JPH11238749A - Semiconductor cutting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor cutting apparatus which is capable of manufacturing high quality small semiconductor devices by omitting a substrate supporting acceptor and accurately cutting a frame member along a peripheral edge of a resin sealing part, at cutting of the frame member into individual semiconductor devices. SOLUTION: This apparatus includes a tape base carrier plate 5 for carrying a tape base 1 around a resin encapsulating part 2 of a frame member 4 having a plurality of semiconductor devices formed integrally therein, a pushing member 12 for pushing the tape base 1 around the resin encapsulating part 2 so as to expand the base 1, and a cutter device 9 for bringing a blade tip of a cutting blade 10b into contact with the base 1 along an outer edge of the encapsulating part 2 and vibrating the cutting blade 10b by means of an ultrasonic oscillator 11 for cutting the tape base 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a so-called BGA (Ball Grid Array) type semiconductor device in which a semiconductor element is mounted on one surface of a substrate and solder balls are formed on the other surface. The present invention relates to a semiconductor cutting apparatus for cutting a material into individual sides.

[0002]

2. Description of the Related Art In recent years, BGA type semiconductor devices have been used in order to promote miniaturization and high-density mounting of semiconductor devices. This BGA type semiconductor device generally has a resin sealing portion in which a semiconductor element mounted on one surface of a resin substrate is resin-sealed, and is electrically connected to the semiconductor element on the other surface of the substrate. Solder balls to be connected and to be external connection terminals are formed respectively. As the resin substrate, a resin substrate such as a glass epoxy resin or a resin film material such as a TAB tape is suitably used.

[0003] Among the above semiconductor devices, TAB is used as a base material.
So-called tape BG using resin film material such as tape
The manufacturing process of the A type semiconductor device will be described. As shown in FIG. 5, a metal foil such as a copper foil is adhered to a strip-shaped tape base material 51 using a polyimide film or the like, and a metal wiring pattern is formed by a known photolithography method, an etching method, or the like. . After a semiconductor element (not shown) is mounted on the tape base material 51, the semiconductor device is sealed with a resin sealing device to form a resin sealing portion 52 at a plurality of locations. Further, a solder ball 53 (see FIGS. 6 and 7) serving as an external connection terminal is joined to a via hole formed on the back surface side of the resin sealing portion 52. In this manner, the frame body 54 in which a plurality of semiconductor devices are integrally formed is carried into a semiconductor cutting device provided with a punch and a die, and is punched to cut the semiconductor devices individually. Was.

The configuration of a semiconductor cutting device for individually cutting the above semiconductor devices will be described. Referring to FIGS. 6 and 7, the semiconductor cutting device supports a punch 55 having a cutting blade and a tape base material 51 of a frame body 54. The die 56 that has the die 56 and supports the tape base 51 is provided with a receiver 57 that contacts and supports the tape base 51 other than the solder ball 53 bonding area. The semiconductor device 59 is cut individually by punching out the tape base material 51 by entering the die hole 56a of the die 56. In the cutting operation of the semiconductor cutting device, a movable portion 58 is provided on a part of the die 56 in FIG.
Are provided, and the semiconductor device 59 cut and individually cut by clamping the tape base material 51 with the punch 55 and the movable portion 58 is taken out and taken out. Further, in FIG. 7, the tape base material 51 around the resin sealing portion 52 is pulled out below the die hole 57 by a punch 55, and the semiconductor device 59 supported by the die 56 after being cut is taken out. Was. Alternatively, as another configuration of the semiconductor cutting device,
There has been an apparatus that cuts the semiconductor devices 59 individually by burning off the tape base material 51 by scanning with a laser beam and aiming at the peripheral portion of the resin sealing portion 52.

[0005]

In order to promote the miniaturization of the semiconductor device 59, it is desirable that the cutting position by the semiconductor cutting device is cut along the periphery of the resin sealing portion 52. However, in the semiconductor cutting device shown in FIGS. 6 and 7, if the punch 55 is used to strictly target the peripheral portion of the resin sealing portion 52 and punches the tape substrate, the tape base material may shrink due to the contraction of the resin sealing portion 52 or the like. When the positioning accuracy of 51 is slightly deviated, as shown in FIG.
With the punch 55. Further, in the die 56, a receiver 57 for releasing the solder balls 53 and supporting the tape base material 51 other than the bonding area of the solder balls 53 is required. During this time, the tape side 51a remains for a slight interval t of the tape base material 51. In order to make the tape side 51a corresponding to the interval t as small as possible, the width of the receiver 57 provided on the die 56 must be narrowed. As described above, the die 5 is provided with the receiving portion 5 of the tape base material 51.
Since there is a risk of breakage if the support 57 is not provided and the support 57 may be damaged if the width of the support 57 is reduced, a semiconductor cutting device that does not require the support 57 is desired. Further, when the laser beam is scanned to burn off the tape base material 51, the cutting speed is slow and the cut surface is burned in a spot-like manner, so that the tape pieces easily remain.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems of the prior art and to omit a support for supporting a base material and cut along a peripheral edge of a resin sealing portion when individually cutting a semiconductor device from a frame body. It is an object of the present invention to provide a semiconductor cutting device capable of manufacturing a smaller and higher quality semiconductor device by cutting with high precision.

[0007]

The present invention has the following arrangement to achieve the above object. That is, from a frame body integrally formed with a plurality of semiconductor devices having a resin sealing portion in which a semiconductor element is resin-sealed on one surface of a base material and solder balls bonded to the other surface, In a semiconductor cutting device for individually cutting a semiconductor device, a substrate supporting means for supporting the substrate around the resin sealing portion in the frame body, and extending the substrate around the resin sealing portion. Pressing means for pressing, cutting means for cutting the base material by vibrating the cutting blade with an ultrasonic oscillator by contacting the cutting edge of the cutting blade with the base material along the four sides of the resin sealing portion, It is characterized by having.

In addition, there is provided moving means for moving the base material supporting means and the cutting blade of the cutting means, which have pressed the base material around the resin sealing portion by the pressing means, closer to each other. Is also good. Further, the pressing means includes a pressing member having a tapered surface inclined adjacent to a pressing surface pressing the base material around the resin sealing portion, and the pressing member is configured to press the base material. When pressing,
The pressing surface may be elastically deformed so as to extend to the adjacent tapered surface so as to hold the substrate while pulling it outward. Further, a part of the pressing member is provided with a suction pad that can be sucked to the resin sealing portion, and the pressing member sucks and holds the resin sealing portion when pressing the base material, The cut semiconductor device may be taken out while being held by suction. Further, the cutting means has four sides with inclined sides inclined with respect to the horizontal direction at the cutting edge of the cutting blade, and vibrates by bringing each sharp part formed at the top of each inclined side into contact with the base material. By doing so, the base material may be cut along four sides of the resin sealing portion.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In this embodiment, B
A semiconductor cutting device suitably used for manufacturing a tape BGA type semiconductor device using a tape material as a base material among GA type semiconductor devices will be described. 1 is an explanatory view showing the entire configuration of a semiconductor cutting apparatus, FIG. 2 is a perspective explanatory view of an integrated cutter, FIG. 3 is an explanatory view of a split type cutter, and FIG. 4 is an explanatory view showing a cutting operation of the semiconductor cutting apparatus. It is.

First, the configuration of a tape BGA type semiconductor device according to the present invention will be described. In FIG. 1, a semiconductor device of a tape BGA type includes a tape substrate 1 such as a three-layer tape in which a metal layer such as a copper foil is bonded to a resin film such as a TAB tape as a substrate. A strip having a metal wiring pattern formed by a method or the like is used. The tape base material 1 is not limited to a strip shape, and may be a long shape wound between reels. A semiconductor element is mounted on one surface of the tape base material 1 and resin-sealed by a resin molding device to form a resin-sealed portion 2 at a plurality of locations. On the other surface of the tape base 1, solder balls 3 serving as external connection terminals are joined to via pad portions formed corresponding to the resin sealing portions 2, and a plurality of semiconductor devices are integrally provided. Thus, a strip-shaped frame body 4 is formed.

