JP2011210857A - Mounting apparatus and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting apparatus and method, capable of integrating a frame with a workpiece to prevent breakage of the workpiece which is caused by peeling of a protective sheet from the workpiece.SOLUTION: A mounting apparatus 1 which integrates a frame RF with an workpiece W through a first adhesive sheet MS having an adhesive layer on one surface of a base material sheet includes a sheet pasting device 5 for pasting the first adhesive sheet MS having a contour larger than that of the workpiece W to the other surface WB of the workpiece W in which a second adhesive sheet S is pasted on one surface WA, a peeling device 6 for peeling the second adhesive sheet S from the workpiece W where the first adhesive sheet MS have been pasted, and a frame pasting device 7 for pasting the frame RF to the first adhesive sheet MS where the second adhesive sheet S protrudes from the workpiece W that has been peeled.

Description

  The present invention relates to a mounting apparatus and a mounting method for integrating a frame and an adherend through an adhesive sheet.

  2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, a mount in which a mounting sheet is attached to a wafer and a ring frame in order to integrate a semiconductor wafer whose surface is protected by a protective sheet (hereinafter sometimes simply referred to as a wafer) and the ring frame. An apparatus is used (for example, see Patent Document 1). In this mounting device, the attaching roller is rolled on the wafer and ring frame held on the chuck table to attach the mounting sheet, the integrated wafer and ring frame are reversed, and then the peeling tape is peeled off by the peeling means. The protective sheet is peeled off from the wafer by peeling off the protective sheet using.

  On the other hand, as a peeling means used in such a mounting device, a peeling tape is wound around a peeling member such as a pressure roller or a peel plate, and the peeling tape is pressed against the wafer by the peeling member to protect it from the wafer. A configuration in which the sheet is peeled is known (see, for example, Patent Document 2 and Patent Document 3).

JP 2003-152058 A JP 2002-124494 A JP 2001-233542 A

However, when the protective sheet is simply peeled off from the wafer as in the mounting apparatus described in Patent Document 1, the wafer is lifted together with the protective sheet, and the wafer may be damaged.
On the other hand, using the peeling means described in Patent Document 2 and Patent Document 3, it may be possible to prevent damage to the wafer by peeling the protective sheet while pressing the protective sheet toward the wafer side. If the width is smaller than the width of the wafer, a portion where the wafer cannot be pressed is formed. For this reason, it is necessary to employ a peeling member having a width larger than the diameter of the wafer. However, in such a case, since the opening of the wafer or the ring frame has a circular shape, the peeling member interferes with the ring frame in the peeling initial region or the peeling late region of the protective sheet, and the peeling member becomes the ring frame. It gets on top and a gap is formed between the protective sheet. Accordingly, the protective sheet cannot be peeled off while being pressed, and the wafer cannot be lifted up and may be damaged.

  On the other hand, in order to avoid interference between the peeling member and the ring frame, the protective sheet may be peeled while the ring frame is pulled down so that the upper surface of the ring frame is positioned below the upper surface of the protective sheet. Conceivable. However, once the ring frame is pulled down, the mounting sheet is extended, and the wafer is swayed in the subsequent transfer process. Under the circumstances where it has become possible to make the wafer extremely thin by increasing the size of the wafer and improving the grinding technique in recent years, another problem that the wafer is damaged by such a movement may occur.

  An object of the present invention is to provide a mounting apparatus and a mounting method capable of integrating a frame and an adherend and preventing damage to the adherend caused by peeling of the protective sheet from the adherend. is there.

  In order to achieve the above object, a mounting apparatus of the present invention is a mounting apparatus that integrates a frame and an adherend through a first adhesive sheet having an adhesive layer on one surface of a base sheet. A sheet attaching means for attaching the first adhesive sheet having an outer shape larger than the outer shape of the adherend to the other surface of the adherend to which the second adhesive sheet is attached to one surface; A peeling means for peeling the second adhesive sheet from the adherend to which the first adhesive sheet is affixed; and the frame is affixed to the first adhesive sheet protruding from the adherend from which the second adhesive sheet has been peeled off The frame adhering means is provided.

At this time, it is preferable that the mounting apparatus of the present invention includes a sheet support unit that supports the first adhesive sheet from the base sheet side.
In the mounting device of the present invention, the sheet support means includes a table that supports the first adhesive sheet, and the first adhesive sheet is supported on the table in a state where the first adhesive sheet is supported on the table. It is preferable to carry out application of one adhesive sheet, peeling of the second adhesive sheet from the adherend, and application of the frame to the first adhesive sheet.
Furthermore, in the mounting apparatus of the present invention, it is preferable that the sheet sticking means includes a pressure reducing means for keeping the adherend and the first adhesive sheet in a reduced pressure atmosphere.

