JP2012074476A - Sheet sticking device and sheet sticking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet sticking device and a sheet sticking method which can accurately stick an adhesive sheet at a predetermined sticking position on an adherend.SOLUTION: Using a sheet sticking device and a sheet sticking method, an adhesive sheet S can be accurately stuck on a predetermined sticking position on a wafer W. This can be achieved by inserting the adhesive sheet S in a recessed portion 43 of a supporting body 41 of pressing means 4 to prevent a positional shift of the adhesive sheet S with respect to the supporting body 41, and by inserting the wafer W in the recessed portion 43 and sticking the adhesive sheet S onto the wafer W at the same time to prevent a positional shift of the adhesive sheet S also with respect to the wafer W. Further, when sticking the adhesive sheet S onto the wafer W by pressing the same using the supporting body 41 of the pressing means 4, an outer peripheral surface 45 of the recessed portion 43 restricts elongation of the adhesive sheet S so that the adhesive sheet S can be stuck onto the wafer W without spreading out of the wafer W and a predetermined shape thereof can be maintained. This can improve the sticking accuracy of the adhesive sheet S.

Description

  The present invention relates to a sheet sticking apparatus and a sticking method for sticking an adhesive sheet to an adherend.

  Conventionally, in a semiconductor manufacturing process, a sheet sticking device for sticking an adhesive sheet such as a dicing tape on the surface of a semiconductor wafer as an adherend (hereinafter sometimes simply referred to as a wafer) has been used (for example, Patent Document 1). reference). This sheet sticking device rolls the adhesive sheet held on the surface of the cylindrical suction roller while pressing it against the wafer surface, sticks the wafer to the adhesive sheet, holds it once with the suction roller, and suctions the ring frame The roller is rolled to attach the adhesive sheet to the ring frame, and the wafer and the ring frame are integrated via the adhesive sheet.

JP 2006-339607 A

  However, in the sheet sticking device described in Patent Document 1, since the sticking sheet is stuck while pressing the adhesive sheet against the wafer surface by rolling the suction roller, the adhesive sheet is pressed no matter how accurately the sticking start position is aligned. It grows due to the pressure, and there arises a problem such as sticking out of the outer edge of the wafer or sticking out of the wafer as the sticking progresses. In particular, in recent years, the tendency of the area of the adhesive sheet to increase with the increase in the wafer outer diameter is remarkable, and the accumulated elongation at the edge of the adhesive sheet increases due to the accumulation of fine elongation. As a result, a deviation between the adhesive sheet and the adhesive sheet may cause various problems such as poor adhesion, adhesion of dust, deterioration of transportability, and damage to the wafer.

  The objective of this invention is providing the sheet sticking apparatus and sticking method which can stick an adhesive sheet correctly to a predetermined sticking position with respect to a to-be-adhered body.

  In order to achieve the above object, the sheet sticking apparatus of the present invention feeds an original fabric in which an adhesive sheet having an adhesive layer on one surface of a base sheet is temporarily attached on a strip-like release sheet at a predetermined interval. A feeding means; a peeling means for peeling the adhesive sheet from the original peel sheet fed by the feeding means; and pressing the adhesive sheet peeled by the peeling means from the other surface side of the base sheet. A pressing means for affixing to the adherend, the pressing means having a bottom surface capable of contacting the other surface of the base sheet, and an outer periphery rising from the bottom surface and capable of contacting the outer edge of the adhesive sheet A concave portion having a surface is provided, and the adhesive sheet having the bottom surface and the outer peripheral surface of the concave portion in contact with each other is pressed against the adherend so as to be pasted.

