JP2000082713A - Apparatus and method for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting an electronic component, in which the electronic component obtained by punching a film carrier can be mounted, with high accuracy and with good operability, on a board such as a display panel or the like. SOLUTION: A lower mold 42 in which a through hole 43 is formed and a punch 50 which punches a film carrier 1A by being moved up and down inside the through hole 43 constitute a punching device 40 which is provided at an electronic-component mounting apparatus for a display panel 60. In addition, a first nozzle 13 in the lower part of the through hole 43 and by which an electronic component 7 obtained by being punched by the punch 50 is vacuum-sucked and received at the lower part so as to be delivered to a second nozzle 54 is installed. Consequently, the electronic component 7 which is obtained by punching the film carrier 1A is received by the first nozzle 13 so as to be delivered to the second nozzle 54, and it can be mounted surely on display panel 60.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component obtained by punching a film carrier on a substrate such as a display panel.

[0002]

2. Description of the Related Art A substrate such as a liquid crystal panel or a plasma panel, which is often used as a display panel of electronic equipment, is bonded to a transparent plate such as a glass plate, and electronic components are attached to electrodes formed on the edge of the transparent plate. Mounted and assembled. As electronic components, TAB (Tape Automated)
Electronic components manufactured by the Bonding method are frequently used. The TAB method is a method in which leads and chips are bonded to the surface of a film carrier made of a synthetic resin film, and the film carrier is punched by a punching device to obtain an electronic component.

FIGS. 7 (a), 7 (b) and 7 (c) are cross-sectional views of a main part of a punching apparatus for explaining a conventional step of punching a film carrier. In FIG. 7 (a), reference numeral 1 denotes a tape-shaped film carrier, on the surface of which a chip 2 and leads (not shown) are bonded. An upper die 3 has a punch 4 on its lower surface. Reference numeral 5 denotes a lower die, in which a knockout pin 6 is provided. The film carrier 1 is wound around a supply reel (not shown), and is fed between the upper die 3 and the lower die 5 at a pitch.

Next, the operation will be described. With the chip 2 stopped between the upper mold 3 and the lower mold 5 as shown in FIG.
As shown in FIG. 7B, the upper die 3 descends, and the film carrier 1 is punched. Next, as shown in FIG. 7 (c), the upper mold 3 is raised, and the knockout pin 6 is also raised. On the upper surface of the knockout pin 6, an electronic component 7 obtained by punching the film carrier 1 is mounted. Next, the transfer head 8 enters between the upper mold 3 and the lower mold 5, and the electronic component 7 on the knockout pin 6 is vacuum-sucked to the nozzle 9 to be picked up and transferred to a display panel (not shown). .

[0005]

Next, the problems of the above-mentioned conventional device will be described with reference to FIG. FIG. 8 shows FIG.
It is a principal part expanded sectional view of the state shown to (c). The punch 4 descends and the film carrier 1 is moved by the punch 4 and the lower mold 5.
, Burrs E1 and E2 are generated at the edge of the film carrier 1. The flash E1 of the film carrier 1 on the remaining side is sharpened downward, and the flash E2 of the film carrier 1 on the knockout pin 6 is sharpened upward. Therefore, when the knockout pin 6 moves up from the lowered position shown in FIG. 7B to the raised position shown in FIG. 7C, the burrs E1 and E2 are caught on each other, and the electronic component 7 is placed on the knockout pin 6. As shown by a chain line in FIG. 8, the nozzle 9 is displaced as a result. As a result, the electronic component 7 cannot be picked up by vacuum suction of the electronic component 7 in a correct posture, and there is a problem that a pick-up error is likely to occur.