  On the other hand, the mounting method of the present invention is a mounting method in which a frame and an adherend are integrated via a first adhesive sheet having an adhesive layer on one surface of a base sheet, The first adhesive sheet having an outer shape larger than the outer shape of the adherend is pasted on the other surface of the adherend to which the second adhesive sheet is pasted, and the first adhesive sheet is pasted. The second adhesive sheet is peeled off from the adherend, and the frame is attached to the first adhesive sheet protruding from the adherend from which the second adhesive sheet has been peeled off.

According to the present invention as described above, the second adhesive sheet is peeled off from the adherend to which the first adhesive sheet larger than the outer shape of the adherend is pasted, and the second adhesive sheet is peeled off from the adherend. By sticking the frame to the protruding first adhesive sheet, the frame and the adherend can be integrated, and the peeling means for peeling the second adhesive sheet can be prevented from interfering with the frame. Accordingly, it is possible to prevent the adherend from being lifted along with the peeling of the second adhesive sheet, and the first adhesive sheet from extending due to the lowering of the frame. Damage to the kimono can be prevented.
Further, by providing sheet support means for supporting the first adhesive sheet from the base sheet side, the first adhesive sheet can be attached to the adherend while the sheet support means supports the first adhesive sheet, A frame can be attached to one adhesive sheet, and the frame and the adherend can be efficiently integrated. Further, on the table constituting the sheet support means, the first adhesive sheet is attached to the adherend, the second adhesive sheet is peeled off from the adherend, and the frame is attached to the first adhesive sheet. If possible, a series of processes can be performed on a single table without moving or placing the adherend to which the first adhesive sheet is attached to another table or the like. Integration of the frame and the adherend can be performed more efficiently, and breakage of the adherend can be more effectively prevented.

  Moreover, by providing the decompression means, they can be bonded without mixing bubbles between the adherend and the first adhesive sheet.

1 is an overall view of a mounting device according to an embodiment of the present invention. Operation | movement explanatory drawing of the sheet sticking means which comprises the mounting apparatus of FIG. Operation | movement explanatory drawing of the peeling means which comprises a mount apparatus. Operation | movement explanatory drawing of the frame sticking means which comprises a mount apparatus.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, unless otherwise specified, terms indicating directions such as “up”, “down”, “left”, and “right” are used with reference to FIG.
In FIG. 1, the mounting apparatus 1 has a circuit formed on a surface WA, which is one surface, and a wafer W as an adherend on which a protective sheet S, which is a second adhesive sheet, is attached to the surface WA. This is a device that attaches a mounting sheet MS, which is a first adhesive sheet, to the back surface WB, which is the surface of the wafer, and integrates the wafer W and a ring frame RF as a frame. Here, the mounting sheet MS has an outer shape larger than the outer shape of the wafer W, with an adhesive layered on one surface of a base sheet (not shown), and is temporarily attached to the release sheet RL. It is prepared in advance as anti-R.

  The mounting apparatus 1 includes a supply unit 2 that supplies the mounting sheet MS, a sheet support unit 3 that supports the supplied mounting sheet MS from the base sheet side, and a sheet pasting unit that can support the wafer W. 5, a peeling means 6 for peeling the protective sheet S from the wafer W to which the mounting sheet MS is stuck, and a frame for sticking the ring frame RF to the mounting sheet MS protruding from the wafer W from which the protective sheet S is peeled The attaching means 7 is provided.

  The supply means 2 is mounted from the release sheet RL by folding back the release sheet RL, a support roller 21 for winding and supporting the original fabric R in a roll shape, two guide rollers 22 and 23 for guiding the original fabric R, By a peel plate 24 that peels off the sheet MS, a driving roller 25 that is rotated by a motor 25A as a driving device, a pinch roller 26 that sandwiches the peeling sheet RL between the driving roller 25, and a driving device such as a motor (not shown). And a collection roller 27 for collecting the release sheet RL.

  The sheet support means 3 includes a linear motor 31 that extends in the left-right direction, a base 33 that is connected to the slider 32 of the linear motor 31 and that can move in the left-right direction, and a suction means such as a decompression pump (not shown). A table 35 for sucking and holding the mounting sheet MS from the base sheet side by a plurality of suction ports 34 communicated with the base 33, and a linear motor 36 as a torque-controllable drive device for moving the table 35 up and down relative to the base 33. And.

