JP2757463B2 - Outer lead bonding apparatus and outer lead bonding method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION The present invention relates to an outer lead bonding apparatus and an outer lead bonding method, and relates to bonding a plurality of types of devices punched from a film carrier to a substrate with good workability and accuracy. Means for doing so.

(Prior Art) As a so-called outer lead bonding means for positioning and bonding an outer lead of a device punched from a film carrier to an electrode portion of a lead frame or a substrate (hereinafter collectively referred to as a substrate), Japanese Patent Application Laid-Open No. The one disclosed in Japanese Patent Publication No. 20846 is known.

In this device, a supply reel for a film carrier and a take-up reel for an interlayer tape (spacer tape) are provided inside the main body. The film carrier is led out from the supply reel, and an outer lead is provided by a cutting device (punch unit). Is punched out, taken up by a transfer head (suction head), transferred to a lead frame and mounted for bonding.

(Problems to be Solved by the Invention) However, the above-described conventional apparatus has the following problems.

(I) The means for sucking the device and transferring it to the lead frame is only one transfer head. This transfer head takes up the device punched from the film carrier, transfers the device to the camera, and transfers the device to the camera. After observing the displacement, it is transferred to the lead frame, mounted, and returned to the position where the device is taken up again. Therefore, the moving stroke of the transfer head is extremely long, and it takes one cycle longer. The mounting speed does not increase.

(Ii) The outer leads of this type of device are extremely fine, and many are formed at a small pitch. These outer leads must be accurately bonded to the electrode portions of the substrate and bonded, which is extremely high. Mounting accuracy is required. For this purpose, it is necessary to increase the magnification of the camera, accurately observe the displacement of the outer lead, correct the displacement, and mount the outer lead on the electrode portion of the substrate.

On the other hand, the device taken up by the transfer head
In many cases, a considerable displacement has occurred. Particularly, in the case of a device that has been punched out of a film carrier and stored in a tray, a considerably large displacement often occurs.

However, when the magnification of the camera is increased as described above, the field of view becomes smaller accordingly.Therefore, as described above, the outer lead of the device having a considerable positional shift taken up by the transfer head is captured in the field of view. Is extremely difficult, so it is necessary to reduce the magnification of the camera to enlarge the field of view, which reduces the observation accuracy,
As a result, it is impossible to accurately observe the device misalignment, and as a result, the mounting accuracy on the substrate is reduced.

(Iii) There are many types of film carriers according to the type of device, and each is separately mounted on a supply reel or a tray. However, the above-described conventional apparatus cannot mount various types of devices on a board, and in order to mount various types of devices on a board, a plurality of apparatuses are installed according to the number of types, or Each time the type is changed, the supply reel, the suction head, the cutting device, and the like must be replaced.

Therefore, an object of the present invention is to provide an outer lead bonding apparatus and an outer lead bonding method which solve the above-mentioned problems of the conventional means.

(Means for Solving the Problems) For this purpose, the present invention provides a device supply unit equipped with a plurality of types of devices punched from a film carrier;
A sub-transfer head driven by a direction moving device to take up and transfer the device, a first camera for observing a displacement of the device transferred by the sub-transfer head, and a sub-transfer A transfer table that is received from the head and transferred to the second camera, and the device is taken up from the transfer table, and the second camera is used to observe the displacement of the device.
A transfer head unit driven by the direction moving device to transfer and mount the device on the substrate, a Y direction moving device for moving the substrate in the Y direction, and an electrode portion of the substrate above the Y direction moving device. An outer lead bonding apparatus is constituted by the third camera for observing the displacement.

(Operation) In the above configuration, the desired device punched from the film carrier is taken up by the sub-transfer head and transferred to the position above the first camera, and the positional deviation is detected. Next, in order to correct this displacement, the device for moving the sub-transfer head in the XY direction is driven, and this device is mounted on the transfer table. Next, the transfer table is transferred to the take-up position of the transfer head, sucked by the nozzle of the transfer head to take up, and then the positional deviation of the taken-up device in the XYθ direction is observed by the second camera. At the same time, the displacement of the electrode portion of the substrate positioned in the Y-direction moving device in the XYθ direction is observed by a third camera. Next, in order to correct the positional deviation in the θ direction, the nozzle is rotated in the θ direction, and in order to correct the positional deviation in the XY direction, the X direction moving device and the Y direction moving device are driven, and The device is transferred and mounted on a substrate, and then the outer leads of the device are thermocompression-bonded to the substrate by a thermocompression bonding tool.

