JP2010153409A - Holding tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a holding tool capable of eliminating the necessity of successively deforming an adhesive layer by exhaustion of an exhaust device until an article is taken out from the adhesive layer. <P>SOLUTION: The holding tool is configured such that a hollow frame 10 is detachably mounted on the surface of a tray 1 and the deformable flexible adhesive layer 11 for holding LED devices 6 is adhered on the surface of the frame 10. In the holding tool, a plurality of supporting protrusions 3 surrounded by the frame 10 protrude from the surface of the tray 1 in the direction of the adhesive layer 11, and an exhaust hole 4 for communicating the portions between the plurality of supporting protrusions 3 to an external exhaust device 5 is drilled in the thickness direction of the tray 1. The adhesive layer 11 is formed of a first adhesive layer 12 for adhesively holding the LED devices 6 removably, and a second adhesive layer 13 adhered on the backside of the first adhesive layer 12 and adhering to the plurality of supporting protrusions 3 removably. Since the second adhesive layer 13 maintains the deformation state of the adhesive layer 11, the adhesive layer 11 is not required to be always deformed by the exhaustion of the exhaust device 5 until the all of the plurality of LED devices 6 are taken out. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a holding jig used for holding, transporting, transporting articles made of semiconductor wafers, semiconductor devices, LED devices, and the like.

  There are various types of devices, one of which is an LED device. Although not shown, this LED device is processed into a predetermined size using, for example, a 4-inch or 6-inch semiconductor wafer, mounted on a chip tray, transported to a mounting location, and then mounted on the chip tray at the mounting location. It is used for a processing apparatus comprising a corresponding mounting machine or the like (see Patent Documents 1, 2, and 3).

  By the way, in recent years, LED devices of 8 × 0.3 × 0.3 mm type have appeared or LED devices with a height higher than the width have appeared, but a plurality of these LED devices are mounted on a conventional chip tray. When transported, the LED device may rotate and change its direction due to impact or vibration during transportation. As a result, there is a problem that the processing apparatus stops and productivity is lowered.

As a means to solve such a problem, a plurality of LED devices are detachably held on the adhesive layer of the holding jig, and the exhaust device attached to the processing apparatus and the exhaust hole of the tray of the holding jig are connected. There is a method in which the exhaust layer is driven to deform the adhesive layer covering the tray into irregularities, and all the plurality of LED devices are sequentially removed from the adhesive layer whose contact area is reduced by deformation. In this case, the exhaust device is connected to an exhaust hole on the back surface or side surface of the tray mounted on the processing device via a guide or the like, so that the air in the holding jig is continuously exhausted to deform the adhesive layer into irregularities. Function.
JP 2004-006467 A JP 2001-244279 A Japanese Patent Laid-Open No. 11-220014

  However, when such a method is adopted, it is possible to prevent the situation where the LED device rotates and changes its direction, but the existing processing device is improved and an exhaust device is attached, and all the plurality of LED devices are removed. The adhesive layer must be continuously deformed continuously by the exhaust of the exhaust device. In order to continuously deform the adhesive layer, it is necessary to improve the existing processing equipment on a large scale because there are various restrictions on the processing equipment etc. when trying to connect the exhaust equipment to the exhaust holes on the back or side of the tray. There is room for new problems in terms of facilities and costs.

  The present invention has been made in view of the above, and an object of the present invention is to provide a holding jig that does not require the adhesive layer to be continuously deformed by exhaust of an exhaust device or the like until an article is removed from the adhesive layer.

In the present invention, in order to solve the above problems, a hollow frame is detachably mounted on the tray, and a deformable flexible adhesive layer for holding an article is attached to the frame,
A plurality of support projections surrounded by the frame from the surface of the tray are projected in the direction of the adhesive layer, and the tray is provided with exhaust holes for communicating (connecting) between the plurality of support projections and an external exhaust device. Is formed from a first adhesive layer that detachably adheres and holds an article, and a second adhesive layer that is attached to the first adhesive layer and detachably adheres to a plurality of support protrusions. It is said.

In addition, a partition wall is provided at the boundary between the central portion and the peripheral portion of the tray surface, and a plurality of support protrusions that are surrounded by the partition wall are formed at the central portion of the tray surface so as to be substantially the same height as the partition wall. The frame can be fitted to the partition wall from the outside.
In addition, it is preferable that the surface of the frame and the front end surfaces of the plurality of support protrusions are substantially the same.

  Here, the tray in the claims can be a planar circle, an ellipse, a rectangle, a polygon or the like. The hollow frame can be formed in a ring shape or a frame shape according to the shape of the tray. The article includes at least one or more semiconductor wafers, semiconductor devices, photomasks, glass substrates, LED devices, electrical components, electronic circuit elements, solar battery cells, and the like. The exhaust device is connected to the exhaust hole of the tray, and exhausts the gas in the space defined by the tray, the frame, and the adhesive layer to the outside to deform the adhesive layer.

