JP2010147343A - Wafer support device and wafer support method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To lessen an exposed portion of a film when supporting a wafer. <P>SOLUTION: A wafer support device (30) which supports a wafer 20 in which a film (3) is adhered on the whole surface includes: a first tube member arranged at the circumference of a wafer (31); and a second tube member (32) arranged at the circumference of the first tube member. The film is bent to the first tube material side at the circumference of the first cylinder member, and is held between the first tube member and the second tube member, thereby to support the wafer. The second tube member may include a support member (33a) which extends into a radial direction interior and supports the end of the first tube member. Moreover, engagement parts (37, 38) which engage together may be provided to the outer circumference surface of the first tube member and the inner circumference surface of the second tube member. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a wafer support method for supporting a wafer and a wafer support for carrying out such a method.

  In the semiconductor manufacturing field, wafers tend to increase in size year by year, and the wafers are becoming thinner to increase the mounting density. In order to reduce the thickness of the wafer, so-called back grinding is performed to grind the back surface of the semiconductor wafer.

  FIG. 9 is a plan view of the wafer before back surface grinding. As shown in FIG. 9, the wafer 20 is positioned concentrically within the annular mount frame 36. And the surface protection film 3 is affixed on the surface 21 of the wafer 20, and, thereby, the wafer 20 and the mount frame 36 are integrated (note that the back surface 22 of the wafer 20 is shown in FIG. 9). I want to be) Thereby, even if it is a case where the thickness of a wafer falls after back surface grinding, the wafer 20 can be handled easily.

  By the way, when the wafer 20 is arranged so that the back surface 22 faces upward during back surface grinding, the wafer 20 and the mount frame 36 are positioned above the surface protection film 3. Since the thickness of the wafer 20 after the back surface grinding is usually smaller than the thickness of the mount frame 36, the grinding wheel may interfere with the mount frame 36 as the back surface grinding proceeds.

  For this reason, in Patent Document 1, the wafer is arranged such that the position of the mount frame 36 is lower than the back surface of the wafer 20. In this case, the grinding wheel does not interfere with the mount frame 36 during back surface grinding, and satisfactory back surface grinding is possible.

Patent Document 2 discloses that the wafer 20 is attached to one surface of a double-sided adhesive film (both surfaces have adhesiveness) and the mount frame 36 is attached to the other surface. In this case, since the double-sided adhesive film is positioned below the wafer 20 and the mount frame 36 is positioned below the wafer 20 during back surface grinding, the grinding wheel does not interfere with the mount frame 36.
Japanese Patent No. 3325650 JP 2002-270560 A

  In Patent Document 1 and Patent Document 2, a general mount frame 36 is used as shown in FIG. As can be seen from FIG. 9, the inner diameter of the mount frame 36 is sized much larger than the outer diameter of the wafer 20. In other words, the area of the exposed portion of the surface protection film 3 located between the wafer 20 and the mount frame 36 is also quite large. As a result, the expanding action, which is a subsequent process, is facilitated.

  In such a case, a large amount of the surface protection film 3 is required to integrate the wafer 20 and the mount frame 36. Since the surface protective film 3 is finally discarded, it is desired to reduce the amount of the surface protective film 3 used from an economical viewpoint.

  Moreover, when the area of the exposed part of the surface protective film 3 is large, there is a possibility that sludge generated during back surface grinding adheres to the exposed part of the surface protective film 3. Further, in recent years, the wafer 20 may be dry-etched after the back surface grinding step, and in such a case, a large amount of outgas is generated from the surface protective film 3.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a wafer support method capable of reducing the exposed portion of a film and a wafer support for carrying out such a method.

In order to achieve the above-described object, according to the first invention, in a wafer support for supporting a wafer having a film attached to one surface, a first cylinder member disposed around the wafer, and the first cylinder A second cylinder member disposed around the member, wherein the film is bent toward the first member around the first cylinder member, and between the first cylinder member and the second cylinder member. To provide a wafer support that supports the wafer.
According to the second invention, in the first invention, the inner diameter of the first cylindrical member is made larger than the outer diameter of the wafer.

  That is, in the first and second inventions, since the area of the exposed portion of the film is determined according to the distance between the first cylindrical member and the wafer, the exposed portion of the film can be reduced. For this reason, the amount of film used is small, sludge generated during backside grinding does not adhere to the exposed portion of the film, and a large amount of outgas can be prevented from being generated from the film during etching. Moreover, since a film is hold | maintained between a 1st cylinder member and a 2nd cylinder member, it is not necessary to use a double-sided adhesive film, Therefore, it can suppress that a manufacturing cost increases.