Example Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an outer lead bonding apparatus,
FIG. 2 is a plan view of the same, and FIG. 3 is a side view of the same. Reference numeral 1 denotes a main body box, and a plurality (four) of supply reels 2 as device supply units are provided at a rear portion thereof. The supply reels include film carriers 3 of different types.
Is wound. Reference numeral 4 denotes a take-up reel for the interlayer tape 5 provided below each of the reels 2.

In FIG. 3, reference numeral 6 denotes a sprocket provided in front of each reel 2, and the film carrier 3 is led forward by the sprocket 6. Reference numeral 7 denotes a cutting device provided on the way, which punches out a device from the film carrier 3. Reference numeral 8 denotes a cutter device for cutting and collecting the film carrier 3 from which the device has been punched.

In FIG. 2, reference numeral 10 denotes a sub-transfer head, which is moved in an XY direction by an X-direction feed screw 11 and a Y-direction feed screw 12. MX1 and MY1 are the drive motors for the lead screws 11 and 12,
In the figure, 13 and 14 are feed nuts and 15 is a slider. These members MX1, MY1 and 11 to 15 constitute a device for moving the head 10 in the XY direction. The head 10 takes up the device P punched by the cutting device 7 by adsorbing it to the nozzle 10a, and transports the device P in the XY direction. In this case, as the head 10 moves in the X direction, a desired device P in the four supply units arranged in the X direction is taken up. The head 10 has a built-in motor M1, and rotates the nozzle 10a in the θ direction about the axis thereof to correct the displacement of the device P in the θ direction.

FIG. 5 shows a device P, in which a semiconductor chip 3b is placed on a sheet 3a punched from a film carrier 3.
Are mounted by the inner lead bonding means, and extra-fine outer leads 3c are provided on both sides of the sheet 3a.
Are formed at a small pitch by etching. As will be described in detail later, the device P is configured to accurately bond the outer lead 3c to the electrode portion of the circuit pattern printed on the substrate and to bond the outer lead 3c, and requires extremely high mounting accuracy.

In FIG. 2, reference numeral 21 denotes a first camera provided on the front side of the sprocket 6, and reference numeral 22 denotes an illumination light source. The sub-transfer head 10 transfers the taken-up device P to a position above the camera 21 and shifts its position in the XYθ direction Δx.
1. Observe △ y1, △ θ1. This camera 21 uses the motor M2
Moves in the X direction. Therefore, by driving the motor M2 to move the camera 21 in the X direction and driving the motor MY1 to move the head 10 in the Y direction, the four corners a to d of the device P (FIG. 5) Observed at high magnification, the positional deviation △ x1, △ y1, △
θ1 can be accurately detected. In addition, this type of device P can accurately detect the displacement by observing the four corners a, b, c, and d of the outer lead 3c.

In FIG. 2, reference numeral 25 denotes a board,
Is positioned on a positioning member 27 on a Y table 26 provided at the front of the motor, and moves in the Y direction by driving the motor MY2. Reference numeral 28 denotes a transfer table of the device P, which is attached to a distal end of an arm 30 rotatably mounted on a support 29 mounted on a rear corner of the positioning member 27, driven by a motor M3, Rotate around pin 31.
The transfer table 28 moves integrally with the substrate 25 and transfers the device P delivered from the head 10 to a second camera (described later). In FIG. 2, reference numeral 28a denotes a transfer table at a rotational position.

In FIGS. 1 and 4, reference numeral 35 denotes a second camera provided on the side of the Y table 26.
28 transfers the device P onto the camera 35. Reference numeral 36 denotes an illumination light source provided above the camera 35, and reference numeral 41a denotes a nozzle of the transfer head 41 (described later). When the transfer table 28 transfers the device P to the take-up position on the camera 35, the nozzle 41a of the transfer head 41 sucks up the device P to take up the device P, and then the motor M3 is operated, thereby causing the device P to take up. The transfer table 28 is retracted sideways so as not to obstruct the observation of the camera 35 (see the chain line in FIG. 4), and the camera 35 shifts the position of the device P in the XYθ direction △ x.
2. Observe △ y2 and △ θ2. The camera 35 is moved in the Y direction by a driving device including a motor M4, and the nozzle 41a
Moves in the X direction by means described later, thereby observing the corners a to d of the device P at a high magnification as in the case of the camera 21 described above. The transfer table 28 is provided with device suction holes 32 to prevent rattling of the device P during transfer.

