WO2013114952A1

WO2013114952A1 - Sheet-detaching device and detaching method

Info

Publication number: WO2013114952A1
Application number: PCT/JP2013/050733
Authority: WO
Inventors: 芳昭杉下
Original assignee: リンテック株式会社
Priority date: 2012-01-31
Filing date: 2013-01-17
Publication date: 2013-08-08
Also published as: KR102038813B1; TW201350388A; JP2013157518A; KR20140128387A; CN104094396A; CN104094396B; TWI597207B; JP5993578B2

Abstract

This sheet-detaching device (1) is equipped with: a supporting means (2) that has a tilted surface (21) which is tilted with respect to a horizontal plane and is for supporting a plate-like member (WF), which has an adhesive sheet (AS) applied to one surface, from the other surface side by means of the tilted surface (21); a feeding means (3) for feeding a detaching tape (PT); an application means (5) for applying the detaching tape (PT), which is fed by the feeding means (3), to the adhesive sheet (AS); and a moving means (6) for moving the supporting means (2) and the application means (5) relative to each other in the in-plane direction of the tilted surface (21) in order to detach the adhesive sheet (AS) from the plate-like member (WF).

Description

Sheet peeling apparatus and peeling method

The present invention relates to a sheet peeling apparatus and a peeling method for peeling an adhesive sheet affixed to a plate member.

2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, there has been known a sheet peeling apparatus that peels an adhesive sheet such as a protective sheet affixed to the surface of a semiconductor wafer that is a plate-like member (hereinafter sometimes simply referred to as “wafer”) ( For example, see Patent Document 1).
The sheet peeling apparatus described in Patent Literature 1 includes a table that sucks and holds a wafer to which an adhesive sheet is stuck, and a tape sticking unit that sticks a strip-shaped peeling tape to the held wafer. By relatively moving the table, the adhesive sheet can be peeled from the wafer.

JP 2009-70837 A

By the way, in recent years, the diameter of a wafer has been increased, and even a large wafer having a size of 18 inches (wafer outer diameter of about 450 mm) is a processing target. In the conventional sheet peeling apparatus as described in Patent Document 1, a dedicated area such as a wafer support surface, a wafer transfer path, and a wafer stock area when viewed from above in the direction of gravity increases. For this reason, in the conventional sheet peeling apparatus, there exists a problem that the installation area (horizontal projection area for apparatus installation) of an apparatus becomes large, so that a wafer becomes large.
Further, since the support means is provided horizontally, impurities such as dust and dirt in the air easily fall on the wafer, and when such impurities adhere, circuits formed around the adhering portion and the periphery thereof. Therefore, there is a problem in that the yield of wafer manufacturing is reduced.

The objective of this invention is providing the sheet | seat peeling apparatus and peeling method which can suppress the increase in the installation area accompanying the increase in the size of a plate-shaped member as much as possible.
Another object of the present invention is to provide a sheet peeling apparatus and a peeling method capable of reducing impurities from adhering to a plate member as much as possible.

The sheet peeling apparatus of the present invention includes a supporting means for supporting a plate-like member having an inclined surface inclined with respect to a horizontal plane and having an adhesive sheet affixed on one surface thereof from the other surface side with the inclined surface, A feeding means for feeding out the tape, a sticking means for sticking the peeling tape fed by the feeding means to the adhesive sheet, and a relative movement of the support means and the sticking means in the in-plane direction of the inclined surface. And a moving means for peeling the adhesive sheet from the plate-like member.

In the sheet peeling apparatus according to the aspect of the invention, it is preferable that the support unit includes a first positioning unit that contacts an outer edge of the plate-like member and positions the plate-like member at a predetermined position on the inclined surface.
Moreover, it is preferable that the sheet peeling apparatus of the present invention includes a receiving unit that receives the plate member when the support of the plate member by the support unit is released.
Further, in the sheet peeling apparatus of the present invention, the feeding means is provided so that the peeling tape can be fed in a state where a width direction perpendicular to the feeding direction of the peeling tape is parallel to the inclined surface. It is preferable to include meandering preventing means for preventing the tape from meandering in the width direction.
Furthermore, the sheet peeling apparatus of the present invention includes second positioning means for positioning the peeling tape with respect to the adhesive sheet by relatively moving the support means and the feeding means in the width direction of the feeding object. It is preferable.