At this time, in the sheet sticking device of the present invention, it is preferable that a holding means for sucking and holding the other surface of the base sheet is provided on the bottom surface of the recess.
Furthermore, it is preferable that the sheet sticking device of the present invention includes a pressing unit that supports the adhesive sheet in the concave portion and a moving unit that relatively moves the adherend.
In the sheet sticking device of the present invention, the outer peripheral surface of the recess is formed to have the same rising edge dimension as the outer edge of the adhesive sheet and larger than the thickness of the adhesive sheet, and supports the adhesive sheet Thus, it is preferable that a positioning means that can be positioned in contact with the outer edge of the adherend is provided at a position closer to the opening side of the outer peripheral surface than the adhesive layer.
Furthermore, in the sheet sticking device of the present invention, the adhesive layer of the adhesive sheet is formed in an annular shape having a predetermined width along the outer edge of the base sheet, and the bottom surface of the recess is a base end of the outer peripheral surface. It is preferable that a high-rigidity region provided annularly along the portion and a low-rigidity region having a lower rigidity than the high-rigidity region on the inner side of the high-rigidity region.

  On the other hand, in the sheet sticking method of the present invention, an adhesive sheet having an adhesive layer on one side of a base sheet is fed out from a raw material temporarily attached onto a strip-like release sheet at a predetermined interval, and the fed raw material is fed out. The adhesive sheet is peeled off from the release sheet, the peeled adhesive sheet is received in the recess of the pressing means, the bottom surface of the recess is brought into contact with the other surface of the base sheet, and the outer peripheral surface of the recess rising from the bottom surface In a state where the adhesive sheet is in contact with the outer edge of the adhesive sheet, the adhesive sheet is pressed against the adherend and pasted.

  According to the present invention as described above, even if the adhesive sheet is stretched by pressing and adhering the adhesive sheet received in the concave portion of the pressing means to the adherend, its outer edge is on the outer peripheral surface of the concave portion. Since the elongation of the adhesive sheet can be constrained by the contact, the adhesive sheet can be accurately stuck at a predetermined position according to the shape of the adherend. In addition, by accepting the adhesive sheet in the concave portion, it is possible to prevent the positional deviation of the adhesive sheet at the time of sticking, thereby further accurately controlling the sticking position on the adherend and improving the sticking accuracy. .

At this time, in the sheet sticking apparatus, if the holding means is provided on the bottom surface of the concave portion, the adhesive sheet is displaced or dropped before being pressed by the pressing means by sucking the base sheet with the holding means. Can be prevented, and the accuracy of the pasting position can be ensured.
Further, if the pressing means in a state where the adhesive sheet is received in the recess and the adherend are configured so as to be relatively movable by the moving means, the pressing means or the adherend is supported even if the adherend is supported at a position away from the peeling means. The adhesive sheet can be stuck by moving the body, and since the movement of the adhesive sheet can be restricted by the concave portion even during this movement, the shift of the sticking position can be prevented.
Further, if positioning means is provided on the outer peripheral surface opening side of the concave portion, the positioning means is brought into contact with the outer edge of the adherend to position the adhesive sheet, so that the adhesive sheet received in the concave portion and the adherend can be accurately positioned. It can stick in the state where it was positioned, and the sticking accuracy can be further improved.
Furthermore, when the adhesive layer of the adhesive sheet is annular, an annular high-rigidity region corresponding to the adhesive layer and a flexible low-rigidity region are formed on the bottom surface of the recess. If this is done, the adhesive layer can be strongly pressed against the adherend by the high-rigidity region, and the pressing force to the inside of the adherend can be appropriately adjusted by bending the low-rigidity region. it can. Therefore, for example, even when the adherend is a bump wafer or the like having bumps (projections) such as electrodes on the inner side (parts other than the outer edge part), the pressing force to the bumps is moderately suppressed. It is possible to prevent the adherend from being damaged.

The side view of the sheet sticking apparatus which concerns on 1st Embodiment of this invention. Operation | movement explanatory drawing of the sheet sticking apparatus of FIG. Operation | movement explanatory drawing of the sheet sticking apparatus following FIG. FIG. The elements on larger scale of the sheet sticking apparatus which concerns on 2nd Embodiment of this invention. The side view of the sheet sticking apparatus which concerns on the modification of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the second and subsequent embodiments, the same constituent members as those described in the first embodiment and the constituent members having the same functions are denoted by the same reference numerals as those in the first embodiment. Those descriptions are omitted or simplified.