Further, as shown in FIG. 7C, the transfer head 8 enters between the upper die 3 and the lower die 5 and
Since the upper electronic component 7 is picked up, in order to secure this entry space, the vertical stroke S of the upper die 3 must be increased so that the upper die 3 can retreat to a high position. However, when the up-and-down stroke S of the upper mold 3 is increased, the impact when the upper mold 3 descends and punches the film carrier 1 increases accordingly, and due to the vibration accompanying the impact, the upper mold 3 and the lower mold 5 are moved. Not only does the entire electronic component mounting apparatus vibrate, causing rattling of the apparatus, but also when the transfer head 8 mounts the electronic component 7 on a display panel (not shown), the mounting position is increased. There was a problem that would cause a mess. Further, since the time required for the vertical movement of the upper mold 3 is long, and the time required for the transfer head 8 to move in and out between the upper mold 3 and the lower mold 5 is also required, the tact time is increased, and the mounting efficiency is not reduced. There was a problem.

Accordingly, the present invention solves the above-mentioned problems of the prior art, and provides an electronic component mounting apparatus and an electronic component capable of mounting an electronic component obtained by punching a film carrier on a substrate such as a display panel with high precision and efficiency. The purpose is to provide an implementation method.

[0008]

According to a first aspect of the present invention, there is provided a lower die having a through hole formed therein, and a film having a chip bonded thereto by moving up and down with respect to the lower die above the lower die. A punching device provided with a punch for punching a carrier, a table on which a substrate is placed on a side of the punching device, and an electronic component obtained by punching a film carrier by the punching device. First received by vacuum suction from
Nozzle, moving means for moving the first nozzle to the delivery position, a second nozzle for receiving the electronic component from the first nozzle at the delivery position and transferring it toward the substrate, An electronic component mounting apparatus comprising: a camera for observing leads of the held electronic component and detecting a displacement thereof.

According to a second aspect of the present invention, there is provided an electronic component mounting method for mounting an electronic component obtained by punching a film carrier to which a chip is bonded on a substrate, wherein a through-hole penetrating vertically is formed. A first step of positioning a film carrier on which a chip is bonded on a mold, and punching the punch downward from above the film carrier toward the through hole to punch the film carrier; A second step in which the nozzle receives the nozzle from below, a third step in which the first nozzle is transferred to the delivery position by the moving unit, and the second nozzle receives the electronic component from the first nozzle in the delivery position and travels toward the substrate. The fourth step of transferring, and observing the lead of the electronic component held by the second nozzle with a camera, and positioning the lead on the electrode of the substrate based on the observation result. A fifth step of mounting the electronic components on a substrate by Align, an electronic component mounting method characterized by including the.

Preferably, the substrate is a display panel, and in the fifth step, the lead of the electronic component held by the second nozzle and the electrode at the edge of the display panel are observed from below with a camera, and And the positional deviation between the electrodes is detected.

In the above arrangement, the punch descends to punch the film carrier, and the electronic component obtained by the punching is received from below by the first nozzle, and the first nozzle moves to the delivery position. Therefore, the electronic component is moved from the first nozzle to the second nozzle.
After that, the electronic component held by the second nozzle is observed by a camera, and the lead and the electrode of the substrate are aligned based on the observation result, and the electronic component is mounted on the substrate. Accordingly, unnecessary displacement of the electronic component does not occur, and the electronic component can be mounted on the substrate with high accuracy and efficiency.

[0012]

(Embodiment 1) FIG. 1 is a plan view showing the overall configuration of an electronic component mounting apparatus according to Embodiment 1 of the present invention, FIG. 2 is a side view thereof, and FIG. It is a rear view of a supply mechanism. In FIG. 1, reference numeral 11 denotes a turntable, in which four arms 12 extend horizontally outward, and a first nozzle 13 (see FIG. 2) is provided at the tip of the arm 12 which is a nozzle holding member. Is provided. In FIG. 2, the turntable 11 is supported on the upper end of an upright shaft 14a of the index drive unit 14, and when the index mechanism unit 14 is driven, the turntable 11 rotates horizontally. The index drive unit 14 is X
It is installed on a table 15 and a Y table 16. X
When the motor 17 of the table 15 is driven, the turntable 11 moves horizontally in the X direction, and when the motor 18 of the Y table 16 is driven, the turntable 11 moves in the Y direction, and the position is adjusted. The position of the turntable 11 is adjusted according to the position of a punching device (described later) for the film carrier. Reference numeral 20 denotes a base.