1 to 3, reference numeral 40 denotes a transfer head unit provided above the Y table 26. This transfer head section 40
Has a plurality (four) of transfer heads 41 along the X direction. Nozzle 41a of each transfer head 41 and thermocompression bonding tool 4
The shape and size of 1b are different from each other, and these transfer heads 41 are selectively used in accordance with the type of device P punched from the plurality of types of film carriers 3.
The transfer head section 40 is mounted on an X-direction feed screw 43 via a feed nut 42, and is driven by a motor MX2 to
Move in the direction. That is, the motor MX2, feed Natsuri 42,
The feed screw 43 forms an X-direction driving device of the transfer head unit 40. In FIG. 3, reference numeral 44 denotes a guide slider,
Is a guide rail, and 46 is a support frame installed on the main body box 1. Each head 41 has a built-in motor M5, and each nozzle 41a has an angle θ about its axis.
Rotate in the direction.

In FIG. 1, reference numeral 50 denotes a third camera for observing the substrate 25 provided above the Y table 26, which is mounted on a feed screw 52 via a feed nut 51 and has a motor MX.
It is driven by 3 and moves in the X direction. In FIG. 3, 55
Is a backup plate, and 56 is a cylinder for raising and lowering the same. When bonding the device P, the substrate 25 is pushed up from below to correct the deflection of the substrate 25. In FIG. 1, reference numerals 57 and 58 denote conveyors for transporting the substrate 25 in the X direction. The means for raising and lowering the nozzles 10a and 41a of the heads 10 and 41 are omitted for simplicity.

This outer lead bonding apparatus is configured as described above, and the overall operation will be described next.

The film carrier 3 derived from the supply reel 2 is
The device P punched out by the cutting device 7 is taken up by the sub-transfer head 10 and is transported above the first camera 21 so that the positional deviation △ x1, △ y1, △ θ1 in the XYθ direction is reduced. The device P is observed and then transferred to the transfer table 28. At this time, the motors MX1 and MY1 are driven so as to correct the positional deviation Δx1 and Δy1 in the XY direction, and the motor M1 is driven to correct the positional deviation Δθ1 in the θ direction.
Is corrected, and the device P is transferred to the center of the transfer table 28. The correction of the positional deviation is a rough correction, and is performed so that the device P enters the field of view of the camera 35 when the device P is precisely observed at a high magnification by the second camera 35. It is.

Next, when the motor MY2 is driven, the transfer table 2
8 moves above the camera 35, where the device P is sucked up by the nozzle 41a of the transfer head 41 waiting above the camera 35 and taken up, and as described with reference to FIG. The displacement of the device P in the XYθ direction △ x2,
Δy2, Δθ2 are observed.

At the same time, the motors MY2 and MX3 are driven, and the camera 50 observes the positional deviations Δx3, Δy3 and Δθ3 of the electrode portions of the circuit pattern on the substrate 25 on which the device P is mounted.

Next, by moving the substrate 25 in the Y direction and moving the head 41 that has taken up the device P in the X direction, the device P is mounted on the electrode section. At this time, the motors MX2 and MY2 are driven so as to correct the above-described positional shifts △ x2 + △ x3, △ y2 + △ y3 in the XY direction, and the transfer head 41 is provided to correct the positional shifts △ θ2 + △ θ3. By driving the motor M5, the outer leads 3c are accurately joined to the electrode portions of the substrate 25. This correction is a precise correction performed in order to correctly join the outer lead 3c to the electrode portion. Next, while the device P is pressed onto the substrate 25 by the nozzle 41a, the thermocompression bonding tool 41b is moved to the outer leads 3c.
This is thermocompression-bonded to the substrate 25.

When the device P is bonded to the substrate 25 in this manner, the sub-transfer head 10 takes up the next desired device P and transfers it to the position above the camera 21.
Further, it is transferred onto the transfer table 28.

In the above operation, the present device has the following advantages. That is, the operation of transferring the device P from the device supply unit to the substrate 25 includes the sub-transfer head 10, the transfer table 28,
Since the transfer is shared by the three transfer units of the transfer head 41, the movement stroke of each of the units 10, 28, 41 is shortened accordingly, and the cycle time can be shortened. Moreover, while the transfer head 41 transfers and mounts the device P to the substrate 25, the sub-transfer head 10 can move to the next device P in the device supply unit.
Can be taken up and transferred onto the first camera 21 and further transferred to the transfer table 28, and the transfer head 41 moves the device P while the transfer table 28 transfers the device P to the second camera 35. The third camera 50 can be moved above the camera 35 and kept on standby.
Can be observed while the camera 35 is observing the positional shift by the camera 35. As described above, the respective working means 10, 28, 41, and 50 can move independently of each other within a predetermined cycle time, and can perform their assigned tasks in cooperation with each other. The cycle time can be greatly reduced, and the mounting speed can be increased.
Also, by moving the sub-transfer head 10 in the X direction,
Of the four device supply units, a desired device P can be arbitrarily selected and taken up, and this device P can be transferred and mounted on the substrate 25 by the optimum transfer head 41.

