JP2007227726A - Aggregate substrate processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an aggregate substrate processing method which solves a problem of dust in formation of a mounting substrate, and secures handleability until the formation of the mounting substrate. <P>SOLUTION: According to the aggregate substrate processing method, an aggregate substrate 1 is formed by integrating a plurality of component mounting substrates into a single substrate, and is used to manufacture a mounting-finished substrate 10, where component mounting and individualization is carried out for each substrate composing the aggregate substrate 1. The method includes a step (S1) of pasting the aggregate substrate 1 before component mounting on a dicing sheet 2, a step (S2) of dicing the aggregate substrate 1 to form individualized substrates 3 and putting the individualized substrates 3 in a state of being held on the dicing substrate 2, a step (S3) of mounting components 4 on the individualized substrates 3 that are individualized and held on the dicing sheet 2, and a step (S4) of separating the individualized substrate 3 carrying a component from the dicing sheet 2 to obtain the mounting-finished substrate 10. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a collective substrate processing method for manufacturing a mounted substrate in which component mounting and separation are performed using the collective substrate.

  Conventionally, when manufacturing modularized parts by mounting electronic elements and optical elements on a small board, such as a camera module of a mobile phone, a plurality of boards for mounting parts are assembled into a single piece. A method using a collective substrate formed in (1) is known (for example, see Patent Document 1).

  As shown in FIGS. 12A and 12B and FIGS. 13A and 13B, the method for forming a mounted substrate using the collective substrate disclosed in Patent Document 1 is as follows. After mounting, the assembled substrate 1 is diced into individual pieces with the assembled substrate held on a dicing sheet having adhesiveness on the surface, and the component 4 is mounted on each individual separated substrate 3 A substrate 10 is formed. In this method, the assembly substrate 1 performs from the mounting of the component 4 to immediately before the formation of the mounted substrate 10.

Further, as shown in FIGS. 14A, 14B, 15, 16A, and 16B, an aggregate substrate 1 is formed to form individual singulated substrates 3, and the aggregate substrate 1 is The mounted substrate 10 is also formed by mounting the component 4 on each individual substrate 3 obtained by dicing. In this method, the assembly substrate 1 is used until the individualized substrate 3 is formed, and the subsequent mounting of the components 4 and the formation of the mounted substrate 10 are performed on the individual individualized substrates 3. is there.
JP 2005-101711 A

  However, in the collective substrate processing method as shown in Patent Document 1 and FIGS. 12A, 12B and 13A, 13B described above, the collective substrate 1 is diced using a dicer or a leuter. As the chips adhere to the component mounting surface, there is a problem that the reliability of the product is lowered. Further, in the collective substrate processing method as shown in FIGS. 14 (a), 14 (b), 15, 16 (a) and 16 (b), the individualized substrates 3 are handled individually, so that the handling property is poor. There is a problem that the sex does not improve.

  An object of the present invention is to solve the above-mentioned problems, and to provide a method for processing an aggregate substrate that can solve the problem of dust in a mounted substrate and can ensure handling properties until a mounted substrate is formed. To do.

  In order to achieve the above-mentioned object, the invention of claim 1 uses a collective board in which a plurality of boards for component mounting are gathered together and formed in an integrated state for each board constituting the collective board. In a collective substrate processing method for manufacturing a mounted substrate on which component mounting and singulation have been performed, a step of attaching the collective substrate to a dicing sheet before component mounting, and dicing the collective substrate into individual pieces Forming the substrate and holding the singulated substrate on the dicing sheet; mounting the component on the singulated substrate held on the dicing sheet; and the component. After the mounting step, a step of peeling the separated substrate mounted with components from the dicing sheet to obtain the mounted substrate is provided.

  A second aspect of the present invention is the collective substrate processing method according to the first aspect, wherein the collective substrate is formed with a resist film avoiding dicing lines and the vicinity thereof in the collective substrate.

  A third aspect of the present invention is the collective substrate processing method according to the first aspect, wherein the collective substrate is formed with a copper foil avoiding dicing lines and the vicinity thereof in the collective substrate.

  According to the invention of claim 1, the step of holding the singulated substrate on the dicing sheet, and the step of mounting the components on the singulated substrate held in the dicing sheet by dividing into individual pieces After that, since the mounted substrate is formed, the problem of dust on the mounted substrate can be solved, and handling properties until the mounted substrate is formed can be secured. That is, since dicing is performed before dicing, the dust does not adhere to the component, and the dicing board is held on the dicing sheet. The whole can be handled as a single body, and these can be handled in the same manner as a collective substrate.