[First Embodiment]
In FIG. 1, the sheet sticking apparatus 1 of this embodiment peels the adhesive sheet S temporarily attached to the strip-like release sheet RL from the release sheet RL and attaches it to the wafer W as an adherend. Here, the adhesive sheet S has the adhesive layer AD on one surface (the surface on the release sheet RL side) of the base sheet BS, and is formed in advance in a predetermined shape (for example, a circular shape) to form the adhesive layer AD. Is prepared as an original fabric R temporarily attached to the release sheet RL. The adhesive layer AD is formed in an annular shape with a predetermined width along the outer edge of the base sheet BS, and the inner part of the adhesive sheet S where the adhesive layer AD is not provided is one of the base sheets BS. This surface is exposed and is not bonded to the wafer W. Further, as shown in FIG. 4, the wafer W is a bump wafer having bumps (protrusions) WA with a plurality of electrodes and the like protruding on the surface thereof.

  The sheet sticking device 1 includes a feeding means 2 that feeds the original fabric R, a peeling plate 3 that peels the adhesive sheet S from the peeling sheet RL of the fed raw fabric R, and an adhesive peeled by the peeling plate 3 A pressing means 4 that presses and adheres the sheet S to the wafer W, a wafer support means 5 that supports the wafer W downward above the pressing means 4, and the pressing means 4 with respect to the wafer W up and down in FIG. It comprises moving means 6 that moves left and right.

The whole of the feeding means 2 is supported by a base frame 20, and a support shaft 21 that supports the roll R by winding the roll R in the base frame 20, and a plurality of guide rollers 22 that guide the roll R. , 23, a driving roller 25 driven by a rotation motor 24 as a driving device, a pinch roller 26 sandwiching the release sheet RL between the drive roller 25, and a recovery for recovering the release sheet RL by a driving device (not shown). And a roller 27.
The release plate 3 is supported by the base frame 20 extending in the left direction in FIG. 1, and the adhesive sheet S is released from the release sheet RL by folding the release sheet RL extending from the guide roller 23 toward the drive roller 25. It is like that.

  The pressing means 4 includes a generally cylindrical support body 41 along an axis extending in a direction orthogonal to the paper surface of FIG. 1 and a rotation motor 42 which is a driving device for rotating the support body 41 about its axis. It is supported by the moving means 6 via the moving motor 42. The support body 41 is formed with a recessed portion 43 that is recessed from the outer peripheral surface thereof, and the recessed portion 43 has a developed shape that fits the wafer W and the adhesive sheet S almost without any gaps. Is formed. That is, the concave portion 43 is formed to have a bottom surface 44 whose shape developed in a plane is the same as the planar shape of the wafer W and the adhesive sheet S and an outer peripheral surface 45 rising from the bottom surface 44. As shown in FIG. 4, a chamber portion 46 connected to a suction means (not shown) is formed inside the hollow of the support 41, and a plurality of suction ports 47 as holding means formed on the bottom surface 44 are formed. In this way, the adhesive sheet S can be sucked and held in the concave portion 43 by sucking outside air into the chamber portion 46.

  Furthermore, the bottom surface 44 of the concave portion 43 is made of a material having high rigidity such as metal, hard resin, hard rubber, and the like, and has an annular high height that is a high rigidity portion facing the adhesive layer AD region of the supported adhesive sheet S. The rigid region 44A is composed of an elastic member such as a soft resin or soft rubber having a lower rigidity than the high-rigidity region 44A, and the low region facing the region other than the region facing the adhesive layer AD of the supported adhesive sheet S. A circular low-rigidity region 44B, which is a rigid part, is formed. In such a bottom surface 44, when the supported adhesive sheet S is pressed and attached to the wafer W, the high-rigidity region 44A can strongly apply the adhesive layer AD to the outer edge surface of the wafer W and can be reliably attached. On the other hand, the deformation of the low-rigidity region 44B can prevent the wafer W from being damaged by receiving a local pressing force via the bump WA.