On the other hand, in the sheet peeling method of the present invention, a plate-like member having an adhesive sheet affixed on one surface is supported from the other surface side by an inclined surface inclined with respect to a horizontal plane, and a peeling tape is fed and fed. Affixing the peeled tape to the adhesive sheet by an attaching means, and moving the plate-like member and the attaching means relative to each other in the in-plane direction of the inclined surface to peel the adhesive sheet from the plate-like member. Features.

According to the present invention as described above, since the adhesive sheet can be peeled from the plate member in a state where the plate member is inclined with respect to the horizontal plane, the area occupied by the support means can be reduced, As a result, the area including the moving space when the support means moves can be reduced, and an increase in the installation area accompanying the increase in the size of the plate-like member can be suppressed as much as possible.
In addition, the possibility that impurities in the atmosphere will fall on the plate-like member is reduced, and even if it falls on the plate-like member, it is easy to fall off the plate-like member due to gravity, so the impurities are on the plate-like member. It can suppress remaining.

At this time, if the first positioning means is provided, even when the plate-like member is supported on the inclined surface, the plate-like member can be positioned only by bringing the plate-like member into contact with the contact portion. For this reason, since the time required for positioning the plate-like member can be shortened, the processing capacity per unit time can be improved.
Moreover, if a receiving means is provided, even if support of a plate-shaped member is cancelled | released, it can prevent the said plate-shaped member falling and damaging.
In addition, if the meandering prevention means is provided, it is possible to prevent the peeling tape from meandering, and it is possible to prevent an inconvenience that the attaching position of the peeling tape to the adhesive sheet is shifted.
Furthermore, if the 2nd positioning means is provided, the sticking position of the peeling tape with respect to an adhesive sheet can be changed arbitrarily.

The perspective view which shows the sheet | seat peeling apparatus which concerns on 1st Embodiment of this invention. The top view of the sheet | seat peeling apparatus of FIG. The front view of the sheet peeling apparatus of FIG.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
Note that the X axis, Y axis, and Z axis in this specification are orthogonal to each other, the X axis and Y axis are axes in a horizontal plane, and the Z axis is an axis that is orthogonal to the horizontal plane. Further, when indicating the direction in each axis, “+” is the direction of the arrow of each axis, and “−” is the direction opposite to the arrow.

1 and 2, a sheet peeling apparatus 1 feeds a peeling tape PT and a supporting means 2 that supports a wafer WF as a plate-like member having an adhesive sheet AS attached to one surface from the other surface side. The feeding means 3, the tape positioning means 4 as the second positioning means for positioning the peeling tape PT with respect to the adhesive sheet AS, and the sticking means 5 for sticking the peeling tape PT fed by the feeding means 3 to the adhesive sheet AS. And a moving means 6 for separating the adhesive sheet AS from the wafer WF by moving the supporting means 2 and the attaching means 5 relative to each other, and receiving the wafer WF when the support means 2 releases the support of the wafer WF. Means 7 are provided.

The support means 2 includes a table 22 having a support surface 21 as an inclined surface capable of sucking and holding the wafer WF by suction holding means (not shown) such as a decompression pump and a vacuum ejector, and a direct drive device provided in the table 22. As a first positioning means for positioning the wafer WF in a state of being protruded from the support surface 21 while being supported by the moving motor 23 (FIG. 2) and the opening 24 of the support surface 21 supported by the linear motion motor 23. Abutting portion 25 (FIG. 2). The support surface 21 is a surface parallel to a plane including the X axis and the Z axis, and is disposed in a state inclined with respect to a horizontal plane (inclination angle 90 °).

