a supplying means 3 for supplying an adhesive sheet AS to a position facing the wafer WF, and an adhesive supplied by the supplying means 3. The cutting means 4 having a closed-loop cutting blade 41 provided between the sheet AS and the wafer WF, and the adhesive sheet AS supplied by the supply means 3 from the opposite side of the cutting blade 41 toward the wafer WF. And cutting and pressing means 6 that presses the adhesive sheet AS against the cutting blade 41 to form the sticking sheet AS1 from the adhesive sheet AS, and presses and sticks the sticking sheet AS1 to the wafer WF. The adhesive sheet AS is displaced together with the cutting and pressing means 6 which is located on the opposite side of the cutting means 4 with respect to the adhesive sheet AS supplied by the supplying means 3 and is separated from the wafer WF. And a suppressing displacement suppression means 7.

  The support means 2 has a recess 21B that is recessed from the upper surface 21A and is open on the front side. The support means 2 is provided in the outer table 21 having a substantially rectangular shape in plan view, that is, viewed from above, and the recess 21B. An inner table 22 having a support surface 22A that can be sucked and held by a decompression means (not shown), a linear motion motor 23 as a driving device that supports the inner table 22 with its output shaft 23A, and a surface WF1 to which the wafer WF is attached And a detecting means 24 constituted by an imaging means such as an optical sensor or a camera capable of detecting the position in the vertical direction.

  The supply means 3 includes a support roller 31 that supports a belt-like adhesive sheet AS having an adhesive AD layer on one surface of the base sheet BS, and a drive roller 32 that is driven by a rotation motor 32A as a drive device. An unnecessary sheet US formed by cutting the adhesive sheet AS1 from the adhesive sheet AS between the pinch roller 33 that sandwiches the adhesive sheet AS therebetween and the drive roller 34 that is driven by a rotation motor 34A as a drive device. And a collection roller 36 that is driven by a driving device (not shown) and collects the unnecessary sheet US.

  As shown in FIGS. 1 and 2, the cutting means 4 rotates the cutting blade 41 along the annular shape of the cutting blade 41 and the cutting blade 41 formed in an annular shape in plan view. Rotating means 42 that rotates the cutting blade 41 around the circle center CA of the cutting blade 41 and a vibration that imparts vibration to the cutting blade 41 is orthogonal to the surface of the adhesive sheet AS pressed against the cutting blade 41. Providing means 51.

The cutting blade 41 has a flange portion 41A formed in an annular shape in a plan view, and a relief portion 41D that protrudes upward from the upper surface of the flange portion 41A on the inner side of the annular ring and prevents the affixing sheet AS1 from abutting on the inside. And a formed blade part 41B. In the case of the present embodiment, the cutting edge 41C of the blade portion 41B is configured to be inclined at a predetermined angle with respect to the left-right direction in a side view, whereby the adhesive sheet AS pressed by the cutting pressing means 6 is cut. The entire cutting edge 41 </ b> C of the blade 41 is not in contact with the blade 41 at the same time. That is, the cutting edge 41C only needs to form the sticking sheet AS1 while partially contacting the adhesive sheet AS pressed by the cutting and pressing means 6. Note that the relief portion 41D can prevent the sticking sheet AS1 from sticking out of the desired position of the wafer WF by adhering the sticking sheet AS1.
The rotating means 42 surrounds the cutting blade holding member 43 having a substantially rectangular box shape in plan view having openings 43A and 43B having a substantially circular shape in plan view at the upper and lower portions, and surrounding the opening portion 43B inside the cutting blade holding member 43. And a rotating bearing 44 such as a thrust bearing or a sliding member that rotatably supports the cutting blade 41 from below, and an outer peripheral surface of the flange portion 41A, and an output shaft 45B of a rotating motor 45A as a driving device. A part of the opening 43A is blocked by the supported main driving roller 45, the driven roller 46 that is in contact with the outer peripheral surface of the flange portion 41A and supported by the rotating shaft 46A so as to be driven to rotate, and the upper portion of the cutting blade holding member 43. In addition, a fixed plate 47 having an opening 47A that allows the cutting blade 41 to protrude, and a thrust supported by the lower surface of the fixed plate 47 and rotatably supporting the cutting blade 41 from above. And a rotary bearing 48, such as bearings and sliding members. In the present embodiment, one main driving roller 45 and three driven rollers 46 are arranged at approximately 90 ° intervals in the outer peripheral direction of the flange portion 41A.
The vibration applying means 51 includes an ultrasonic vibration device, a vibrator, an eccentric motor, and the like. The lower part is supported by the upper surface 21A of the outer table 21, and the cutting blade holding member 43 is supported by the upper part.