  As shown in FIG. 2, the sheet sticking means 5 is provided so as to be movable in the vertical direction by a driving device such as a linear motion motor (not shown), and has a bottomed tube that forms a space A by contacting the upper surface of the base 33. And a pipe 52 as a pressure reducing means for maintaining the inside of the space A in a pressure-reduced atmosphere including a vacuum while communicating with a pressure reducing device such as a pressure reducing pump (not shown). The cover member 51 is formed by an upper surface portion 51A and a side surface portion 51B. The upper surface portion 51A is provided with holding means such as a chuck mechanism that can be driven by a driving device (not shown) so that the wafer W can be held. It is configured. In addition, a seal member 51C is provided on the lower surface of the side surface portion 51B, and is provided so that the space A can be sealed from the outside air. Such sheet sticking means 5 is provided so that the mounting sheet MS can be stuck on the back surface WB of the wafer W by co-operation with the linear motion motor 36 of the sheet support means 3. The pipe 52 is provided so that the atmosphere can be introduced into the space A.

  As shown in FIG. 3, the peeling means 6 includes a support roller 61 that rolls and supports the peeling tape PT in a roll shape, and adheres the peeling tape PT to the protective sheet S to remove the protective sheet S from the wafer W. A peel plate 62 to be peeled off, a driving roller 63 rotated by a motor 63A as a driving device, a pinch roller 64 sandwiching the peeling tape PT and the peeled protective sheet S between the driving roller 63, a motor (not shown), etc. A recovery roller 65 that recovers the peeling tape PT and the protective sheet S by a driving device is provided. The peel plate 62 has a width equal to or greater than the diameter of the wafer W.

  As shown in FIG. 4, the frame sticking means 7 includes a suction arm 72 having a suction pad 71 for sucking and holding the ring frame RF, and an articulated robot (not shown) that supports the suction arm 72 so as to be movable. Drive equipment.

  In the mounting apparatus 1 described above, as a procedure for integrating the wafer W and the ring frame RF, first, as shown in FIG. 1, the sheet support means 3 is supplied from the supply means 2 by the linear motor 31 to the table 35. It is located at a predetermined position below the mounting sheet MS. Next, the table 35 is raised by the linear motion motor 36 to a height at which the upper surface thereof is in contact with the lower surface of the mounting sheet MS. Subsequently, the suction holding of the mounting sheet MS is started through the suction port 34, and the motor 25A and the linear motor 31 are synchronously driven, whereby the mounting sheet peeled from the peeling sheet RL by the peel plate 24. The MS is held by suction on the table 35. Thereafter, the table 35 is moved in the direction of the sheet pasting means 5 by the linear motor 31.

  Next, when the table 35 reaches a predetermined position below the cover member 51, the sheet support means 3 stops the movement of the table 35, and as shown in FIG. 51 is lowered and its lower surface is brought into contact with the upper surface of the base 33. The wafer W with the protective sheet S attached to the front surface WA is held in advance on the upper surface portion 51A of the cover member 51 by a transfer device (not shown) as indicated by a two-dot chain line in FIG. Thereby, the space A is formed, and the back surface WB of the wafer W and the adhesive surface of the mounting sheet MS are disposed to face each other in the space A. Thereafter, a decompression device (not shown) creates a decompressed atmosphere in the space A through the pipe 52. Then, the sheet support means 3 lifts the table 35 by the linear motion motor 36 and affixes the mounting sheet MS against the wafer W. Next, the sheet sticking unit 5 releases the holding of the wafer W by a holding unit (not shown), introduces the atmosphere into the space A through the pipe 52, and then raises the cover member 51. Thereby, the wafer W and the mounting sheet MS can be stuck without air bubbles being mixed. Then, the sheet support means 3 lowers the table 35 by the linear motor 36 and moves the table 35 in the direction of the peeling means 6.

  Next, when the right end of the protective sheet S reaches the lower position of the tip of the peel plate 62, the sheet support means 3 stops the movement of the table 35, and the table 35 is raised by the linear motion motor 36. As shown by, the right end of the protective sheet S is adhered to the peeling tape PT. Then, when the motor 63A and the linear motor 31 are driven synchronously, the protective sheet S is peeled from the wafer W as shown by the solid line in FIG. At this time, it is possible to peel off the protective sheet S while pressing the protective sheet S toward the wafer W with the peel plate 62 having a width equal to or larger than the diameter of the wafer W. Therefore, the protective sheet S is peeled off. Accordingly, it is possible to prevent the wafer W from being lifted. Further, the torque of the linear motion motor 36 is controlled so that an excessive pressing force is not applied to the wafer W by the peel plate 62, so that the wafer W is stressed or cracked. Can be prevented. When the protective sheet S is completely peeled off from the surface WA of the wafer W, the sheet support means 3 lowers the table 35 by the linear motion motor 36 and moves the table 35 toward the frame sticking means 7.

  Next, as indicated by a two-dot chain line in FIG. 4, when the center position of the ring frame RF that has been sucked and held in advance by the suction arm 72 reaches a position where the center position of the wafer W coincides, the sheet support means 3 moves to the table 35. Stop moving. Thereafter, the frame sticking means 7 lowers the suction arm 72 by a driving device (not shown), and presses and attaches the ring frame RF to the mounting sheet MS protruding from the wafer W from which the protective sheet S has been peeled off. Thereby, the wafer W and the ring frame RF are integrated via the mounting sheet MS.