The feeding means 3 peels between the driving roller 32 and the supporting roller 31 that winds and supports the peeling tape PT on the receiving plate 31A, the driving roller 32 that is driven by the rotation motor 32A as a driving device, and the driving roller 32. A pinch roller 33 for sandwiching the adhesive tape PT, a recovery roller 34 that is driven by a rotation motor 34A as a driving device and collects the release tape PT and the adhesive sheet AS attached to the release tape PT, and an exfoliation tape Meandering prevention means 35 for preventing PT meandering, and the whole is supported by the base frame 30. The feeding means 3 is configured so that the peeling tape PT can be fed in a state where the width direction perpendicular to the feeding direction of the peeling tape PT is parallel to the support surface 21 (a state in which the peeling tape PT is in the Z-axis direction).

As shown in FIG. 2, the meandering prevention means 35 includes a bottom surface portion 36, a pair of upright portions 37 erected from both ends of the bottom surface portion 36 in the short width direction, and one end side of the upright portion 37 in the long width direction. And an expanding portion 38 that expands toward the one end side. The receiving plate 31A and the meandering preventing means 35 are provided so as to be movable up and down in the Z-axis direction in accordance with the width of the peeling tape PT and the position where the peeling tape PT is attached to the adhesive sheet AS.

The tape positioning unit 4 includes a linear motion motor 41 as a driving device in which an output shaft (not shown) is fixed to the base frame 30, and the base frame 30 is moved in the Z-axis direction by the linear motion motor 41, thereby supporting means. 2 and the feeding means 3 are configured to be relatively movable in the in-plane direction of the support surface 21 and in the width direction of the peeling tape PT.

The sticking means 5 includes a pressing plate 51 supported in a posture extending in the Z-axis direction, and a heating means 52 such as a heater provided in the pressing plate 51 (FIG. 2).

The moving means 6 includes a linear motion motor 62 as a drive device extending in the X-axis direction, and the slider 61 supports the table 22 and is configured to be movable in the X-axis direction.

The receiving means 7 is arranged below the range in which the table 22 moves, and in parallel with the support surface 21 in the range in which the table 22 moves, and the housing member 71 having a U-shaped cross section provided along the X-axis direction. And two tilting prevention plates 72 are provided. Buffering means 73 and 74 made of an elastic member such as rubber, resin, or sponge are provided on the surface of the accommodation member 71 where the wafer WF is accommodated and the table 22 side of the tilt prevention plate 72. In addition, a gap 72 </ b> A that allows the pressing plate 51 to press the adhesive sheet AS against the wafer WF is provided between the tilt prevention plates 72.

The transport means 8 includes an articulated robot 81 as a driving device and a suction tool 82 provided at the tip of the articulated robot 81, and connects the suction tool 82 to suction means such as a suction pump (not shown). Thus, the wafer WF can be sucked and held. The articulated robot 81 is a so-called six-axis robot having joints that can rotate at six locations, and is configured such that the suction tool 82 can be displaced at any position and at any angle within the work range of the articulated robot 81. ing.

In the above sheet peeling apparatus 1, the procedure for peeling the adhesive sheet AS from the wafer WF will be described.
First, the peeling tape PT is set as shown in FIG. Further, the linear motion motor 41 is driven to move the base frame 30 in the Z-axis direction, thereby positioning the application position of the peeling tape PT with respect to the adhesive sheet AS.

Next, the transfer means 8 drives the articulated robot 81 to take out the wafer WF from the wafer storage cassette CT via the suction tool 82, and the support surface of the table 22 waiting at the position indicated by the double chain line in FIG. The wafer WF is brought into contact with 21. At this time, the transport unit 8 contacts the two points on the outer edge of the wafer WF with the contact portion 25 protruding from the support surface 21, and positions the wafer WF at a predetermined position on the support surface 21. Next, the support means 2 drives a suction holding means (not shown) to suck and hold the wafer WF on the support surface 21 and drives the linear motion motor 23 to bring the contact portion 25 into the table 22 as shown in FIG. Evacuate.

Then, the moving means 6 drives the linear motor 62 to move the table 22 in the + X axis direction. When the detection means (not shown) detects that the wafer WF has reached a predetermined position, the feeding means 3 drives the rotation motor 32A in synchronization with the movement of the table 22 and the peeling tape via the drive roller 32. Extend PT. Accordingly, the peeling tape PT is pressed against the adhesive sheet AS by the pressing plate 51, and the peeling tape PT is folded back to the driving roller 32 side by the pressing plate 51, whereby the adhesive sheet AS is peeled from the wafer WF. The At this time, the peeling tape PT is prevented from meandering by restricting the movement of the peeling tape PT to the −Z axis side and the out-of-plane direction of the peeling tape PT by the meander prevention means 35. In addition, by heating the peeling tape PT by the heating means 52, the adhesive of the peeling tape PT is softened, and the degree of adhesion of the adhesive to the surface of the adhesive sheet AS is increased, so that the adhesive sheet AS is surely secured. Can be peeled off.

When the peeling of the adhesive sheet AS from the wafer WF is completed, the moving unit 6 stops driving the linear motor 62. Thereafter, when the transfer unit 8 drives the articulated robot 81 and sucks and holds the wafer WF with the suction tool 82, the support unit 2 stops driving the suction holding unit (not shown). Then, the transfer unit 8 drives the articulated robot 81 to store the wafer WF in the wafer storage cassette CT.
Thereafter, the moving means 6 drives the linear motion motor 62 to move the table 22 in the −X axis direction to return it to the position indicated by the chain double-dashed line in FIG. 1, and thereafter the same operation as described above is repeated.

Here, when the wafer WF is supported on the table 22 and the suction holding by the suction holding means is released for some reason, the wafer WF falls and is damaged. In the case of the present embodiment, even if the suction holding by the suction holding means is canceled, the wafer WF is supported by the accommodation member 71 and the tilt prevention plate 72 as shown by the double chain line in FIG. Therefore, there is no inconvenience that the wafer WF is damaged. Moreover, since the buffering means 73 of the housing member 71 and the buffering means 74 of the tilt prevention plate 72 absorb the impact when the wafer WF falls, damage to the wafer WF can be more reliably suppressed.

According to this embodiment as described above, the following effects are obtained.
That is, the support means 2 supports the wafer WF with the support surface 21 inclined with respect to the horizontal plane, and the moving means 6 moves the support means 2 and the pasting means 5 relative to each other in the in-plane direction of the support surface 21 to move from the wafer WF. The adhesive sheet AS is peeled off. Therefore, an increase in the installation area of the apparatus accompanying an increase in the size of the wafer WF can be suppressed as much as possible.
In addition, since the support surface 21 is inclined with respect to the horizontal plane, the possibility of impurities in the atmosphere falling on the wafer WF is reduced, and even if it falls on the wafer WF, it falls from the wafer WF due to gravity. Since it becomes easy, it can suppress that an impurity remains on the wafer WF.

As described above, the best configuration, method and the like for carrying out the present invention are disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such is included in this invention.

For example, in the above-described embodiment, the support surface 21 has an inclination angle of 90 °. However, the support surface 21 may be arranged to be inclined with respect to the horizontal plane. For example, the inclination angle is 90 °. Is set to be smaller (so that the support surface 21 can be seen from above in the direction of gravity) or larger than 90 ° (so that the support surface 21 cannot be seen from above in the direction of gravity). However, from the viewpoint of suppressing an increase in the installation area of the apparatus, the inclination angle is preferably 45 ° to 135 ° with respect to the horizontal plane.

Alternatively, the wafer WF mounted on the ring frame via the mount sheet may be configured so that the support means 2 can support the sheet affixed to the wafer WF.

Further, the contact portion 25 is projected and retracted from the support surface 21, but the contact portion 25 is formed in a shape protruding from the support surface 21, and the contact portion 25 always protrudes from the support surface 21. It may be in a state (impossible to sink).

Further, the tape positioning means 4 may move the support means 2 with the feeding means 3 stopped, or both the supporting means 2 and the feeding means 3 may be moved.
Furthermore, the moving means 6 may move the sticking means 5 while the support means 2 is stopped, or may move both the support means 2 and the sticking means 5.

Further, the receiving means 7 may be configured as a single member in which the housing member 71 and the tilt prevention plate 72 are continuous, or the receiving means 7 may not be provided.
Furthermore, the sticking means 5 can employ a pressing member made of a roller, rubber, resin, sponge, or the like instead of the pressing plate 51, and can also employ a configuration in which pressing is performed by air blowing.

In addition to the wafer WF, the plate-like member can be a glass plate, a steel plate, or another plate-like member such as a resin plate, or a member other than the plate-like member. The wafer WF can be exemplified by a silicon semiconductor wafer, a compound semiconductor wafer, and the like. The adhesive sheet AS attached to such a semiconductor wafer is not limited to a protective sheet, a dicing tape, and a die attach film, but any other sheet, Sheets of arbitrary uses and shapes, such as films and tapes, can be applied.

Furthermore, the type and material of the adhesive sheet AS are not particularly limited. For example, the adhesive sheet AS has three or more layers such as those having an intermediate layer provided between the base sheet and the adhesive layer, and other layers. Alternatively, a single adhesive layer without a base sheet may be used.
The plate member may be an optical disk substrate, and the adhesive sheet may have a resin layer constituting a recording layer. As described above, as the plate-like member, any form of member, article, or the like can be targeted.
Further, a pressure-sensitive adhesive sheet, a heat-sensitive adhesive sheet, or the like can be used as the peeling tape PT.

The drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition, it is possible to adopt a combination of them directly or indirectly (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 Sheet peeling apparatus 2 Support means 3 Feeding means 4 Tape positioning means (2nd positioning means)
5 sticking means 6 moving means 7 receiving means 21 support surface (inclined surface)
25 Contact part (first positioning means)
35 Meandering prevention means AS adhesive sheet PT peeling tape WF wafer (plate-like member)

Claims

Support means for supporting a plate-like member having an inclined surface inclined with respect to a horizontal plane and having an adhesive sheet attached to one surface from the other surface side with the inclined surface;
A feeding means for feeding out the peeling tape;
A sticking means for sticking the peeling tape fed by the feeding means to the adhesive sheet;
A sheet peeling apparatus comprising: a moving means for moving the support means and the sticking means relative to each other in an in-plane direction of the inclined surface to peel the adhesive sheet from the plate-like member.
2. The sheet peeling device according to claim 1, wherein the supporting unit includes a first positioning unit that contacts an outer edge of the plate-shaped member and positions the plate-shaped member at a predetermined position of the inclined surface. apparatus.
3. The sheet peeling apparatus according to claim 1 or 2, further comprising receiving means for receiving the plate member when the support of the plate member by the support means is released.
The feeding means is provided such that the peeling tape can be fed in a state where a width direction perpendicular to the feeding direction of the peeling tape is parallel to the inclined surface,
The sheet peeling apparatus according to any one of claims 1 to 3, further comprising meandering preventing means for preventing the peeling tape from meandering in the width direction.
2. A second positioning means for positioning the peeling tape with respect to the adhesive sheet by moving the supporting means and the feeding means relative to each other in the width direction of the feeding object. The sheet peeling apparatus according to claim 4.
A plate-like member having an adhesive sheet attached to one surface is supported from the other surface side with an inclined surface inclined with respect to the horizontal plane,
Pull out the peeling tape,
Affixing the peeled tape that has been unwound to the adhesive sheet by an attaching means,
A sheet peeling method, wherein the adhesive sheet is peeled from the plate member by relatively moving the plate member and the sticking means in an in-plane direction of the inclined surface.