FIGS. 4 (a), 4 (b) and 4 (c) are side views of the vicinity of the punching device of the film carrier of the electronic component mounting apparatus according to the first embodiment of the present invention. In FIG. 4A,
A nozzle shaft 21 is provided upright on the upper surface of the distal end of the arm 12, and the first nozzle 13 is mounted on the upper end thereof. The nozzle shaft 21 is connected to a cylinder 22 mounted on the lower surface of the tip of the arm 12. Therefore, when the cylinder 22 operates and the nozzle shaft 21 protrudes, the nozzle 13 rises to the position shown by the dotted line in the same figure, and when the nozzle shaft 21 retracts, it lowers to the position shown by the solid line. That is, the cylinder 22 is a means for vertically moving the nozzle 13 for vertically moving the nozzle 13 with respect to a through hole 43 (described later) of the lower mold 42.

In FIG. 4A, a motor 23 is mounted on the lower surface of the arm 12 near the distal end. Motor 2
The pulley 2 is attached to the rotation shaft 3 and the nozzle shaft 21 respectively.
4 and 25 are attached, and a belt 26 is tuned to the pulleys 24 and 25. Therefore, the motor 23
Is driven, the nozzle shaft 21 rotates around its axis, and adjusts the horizontal direction of an electronic component (described later) vacuum-adsorbed on the upper surface of the nozzle 13. That is, the motor 23, the pulleys 24 and 25, the belt 26, and the like are nozzle rotating means for rotating the nozzle 13 about its axis in order to adjust the horizontal direction of the electronic component.

In FIG. 1, film carriers 1A, 1
B and 1C are provided, and the arm 12 is provided from three directions.
Is supplied towards. Each film carrier 1A,
Chips 2A, 2B, 2
C and leads (not shown) are bonded. In the figure, A is a punching line, and an electronic component can be obtained by punching the film carriers 1A, 1B, 1C by a punching device (described later) along this line. The types of the three film carriers 3A, 3B, and 3C may be different types or the same type, and are arbitrarily determined.

Next, the supply mechanism of the film carriers 1A, 1B, 1C will be described with reference to FIGS.
In FIG. 2, reference numeral 31A denotes a first support wall, and 31B denotes a second support wall.
3. Guide roller 34, punched film carrier 1
A winding roller 35 for winding A, 1B, and 1C is attached. One supply reel 32 has a film carrier 1
A is wound, and the other supply reel 32 is wound with the film carrier 1B. The take-up reel 33 is
The separate tape 36 wound around the supply reel 32 is wound on the film carriers 1A, 1B, 1C. FIG.
FIG. 9 is a rear view of the film carrier supply mechanism, and FIG.
A supply reel 32, a take-up reel 33, a roller 34, a take-up roller 35, etc. of the film carrier 1C are provided on the support wall 31C. 37 is a film carrier 1A, 1
A pair of sprockets for positioning B and 1C with respect to a punching device 40 described later.

The supply reel 32, the take-up reel 33, the take-up roller 35, and the sprocket 35 are rotated by driving means (not shown). Therefore, when the driving means is driven, the film carriers 1A, 1B, 1C are supplied to the supply reel 32.
And the separated tape 36 is wound on a take-up reel 33, and the punched film carriers 1A, 1B, 1C are wound on a winding roller 35.

In FIG. 1, reference numeral 40 denotes a film carrier 1.
This is a punching device for A, 1B and 1C, and three punching devices are provided according to three film carriers 1A, 1B and 1C. As shown in FIGS. 2 and 3, the film carriers 1A, 1B, and 1C fed from the supply reel 32 are connected to a punching device 40.
, And the sheet is punched by this, and then wound up by a winding roller 35. Next, a detailed structure of the punching device 40 will be described with reference to FIG.