  The cutting and pressing means 6 is supported by an output shaft 61A of a direct acting motor 61 as a drive device, and has a pressing member 62 having a pressing surface 62A connected to a pressure reducing means (not shown) such as a pressure reducing pump or a vacuum ejector, and a pressing member 62. And an adhesion enhancing means 63 for increasing the adhesive force of the adhesive AD layer of the adhesive sheet AS. As the adhesion enhancing means 63, a heating means such as a coil heater or a heat pipe heating side, a cooling means such as a Peltier element or a cooling side of a heat pipe, a light irradiation means, a microwave irradiation means, an ultraviolet irradiation means, an infrared irradiation means, etc. Depending on the characteristics of the adhesive AD layer, it can be selected as appropriate. In this embodiment, a heating means is employed. The planar shape of the pressing surface 62A is a slightly similar shape to the planar shape of the cutting edge 41C.

  The displacement suppression means 7 is formed by a plate-like member having a through hole 71 through which the pressing member 62 can pass, and is supported by a frame (not shown).

In the sheet sticking apparatus 1 described above, a procedure for sticking the adhesive sheet AS to the wafer WF will be described.
First, when the operator sets an adhesive sheet AS as shown in FIG. 1 and then inputs an operation start signal via an input means such as an operation panel or a personal computer (not shown), the cutting and pressing means 6 causes the adhesion enhancing means 63 to be used. And the pressing surface 62A of the pressing member 62 is heated. Next, the supply means 3 drives the rotation motors 32A and 34A and a driving device (not shown), and the adhesive sheet is fed out for a predetermined length so that the unused portion of the adhesive sheet AS faces the adherend surface WF1 of the wafer WF. The sheet sticking device 1 is in a standby state. Thereafter, when the wafer WF is placed on the support surface 22A by hand or by a transfer means (not shown), the support means 2 drives a decompression means (not shown) to hold the wafer WF by suction. Next, when the supporting means 2 drives the linear motion motor 23 to raise the inner table 22 and the adherend surface WF1 is detected by the detection means 24 as shown by a two-dot chain line in FIG. Stop driving. In this way, by setting the position of the adherend surface WF1 to a predetermined position, even when the thickness of the wafer WF is different, it is not necessary to change the lifting stroke of the linear motor 61.

  Next, the cutting unit 4 drives the vibration applying unit 51 to apply vibration to the cutting blade 41. Thereafter, the cutting and pressing means 6 drives a decompression means and a linear motion motor 61 (not shown), lowers the pressing member 62, sucks and holds the adhesive sheet AS with the pressing surface 62A, and presses the adhesive sheet AS against the cutting blade 41. The adhesive sheet AS1 is formed from the adhesive sheet AS. At this time, the adhesive sheet AS is pressed against the cutting edge 41C in order from the left end in FIG. 2 toward the right end in the position closest to the pressing surface 62A in the cutting edge 41C, and the right end in FIG. 2 of the cutting edge 41C. At the point of time, the sticking sheet AS1 is formed. Thereafter, the lowering operation of the pressing member 62 is continued, and the sticking sheet AS1 sucked and held by the pressing surface 62A is pressed against the adherend surface WF1 of the wafer WF by the pressing member 62 and heated by the adhesion enhancing means 63. Affixed to wafer WF. The cutting means 4 may drive the rotation motor 45A and rotate the cutting blade 41 to form the sticking sheet AS1 and stick it to the wafer WF in the same manner as described above.

  Next, after the cutting and pressing means 6 stops driving the decompression means (not shown) and releases the holding of the sticking sheet AS1, the linear motion motor 61 is driven to return the pressing member 62 to the position shown in FIG. At the time of this return, the displacement suppression means 7 can prevent the pressing member 62 from being fitted in the punched hole of the sticking sheet AS1 and preventing the unnecessary sheet US from being collected. Then, after the support means 2 drives the linear motion motor 23 to return the inner table 22 to the position indicated by the solid line in FIG. 1, the drive of the decompression means (not shown) is stopped and the holding of the wafer WF is released. Thereafter, the wafer WF to which the sticking sheet AS1 is stuck is transferred to the next process manually or by a transfer means (not shown), and thereafter the same operation as described above is repeated.