Next, a configuration of a semiconductor cutting device for individually cutting semiconductor devices from a frame body 4 integrally provided with a plurality of semiconductor devices will be described with reference to FIG. Reference numeral 5 denotes a tape base support plate as base support means, which supports the tape base 1 of the frame body 4. A punched hole 6 is formed in the tape base support plate 5 at a position corresponding to a cutting position described later. The frame body 4 is mounted on the tape base material supporting plate 5 such that the tape base material 1 is supported at the peripheral edge of the hole 6 and the solder ball 3 is released at a position corresponding to the hole 6. The frame body 4 is positioned by inserting guide pins (not shown) erected on the tape base support plate 5 into sprocket holes of the tape base 1. The tape base support plate 5 includes:
Linear guides 8 on guide rails 7 erected on the left and right sides
It is mounted so as to be movable in the vertical direction via the.

Reference numeral 9 denotes a cutter device serving as a cutting means. A cutter 10 is mounted on an upper portion of the ultrasonic oscillator 11, and the cutter 10 is caused to vibrate by the ultrasonic oscillator 11. To the tape base 1 supported by the tape base support plate 5, a cutter 10
The semiconductor device is further cut into four pieces by making the cutting edge come into contact with the tape substrate 1 and vibrating by the ultrasonic oscillator 11 to cut four sides. The ultrasonic oscillator 11
Is configured to emit ultrasonic waves oscillated by a vibrator through a horn to vibrate the cutter 10.
The reason why the ultrasonic oscillator 11 was used is that the tape base material 1 is a very thin material in the form of a film.
This is because there is an advantage that cutting can be performed with less impact on the blade, that the cutting is performed by the vibration of the blade, that no chips are generated, and that the life of the blade can be maintained longer.

Reference numeral 12 denotes a pressing member which constitutes a pressing means, and is made of a relatively soft rubber material having four sides formed in an inverted U-shaped cross section. A tapered surface 12a is formed in an eight-shaped cross section at an inner corner portion of the pressing member 12 adjacent to the pressing surface 12b. When the tape substrate 1 supported by the tape substrate support plate 5 is pressed by the pressing member 12, not only the pressing surface 12b but also the tapered surface 12a will gradually adhere to the tape substrate 1. As a whole, since the pressing surface 12b is elastically deformed so as to expand, the tape base material 1 is pressed while being pulled in the extending direction. Thereby, even if the resin sealing portion 2 shrinks, the tape base material 1 can be appropriately tensioned, and can be cut by the cutter 10 smoothly and with high accuracy along the outer edge of the resin sealing portion 2. it can.
The pressing member 12 is attached to a pressing support plate 13. The pressing support plate 13 is attached to guide rails 7 erected on both right and left sides via a linear guide 14 so as to be movable in a vertical direction. I have.

At the center of the pressing member 12, a suction pad 1 capable of holding the resin sealing portion 2 of the semiconductor device by suction is provided.
5 is equipped. The suction pad 15 is provided with a suction pad holding arm 15 provided through the pressing support plate 13.
The air is sucked by operating a suction device (not shown). The semiconductor device can be suction-held by the suction pad 15 while the tape base 1 around the resin sealing portion 2 is pressed by the pressing member 12. On the lower surface side of the pressing support plate 13, butting blocks 16 are provided on both sides,
When the pressing support plate 13 moves downward, it abuts against the upper surface of the tape base supporting plate 5 and pushes the tape base supporting plate 5 closer to the cutter device 9. The pressing member 1
A relatively hard rubber cushion 1 between the suction pad 15 and the suction pad 15
7 is fitted, and the impact or cutter 1 generated when the pressing member 12 presses down on the tape base material 1 and elastically deforms the tape base material 1.
Absorbs vibration at the time of cutting by zero.