According to a third aspect, in the first or second aspect, the apparatus further includes a fixing portion that fixes the first cylindrical member and the second cylindrical member.
That is, in the third invention, the film can be held more firmly. The fixing portion is, for example, a pin inserted into a through hole formed in the first cylinder member and the second cylinder member, or a protrusion formed on the outer peripheral surface of the first cylinder member and the inner peripheral surface of the second cylinder member, respectively. And a groove.

According to a fourth invention, in any one of the first to third inventions, at least a part of an axial section of the first cylindrical member includes a first curved portion, and the axial direction of the second cylindrical member The cross section includes a second bending portion corresponding to the first bending portion of the first cylindrical member.
That is, in the fourth invention, the film can be held more firmly. The cross section in the axial direction of the bending portion may be S-shaped, C-shaped, or the like.

According to a fifth aspect, in any one of the first to fourth aspects, the second cylindrical member includes a support member that extends inward in the radial direction and supports the end of the first cylindrical member.
That is, in the fifth aspect, it is possible to prevent the first cylinder member from dropping out.

According to a sixth invention, in any one of the first to fifth inventions, the outer peripheral surface of the first cylindrical member and the inner peripheral surface of the second cylindrical member are provided with engaging portions that engage with each other. ing.
That is, in the sixth aspect, the film can be held more firmly. The engaging portion can be, for example, a plurality of concave and convex portions formed over the outer peripheral surface of the first cylindrical member and the inner peripheral surface of the second cylindrical member. Or the combination of the protrusion provided in the outer peripheral surface of the 1st cylinder member, and the groove | channel formed in the internal peripheral surface of the 2nd cylinder member may be sufficient as an engaging part.

  According to the seventh invention, in the wafer support method for supporting a wafer, the adhesive surface of the film is attached to one surface of the wafer, and the first cylindrical member is disposed around the wafer on the non-adhesive surface opposite to the adhesive surface. Arranging the second cylinder member around the first cylinder member on the adhesive surface of the film, and bending the second cylinder member around the first cylinder member toward the first cylinder member. Is moved toward the first cylinder member, and the film is held between the first cylinder member and the second cylinder member, thereby providing a wafer support method for supporting a wafer.

  According to an eighth aspect of the invention, in the wafer support method for supporting a wafer, the non-adhesive surface of the film is affixed to one end of a first cylindrical member having an inner diameter larger than the outer diameter of the wafer, and the non-adhesive surface of the film The second cylinder member is arranged around the first cylinder member on the adhesive surface opposite to the first cylinder member, and the second cylinder member is folded while bending the film around the first cylinder member toward the first cylinder member. Moving toward the first cylinder member, holding the film between the first cylinder member and the second cylinder member, and bonding the wafer to the adhesive surface of the film in the first cylinder member; Thereby, a wafer support method for supporting the wafer is provided.

  That is, in the seventh and eighth inventions, since the area of the exposed portion of the film is determined according to the distance between the first cylindrical member and the wafer, the exposed portion of the film can be reduced. For this reason, the amount of film used is small, sludge generated during backside grinding does not adhere to the exposed portion of the film, and a large amount of outgas can be prevented from being generated from the film during etching. Moreover, since a film is hold | maintained between a 1st cylinder member and a 2nd cylinder member, it is not necessary to use a double-sided adhesive film, Therefore, it can suppress that a manufacturing cost increases.

According to the ninth invention, in the seventh or eighth invention, the inner diameter of the first cylindrical member is made larger than the outer diameter of the wafer.
That is, in the ninth aspect, the film can be held more firmly. For example, it can be a pin inserted into the through hole of the first cylinder member and the second cylinder member, or a combination of a groove and a protrusion.

According to a tenth aspect, in the seventh or eighth aspect, the method further includes fixing the first cylindrical member and the second cylindrical member.
That is, in the tenth invention, the film can be held more firmly. The fixing portion is, for example, a pin inserted into a through hole formed in the first cylinder member and the second cylinder member, or a protrusion formed on the outer peripheral surface of the first cylinder member and the inner peripheral surface of the second cylinder member, respectively. And a groove.

Embodiments of the present invention will be described below with reference to the accompanying drawings. In the following drawings, the same members are denoted by the same reference numerals. In order to facilitate understanding, the scales of these drawings are appropriately changed.
FIG. 1 is a diagram showing a flow of processing in a wafer processing apparatus. As shown in FIG. 1, a wafer processing apparatus 100 includes a wafer support unit 110 that supports a wafer 20 with a wafer support 30 and a back grinding unit 120 that grinds a back surface 22 of the wafer 20 supported by the wafer support 30. And an etching unit 130 for etching the wafer after the back surface grinding.

  It is assumed that a circuit pattern (not shown) is already formed on the surface 21 of the wafer 20 processed by the wafer support unit 110. Such a wafer 20 is integrated with the wafer support 30 in the wafer support unit 110, and then the back surface 22 of the wafer 20 is ground in the back surface grinding unit 120. Thereafter, the wafer 20 is etched by the etching unit 130 by a known method.