Reference numeral 42 denotes a lower die, in which a through hole 43 penetrating vertically is formed at the center. Reference numeral 44 denotes a support frame for the lower mold 42. As described above, the first nozzle 13 can move up into the through hole 43. A guide rod 46 is provided upright at the upper surface corner of the lower mold 42, and a base plate 45 is mounted on the upper part of the guide rod 46. A cylinder 47 is installed on the base plate 45, and an upper die 49 is connected to a rod 48 of the cylinder 47. A punch 50 is mounted on the lower surface of the upper die 49. The guide rod 46 penetrates the upper die 49 and guides the upper die 49 to move up and down. Therefore, when the rod 48 of the cylinder 47 projects, the punch 50 descends, and the punch 50 and the lower mold 42 cause the film carrier 1 to move downward.
Punch A. When the rod 48 of the cylinder 47 is retracted, the punch 50 retreats upward.

In FIG. 1, reference numeral 51 denotes a rotary table, which has four arms 52 extending horizontally outward. As shown in FIG. 2, the turntable 51 is supported by an upright shaft 53a of an index mechanism 53,
When the index driving unit 53 is driven, the turntable 51
Rotates the pitch in the horizontal direction. A second nozzle 54 is provided at the tip of the arm 52. The rotation trajectory of the first nozzle 13 and the rotation trajectory of the second nozzle 54 intersect with each other. At the intersection, the second nozzle 54 is positioned directly above the first nozzle 13 and the first nozzle 13
Then, the electronic component 7 is delivered to the second nozzle 54. FIG.
At the bottom of the rotation orbit of the nozzle 54, the observation device 5
5 are provided. The observation device 55 includes an optical system such as a camera, and detects the position of the electronic component 7 that is vacuum-adsorbed to the nozzle 54.

In FIGS. 1 and 2, reference numeral 60 denotes a display panel. The display panel 60 is mounted on a movable table 61 disposed on the side of the punching device 40. The movable table 61 includes an X table 62, a Y table 63, and a θ table 64. When the motor 65 of the X table 62 or the motor 66 of the Y table 63 is driven, the display panel 60 moves horizontally in the X direction or the Y direction,
4 rotates horizontally when driven. As shown in FIG. 2, a bonding head 70 is provided above the display panel 60. The bonding head 70 includes a thermocompressor 71 for pressing the leads of the electronic component 7 against the electrodes formed on the edges of the long side and the short side of the display panel 60 for thermocompression bonding.

In FIG. 2, a cylinder 72 is provided on the upper surface of the Y table 63. The lower receiving plate 73 is connected to the rod of the cylinder 72. The lower receiving plate 73 is located below the thermocompression bonding element 71, and when the thermocompression bonding element 71 descends to press the lead of the electronic component 7 against the edge of the display panel 60, the edge of the display panel 60 is pressed. Support from below. A rod 74 is provided upright on the upper surface of the base 20.
A lower receiving plate 75 is connected to the upper end of the rod 74. The rod 74 moves up and down by means not shown,
The electronic component 7 vacuum-sucked on the nozzle 54 is supported from below. A camera 76 is provided below the bonding position. Reference numeral 77 denotes a lens barrel of the camera 76. This camera 76 detects the positions of the leads of the electronic component 7 and the electrodes of the display panel 60.

The electronic component mounting apparatus for a display panel is configured as described above. Next, the overall operation will be described.
The supply reel 3 is driven by driving a driving unit (not shown).
2. The film carrier 1A is fed out from
Is positioned between the lower die 42 and the punch 50.

Next, the punching step will be described with reference to FIG. FIG. 4A shows a state before punching. At this time, the first nozzle 13 is on standby just below the through hole 43. As shown in FIG. 4B, when the nozzle shaft 21 projects upward, the nozzle 13 moves up into the through hole 43. At this time, the rod 48 of the cylinder 47 also projects downward, and the punch 50 descends, and the film carrier 1A
Is perforated. The electronic component 7 obtained by punching the film carrier 1A is vacuum-adsorbed to the nozzle 13. That is, the nozzle 13 also serves as a receiving means for receiving the electronic component 7 punched by the punching device 40 from below.