Reference numeral 18 denotes a vertically moving cylinder (air cylinder) as a moving means, which is supported by a base support plate 19 supported between the left and right guide rails 7.
The cylinder rod 18a of the vertically moving cylinder 18 is inserted through the tape base support plate 5 and the distal end thereof is pressed against the pressing support plate 13.
It is connected to. Further, one end of a support spring 20 is connected to the base support plate 19, and the other end is connected to the tape base support plate 5 to constantly urge the tape base support plate 5 upward.

The vertical support cylinder 18 is operated, and the cylinder rod 18a is retracted, whereby the pressing support plate 1 is moved.
3 moves down along the guide rail 7, and the abutting block 16 is attached to the tape base support plate 5 in a state where the pressing member 12 holds the tape base 1 and sucks the resin sealing portion 2 by the suction pad 15. Abutting the tape base support plate 5
Of the guide rail 7 against the urging force of the support spring 20.
, And is pushed to a position where it can approach the cutter device 9. When the cylinder rod 18a of the vertically moving cylinder 18 is extended and returned to the original position, the pressing support plate 13 moves upward along the guide rail 7 while sucking the semiconductor devices individually cut by the suction pads 15. At this time, the tape base support plate 5 moves upward together with the pressing support plate 13 by the elastic force of the support spring 20 and returns to the original position. And the butting block 1
Even when 6 is separated, it is urged and supported by the support spring 20.

In this embodiment, the vertical movement cylinder 18 is provided as a moving means for moving the tape base support plate 5 closer to the cutter device 9. However, a combination of a servo motor capable of driving forward and reverse rotation and a ball screw is provided. May be moved up and down. In the present embodiment, the cutter device 9 is fixed, and the pressing member 12 and the tape base support plate 5 are configured to be movable. The support plate 5 may be fixed.

Next, the cutter 10 provided in the cutter device 9 will be described with reference to FIGS.
The cutter 10 is detachably mounted on the upper part of the cutter device 9. The cutter 10 has four sides with inclined sides 10a inclined with respect to the horizontal direction at the cutting edge of the cutting blade 10b, and a sharp part (a sharp angle part) 10c formed at the top of one end of the inclined side 10a with a tape base material. By vibrating the semiconductor device by contacting the semiconductor device 1, the four sides of the semiconductor device can be cut at the same time. The cutter 10 may be an integrated cutter (see FIG. 2) in which the inclined sides 10a are disposed so that all four sides are inclined in the same direction, and the cutting blade 10b is integrally formed on the four sides. Blade 10b
Can be divided for each inclined side 10a (see FIG. 3).
Reference).

The cutter device 9 may cut the semiconductor devices formed on the strip-shaped frame body 4 one by one, or may cut a plurality of semiconductor devices at the same time. Further, the oscillation frequency of the ultrasonic oscillator 11 is arbitrary,
For example, those having a frequency of 22 kHz and an ultrasonic output of about 220 W are used.

Next, the cutting operation of the semiconductor cutting device configured as described above will be described in detail with reference to FIGS. In FIG. 4A, a strip-shaped frame body 4 is placed on a tape base material supporting plate 5. A plurality of resin sealing portions 2 are formed on the upper surface side of the frame body 4, and the solder balls 3 are joined on the lower surface side. The frame body 4 is positioned and mounted on the tape base material supporting plate 5 by inserting a sprocket hole of the tape base material 1 into a guide pin (not shown) in alignment with the punched hole 6 as a relief hole for the solder ball 3. Is placed.
The setting of the frame body 4 may be performed by an automatic machine such as a frame transport device (not shown), or may be manually set by an operator.

Next, referring to FIG.
5 to start suctioning air, and
Is operated to retract the cylinder rod 18a. As a result, the pressing support plate 13 moves down along the guide rail 7, and the pressing surface 12 b of the pressing member 12 presses the tape base material 1, and is elastically deformed so that the adjacent tapered surface 12 a also comes into close contact with the tape base 1. The tape base material 1 is pulled in the extending direction so as to provide an appropriate tension and hold down. When the pressing surface 12 b of the pressing member 12 presses the tape base 1, the suction pad 15 is suctioned to the resin sealing portion 2. At this time, the impact when the pressing surface 12b of the pressing member 12 abuts on the tape substrate 1 is absorbed by the vibration-proof rubber 17 and the support spring 20 (see FIG. 1).