  The outer peripheral surface 45 of the recess 43 has a rising dimension larger than the thickness of the adhesive sheet S (the thickness of the base sheet BS and the adhesive layer AD), and faces the outer edge of the supported adhesive sheet S. 45 A of opposing surface parts and the positioning part 45B as a positioning means located in the radial direction outer side of the support body 41 from the opposing surface part 45A, ie, the opening side of the outer peripheral surface 45, rather than the adhesive layer AD of the supported adhesive sheet S. Configured. The opposing surface portion 45A restrains the elongation by abutting the outer edge of the adhesive sheet S to be stretched when the supported adhesive sheet S is pressed and stuck to the wafer W, and the adhesive sheet S adheres to the predetermined surface of the wafer W. It functions as a sheet restraining means that enables it to be attached to a position. The positioning unit 45B is configured to be able to position the wafer W and the adhesive sheet S by contacting the outer edge of the wafer W, and rotates the support 41 while keeping the positioning unit 45B along the outer edge of the wafer W. Thus, the adhesive sheet S can be attached without protruding from the wafer W. In the present embodiment, the rising dimension of the outer peripheral surface 45 is set to a dimension smaller than the combined thickness of the adhesive sheet S and the wafer W.

The wafer support means 5 includes a hollow rectangular table 51 and a suction means (not shown) connected to the inside of the hollow. The support surface 52 located on the lower surface side of the table 51 includes A plurality of suction ports (not shown) leading to the hollow interior are formed, and the wafer W can be sucked and held by the support surface 52.
The moving means 6 includes a linear motion motor 61 that is a drive device extending in the vertical direction perpendicular to the support surface 52 on the back side of the paper in FIG. 1 with respect to the table 51, and a slider 62 (slidably driven by the linear motion motor 61). 2), and the rotation motor 42 of the sheet support means 4 is fixed to the slider 62. Further, the moving means 6 includes a linear motion motor 63 that is a drive device extending in the left-right direction on the rear side of the paper in FIG. 1 with respect to the linear motion motor 61 and a slider 64 that is slidably driven by the linear motion motor 63. The linear motion motor 61 is fixed to the slider 64.

  As a procedure for sticking the adhesive sheet S to the wafer W by the sheet sticking apparatus 1 described above, first, as shown in FIG. 1, the moving means 6 drives the linear motion motor 61 and the linear motion motor 63 so as to remove the peeling plate 3. The support body 41 is disposed in the vicinity of the tip position. Further, the pressing means 4 drives the rotation motor 42 and directs the first end 43A of the recess 43 directly below, so that the first end 43A can receive the leading end of the adhesive sheet S in an initial state. . From the initial state, when the unwinding means 2 unwinds the original fabric R, the tip of the adhesive sheet S comes into contact with the first end portion 43A, and when this contact is detected by a detection means such as a sensor (not shown), In synchronization with the feeding of the adhesive sheet S (at the same speed), the support body 41 is rotationally driven in the clockwise direction of FIG. Then, as shown in FIG. 2, the adhesive sheet S that is peeled from the release sheet RL by the release plate 3 is received in the concave portion 43, and the base sheet BS is sucked by the suction port 47 of the bottom surface 44 to hold the adhesive sheet S. By doing so, the adhesive sheet S is delivered from the feeding means 2 to the pressing means 4. At this time, the pressing means 4 receives the adhesive sheet S while guiding the outer edge of the adhesive sheet S with the opposed surface portion 45A of the concave portion 43, so that the adhesive sheet S does not protrude from the concave portion 43 or is not greatly separated. The adhesive sheet S is held in a state in which it is fitted to 43 with almost no gap.