  According to the second aspect of the present invention, since the resist film is not processed during dicing, no dust is generated from the resist film. By the way, during dicing, the collective substrate is fully cut and the dicing sheet needs to be not damaged as much as possible in order to hold individual singulated substrates as an integrated object. Is adjusted. Therefore, when the cutting edge of the dicer is worn, burrs are generated due to uncut cutting on the surface of the aggregate substrate in contact with the dicing sheet. However, when the surface of the collective substrate is in contact with the dicing sheet through the resist film, a space corresponding to the resist film thickness is formed in the dicing line and its vicinity, so even when the cutting edge of the dicer is worn, Such cutting residue and burrs can be avoided. Accordingly, it is possible to avoid generation of dust due to cutting residue and burrs falling off in a subsequent process.

  According to the invention of claim 3, since the copper foil which is generally sticky and has a low free cutting property is not provided in the dicing line and the vicinity thereof, it is possible to avoid the cutting residue of the copper foil and the generation of burrs. In the process, it is possible to avoid generation of dust due to cutting residue and burrs falling off.

  Hereinafter, a method of processing an aggregate board according to an embodiment of the present invention, that is, individual boards constituting the aggregate board using the aggregate board formed by assembling a plurality of boards for component mounting into one piece A method of processing a collective substrate for manufacturing a mounted substrate that has been mounted with components and separated into pieces will be described with reference to the drawings.

(First embodiment)
FIG. 1 shows a flowchart of processing for the collective substrate processing method according to the first embodiment of the present invention, and FIGS. 2A and 2B show a state in which the collective substrate 1 is attached to a dicing sheet 2. 3 (a) and 3 (b) show the individualized substrate 3 held on the dicing sheet 2, and FIGS. 4 (a) and 4 (b) show the individualized component 4 mounted on the dicing sheet 2. FIG. The board | substrate 3 is shown and FIG. 5 shows a mode that the mounted board | substrate 10 is obtained.

  In the collective substrate processing method of this embodiment, the collective substrate 1 before component mounting is attached to the dicing sheet 2 (S1), and the collective substrate 1 is diced to form a separate substrate 3 and its individual pieces. A step (S2) in which the singulated substrate 3 is held on the dicing sheet 2, a step (S3) in which the component 4 is mounted on the singulated substrate 3 that is singulated and held on the dicing sheet 2, and a component After the mounting step, a step (S4) of obtaining the mounted substrate 10 by peeling the individualized substrate 3 mounted with components from the dicing sheet 2 is provided. Hereinafter, each process is explained in full detail.

  2A and 2B show the collective substrate 1 attached to the dicing sheet 2 after the above-described step S1. The collective substrate 1 is, for example, a printed wiring board, and has a quadrangular shape, and is formed by assembling 4 × 10 = 40 square singulated substrates 3 together. This collective substrate 1 is fully cut along dicing lines 11 indicated by a plurality of dotted lines in the vertical direction and the horizontal direction in a subsequent process. The collective substrate 1 is attached to a dicing sheet 2. The dicing sheet 2 has a rectangular shape larger than the collective substrate 1 and includes a frame body 2a on the outer peripheral portion. The dicing sheet 2 and the frame 2a constitute a carrier for holding the collective substrate 1 and providing it to each processing step. As the dicing sheet 2, for example, a pressure-sensitive adhesive sheet that can be used for dicing a semiconductor wafer and capable of reducing the adhesive force by irradiation with ultraviolet rays, a so-called UV sheet can be used.

  3A and 3B show a state in which the aggregate substrate 1 is separated into pieces by dicing and held on the dicing sheet 2 after the above-described step S2. The collective substrate 1 is cut by a rotating blade 5 of a dicer, and forty pieces of separated substrates 3 separated from each other by a cutting region 12 having a width of the blade 5 are arranged in the original arrangement state of the collective substrate 1 and the dicing sheet 2 Is held on. The dicing sheet 2 and the frame 2a constituting the carrier can accurately maintain the pitch accuracy between the cut individualized substrates 3 in the state of the collective substrate 1. Further, these singulated substrates 3 are cleaned while being held on the dicing sheet 2, and abrasive grains and cutting waste during dicing are removed.

  4A and 4B show the singulated substrate 3 on which the component 4 is mounted on the dicing sheet 2 after the above-described step S3. The component 4 is mounted on the singulated substrate 3 in the same manner as mounting the component on the collective substrate 1 before being cut by the dicer.