Next, as shown in FIG. 4 (c), when the abutment block 16 abuts on the tape base material supporting plate 5 due to the further downward movement of the pressing support plate 13, the abutting block 16 is attached with a supporting spring 20. Push down along the guide rail 7 against the force. Then, the cutting edge of the cutter 10 of the cutter device 9 is made to enter the hole 6 of the tape base support plate 5. At this time, the cutter device 9 operates the ultrasonic oscillator 11 to vibrate the cutter 10, and the sharpened portions 10 c of the cutting blades 10 b provided on the four sides come into contact with the four points of the tape base material 1, and By slightly lowering the substrate 1, four sides are cut at the same time along the inclined side 10a. Thus, the tape base 1 around the resin sealing portion 2 is pressed against the pressing member 1.
The cutter 10 vibrates at the moving end of the tape base supporting plate 5 while giving appropriate tension while being pressed by the cutter 10.
, A smooth cutting operation of the semiconductor device 21 is performed. Further, by cutting the frame body 4 at the same time on four sides, cutting can be performed at a processing speed similar to that of punching with a normal press device.

Next, in FIG. 4D, when the cylinder rod 18a of the vertical movement cylinder 18 is extended, the pressing support plate 13 moves upward along the guide rail 7, and together with the pressing support plate 13, the tape base is supported. The plate 5 also moves upward along the guide rail 7 integrally by the elastic force of the support spring 20. At this time, the cut semiconductor device 21 moves upward together with the pressing support plate 13 while the resin sealing portion 2 is suction-held by the suction pad 15.

When the pressing support plate 13 returns to the original position, the semiconductor device 21 sucked and held by the suction pad 15 is discharged out of the device. For example, the suction pad 1
5 may be released and the semiconductor device 21 may be transferred to a discharge tray (not shown) and taken out. Alternatively, while the semiconductor device 21 is being suctioned by the suction pad 15, the suction pad holding arm 15a may be moved. It may be moved to be loaded on a discharge tray (not shown). Further, the tape base support plate 5 returns to the original position by the elastic force of the support spring 20. At this time, an unnecessary tape after the semiconductor device 21 is cut is attached to the tape base support plate 5. Although the base material 1 remains, since the guide pins (not shown) erected on the tape base material supporting plate 5 are inserted into the sprocket holes of the tape base material 1,
There is no misalignment or falling out of the hole 6. Further, the unnecessary tape base material 1 may be collected by a tape base material discharging device (not shown), or may be manually removed by an operator.

According to the above configuration, the plurality of semiconductor devices 21
Can be omitted when individually cutting from the frame body 4 integrally formed, the tape base 1 provided on the conventional die can be omitted. It can be cut, and a semiconductor device with smaller external dimensions can be manufactured. Further, the extremely thin film-shaped tape base material 1 is held down while being extended by the pressing member 12, and the cutter 1 is moved by the ultrasonic oscillator 11 provided in the cutter device 9.
Since the cutting is performed by vibrating 0, even if the resin sealing portion 2 contracts, the cutting of the tape base material 1 can be smoothly performed with high precision, and the unnecessary tape base material 1 remains around the resin sealing portion 2. And high-quality semiconductor devices can be manufactured because they do not remain after burning, unlike laser light. Further, by cutting the tape base 1 at the same time on the four sides by the cutter 10, the semiconductor devices 21 can be cut individually at the same speed as the punching process by a normal press device, thereby reducing the working efficiency. Cutting work can be performed without any.

In the above embodiment, the semiconductor cutting apparatus applied to the manufacture of a tape BGA type semiconductor device has been described. However, the work to be processed is not limited to this. BG
It goes without saying that many modifications can be made without departing from the spirit of the invention, such as being applicable to various substrates for manufacturing semiconductor devices such as a resin substrate for manufacturing A.