(First sticking procedure)
Next, the rotation motor 42 and the linear motion motor 63 are driven to move the support 41 so that the center of the recess 43 (center of the adhesive sheet S) faces the center of the wafer support means 5 (center of the wafer W). In addition, the moving means 6 drives the linear motion motor 61 to raise the pressing means 4 while rotating. When the wafer W is received in the recess 43, a part of the adhesive layer AD is brought into linear contact with the center of the wafer W, and the pressing force of the adhesive layer AD on the wafer W is appropriately adjusted. While the drive of 61 is stopped and the position is maintained, the suction holding by the suction port 47 is also stopped. With the adhesive layer AD being pressed against the wafer W from the sticking start position, first, the moving means 6 drives the linear motion motor 63 to move the pressing means 4 to the right direction in FIG. 3 (the direction indicated by the one-dot chain line arrow). In synchronism with this movement (at the same speed), the pressing means 4 drives the rotation motor 42 to rotate the support body 41 counterclockwise (rotation direction indicated by a one-dot chain line arrow in FIG. 3). By rotating and continuing this movement and rotation, the first end 43A of the recess 43 reaches one end (the right end in FIG. 3) of the wafer W, so that the adhesive layer AD that is substantially half of the adhesive sheet S is formed. Affix to wafer W. Next, the linear motion motor 63 is driven in the opposite direction to move the pressing means 4 in the direction indicated by the solid line arrow in FIG. 3, and the rotation motor 42 is also rotated in reverse in synchronization (at the same speed). Then, the support body 41 is rotated in the clockwise rotation direction indicated by the solid line arrow in FIG. 3, and the pressing means 4 is moved to the sticking start position. Subsequently, the linear motor 63 and the rotation motor 42 are further driven, and the pressing means 4 is moved and rotated in the direction indicated by the two-dot chain line arrow in FIG. To the other end of the wafer W (left end in FIG. 3), the remaining half of the adhesive layer AD of the adhesive sheet S is attached to the wafer W.

  When such an adhesive sheet S is applied, the high-rigidity region 44A of the bottom surface 44 of the recess 43 strongly attaches the adhesive layer AD to the outer edge surface of the wafer W for application. On the other hand, the low-rigidity region 44B is deformed to the inner side of the support body 41 by the reaction force between the base sheet BS and the bump WA on the wafer W, and the low-rigidity region 44B is deformed in this manner, thereby causing the bump WA. Thus, it is possible to prevent the wafer W from being damaged via the bump WA. When the adhesive layer AD of the entire adhesive sheet S is attached to the wafer W as described above, the moving means 6 and the pressing means 4 drive the linear motion motors 61 and 63 and the rotation motor 42, respectively, and the support body 41 is in the initial state. Is placed in the position and waits in a state where the next adhesive sheet S is received. Further, the wafer support means 5 transfers the wafer W to which the adhesive sheet S is adhered to a transfer means (not shown), receives the next wafer W, sucks and holds it at a predetermined position on the support surface 52, and stands by. Thereafter, the adhesive sheet S can be sequentially attached to the plurality of wafers W by repeating the same procedure as described above.

(Second pasting procedure)
In addition to the first sticking procedure described above, the following second sticking procedure may be adopted as the sticking procedure of the adhesive sheet S. That is, when the pressing means 4 supporting the adhesive sheet S is raised by the linear motor 61 of the moving means 6, the height is such that the wafer W can be received in the recess 43 and the adhesive layer AD does not contact the wafer W. When the pressing means 4 is raised, the driving of the linear motor 61 is once stopped. At this height position, first, the moving means 6 drives the linear motor 63 to move the pressing means 4 in either the left or right direction, and the pressing means 4 drives the rotating motor 42 in synchronization with this movement. Then, the support body 41 is rotated. For example, as shown in FIG. 4, when the pressing means 4 is moved to the right end of the wafer W, the support 41 is rotated counterclockwise by the rotation motor 42, and the first end 43 </ b> A of the recess 43 is moved. The wafer 43 is brought into contact with the edge of the wafer W, and the recess 43 and the wafer W are aligned. Thereafter, the linear motion motor 61 of the moving means 6 is driven to press the adhesive layer AD against the wafer W, and then the linear motion motor 63 is driven to move the pressing means 4 in the left direction of the figure. In synchronization with (at the same speed), the rotation motor 42 is driven to rotate the support body 41 in the clockwise direction in the figure, and the adhesive layer AD is sequentially pressed and stuck to the wafer W, and the second end of the recess 43 By continuing the movement and rotation of the pressing means 4 until 43B reaches the left end of the wafer W, the adhesive layer AD of the entire adhesive sheet S is attached to the wafer W.