  FIG. 5 corresponds to the above-described step S <b> 4 and shows a state where the mounted substrate 10 is peeled off from the dicing sheet 2. When a UV sheet is used as the dicing sheet 2, the ultraviolet light 6 is irradiated from the lower surface of the dicing sheet 2 (the surface without the singulated substrate 3) to weaken the adhesiveness of the dicing sheet 2 and the mounted substrate 10. Pickup is performed.

  According to the invention of the present embodiment, the process of bringing the singulated substrate 3 into the state of being held on the dicing sheet 2 and mounting the components on the singulated substrate 3 that has been singulated and held on the dicing sheet 2 are performed. Since the mounted substrate 10 is formed through the steps, it is possible to solve the problem of dust in the mounted substrate 10 and to ensure handling properties until the mounted substrate 10 is formed. That is, since dicing is performed before dicing of the component 4, dust during dicing does not adhere to the component 4, and the singulated substrate 3 is held on the dicing sheet 2. The entire singulated substrate 3 can be handled as an integrated object, and these can be handled in the same manner as the collective substrate 1. When the component to be mounted on the singulated substrate 3 is, for example, an optical element such as a CCD element of a camera module, it is particularly important for manufacturing the mounted substrate 10 to suppress the generation and adhesion of dust. The collective substrate processing method is effective.

(Second Embodiment)
6 (a) and 6 (b) show a state in which the aggregate substrate 1 processed by the aggregate substrate processing method according to the second embodiment of the present invention is attached to the dicing sheet 2 on the base 2b, and FIG. a) and (b) show the individualized substrate 3 held on the dicing sheet 2, FIG. 8 shows the individualized substrate 3 on which the component 4 is mounted on the dicing sheet 2, and FIG. A mode that the board | substrate 10 is obtained is shown.

  In the collective substrate processing method in the second embodiment, instead of the frame body 2a of the dicing sheet 2 in the first embodiment described above, the lower side of the dicing sheet 2 (the side without the singulated substrate 3). Unlike the collective substrate processing method of the first embodiment, the carrier base 2b is provided in the other points, and the other points are the same. The dicing sheet 2 of this embodiment has adhesiveness on both sides, and holds the aggregated substrate 1 and the aggregated substrate 3 formed by dicing the aggregated substrate 1 by the adhesiveness of the upper surface. The dicing sheet 2 and the base 2b are fixed to each other by the adhesiveness of the lower surface.

  The base 2b is used to hold the dicing sheet 2 and the collective substrate 1 and the singulated substrate 3 on the dicing sheet 2, and to transport these held between processes or process them in the process. Further, when a UV sheet is used as the dicing sheet 2, the base 2 b irradiates the ultraviolet rays 6 from the lower surface of the dicing sheet 2 (the surface without the singulated substrate 3), thereby improving the adhesiveness of the dicing sheet 2. It is made of a material that transmits ultraviolet light so that the mounted substrate 10 can be picked up weakly. The base 2b is made of, for example, plastic or glass having a high ultraviolet transmittance.

  The aggregate substrate processing method of this embodiment has the same effects as those of the first embodiment, and the base 2b can support the entire aggregate substrate 1 and the entire singulated substrate 3 from the lower surface. The process of each process can be performed while maintaining the position of the singulated substrate 3 with higher accuracy.

(Third embodiment)
FIG. 10 shows a dicing process for the collective substrate processing method according to the third embodiment of the present invention, FIG. 11 (a) shows a general dicing process, and FIG. 11 (b) shows a dicing process. The state of the occurrence of defects in is shown.

  The collective substrate processing method according to the third embodiment further reduces the generation of burrs and dust during dicing in the collective substrate processing method according to the first and second embodiments described above. For this reason, the collective substrate 1 used in the present embodiment is, as shown in FIG. 10, at or near the dicing line of the collective substrate 1 to be cut by the dicer blade 5 and at the side opposite to the dicing sheet 2. A copper foil 1b and a resist film 1c are formed by providing a space P (escape) so as to avoid the region.

  By the way, when the separated substrate 3 is formed from the assembled substrate 1, as shown in FIG. 11 (a), the assembled substrate 1 is fully cut, but the dicing sheet 2 is formed by combining individual separated substrates. As much as possible to keep it from being hurt. For this reason, the cutting depth of the cutting edge of the blade 5 is adjusted to the minimum necessary. Therefore, when the blade edge 5a of the dicer is worn, as shown in FIG. 11 (b), burrs Q due to the cutting residue are generated on the surface of the collective substrate 1 in contact with the dicing sheet 2.