Next, as shown in FIG. 4C, the nozzle shaft 21 is retracted downward, and the nozzle 13 escapes downward from the through hole 43. Further, the rod 48 of the cylinder 47 is pulled upward, and the punch 50 rises. Thereafter, the punched film carrier 1 located between the lower mold 42 and the punch 50
A is taken up by a take-up roller 35 (FIG. 2).

As described above, the nozzle 13 is connected to the electronic component 7.
Is received, the turntable 11 is rotated by 180 ° horizontally, and the first nozzle 13 is moved to a position directly below the second nozzle 54 provided at the tip of the arm 52 of the rotary table 51 as shown in FIG. Let it. That is, the turntable 11 serves as moving means for moving the first nozzle 13 from the punching device 40 to the delivery position to the second nozzle 54 (ie, moving the electronic component 7 closer to the display panel 60). I have. Here, the electronic component 7 is delivered from the nozzle 13 to the nozzle 54 by releasing the vacuum suction state of the one nozzle 13 and vacuuming the other nozzle 54 in that state.

Next, in FIG.
By horizontally rotating in the counterclockwise direction, the nozzle 54 moves directly above the observation device 55, and the electronic device 7 vacuum-adsorbed to the nozzle 54 is observed by the observation device 55, and its position is roughly detected. Next, when the turntable 51 is rotated by 90 °, the electronic component 7 is transferred to a position immediately above the edge of the display panel 60.

Next, a process of mounting the electronic component 7 on the display panel 60 will be described with reference to FIG. X table 6
The display panel 60 is waiting at a predetermined position in advance by driving the second and Y tables 63. In this case, the position of the display panel 60 is adjusted based on the observation result of the observation device 55 so that the predetermined electrode on the long side of the display panel 60 is located below the lead of the electronic component 7.

When the electronic component 7 held by vacuum suction on the nozzle 54 arrives above the camera 76, the camera 76 attaches the lead attached to the film carrier 1 A of the electronic component 7 to the edge of the display panel 60. XY of the formed electrode
The displacement in the θ direction is precisely detected. In this case, FIG.
As shown in (5), the lead of the electronic component 7 held by the nozzle 54 is positioned near the electrode at the edge of the display panel 60,
The same camera 76 used for both lead observation and electrode observation
To observe the leads of the electronic component 7 and the electrodes of the display panel 60. The displacement in the X direction or the Y direction is performed by driving the X table 62 or the Y table 63 to move the display panel 60 to the X direction.
The correction is made by moving the display panel 60 in the direction or the Y direction, and the positional deviation in the θ direction is corrected by driving the θ table 64 and rotating the display panel 60 horizontally. Of course, this correction method is not limited to the present embodiment. For example, the position shift in the θ direction may be corrected by rotating the nozzle 54.

When the correction is completed, the nozzle 54 is projected downward to land the lead of the electronic component 7 on the electrode of the display panel 60, and then the thermocompressor 71 of the bonding head 70 is lowered to connect the lead to the electrode. And thermocompression bonded. Next, when the nozzle 54 and the thermocompression contactor 71 are raised, a series of operations is completed. By repeating the above operation, the electronic component 7 is located on the long side edge of the display panel 60.
Are installed one after another.

In the first embodiment, the bonding head 70 is provided at the bonding position, and the bonding head 70 is provided with the thermocompression contact 71. However, the thermocompression contact may be provided on the second nozzle 54 side. Good. However, in this case, there is a possibility that the nozzle 54 is heated by the heat transfer of the thermocompression bonding element 71 and thermally deformed. Therefore, as in the first embodiment, the bonding head 70 is provided with the thermocompression bonding element 71 and the second nozzle It is desirable that the nozzle 54 be separated from the nozzle 54 so as not to be affected by the heat of the thermocompression bonding element 71 as much as possible.