According to this embodiment, there are the following effects.
That is, by receiving and supporting the adhesive sheet S in the concave portion 43 of the support body 41 in the pressing means 4, the positional deviation of the adhesive sheet S with respect to the support body 41 can be prevented, and the wafer W is received by the concave portion 43. By adhering the adhesive sheet S to the wafer W while guiding, the positional deviation of the adhesive sheet S with respect to the wafer W can be prevented, and the adhesive sheet S can be accurately applied to a predetermined application position of the wafer W. . Furthermore, when the adhesive sheet S is stuck to the wafer W while pressing the adhesive sheet S with the support 41 by the moving means 6, the adhesive sheet S is removed from the wafer W by restraining the elongation of the adhesive sheet S on the outer peripheral surface 45 of the recess 43. The sticking can be carried out while maintaining a predetermined shape without protruding, and the sticking accuracy can be improved. Further, the wafer support means 5 supports the wafer W downward, and the sheet support means 4 is raised from below to attach the adhesive sheet S, so that the surface of the wafer W is less likely to get dust.
Further, by adopting the first sticking procedure, the integrated elongation amount in the sticking direction in the adhesive sheet S can be halved compared to the second sticking procedure, and the cumulative amount in which the adhesive sheet S is restrained by the facing surface portion 45A. The amount of restraint is halved, and the internal stress in the adhesive sheet S after being attached to the wafer W can be halved. Thereby, for example, when the wafer W to which the adhesive sheet S is attached is ground to several tens of μm, the wafer W is curled (warped) by the internal stress of the adhesive sheet S, and the wafer W It is possible to prevent inconvenience such as damage. This can effectively eliminate the inconvenience that becomes noticeable as the wafer W becomes larger.

[Second Embodiment]
Next, a sheet pasting apparatus 1A according to a second embodiment of the present invention will be described with reference to FIG.
In the sheet sticking device 1A of the present embodiment, the pressing means 4 includes a support body 41 that has the same configuration as that of the first embodiment but is supported so as to be immovable and rotatable in the vicinity of the tip of the peeling plate 3. On the other hand, the wafer support means 5 is supported by the moving means 6A so as to be movable in the left-right direction and the up-down direction in FIG. That is, the moving means 6A is a drive device that is provided on the slider 66 of the linear motion motor 65 and moves up and down the table 51 of the wafer support means 5 as a drive device that extends in the left-right direction in FIG. A linear motion motor 67 is included. In addition, air is blown from below the adhesive sheet S protruding from the release plate 3 at a position in front of the table 51 to the sheet sticking apparatus 1A to prevent the adhesive sheet S from drooping, and the tip of the adhesive sheet S is pressed by the pressing means 4. Assist means 7 for guiding to the recess 43 is provided.

  As a sticking procedure of the adhesive sheet S in such a sheet sticking apparatus 1A, first, the pressing unit 4 waits in an initial state in which the first end portion 43A of the concave portion 43 faces directly below. From the initial state, when the raw material R is fed out by the feeding means 2, the adhesive sheet S is peeled from the peeling sheet RL by the peeling plate 3, and the tip of the peeled adhesive sheet S is assisted by the assisting means 7, The tip of S abuts on the first end 43A and is sucked and held. When this suction is detected by a detection means such as a sensor (not shown), the air blowing of the assist means 7 and the feeding of the original fabric R of the feeding means 2 are stopped. Next, when the table 51 supporting the wafer W on the upper surface is moved by the moving means 6A and the left end of the wafer W in the drawing is brought into contact with the first end portion 43A, the movement is stopped, whereby the recess 43 and the wafer W are stopped. Is aligned. At this time, the height position of the table 51 is set by the linear motor 67 so that the wafer W can be received in the recess 43 and the adhesive layer AD does not contact the wafer W. Then, the linear motion motor 67 is driven to raise the table 51, thereby bringing the adhesive layer AD at the tip of the adhesive sheet S into contact with the outer edge portion of the wafer W, and the pressing force of the adhesive layer AD to the wafer W is increased. If adjusted appropriately, the drive of the linear motion motor 67 is stopped to maintain the position thereof, and the suction holding of the adhesive sheet S by the pressing means 4 is also stopped.