  Normally, as shown in FIG. 10, a collective substrate 1 used for component mounting is a resist film such as a solder resist covering a layer of a copper foil 1b for forming a circuit pattern on both sides of a substrate core 1a and further covering a layer of the copper foil 1b. A layer 1c is formed. Therefore, by providing a space P corresponding to the thickness of the resist film 1c at the tip of the cutting region in the resist film 1c of the collective substrate 1 in contact with the dicing sheet, even when the blade edge 5a of the blade 5 is worn. Further, the remaining cutting of the resist film 1c and the generation of burrs can be avoided.

  Moreover, if the copper foil 1b and organic materials such as the substrate core 1a and the resist film 1c are mixed in the dicing line, burrs due to the cutting residue of the copper foil 1b are likely to occur, but similarly, the copper foil 1b also escapes. By forming it, it is possible to avoid cutting residue and burrs of the copper foil 1b. Therefore, it is possible to avoid the generation of dust due to the remaining cutting of the copper foil 1b and the resist film 1c and the removal of burrs in the subsequent process.

  The present invention is not limited to the above-described configuration, and various modifications can be made. For example, the collective substrate 1 has been described as a printed wiring board. However, the collective substrate 1 is not limited to this, and the present invention can be applied to any collective substrate on which electronic components and semiconductor elements are mounted. For example, a collective substrate 1 made of a silicon wafer or the like that is a semiconductor substrate can be mentioned. In addition, as a method of mounting components on the singulated substrate 3 on the dicing sheet 2, a conductive adhesive, wire bonding, ball bonding, electrical connection using a sheet-like connection member, or the like can be used. .

The flowchart of the process processing about the aggregate substrate processing method which concerns on the 1st Embodiment of this invention. (A) is a top view of the state which affixed the assembly board processed by the processing method same as the above on the sheet | seat for dicing, (b) is the sectional drawing. (A) is a top view which shows a mode that the separate board | substrate formed by the processing method same as the above is hold | maintained at the sheet | seat for dicing, (b) is the same sectional drawing shown with the dicing blade. (A) is a top view after performing component mounting on the singulated substrate on the sheet for dicing formed by the above processing method, and (b) is a sectional view of the same. Sectional drawing which shows a mode that a mounted board | substrate is peeled from the sheet | seat for dicing in the processing method same as the above. (A) is a top view of the state which affixed the aggregate substrate processed by the aggregate substrate processing method concerning the 2nd Embodiment of this invention to the sheet | seat for dicing on a base, (b) is the same sectional drawing. (A) is a top view which shows a mode that the separated substrate formed by the processing method same as the above is hold | maintained at the sheet | seat for dicing, (b) is the sectional drawing. Sectional drawing after performing component mounting on the separate board | substrate on the sheet | seat for dicing formed by the processing method same as the above. Sectional drawing which shows a mode that a mounted board | substrate is peeled from the sheet | seat for dicing in the processing method same as the above. Sectional drawing which shows the mode of the dicing process about the aggregate substrate processing method which concerns on the 3rd Embodiment of this invention. (A) is sectional drawing which shows the mode of a general dicing process, (b) is sectional drawing explaining the malfunction occurrence in a general dicing process. (A) is a top view of the assembly board which mounted components in the conventional processing method, (b) is the same sectional drawing. (A) is sectional drawing which shows the state which separated the collective board which mounted components same as the above, (b) is sectional drawing which shows a mode that the mounted board | substrate is peeled from the sheet | seat for dicing. (A) is a top view of the aggregate substrate in the other conventional processing method, (b) is the same sectional view. The top view of the collective board separated into pieces in the conventional processing method same as the above. (A) is a top view which shows a mode that components are mounted in the separated board | substrate in the conventional processing method, (b) is the same side surface.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Collective board 2 Dicing sheet 3 Divided board 4 Parts 10 Mounted board 11 Dicing line 1b Copper foil 1c Resist film

Claims (3)

Using a collective board formed by integrating a plurality of boards for component mounting into one piece, a mounted board that has been mounted and separated into individual parts for each board constituting the collective board In the collective substrate processing method to be manufactured,
A step of attaching the collective substrate before component mounting to a dicing sheet;
Dicing the collective substrate to form an individualized substrate and holding the individualized substrate on the dicing sheet; and
Mounting the components on the singulated substrate held in the sheet for dicing and dicing;
After the component mounting step, there is provided a step of peeling the singulated substrate mounted with the component from the dicing sheet to obtain the mounted substrate.   2. The collective substrate processing method according to claim 1, wherein the collective substrate is formed with a resist film avoiding dicing lines and the vicinity thereof in the collective substrate.   The aggregate substrate processing method according to claim 1, wherein the aggregate substrate is formed with a copper foil avoiding dicing lines and the vicinity thereof in the aggregate substrate.

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