In FIG. 1, when the electronic component 7 is mounted on the short side of the display panel 60, the θ table 64 is driven to rotate the display panel 60 horizontally by 90 °, and the short side is positioned below the bonding head 70. Then, the same operation as described above is performed. Here, when the types of the electronic components 7 mounted on the long side and the short side of the display panel 60 are different, another film carrier 1B or 1C is punched in accordance therewith to obtain the desired electronic component 7, What is necessary is just to mount this electronic component 7. That is,
In FIG. 1, three film carriers 1A, 1B, and 1C are provided in the present embodiment. However, these film carriers 1A, 1B, and 1C may be of the same type or different types. It is.

As described above, the plurality of film carriers 1
With the A, 1B, and 1C and the punching device 40, various types of electronic components 7 can be mounted on the display panel 60. Further, since the amount of the film carriers 1A, 1B, 1C is large, the frequency of replacing the supply reels 32 when the film carriers 1A, 1B, 1C are out of stock can be reduced. If any of the three film carriers 1A, 1B, and 1C is out of stock, the operation can be continued with another film carrier, and during this time, the out-of-stock film carrier can be replenished. There is no need to stop the operation, and a decrease in work efficiency due to the replenishment of the film carrier can be eliminated.

Embodiment 2 FIG. 5 is a plan view of an electronic component mounting apparatus according to Embodiment 2 of the present invention. In this embodiment, the X table 15 of the first embodiment shown in FIG. 2 is removed, and the turntable 11 is set on the Y table 16 and moves only in the Y direction. 16a is a guide rail for guiding the movement of the turntable 11.

A total of four punching devices 40 are provided, two on each side of the Y table 16, and the film carriers 1A, 1B, 1C, 1D are supplied from the lateral direction. The turntable 11 is provided with two arms 12 orthogonal to each other. Therefore, when the turntable 11 moves on the Y table 16, the film carriers 1A to 1D to which the transfer nozzle 13 at the tip of the arm 12 is vacuum-adsorbed are selected. In addition, the first reciprocating rotation of the turntable 11 in the 90 ° horizontal direction allows the first
The electronic component 7 vacuum-sucked by the nozzle 13 is transferred to the second nozzle 54. Other operations are the same as those of the first embodiment,
The description is omitted.

(Embodiment 3) FIG. 6 is a plan view of an electronic component mounting apparatus according to Embodiment 3 of the present invention. This device has two punching devices 40 on both sides of the turntable 11.
The film carriers 1A, 1
B is supplied. The turntable 11 has an arm 1
2 are provided orthogonal to each other. Therefore, when the turntable 11 reciprocates in the horizontal direction by 90 °, the first nozzle 13 delivers the electronic component 7 to which the vacuum suction has been performed to the second nozzle 54. Other operations are the same as those in the first embodiment, and a description thereof will be omitted.

As described above, in the present invention, various design changes are conceivable. In any case, a plurality of film carriers are provided, and each of the film carriers is punched by the punching device 40 to form the first film carrier.
The work efficiency can be remarkably improved by configuring the nozzle 13 to receive the work. In the above embodiment, the display panel has been described as an example of the substrate.
The substrate may be a printed circuit board or the like other than the display panel.

[0038]

As described above, according to the present invention, the electronic component obtained by punching with the punching device can be reliably received by the first nozzle and mounted on the substrate. Further, since the first nozzle is located below the punching device and receives the electronic component, the vertical stroke of the punch may be short. Therefore, the vibration generated by the vertical movement of the punch is small. A decrease in mounting position accuracy due to transmission to the nozzle side can be prevented. Further, since the conventional knockout pin and its vertical movement mechanism shown in FIG. 7 are not required, the configuration of the punching device can be simplified, and the punching up / down stroke can be shortened, so that the punching device can be downsized.

Further, by equipping a plurality of film carriers and punching devices, electronic components obtained by punching with any of the punching devices can be received by the first nozzle and delivered to the second nozzle, If any one of the film carriers is out of stock, the operation of mounting the electronic components on the substrate is continued while the operation of the apparatus is continued by another film carrier, and during this time, the out-of-stock film carrier can be replenished. Therefore, it is possible to eliminate a decrease in operation efficiency due to the replenishment of the film carrier.