  Next, the linear motor 65 starts moving the table 51 in the left direction in FIG. 5, and simultaneously, the support body 41 is rotated clockwise in FIG. 5 by the rotation motors 42 and 24 (see the first embodiment). By driving and feeding the raw fabric R, the adhesive sheet S is received in the recess 43, and the expansion and displacement of the adhesive sheet S are regulated by the outer peripheral surface 45, while the adhesive sheet S is viewed from the base sheet BS side at the bottom surface 44. To attach the adhesive layer AD to the wafer W. At this time, when the second half region of the adhesive sheet S is not constrained by the outer peripheral surface 45, the extension of the adhesive sheet S in the adhesive sheet S cannot be regulated. This can be solved by slightly increasing the speed of conveyance of 51. When the feeding speed of the adhesive sheet S is increased in this way, the adhesive sheet S tends to extend in a direction orthogonal to the feeding direction of the adhesive sheet S. However, the presence of the outer peripheral surface 45 also regulates this elongation. be able to. The feeding speed of the adhesive sheet S can be appropriately adjusted by the operator depending on the material of the adhesive sheet S, the temperature of the atmosphere, and the like. When the entire adhesive sheet S is attached to the wafer W in this way, the wafer support means 5 delivers the wafer W to which the adhesive sheet S is attached to a conveying means (not shown), and the moving means 6A and the pressing means 4 are linear motors. 65 and 67 and the rotation motor 42 are driven to place the support 41 in the initial position, and the apparatus waits in a state where the next adhesive sheet S is received. Thereafter, the adhesive sheet S can be sequentially attached to the plurality of wafers W by repeating the same procedure as described above.

  As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to particular embodiments, but with respect to the embodiments described above, such as shape and the like, without departing from the scope and spirit of the invention. In the detailed configuration, various modifications can be made by those skilled in the art. Moreover, since the description which limited the shape etc. which were disclosed above was illustrated in order to make an understanding of this invention easy, it does not limit this invention, Therefore The description by the name of the member which remove | excluded one part or all part is included in this invention.

For example, in the above-described embodiment, the case where the adherend is the semiconductor wafer W has been described. However, the adherend is not limited to the semiconductor wafer W, and may be a glass plate, a steel plate, a resin plate, or the like. Members can also be targeted, and examples of semiconductor wafers include silicon semiconductor wafers and compound semiconductor wafers. Furthermore, the wafer is not limited to the bump wafer as in the above embodiment, and may be a wafer having a flat surface without bumps.
The adhesive sheet S may be a sheet for mounting, a protective sheet, a dicing tape, a die bonding tape, or other various sheets, tapes, or films attached to a semiconductor wafer, and the adherend is not a semiconductor wafer. In the case of a member, a sheet for an appropriate use such as a surface coating sheet or film, or a decorative sheet can be used.
Further, an adhesive layer may be provided inside the edge annular adhesive layer AD, and the adhesive layer is laminated on one whole surface of the base sheet BS other than the one formed in the edge annular shape. It may be a thing.
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).
Furthermore, the rising dimension of the outer peripheral surface 45 may be set to a dimension larger than the combined thickness of the adhesive sheet S and the wafer W. In this case, the pressing means 4 may be pressed to such an extent that the material of the support 41 is recessed. The support surface 52 of the table 51 may be set to a dimension that does not protrude from the outer edge of the wafer W.
In addition, the concave portion 43 may have a shape that is partially coincident with the shape developed in a plane, not the shape that completely matches the planar shape of the wafer W and the adhesive sheet S.

