JP2011049287A - Tape sticking auxiliary tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To cause neither breakage nor a fault of a device formed on a top surface side of a plate-like body when a tape is stuck on a reverse surface of the plate-like body. <P>SOLUTION: The tape sticking auxiliary tool 1 which supports the plate-like body 2 having, on a top surface, a structure region 20 where a structure is formed and an outer periphery excessive region 21 enclosing the structure region 20 when sticking the tape 3 on the reverse surface 2b of the plate-like body 2 is constituted of a support member 10 including a support surface 100 for supporting the outer peripheral excessive region 21 of the plate-like body 2 mounted with the reverse surface 2b up, and a plurality of projections 11 arranged and mounted at predetermined intervals on an outer peripheral edge of the support surface 100, wherein the support member 10 supports only the outer peripheral excessive region 21 of the plate-like body 2, and the structure region 20 is supported in the air. Further, the plurality of projections 11 restrict movement of the plate-like body 2, and prevent the tape 3 from being tightly stuck on the tape sticking auxiliary tool 1, thereby facilitating peeling of the tape 3 from the tape sticking auxiliary tool 1. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a tape sticking auxiliary jig used when sticking a tape such as a dicing tape on the back surface of a plate-like object.

  A plate-like object having a structure such as an IC, LSI, CMOS, CCD, or MEMS formed on the surface is divided into individual chips using a processing device such as a dicing device or a laser processing device. Widely used in various electric devices such as mobile phones and personal computers.

  When dividing the plate-like material into chips, in order to facilitate handling after the division, an acrylic or other adhesive is applied to the back surface of the plate-like material, for example, on a PO (polyolefin) or PVC (Polyvinyl chloride) substrate. The tape on which the layers are laminated is applied in advance. For attaching the tape to the back surface of the plate-like object, for example, a tape applicator disclosed in Patent Document 1 is used. As shown in Patent Document 1, in a tape applicator, a plate-like object is placed on a support base with the back surface of the plate-like object facing upward, and a tape is attached to the back surface of the plate-like object. To do. That is, the tape is attached to the plate-like object in a state where the support base of the tape applicator and the surface of the plate-like object are in contact.

JP-A H06-177243

  However, when the plate-like object is, for example, a MEMS wafer having a MEMS (Micro Electro Mechanical Systems) device on the surface, there is a problem that the MEMS device is damaged when the support base is brought into contact with the wafer surface. is there.

  In addition, when a device that causes device failure due to adhesion of foreign matter such as imaging devices such as CMOS (Complementary Metal Oxide Semiconductor) and CCD (Charge Coupled Device) or inkjet printers is formed on the surface of the plate-like object However, there is a problem in that foreign matters adhere to the surface of the plate-like object by bringing the support table and the wafer surface into contact with each other, causing a device failure.

  This invention is made | formed in view of the said fact, The subject is enabling tape sticking which does not cause a device damage and a device defect.

  The present invention relates to a tape sticking assist for supporting a plate-like object when sticking the tape to the back surface of the plate-like object having a structure region having a structure formed on the surface and an outer peripheral surplus region surrounding the structure region. Related to the jig, a support member including a support surface for supporting the outer peripheral surplus area of the plate-like object placed with the back side up, and a placement at a predetermined interval on the outer peripheral edge of the support surface And a plurality of protrusions for restricting the movement of the plate-like object.

  The support surface constituting the support member is desirably an inclined surface that is inclined downward from above toward the center of the plate-like object to be placed. The support member is preferably an annular frame.

  In the present invention, since the structure region is supported in a hollow state by supporting only the outer peripheral surplus region on the surface of the plate-like object by the support member, even when the plate-like object having the structure formed on the surface is supported. The tape can be attached to the back surface of the plate-like object without any foreign matter adhering to the structure or damage to the structure. Also, by providing a plurality of protrusions on the outer peripheral edge of the support surface, it is possible to restrict the plate-like object from moving in the radial direction and to prevent the tape from firmly sticking to the tape sticking auxiliary jig of the present invention. The peeling from the auxiliary jig can be facilitated.

  Further, since the support surface has an inclination toward the center of the plate-like object, the outer peripheral edge of the plate-like object is supported in a line contact state by the inclined surface. Therefore, even a plate-like object whose outer peripheral surplus area is a small area can be attached to the tape without supporting the structure area.

  Furthermore, by making the support member an annular frame, the tape sticking auxiliary jig can be reduced in size, and it can be easily carried and installed on the support base.

It is a top view which shows an example of a tape sticking auxiliary jig. It is the sectional view on the AA line of FIG. It is sectional drawing which expands and schematically shows a part of example of a plate-shaped object. It is a top view which shows the state which mounted the plate-shaped object in the tape sticking auxiliary jig. It is the BB sectional view taken on the line of FIG. It is sectional drawing which expands and shows a part of FIG. It is sectional drawing which shows the state which sticks a tape on the back surface of a plate-shaped object. It is sectional drawing which expands and shows a part of state in which the tape was affixed on the back surface of the plate-shaped object.

  A tape sticking auxiliary jig 1 shown in FIG. 1 is a jig that supports a plate-like object when sticking the tape to the plate-like object, and a support member 10 that supports the placed plate-like object from below. And a plurality of protrusions 11 protruding upward from the support member 10.