  According to the present invention, an external exhaust device is connected to the exhaust hole of the tray and the exhaust device is driven before setting the holding jig holding the article to be adhered to the processing device or the like. Then, the adhesive layer is deformed according to the plurality of supporting protrusions, and the article can be peeled off from the adhesive layer to perform various processes. At this time, since the second adhesive layer adheres to the surface of the tray and the support protrusion, once the exhaust device is driven, the deformed state of the adhesive layer can be ensured without continuing driving.

  After securing the deformed state of the adhesive layer, disconnect the tray exhaust hole from the exhaust device and set the holding jig in the processing device etc. with the adhesive layer deformed, then remove the article from the adhesive layer and process it. can do.

  According to the present invention, the second adhesive layer adheres to the surface of the tray, the supporting protrusions, etc. and maintains the deformed state of the adhesive layer, so that the adhesive layer is removed by exhausting the exhaust device or the like until the article is removed from the adhesive layer. There is an effect that a holding jig which does not need to be continuously deformed can be provided.

  Moreover, if the surface of the frame and the front end surfaces of the plurality of support protrusions are aligned substantially the same, the adhesive layer attached to the frame is suppressed from becoming uneven by the support protrusions, and the article is appropriately adhered and held, The posture of the article can be stabilized.

  Hereinafter, a preferred embodiment of the holding jig according to the present invention will be described with reference to the drawings. The holding jig in this embodiment is a hollow frame 10 on the surface of a tray 1 as shown in FIGS. Is mounted on the surface of the frame 10, and a flexible adhesive layer 11 that holds the plurality of LED devices 6 is attached to the surface. The adhesive layer 12 and the second adhesive layer 13 that is adhered to the back surface of the first adhesive layer 12 and adheres to the plurality of support protrusions 3 of the tray 1 are formed in a multilayer structure.

  As shown in FIGS. 1 to 3, the tray 1 is formed into a circular shape in plan view using a predetermined material and has a rigidity. The center of the back surface is cut out into a substantially dish-shaped cross section. A flat ring-shaped partition wall 2 is provided in a standing manner at the boundary between the central portion and the outer peripheral edge portion, and a plurality of portions surrounded by the partition wall 2 and the frame 10 are provided in the central portion of the surface. The support protrusion 3 is formed to protrude. The material of the tray 1 is not particularly limited, and examples thereof include polycarbonate, polypropylene, polyethylene, acrylic resin, vinyl chloride resin, aluminum alloy, magnesium alloy, glass, and stainless steel.

  The plurality of support protrusions 3 have the same height as the height of the partition wall 2 and the thickness of the frame 10, and are formed side by side by forming an uneven surface at the center of the surface of the tray 1. A method for forming the central portion of the surface of the tray 1 to be uneven is not particularly limited, and for example, a molding method, a sand blast method, an etching method, or the like is appropriately employed. Each support protrusion 3 is formed in a truncated cone shape and projects in a tapered manner in the direction of the adhesive layer 11 (upward direction in FIG. 1). Sticky.

  In the vicinity of the center of the central portion of the tray 1, an exhaust hole 4 that communicates between the plurality of support protrusions 3 and the outside is formed in the thickness direction, and an exhaust device 5 is attached to and detached from the end of the exhaust hole 4 from the outside. Connect freely. The exhaust device 5 includes, for example, a vacuum pump or the like, and is separately installed outside the processing device.

  As shown in FIGS. 1 to 3, the frame 10 is formed in a rigid ring shape using the same material as that of the tray 1 and is detachably mounted on the peripheral edge of the surface of the tray 1. 1 is positioned and fitted to the partition wall 2 from the outside. When the frame 10 is mounted on the tray 1, the surface thereof is aligned with the front end surfaces of the partition wall 2 and the plurality of support protrusions 3, and the adhesive layer 11 is prevented from being uneven, thereby preventing the plurality of LED devices 6. It functions to contribute to adhesive retention.

  As shown in the drawing, the adhesive layer 11 is adhered to the entire back surface of the first adhesive layer 12 for detachably sticking and holding the plurality of LED devices 6, and the plurality of trays 1. Is integrally laminated from the second adhesive layer 13 that is detachably adhered to the support protrusion 3 and deformed to be uneven by driving the exhaust device 5, thereby reducing the contact area with the plurality of LED devices 6. The LED device 6 functions to be removable.

  The first and second adhesive layers 12 and 13 are made of, for example, a silicone-based, urethane-based, olefin-based, or fluorine-based elastomer that has excellent heat resistance, weather resistance, water resistance, peelability, stability over time, and the like. It is formed into a circular thin film that can be elastically deformed, and the back peripheral edge of the second adhesive layer 13 is adhered to the flat front peripheral edge of the frame 10.

  In the above configuration, when a plurality of LED devices 6 are adhesively held on a holding jig and transported or set and mounted on a processing apparatus, first, the holding jig is configured by combining the tray 1 and the frame 10. Then, the plurality of LED devices 6 may be adhered and held on the surface of the flat adhesive layer 11, in other words, the surface of the first adhesive layer 12 (see FIG. 2).