  When the attachment of the ring frame RF to the mounting sheet MS is completed as described above, the wafer W integrated with the ring frame RF is transferred to the next process by unillustrated unloading means, and thereafter the same operation as described above is performed. Repeated.

According to this embodiment as described above, the following effects are obtained.
That is, since the protective sheet S can be peeled from the surface WA of the wafer W before the ring frame RF is attached to the mounting sheet MS, the wafer W can be lifted when the protective sheet S is peeled off, It is possible to prevent the mount sheet MS from extending due to the lowering of the RF, and it is possible to prevent the wafer W from being damaged due to the peeling of the protective sheet S.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, in the above-described embodiment, the case where the adherend is a semiconductor wafer is shown, but the adherend is not limited to the semiconductor wafer, and other members such as a glass plate, a steel plate, or a resin plate are also included. Examples of semiconductor wafers include silicon semiconductor wafers and compound semiconductor wafers.
In the embodiment, the mounting sheet MS is exemplified as the first adhesive sheet. However, the first adhesive sheet in the present invention is not limited to the mounting sheet MS, and is attached to a semiconductor wafer such as a dicing tape or a die bonding tape. In the case where the adherend is a member other than a semiconductor wafer, a surface coating sheet or film, a decorative sheet, or the like may be appropriately used as the second adhesive sheet. Sheets for various purposes can be used.

  In the above embodiment, the wafer W is held by the holding means such as a chuck mechanism (not shown) in the sheet sticking means 5, but the support of the wafer W in the sheet sticking means 5 is not limited to such a method. That is, it is only necessary to be able to support the wafer W, and for example, the wafer W may be adhered and supported below the cover member 51.

Moreover, in the said embodiment, when peeling off the protection sheet S from the wafer W, it peeled off, pressing the protection sheet S to the wafer W side with the peel plate 62, but in order to make it peel, pressing the protection sheet S. The peeling member is not limited to the peel plate 62 but may be another member such as a roller. Furthermore, if the wafer W is not lifted when the protective sheet S is peeled off due to the thickness and rigidity of the wafer W, the adhesive property of the protective sheet S, the peeling method of the protective sheet S, etc., It is not an essential requirement of the present invention that the protective sheet S is pressed toward the wafer W at the time of peeling, and the protective sheet S may be peeled off without being pressed. Even in this case, it is possible to prevent the peel plate 62 from interfering with the ring frame RF by attaching the ring frame RF to the mounting sheet MS after the protective sheet S is peeled from the wafer W. An effect such as prevention of breakage of the resulting wafer W is obtained.
Furthermore, the drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. (Some overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 Mount apparatus 2 Supply means 3 Sheet support means 5 Sheet sticking means 6 Peeling means 7 Frame sticking means 35 Table 52 Decompression means S Protection sheet (2nd adhesive sheet)
MS mount sheet (first adhesive sheet)
RF ring frame (frame)
W Wafer (Substrate)
WA surface (one side)
WB back side (the other side)

Claims (5)

A mounting device for integrating a frame and an adherend through a first adhesive sheet having an adhesive layer on one surface of a base sheet,
Sheet sticking means for sticking the first adhesive sheet having an outer shape larger than the outer shape of the adherend to the other surface of the adherend to which the second adhesive sheet is stuck on one surface;
A peeling means for peeling the second adhesive sheet from the adherend to which the first adhesive sheet is attached;
A mounting device comprising: a frame sticking means for sticking the frame to the first adhesive sheet protruding from the adherend from which the second adhesive sheet has been peeled off.   The mounting apparatus according to claim 1, further comprising sheet support means for supporting the first adhesive sheet from the base sheet side. The sheet support means includes a table that supports the first adhesive sheet,
With the first adhesive sheet supported on the table, the first adhesive sheet is attached to the adherend, the second adhesive sheet is peeled off from the adherend, and the first adhesive sheet. The mounting device according to claim 2, wherein the frame is attached to the frame.   The mounting apparatus according to any one of claims 1 to 3, wherein the sheet sticking unit includes a decompression unit that maintains the adherend and the first adhesive sheet in a decompressed atmosphere. A mounting method for integrating a frame and an adherend through a first adhesive sheet having an adhesive layer on one surface of a base sheet,
Affixing the first adhesive sheet having an outer shape larger than the outer shape of the adherend to the other surface of the adherend to which the second adhesive sheet is affixed on one surface;
Peeling off the second adhesive sheet from the adherend to which the first adhesive sheet is attached;
A mounting method comprising attaching the frame to the first adhesive sheet protruding from an adherend from which the second adhesive sheet has been peeled off.

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