  The support member 10 in the illustrated example is an annular frame formed in an annular shape, and as shown in FIG. 2, the support surface 100 on which the plate-like object is placed is inclined downward toward the center. It is a surface. The support member 10 in the example of FIGS. 1 and 2 is formed in an annular shape having an opening 12 at the center, but may be formed in a concave shape having a bottom without opening the center, for example. . When the support member 10 is an annular frame, it can be downsized and can be easily carried.

  The plurality of protrusions 11 are formed so as to protrude upward from the outer peripheral end that is the top of the support surface 100. The protrusions 11 are formed at a predetermined interval and desirably formed at regular intervals, but it is not always necessary that the projections 11 be arranged at regular intervals.

  The plate-like object 2 shown in FIG. 3 has a structure area 20 in which a structure is formed on the surface 2a side, and an outer peripheral surplus area 21 is formed surrounding the structure area 20. No structure is formed on the back surface 2b. Examples of the plate-like object configured as described above include a MEMS wafer having a MEMS device in the structure area 20, a wafer having an imaging device such as CMOS or CCD in the structure area 20, and a printer for the structure area 20. There are wafers having an inkjet device.

  As shown in FIG. 4, the plate-like object 2 shown in FIG. 3 is placed on the support member 10. At this time, as shown in FIG. 5, the surface 2 a of the plate-like object 2 is supported by being in contact with the support surface 100 of the support member 10, and the back surface 2 b is exposed upward. If it does so, the outer periphery of the surface 2a of the plate-shaped object 2 will be supported in the state which line-contacted with the support surface 100 circularly. The support member 10 is formed with a plurality of protrusions 11, and the protrusions 11 are positioned on the outer peripheral side of the plate-like object 2, so that the movement of the plate-like object 2 in the radial direction is restricted by the protrusions 11 and stable. Supported by In addition, in FIG. 5, illustration of the structure area | region 20 is abbreviate | omitted.

  As shown in FIG. 6, the surface 2 a of the plate-like object 2 is supported by the support surface 100, but the peripheral portion of the surface 2 a is the outer peripheral surplus region 21, and the structure region 20 is formed on the support surface 100. Do not touch. Thus, only the outer peripheral surplus region 21 is supported in a contact state, and the structure region 20 is supported in a non-contact state. Further, since the surface 2a of the plate-like object 2 is supported in a line contact state, even the plate-like object whose outer peripheral surplus region 21 is a small region does not support the structure region 20 in a contact state.

  In the state in which the plate-like object 2 is supported in this manner, next, as shown in FIG. 7, the adhesive surface 3a of the tape 3 is lowered to face the back surface 2b of the plate-like object 2, and the tape is applied to the back surface 2b. 3 is pasted. At this time, by pressing a roller or the like from the non-adhesive surface 3 b of the tape 3 as necessary, the adhesive surface 3 a is firmly attached to the back surface 2 b of the plate-like object 2. At this time, since the protrusion 11 restricts the movement of the plate-like object 2 in the radial direction, the tape 3 can be reliably attached.

  In FIG. 7, the structure region 20 is not shown. In the example of FIG. 7, the ring frame 4 is previously attached to the peripheral portion of the adhesive surface 3 a of the tape 3, but the ring frame 4 is not attached to the tape 3 and the outer periphery of the plate-like object 2. The tape 3 may be attached to the ring frame 4 when the tape 3 is attached to the plate-like object 2.

  Since the tape 3 is pressed from above in this way, force is also applied to the plate-like object 2 from above. However, as shown in FIG. Since the structure region 20 is not in contact with the support surface 100 and is only supported in a hollow state, the structure formed in the structure region 20 is damaged or foreign matter is present in the structure. It can be prevented from adhering. For example, when a MEMS device is formed in the structure region 20, the MEMS device can be prevented from being damaged. When an imaging device or an inkjet device is formed in the structure region 20, the adhesion of foreign matters and As a result, it is possible to prevent device failure.

  As shown in FIG. 8, when the tape 3 is attached to the plate-like object 2, the adhesive surface 3 a of the tape 3 also contacts the support member 10, but the contact portion is a protrusion 11, Small contact area. Therefore, after the tape 3 is attached to the plate-like object 2, the tape 3 can be easily removed from the support jig 10 when the plate-like object 2 and the tape 3 are integrally removed from the tape application auxiliary jig 1. Can be peeled off.

DESCRIPTION OF SYMBOLS 1: Tape sticking holding jig 10: Support member 100: Support surface 11: Protrusion 12: Opening part 2: Plate-like object 2a: Front surface 2b: Back surface 20: Structure area 21: Peripheral surplus area 3: Tape 3a: Adhesive surface 3b: Non-adhesive surface 4: Frame

Claims (3)

A tape attaching auxiliary jig that supports the plate-like object when the tape is attached to the back surface of the plate-like object having a structure region having a structure formed on the surface and an outer peripheral surplus region surrounding the structure region. Because
A support member including a support surface that supports the outer peripheral surplus region of the plate-like object placed with the back side up;
A plurality of protrusions disposed at a predetermined interval on the outer peripheral end of the support surface and restricting movement of the plate-like object to be placed;
Tape sticking auxiliary jig equipped with. The support surface is an inclined surface that is inclined downward from above toward the center of the plate-like object to be placed.
The tape sticking auxiliary jig according to claim 1. The support member is an annular frame;
The tape sticking auxiliary jig according to claim 1 or 2.

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