Once the plurality of LED devices 6 are adhered and held on the holding jig in this way, they can be set in the processing apparatus. Just before that, the exhaust device 5 is connected to the exhaust hole 4 of the tray 1 and the exhaust device 5 is temporarily driven. To do.
Then, the air in the space defined by the surface of the tray 1, the frame 10, and the adhesive layer 11 (see arrows in FIGS. 2 and 3) is exhausted to the outside, so that the flat adhesive layer 11 has a plurality of support protrusions. 3 is deformed to be uneven, air flows between the plurality of LED devices 6 and the adhesive layer 11, and the plurality of LED devices 6 can be peeled from the adhesive layer 11 and mounted.

  At this time, the second adhesive layer 13 adheres to the central portion of the surface of the tray 1 and the peripheral surface of each support protrusion 3 to maintain the deformed state of the adhesive layer 11 deformed into irregularities (see FIG. 3). Therefore, there is no need to constantly exhaust the air in the space defined by the surface of the tray 1, the frame 10, and the adhesive layer 11 to the outside, and energy saving can be greatly expected.

If the uneven deformation state of the adhesive layer 11 is secured, the connection between the exhaust hole 4 of the tray 1 and the exhaust device 5 is released, and a holding jig is set in the processing device in a state where the adhesive layer 11 is deformed. The device 6 can be sequentially peeled from the adhesive layer 11 and mounted.
At this time, the first pressure-sensitive adhesive layer 12 is deformed into an uneven shape together with the second pressure-sensitive adhesive layer 13, but does not completely lose the adhesive holding force, so the LED device 6 rotates and changes its orientation. It is possible to suppress rolling and effectively prevent the processing apparatus from stopping and causing a decrease in productivity.

  When all of the plurality of LED devices 6 are peeled off from the adhesive layer 11 and mounted, the frame 10 and the adhesive layer 11 are recovered by separating the tray 1 and the frame 10 and returning the deformed adhesive layer 11 to its original flat state. And can be reused.

  According to the above, the LED device 6 can be prevented from rotating and changing its direction or rolling, and the second adhesive layer 13 is in close contact with the center of the surface of the tray 1 and the peripheral surface of each support protrusion 3. Since the deformation state of the adhesive layer 11 is maintained, there is no need to continuously deform the adhesive layer 11 by exhausting the exhaust device 5 until all of the plurality of LED devices 6 are removed. Therefore, it is not necessary to improve the existing processing apparatus on a large scale, and the cost can be greatly reduced.

  In addition, since it is not necessary to incorporate the exhaust device 5 in the processing device or to install it, the facility can be simplified. In addition, since the frame 3 is fitted to the partition wall 2 on the surface of the tray 1 from the outside, it is possible to suppress and prevent horizontal displacement and backlash of the frame 2. Furthermore, since the LED device 6 is held by the adhesive layer 11 instead of the adhesive tape, the adhesive paste of the adhesive tape does not adhere to the LED device 6.

  Note that the partition wall 2 of the tray 1 of the above embodiment may be omitted unless particularly required. Further, an IC tag for physical distribution management can be appropriately attached to the surface of the tray 1 or the frame 10. Further, as the first and second adhesive layers 12 and 13, an adhesive film may be used in addition to the adhesive elastomer.

  Further, an adhesive layer may be interposed between the first and second adhesive layers 12 and 13, and the first and second adhesive layers 12 and 13 may be bonded and integrated by this adhesive layer. Furthermore, the second adhesive layer 13 is not adhered to the entire back surface of the first adhesive layer 12, but the second adhesive layer 13 is adhered to the center of the back surface of the first adhesive layer 12, and the first adhesive layer The peripheral edge of the back surface of the layer 12 can be adhered to the peripheral edge of the front surface of the frame 10.

It is a section explanatory view showing typically the state which constitutes a holding jig combining a tray and a frame in an embodiment of a holding jig concerning the present invention. It is a section explanatory view showing typically the state where the adhesive layer in the embodiment of the holding jig concerning the present invention was made to stick and hold a plurality of LED devices. It is a section explanatory view showing typically the state where the adhesion layer in the embodiment of the holding jig concerning the present invention deforms following a plurality of support projections, and peels off the LED device from the adhesion layer.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Tray 2 Partition wall 3 Support protrusion 4 Exhaust hole 5 Exhaust apparatus 6 LED device (article)
10 frame 11 adhesive layer 12 first adhesive layer 13 second adhesive layer

Claims (2)

A holding jig in which a hollow frame is detachably mounted on a tray, and a deformable flexible adhesive layer for holding an article is attached to the frame,
A plurality of support protrusions surrounded by the frame are projected from the surface of the tray in the direction of the adhesive layer, and the tray is provided with exhaust holes that communicate between the plurality of support protrusions and an external exhaust device, and the adhesive layer is attached to the article. Retaining treatment characterized in that it is formed from a first adhesive layer that is detachably adhered and held, and a second adhesive layer that is adhered to the first adhesive layer and adheres detachably to a plurality of support protrusions. Ingredients.   The holding jig according to claim 1, wherein the surface of the frame and the front end surfaces of the plurality of support protrusions are arranged substantially the same.

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