  According to the embodiment as described above, the adhesive sheet AS1 can be formed while the force with which the adhesive sheet AS is pressed against the blade edge 41C is concentrated on a part of the blade edge 41C, and thus the adhesive sheet AS1 can be formed. Simultaneously abuts against the entire cutting edge 41C, the force with which the adhesive sheet AS is pressed against the cutting edge 41C is not dispersed throughout the cutting edge 41C, and the adhesive AD adheres to the cutting blade 41 or the cutting blade Even when 41 is worn, it is possible to form a sticking sheet AS1 with a clean outer edge and quickly stick it to the wafer WF.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

  For example, instead of the cutting blade 41, the cutting blades 81 and 82 having triangular cutting edges 81C and 82C as shown in FIGS. 3 (A) and 3 (B), and a side view as shown in FIG. 3 (C). A cutting blade 83 having an arcuate cutting edge 83C, a cutting blade 84 having a rectangular cutting edge 84C as shown in FIG. 4D, and a trapezoidal cutting edge 85C as shown in FIG. The cutting blade 85 has an upper surface 86E that is inclined with respect to the lower surface 86D as shown in FIG. 5F and has a substantially circular plate shape having a through-hole 86F that penetrates vertically, and is substantially formed by the upper edge of the through-hole 86F. A cutting blade 86 having a circular cutting edge 86C may be applied. Even with these cutting blades 81, 82, 83, 84, 85, 86, the adhesive sheet AS pressed by the pressing surface 62A as shown by the two-dot chain line in FIGS. Can be prevented from being simultaneously pressed against the entire closed-loop cutting edges 81C, 82C, 83C, 84C, 85C, 86C.

When the wafer WF is supported by another apparatus or the like, the support means 2 may not be provided in the present invention.
The support means 2 may not be provided with the linear motor 23.
The outer shape of the outer table 21 in plan view may be other shapes such as a rectangular polygon, a circle, and an ellipse.
The cutting means 4 may form the sticking sheet AS1 by simply rotating the cutting blade 41 with the rotating means 42 without driving the vibration applying means 51 or without providing the vibration applying means 51. Then, the sticking sheet AS1 may be formed only by applying vibration to the cutting blade 41 by the vibration applying means 51 without driving the rotating means 42 or without providing the rotating means 42. In addition, when the cutting blade 41 is a simple closed loop shape which is not circular, the rotating means 42 may be omitted.
The circular cutting blade 41 does not have to be a perfect circular ring. For example, the circular cutting blade 41 can have a planar shape such as an ellipse or a polygon whose corners are arcuate, and the planar shape of the pressing surface 62A is also matched thereto. Thus, the shape can be made smaller than the planar shape of the cutting edge 41C. In this case, for example, the rotating means 42 may be rotated by bending an annular band saw (band cutter), wire saw (wire cutter) or the like into a planar shape such as an ellipse or a polygon with rounded corners.
When the rotating means 42 is not provided, the cutting blade 41 may be formed with a cutting edge 41C in a closed loop shape other than a perfect circle, such as a triangle, a quadrilateral or more polygonal shape, or an ellipse.
The rotation means 42 is not particularly limited with respect to the arrangement interval and the number of each of the main driving roller 45 and the driven roller 46, and a total of three or more is preferable. The configuration may be such that the cutting blade 41 is rotated by only one or a plurality of main driving rollers 45 without providing 46.
The rotating means 42 is not limited as long as it can rotate the cutting blade 41, and the main driving roller 45 is configured by a gear, a sprocket, an uneven pulley, and the like, and a gear that meshes with the flange 41A side. , Chain, irregularities, etc., the main driving roller 45 is composed of gears, sprockets, timing pulleys, etc., and gears, sprockets, timing pulleys, etc. are also provided on the flange 41A side via planetary gears, chains, timing belts, etc. The cutting blade 41 may be configured to rotate. In short, any configuration that can rotate the cutting blade 41 so that the pressing surface 62A can pass through the annular shape or the closed loop of the cutting blade 41 is sufficient.
The rotation means 42 turns the rotation motor 45A to, for example, 5 degrees, 10 times after affixing one or a plurality of application sheets AS1 to the wafer WF without rotating the cutting blade 41 or when a predetermined time has elapsed. You may make it rotate a predetermined angle, such as a degree and 90 degree | times. In this case, since the corresponding positions of the pressing member 62 and the blade edge 41C are shifted, uneven wear of the pressing member 62 and the blade edge 41C can be prevented.
The rotating means 42 may rotate the cutting blade 41 in one direction, may rotate the cutting blade 41 in both one direction and the other direction, and the rotation speed and rotation angle of the cutting blade 41. Can be appropriately set based on experience values, theoretical values, and the like.
The adhesive sheet AS supplied by the supply means 3 may be a single sheet.
The arrangement position and the number of vibration applying means 51 are not particularly limited, and the cutting blade holding member 43 is supported by one or more vibration applying means 51 and one or more elastic members such as rubber or resin. For example, the cutting blade holding member 43 may be supported at an equal interval of 90 degrees or an equal interval of 120 degrees.
The setting of the vibration frequency, amplitude, vibration direction, and the like of the vibration applying means 51 is not particularly limited, and can be set as appropriate based on experience values, theoretical values, and the like.
The pressing member 62 may be configured to hold the adhesive sheet AS (sticking sheet AS1) with an electrostatic chuck, an adhesive, or the like, or may be used for sticking without holding the adhesive sheet AS (sticking sheet AS1). When the sheet AS1 can be attached to the wafer WF, the adhesive sheet AS (attachment sheet AS1) may not be held.
The adhesion enhancing means 63 performs heating after the bonding sheet AS1 is formed, performs heating until the bonding sheet AS1 contacts the wafer WF, or presses the bonding sheet AS1 against the wafer WF. It may be heated afterwards.
For example, with respect to components that are not described as components in the independent claims of the present invention, such as the detection unit 24, the escape portion 41D, the rotation unit 42, the vibration applying unit 51, the adhesion enhancing unit 63, the displacement suppressing unit 7, etc. Each may be employed as necessary, and may not be employed.