Furthermore, since the operation of transferring and mounting the electronic parts obtained by punching the film carrier onto the substrate is performed using a plurality of nozzles independent of each other, the work of punching the film carrier or the one obtained by punching is performed. Various operations up to the transfer and mounting of the electronic component on the substrate can be performed in parallel, so that the overall tact time can be reduced and the mounting efficiency can be greatly improved.

Further, in this case, the electronic component may be transported in the direction approaching the substrate by the first nozzle, and may be delivered to the second nozzle at a delivery position closer to the substrate than the punching device. With this configuration, the transfer stroke required to transfer the electronic component from the punching device to the substrate can be obtained by the first nozzle, so that the overall tact time can be shortened and the mounting efficiency can be greatly improved.

According to the third aspect of the present invention, the electrodes at the edges of the display panel and the leads of the electronic components can be observed by a common camera, so that the positional deviation between the leads and the electrodes can be detected very precisely. In addition, since this displacement is detected immediately before the electronic component is mounted on the display panel, no new displacement occurs after the alignment based on the observation result, and therefore the lead is aligned with the electrode with high accuracy. It can be mounted.

[Brief description of the drawings]

FIG. 1 is a plan view showing an overall configuration of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a side view of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 3 is a rear view of a film carrier supply mechanism of the electronic component mounting apparatus according to the first embodiment of the present invention.

4A is a side view showing a vicinity of a punching device of a film carrier of the electronic component mounting apparatus according to the first embodiment of the present invention. FIG. 4B is a side view of the electronic component mounting apparatus according to the first embodiment of the present invention. Side view near punching device (c) Side view near punching device of film carrier of electronic component mounting device according to Embodiment 1 of the present invention

FIG. 5 is a plan view of an electronic component mounting apparatus according to a second embodiment of the present invention.

FIG. 6 is a plan view of an electronic component mounting apparatus according to a third embodiment of the present invention.

7A is a cross-sectional view of a main part of a conventional film carrier punching device. FIG. 7B is a main part cross-sectional view of a conventional film carrier punching device. FIG. 7C is a main part of a conventional film carrier punching device. Sectional view

FIG. 8 is an enlarged sectional view of a main part of a conventional film carrier punching device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1A film carrier 1B film carrier 1C film carrier 1D film carrier 2 chip 7 electronic component 13 first nozzle 40 punching device 42 lower die 43 through hole 50 punch 54 second nozzle 60 display panel 61 movable table 76 camera

Claims (3)

[Claims] 1. A punch comprising: a lower die having a through hole formed therein; and a punch which is located above the lower die and moves up and down with respect to the through hole to punch a film carrier to which a chip is bonded. An apparatus, a table on the side of the punching apparatus on which a substrate is mounted, and a first nozzle for vacuum-sucking and receiving an electronic component obtained by punching a film carrier by the punching apparatus from below. Moving means for moving the first nozzle to the transfer position, a second nozzle for receiving the electronic component from the first nozzle at the transfer position and transferring it toward the substrate, and held by the second nozzle. An electronic component mounting apparatus, comprising: a camera that observes leads of the electronic component and detects a displacement thereof. 2. An electronic component mounting method for mounting an electronic component obtained by punching a film carrier to which a chip is bonded on a substrate, wherein the chip is mounted on a lower die having a through-hole penetrating vertically. A first step of positioning the bonded film carrier; lowering the punch from above the film carrier toward the through hole to punch the film carrier; and receiving the electronic component obtained by punching from below the first nozzle. A second step, a third step of transferring the first nozzle to the transfer position by the moving unit, and a fourth step of receiving the electronic component from the first nozzle at the transfer position, and transferring the electronic component toward the substrate. And observing the lead of the electronic component held by the second nozzle with a camera, and positioning the lead on the electrode of the substrate based on the observation result. A fifth step of mounting the article on the substrate,
An electronic component mounting method comprising: 3. A display panel, wherein in the fifth step, a lead of the electronic component held by the second nozzle and an electrode at an edge of the display panel are observed from below with a camera, and the lead and the electrode are observed. 3. The electronic component mounting method according to claim 2, wherein the position shift is detected.