Further, as shown in FIG. 6, a pressing means 4A having a flat support 41A and having a recess 43 formed on the lower surface thereof, and a wafer support means 5A having a support surface 52 on the upper surface of the table are provided. The sheet sticking apparatus 1B can be used. In this case, the support 41A is lowered from above the adhesive sheet S before being peeled off by the peeling plate 3, and the adhesive sheet S is received in the recess 43, and the base sheet is received by a suction port (not shown) provided on the bottom surface 44. The adhesive sheet S is held by sucking the BS. Then, in synchronism with the feeding of the adhesive sheet S by the feeding means 2 (at the same speed), the moving means 6 moves the pressing means 4A in the left direction in the figure, while the peeling sheet 3 peels off the peeling sheet RL. S is supported by the support 41A. Next, a sticking procedure may be employed in which the pressing means 4A is lowered by the moving means 6 and the adhesive sheet S is pressed onto the upper surface of the wafer W supported by the wafer support means 5A to stick the adhesive sheet S to the wafer W. it can.
In the sheet sticking apparatus 1B, the support surface 52 of the wafer support means 5A is provided on the upper surface of the table 51. However, the present invention is not limited thereto, and the wafer W is supported on the lower surface side of the table in the same manner as the wafer support means 5. There may be. In this case, the pressing unit 4A includes a rotating unit, and the rotating unit 41 rotates the support 41A so that the adhesive layer AD of the adhesive sheet S faces upward, and then the moving unit 6 raises the pressing unit 4A. What is necessary is just to comprise so that the adhesive sheet S may be pressed and attached from the downward direction of the wafer W. FIG.

1, 1A, 1B Sheet sticking device 2 Feeding means 3 Peeling plate (peeling means)
4, 4A pressing means 6, 6A moving means 43 concave portion 44 bottom surface 44A high rigidity region 44B low rigidity region 45 outer peripheral surface 45B positioning portion (positioning means)
47 Suction port (holding means)
R Original fabric RL Release sheet S Adhesive sheet BS Base sheet AD Adhesive layer

Claims (6)

A feeding means for feeding out the original fabric temporarily attached onto the strip-shaped release sheet with a predetermined interval between the adhesive sheet having an adhesive layer on one surface of the base sheet;
A peeling means for peeling the adhesive sheet from the original peeling sheet fed by the feeding means;
A pressing means for pressing the adhesive sheet peeled by the peeling means from the other surface side of the base sheet and sticking it to an adherend;
The pressing means is provided with a recess having a bottom surface capable of contacting the other surface of the base sheet and an outer peripheral surface rising from the bottom surface and capable of contacting the outer edge of the adhesive sheet. A sheet sticking apparatus, wherein the adhesive sheet with the bottom surface and the outer peripheral surface of the concave portion in contact with each other is pressed against the adherend and can be pasted.   The sheet sticking device according to claim 1, wherein holding means for sucking and holding the other surface of the base sheet is provided on a bottom surface of the concave portion.   The sheet sticking device according to claim 1 or 2, further comprising a moving unit that relatively moves the pressing unit that supports the adhesive sheet in the concave portion and the adherend. .   The outer peripheral surface of the recess is formed to have the same rising edge dimension as the outer edge of the adhesive sheet and larger than the thickness of the adhesive sheet, and the outer peripheral surface than the adhesive layer in a state of supporting the adhesive sheet. 4. The sheet sticking device according to claim 1, wherein a positioning means that can be positioned by contacting an outer edge of the adherend is provided at a position on the opening side. The adhesive layer of the adhesive sheet is formed in an annular shape having a predetermined width along the outer edge of the base sheet,
The bottom surface of the recess has a high-rigidity region provided annularly along the base end portion of the outer peripheral surface, and a low-rigidity region having a lower rigidity than the high-rigidity region on the inner side of the high-rigidity region. The sheet sticking apparatus according to any one of claims 1 to 4, which is configured as described above. An adhesive sheet having an adhesive layer on one surface of the base sheet is fed out a raw material temporarily attached on a strip-shaped release sheet at a predetermined interval,
Peel off the adhesive sheet from the unrolled original peel sheet,
The peeled adhesive sheet is received in the concave portion of the pressing means, the bottom surface of the concave portion is brought into contact with the other surface of the base sheet, and the outer peripheral surface of the concave portion rising from the bottom surface is brought into contact with the outer edge of the adhesive sheet. A sheet sticking method comprising pressing the adhesive sheet against an adherend in a state.

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