  Further, the material, type, shape and the like of the adhesive sheet AS and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS is not limited to adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. Such an adhesive sheet AS is, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, a cover layer on the upper surface of the base sheet, etc. Three or more layers, or a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer may be used. The double-sided adhesive sheet comprises a single-layer or multi-layer intermediate layer. It may be a single layer or a multilayer having no intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, as long as the supply means can supply the adhesive sheet to the position facing the adherend, it is not limited in any way as long as it is within the technical scope in light of the common general technical knowledge at the time of filing ( Description of other means and steps is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 ... Sheet sticking apparatus 3 ... Supply means 4 ... Cutting means 6 ... Cutting press means 7 ... Displacement suppression means 41, 81, 82, 83, 84, 85, 86 ... Cutting blade 41C, 81C, 82C, 83C, 84C, 85C 86C ... Cutting edge 42 ... Turning means 51 ... Vibration applying means AS ... Adhesive sheet AS1 ... Sheet for sticking CA ... Center of circle WF ... Wafer (adhered body)

Claims (5)

Supply means for supplying an adhesive sheet to a position facing the adherend;
A cutting means having a closed-loop cutting blade provided between the adhesive sheet supplied by the supply means and the adherend;
By moving toward the adherend side from the opposite side of the cutting blade with respect to the adhesive sheet supplied by the supply means, the adhesive sheet is pressed against the cutting blade, and the adhesive sheet is removed from the adhesive sheet. And forming and pressing means for pressing and sticking the sticking sheet to the adherend,
The cutting blade is formed so that the adhesive sheet pressed by the cutting pressing means does not simultaneously contact the entire cutting edge of the cutting blade.   The sheet sticking apparatus according to claim 1, wherein the cutting unit includes a vibration applying unit that applies vibration to the cutting blade.   Displacement suppression means that suppresses displacement of the adhesive sheet together with the cutting pressing means that is positioned on the opposite side of the cutting means with respect to the adhesive sheet supplied by the supply means and is spaced apart from the adherend. The sheet sticking apparatus according to claim 1 or 2, wherein The cutting blade is formed in an annular shape,
The sheet sticking device according to any one of claims 1 to 3, wherein the cutting means includes a rotating means for rotating the cutting blade along an annular ring of the cutting blade. Supplying an adhesive sheet to a position facing the adherend;
Pressing the supplied adhesive sheet against a closed-loop cutting blade with a cutting and pressing means to form an adhesive sheet from the adhesive sheet; and
A step of pressing and sticking the sticking sheet to the adherend with the cutting and pressing means,
In the step of forming a sticking sheet from the adhesive sheet, the sticking sheet using a cutting blade provided so that the adhesive sheet pressed by the cutting and pressing means does not simultaneously contact the entire cutting edge of the cutting blade. The sheet sticking method characterized by including the process of forming.

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