The device supply unit of the above embodiment draws out the film carrier 3 from the supply reel 2, punches out the device P by the cutting device 7, and takes up the device P by the sub-transfer head 10. As shown in FIG. 6, the supply unit stores the devices P punched out from the film carrier in advance into a plurality of trays 6 for each type, and takes up the devices P in the trays 6 by the sub-transfer head 10. You may do it.

(Effects of the Invention) As described above, the present invention allows a device punched from a film carrier to be transferred and mounted on a substrate by using a sub-transfer head, a transfer table, and a transfer head that can be moved separately from each other. The sub-transfer head transfers the device to the transfer table, the transfer table transfers the transfer head, and the transfer head transfers to the substrate, while sharing and cooperating with each other within a predetermined cycle time. Therefore, the workability is extremely good, and the cycle time can be reduced and high-speed mounting can be performed.

In addition, observation and correction of device displacement are performed twice, rough correction and fine correction, and observation and correction of positional displacement of the electrode portion of the substrate are also performed. And can be bonded very accurately. Furthermore, since a plurality of types of devices are provided in the device supply unit, and a plurality of types of transfer heads are provided in the transfer head unit correspondingly, a plurality of types of transfer heads are provided according to the type of device. By selective use, the device can be bonded to the substrate in the best mode.

[Brief description of the drawings]

1 shows an embodiment of the present invention. FIG. 1 is a perspective view of an outer lead bonding apparatus, FIG. 2 is a plan view of the same, FIG. 3 is a side view of the same, FIG. FIG. 5 is a plan view of the device, and FIG. 6 is a plan view of the tray. 2,6 Device supply unit, 3 Film carrier 3c Outer lead 10 Sub transfer head 21 First camera 25 Substrate 28 Transfer table 35 Second camera 40 Transfer head 41 Transfer head 41b Thermo-compression tool 50 Third camera P Device a, b, c, d Device corners MX1, MY1, 11 to 15 … X-direction moving device for sub-transfer head MX2,42,43… X-direction moving device for transfer head MY2,26… Y-direction moving device for substrate

Claims (5)

(57) [Claims] 1. A device supply unit equipped with a plurality of types of devices punched from a film carrier, a sub-transfer head driven by an XY direction moving device to take up and transfer the device, and a sub-transfer head A first camera for observing the displacement of the device transferred by the head, a transfer table for receiving the device from the sub-transfer head and transferring it to the second camera, and taking up the device from the transfer table After observing the device misalignment with the second camera, a transfer head unit driven by an X-direction moving device to transfer and mount the device on a substrate, and a Y-direction movement for moving the substrate in the Y direction An outer device comprising a device and a third camera located above the Y-direction moving device for observing a displacement of an electrode portion of the substrate. Lead bonding apparatus. 2. The outer lead bonding according to claim 1, wherein said transfer table is attached to said Y direction moving device and moves in the Y direction integrally with said substrate. apparatus. 3. The transfer head section includes a plurality of transfer heads, each of which includes a nozzle for sucking a device,
2. The outer lead bonding apparatus according to claim 1, further comprising a thermocompression bonding tool for thermocompression bonding an outer lead of the device to a substrate. 4. A device of a device supply unit equipped with a plurality of types of devices punched from a film carrier is taken up by a sub-transfer head driven by an XY-direction moving device, and then the device is mounted on a first camera. After moving upward, detecting the position shift, the XY direction moving device is driven to correct the position shift, the device is mounted on the transfer table, and then the transfer table is moved in the X direction. It is transferred to the take-up position of the transfer head driven by the apparatus, sucked by the nozzle of the transfer head to take up, and then the taken-up device
Observe the displacement in the XYθ direction with the second camera, and observe the position of the electrode part of the substrate positioned by the Y-direction moving device.
The position shift in the XYθ direction is observed by a third camera provided above the Y-direction moving device, and then, in order to correct the position shift in the θ direction, the nozzle is rotated in the θ direction, In order to correct the positional deviation, the X-direction moving device and the Y-direction moving device are driven to transfer and mount the device on the substrate, and then the outer leads of the device are thermocompression-bonded to the substrate by a thermocompression bonding tool. An outer lead bonding method, characterized in that: 5. The device according to claim 1, wherein the second camera is moved in the X and Y directions relative to the device adsorbed to the transfer head to observe a corner of the device. The outer lead bonding method according to claim 4, wherein: