JP2010205817A - Electronic component holder - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component holder for easily detaching a held electronic component and suppressing the breakage and falling of the electronic component by the large deformation of the whole. <P>SOLUTION: The electronic component holder includes a frame body 1, a holding plate 6 for freely detachably holding a semiconductor wafer 4 which is loosely fitted inside the frame body 1 and thinned, and a buffer connection layer 8 for connecting the frame body 1 and the holding plate 6, and flexibility is imparted to the frame body 1, the holding plate 6 and the buffer connection layer 8 respectively. On the surface of the holding plate 6, an adhesive layer 7 for the semiconductor wafer 4 is laminated and stuck. Even when vibrations are generated and act on the frame body 1 during work or conveyance, since the buffer connection layer 8 absorbs the vibrations, lowers a generation acceleration and suppresses and prevents the transmission of the vibrations to the holding plate 6, both of the frame body 1 and the holding plate 6 are not largely deformed. Thus, the semiconductor wafer 4 is effectively prevented from being damaged or falling from the holding plate 6 accompanying the vibrations or the like. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component holder that detachably holds an electronic component typified by a semiconductor wafer.

  In recent years, electronic devices typified by mobile phones have been reduced in size and weight, and in order to achieve this reduction in size and weight, there has been a demand for thinning electronic devices and displays. In order to satisfy the requirements, it is necessary to make the semiconductor wafer and the glass substrate for liquid crystal as thin as possible.

  However, if a semiconductor wafer or glass substrate is thinned, it becomes brittle and easily broken, which may hinder handling and transport during manufacturing. In view of this point, conventionally, a flat, hard support substrate is formed using a material such as metal, ceramic, plastic, etc., and a thinned semiconductor wafer or glass substrate is laminated and bonded to the support substrate. The work is performed or transported in a state where rigidity is ensured (see Patent Document 1).

JP-A-2005-333100

  The conventional electronic component holder is configured as described above, and the thinned semiconductor wafer or glass substrate is simply stacked and pasted on a hard support substrate, so that rigidity can be ensured, but removal There is a problem that becomes difficult. As a method for solving such a problem, a method of removing the semiconductor wafer or the glass substrate by deforming the support substrate has been studied. In this method, the entire support substrate is accompanied by vibration during transportation. As a result, there is a new problem that the semiconductor wafer or the glass substrate is broken or dropped from the support substrate.

  The present invention has been made in view of the above, and it is an object of the present invention to provide an electronic component holder capable of easily removing a held electronic component and suppressing damage and dropout of the electronic component due to the overall large deformation. It is an object.

In the present invention, in order to solve the above problems, the electronic component is detachably held,
Including a frame, a holding plate that is fitted into the frame via a gap and detachably holds an electronic component, and a buffer connection layer that connects the frame and the holding plate,
Flexibility is imparted to the frame, the holding plate, and the buffer connection layer, respectively, and an adhesive layer for electronic components is provided on the surface of the holding plate.

Note that the holding plate can be formed hollow so that the front and back surfaces of the electronic component are exposed, and a buffer connection layer can be provided between the back surface of the frame and the back surface of the holding plate.
Moreover, the photocurable adhesive layer which adhesiveness falls by irradiation of a light beam can also be laminated | stacked on the surface of a holding plate.

  Here, the electronic components in the claims include at least one semiconductor wafer (such as a silicon wafer), a glass substrate, a semiconductor chip, and a circuit element. This electronic component is mainly a thin and fragile component, but does not specifically exclude a thick component. The frame is not particularly limited to a ring shape, a hollow rectangle, a polygon or the like. Further, the holding plate and the buffer connection layer can be formed in a circular shape, an elliptical shape, a rectangular shape, a polygonal shape, a ring shape, a frame shape, or the like.

  According to the present invention, even when vibration occurs and acts on the frame of the electronic component holder during various operations or transportation, the buffer connection layer absorbs the vibration and the vibration is transmitted to the holding plate. Therefore, both the separate frame and the holding plate are hardly deformed.

According to the present invention, there is an effect that the held electronic component can be easily removed. In addition, the electronic component holder can be effectively prevented from being damaged or dropped due to a large deformation of the entire electronic component holder.
Moreover, if the holding plate is formed hollow so that the front and back surfaces of the electronic component are exposed, and a buffer connection layer is provided between the back surface of the frame body and the back surface of the holding plate, both sides of the substrate are exposed. Therefore, it is possible to conduct a continuity test or the like of a substrate on which circuits are formed on both sides.

It is plane explanatory drawing which shows typically embodiment of the electronic component holder which concerns on this invention. It is a section explanatory view showing typically an embodiment of an electronic component holder concerning the present invention. It is a section explanatory view showing typically a 2nd embodiment of the electronic parts holder concerning the present invention.

  Hereinafter, a preferred embodiment of an electronic component holder according to the present invention will be described with reference to the drawings. The electronic component holder in this embodiment is gripped by an operator as shown in FIGS. 1 and 2. A hollow frame 1, a holding plate 6 that holds the thinned semiconductor wafer 4 loosely fitted in the frame 1, and a buffer connection that tensions and connects the frame 1 and the holding plate 6. The thinned semiconductor wafer 4 is provided with the layer 8 and used for various operations and conveyances while ensuring the rigidity of the thinned semiconductor wafer 4.

  Both the frame body 1 and the holding plate 6 are formed using a predetermined material, and are provided with deformable flexibility. These materials are not particularly limited as long as rigidity and flexibility capable of preventing deformation and damage of the semiconductor wafer 4 are ensured. For example, polycarbonate, polypropylene, polyethylene, acrylic resin, Examples thereof include glass fiber kneading materials.

  As shown in FIG. 1, the frame body 1 is basically formed in a substantially ring-shaped flat plate having a diameter larger than that of the semiconductor wafer 4 and the holding plate 6, and surrounds the holding plate 6 from the outside via the gap 2. In addition, a part 3 of the outer peripheral portion is notched linearly and used for direction identification and positioning.

  As shown in FIGS. 1 and 2, the semiconductor wafer 4 is basically sliced into a plane circle and back-ground to a thickness of 100 μm or less, and a circuit pattern is formed on at least the front and back surfaces. A part of the outer peripheral portion is cut out linearly to obtain an orientation flat 5 for direction identification and positioning.

  As shown in FIG. 1 and FIG. 2, the holding plate 6 is formed in a planar circular flat plate having the same size as that of the semiconductor wafer 4, and the adhesive layer 7 for the semiconductor wafer 4 is laminated and adhered to the surface. The semiconductor wafer 4 is detachably adhered to the surface of the adhesive layer 7. The pressure-sensitive adhesive layer 7 is formed into a flat circular shape using a photo-curing material in which the pressure-sensitive adhesive is cured by irradiation with a predetermined light beam (ultraviolet light or the like), for example.

  As shown in the figure, the buffer coupling layer 8 is formed into a planar circular shape having flexibility using a predetermined material, and is bonded to the back surface of the frame 1 and the holding plate 6. It functions to buffer the impact against This buffer connection layer 8 is elastically deformed by using a thin resin film made of polyethylene terephthalate or polycarbonate which is stable to light and heat and has a small tensile elongation rate, and a silicone, urethane, olefin or fluorine elastomer. Molded into a possible thin film.

  In the above configuration, when the thinned semiconductor wafer 4 is held on the holding plate 6 of the electronic component holder, the holding plate can be obtained by placing the semiconductor wafer 4 on the adhesive layer 7 of the holding plate 6 and pressing it with a roller or the like. 6 can hold the semiconductor wafer 4 and ensure rigidity. In a state where such rigidity is ensured, the semiconductor wafer 4 is used for various operations and conveyance.

  During such work or transport, vibration may occur and act on the frame 1, but the buffer coupling layer 8 bends and absorbs vibration, and the generated acceleration is lowered and transmitted to the holding plate 6. Therefore, neither the frame body 1 nor the holding plate 6 is greatly deformed. Therefore, it is possible to effectively prevent the semiconductor wafer 4 from being damaged or falling off from the adhesive layer 7 of the holding plate 6 due to vibration during operation or conveyance.

  Next, when removing the semiconductor wafer 4 from the holding plate 6 of the electronic component holder, the electronic component holder is turned upside down so that the semiconductor wafer 4 is directed downward, and the semiconductor wafer 4 is not shown in the drawing. Then, the frame body 1 may be bent upward while irradiating the adhesive layer 7 of the holding plate 6 with a predetermined light beam.

  Then, since the external force that deforms the frame 1 acts on the buffer connection layer 8 and pulls, the holding plate 6 deforms like a bow and peels from the semiconductor wafer 4, and the semiconductor wafer 4 is removed smoothly and reliably by this peeling. be able to.

  Next, FIG. 3 shows a second embodiment of the present invention. In this case, the holding plate 6 is partitioned into a hollow ring shape so that both the front and back surfaces of the semiconductor wafer 4 are exposed, Between the back surface of the frame 1 and the back surface of the holding plate 6, a buffer connection layer 8 partitioned and formed in a hollow ring shape is constructed and bonded.

  The holding plate 6 is partitioned and formed in a ring shape having a diameter slightly larger than that of the semiconductor wafer 4, and a flat ring-shaped adhesive layer 7 is laminated and adhered to the surface, and the circuit pattern of the semiconductor wafer 4 is adhered to the surface of the adhesive layer 7. The peripheral edge where no is formed is detachably adhered. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected, and both the front and back surfaces of the semiconductor wafer 4 can be exposed. Therefore, the thickness direction of the semiconductor wafer 4 in which the circuit pattern is formed on both the front and back surfaces. It is clear that the continuity test can be performed. Furthermore, since the contact area between the adhesive layer 7 of the holding plate 6 and the semiconductor wafer 4 is reduced, the contamination of the semiconductor wafer 4 can be expected to be prevented.

  In addition, in the said embodiment, although the part 3 of the outer peripheral part of the frame 1 was notched linearly, it is not limited to this at all. For example, a semicircular cutout may be formed in a part 3 of the outer peripheral portion and used for direction identification and positioning. Alternatively, the holding plate 6 may be formed using a self-adhesive material, and the holding plate 6 and the adhesive layer 7 may be integrated.

1 Frame 2 Gap 4 Semiconductor wafer (electronic component)
6 Holding plate 7 Adhesive layer 8 Buffer connection layer

Claims (3)

An electronic component holder that detachably holds an electronic component, a frame, a holding plate that is fitted into the frame via a gap and holds the electronic component detachably, and the frame and the holding plate A buffer connection layer for connecting
An electronic component holder comprising a frame, a holding plate, and a buffer connection layer, each having flexibility, and an adhesive layer for an electronic component provided on the surface of the holding plate.   The electronic component holder according to claim 1, wherein the holding plate is formed to be hollow so that the front and back surfaces of the electronic component are exposed, and a buffer connection layer is provided between the back surface of the frame body and the back surface of the holding plate.   The electronic component holder according to claim 1 or 2, wherein a photocurable adhesive layer whose adhesiveness is reduced by irradiation of light is laminated on the surface of the holding plate.

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