[0027]

As described above, according to the present invention, when the semiconductor devices are individually cut from a frame body in which a plurality of semiconductor devices are integrally formed, it is possible to omit the receiving of the base material conventionally provided on the die. Therefore, the base material can be cut substantially along the outer edge of the resin sealing portion, and a semiconductor device having smaller outer dimensions can be manufactured. Further, since the base material around the resin sealing portion is pressed while being extended outward by a pressing member, and cut by vibrating the cutting blade by an ultrasonic oscillator provided in the cutting means, the resin sealing portion is Even if contracted, the cutting of the base material can be performed smoothly with high precision, and no unnecessary base material remains around the resin sealing portion, and also does not remain after baking like laser light, A high-quality semiconductor device can be manufactured. Further, the semiconductor device can be individually cut at the same speed as punching by a normal press device by cutting the base material at the same time on the four sides by the cutting means, and the cutting operation can be performed without lowering the working efficiency. Can be performed.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing an overall configuration of a semiconductor cutting device.

FIG. 2 is a perspective explanatory view of an integrated cutter.

FIG. 3 is an explanatory view of a split type cutter.

FIG. 4 is an explanatory diagram showing a cutting operation of the semiconductor cutting device.

FIG. 5 is an explanatory view of a conventional frame member.

FIG. 6 is an explanatory diagram showing a cutting operation of a conventional semiconductor cutting device.

FIG. 7 is an explanatory diagram showing a cutting operation of a conventional semiconductor cutting device.

FIG. 8 is an explanatory diagram showing a problem in a cutting operation of a conventional semiconductor cutting device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Tape base material 2 Resin sealing part 3 Solder ball 4 Frame body 5 Tape base support plate 6 Drilled hole 7 Guide rail 8,14 Linear guide 9 Cutter device 10 Cutter 10a Inclined side 10b Cutting blade 10c Sharp part 11 Ultrasonic oscillator DESCRIPTION OF SYMBOLS 12 Pressing member 12a Taper surface 12b Pressing surface 13 Pressing support plate 15 Suction pad 15a Suction pad holding arm 16 Butting block 17 Vibration-proof rubber 18 Vertical movement cylinder 18a Cylinder rod 19 Base support plate 20 Support spring

Claims (5)

[Claims] 1. A frame body integrally formed with a plurality of semiconductor devices each having a resin sealing portion in which a semiconductor element is resin-sealed on one surface of a base material and solder balls bonded to the other surface. In a semiconductor cutting device for individually cutting the semiconductor device, a base supporting means for supporting the base around the resin sealing portion of the frame body; Pressing means for pressing so as to stretch the material, and cutting the base material by bringing the cutting edge of the cutting blade into contact with the base material along four sides of the resin sealing portion and vibrating the cutting blade with an ultrasonic oscillator. A semiconductor cutting device, comprising: cutting means. 2. A moving means for moving the base material supporting means pressed around the resin sealing portion by the pressing means and the cutting blade of the cutting means so as to approach each other. The semiconductor cutting device according to claim 1, wherein 3. The pressing means includes a pressing member formed with a tapered surface inclined adjacent to a pressing surface pressing the base material around the resin sealing portion, wherein the pressing member is 2. The method according to claim 1, wherein, when pressing the base material, the pressing surface is elastically deformed so as to spread to the adjacent tapered surface and presses the base material while pulling the base material outward.
A semiconductor cutting device as described in the above. 4. A part of the pressing member is provided with a suction pad which can be sucked to the resin sealing portion, and the pressing member sucks the resin sealing portion when pressing the base member. 4. The semiconductor cutting apparatus according to claim 3, wherein the held and cut semiconductor device is taken out while being held by suction. 5. The cutting means has, on four sides, inclined sides inclined with respect to the horizontal direction at the cutting edge of the cutting blade, and contacts each sharp portion formed at the top of each inclined side with the base material. The semiconductor cutting device according to claim 1, wherein the base material is cut along four sides of the resin sealing portion by causing the base material to vibrate.