  Hereinafter, the supporting process of the wafer 20 in the wafer supporting unit 110 will be described with reference to FIGS. 2 (a) to 2 (e). As shown in FIG. 2A, the wafer support unit 110 includes a table 10. As can be seen from FIG. 2 (a), a circular protrusion 12 corresponding to the outer shape of the wafer 20 is provided at the center of the table 10, and the wafer 20 is placed on the top surface 11 of the protrusion 12. The An annular groove 15 is formed around the protrusion 12 concentrically with the protrusion 12. As shown in the drawing, a second cylindrical member 32 (described later) of the wafer support 30 is inserted into the annular groove 15.

  First, the wafer 20 is placed on the top surface 11 of the table 10 so that the surface 21 of the wafer 20 faces upward. At this time, the back surface 22 of the wafer 20 is in contact with the top surface 11. Then, the wafer 20 is fixed to the top surface 11 of the table 10 by, for example, vacuum suction.

  Next, as shown in FIG. 2A, the surface protection film 3 is stuck to the surface 21 of the wafer 20 using the sticking roll 5. The surface protective film 3 is a single-sided adhesive film and includes an adhesive surface 3a and a non-adhesive surface 3b. For this reason, strictly speaking, the surface 21 of the wafer 20 is attached to the adhesive surface 3 a of the surface protective film 3. When the surface protective film 3 is attached, a circuit pattern (not shown) formed on the surface 21 of the wafer 20 is protected by the surface protective film 3.

  Next, as shown in FIG. 2B, the first cylindrical member 31 of the wafer support 30 is lowered from above the table 10 toward the wafer 20. The first cylinder member 31 is a cylinder made of metal, for example, stainless steel, and the height thereof is smaller than the diameter of the first cylinder member 31. Further, the inner diameter of the first cylindrical member 31 is slightly larger than the outer diameter of the wafer 20. In some embodiments, the inner diameter of the first cylindrical member 31 is 10% longer than the outer diameter of the wafer 20. Hereinafter, the first cylinder member 31 and the second cylinder member 32 may be collectively referred to as a wafer support 30 as appropriate.

  As shown in FIG. 2C, the lower end of the first cylindrical member 31 is placed concentrically with the wafer 20 on the non-adhesive surface 3 b of the surface protective film 3. And the 2nd cylinder member 32 in the annular groove part 15 is raised. In the illustrated embodiment, the second cylinder member 32 is formed of the same material as the first cylinder member 31, and the height and thickness of the second cylinder member 32 are the same as those of the first cylinder member 31. . However, you may use the 2nd cylinder member 32 of height and different thickness.

  As can be seen from FIG. 2C and the like, the inner diameter of the second cylinder member 32 is slightly larger than the outer diameter of the first cylinder member 31. The difference between the inner diameter of the second cylinder member 32 and the outer diameter of the first cylinder member 31 is a length suitable for gripping the surface protection film 3 and is smaller than the thickness of the surface protection film 3. preferable.

  When the second cylinder member 32 is raised, the upper end of the second cylinder member 32 adheres to the adhesive surface 3 a of the surface protective film 3 while the second cylinder member 32 is positioned around the first cylinder member 31. As can be seen from FIG. 2 (d), when the second cylinder member 32 is further raised, the surface protection film 3 is bent around the first cylinder member 31 toward the first cylinder member 31. Then, the second cylinder member 32 is raised until the lower end of the second cylinder member 32 is flush with the lower end of the first cylinder member 31. Thereby, the 1st cylinder member 31 and the 2nd cylinder member 32 mutually fit, and the surface protection film 3 comes to be hold | gripped between the 1st cylinder member 31 and the 2nd cylinder member 32 (FIG. 2). (See (e)).

  Thereafter, as shown in FIG. 2 (e), the surface protection film 3 extending from the upper ends of the first cylinder member 31 and the second cylinder member 32 is cut by the cutter 19. Finally, the fixing action of the wafer 20 is released, and the wafer 20 is removed from the table 10 together with the first cylinder member 31 and the second cylinder member 32.

  In the removed state, the surface protection film 3 is held between the first cylinder member 31 and the second cylinder member 32, while the wafer 20 is on one end side of the first cylinder member 31 and the second cylinder member 32. Attached to the surface protective film 3. That is, the wafer 20 is supported by being integrated with the wafer support 30 via the surface protection film 3. Therefore, in the present invention, handling of the wafer 20 can be facilitated in a subsequent process, for example, a back grinding process.

  In the present invention, the area of the exposed portion of the surface protection film 3 is determined according to the distance between the first cylindrical member 31 and the wafer 20. Therefore, the exposed part of the surface protection film 3 can be reduced, and as a result, the amount of the surface protection film 3 used can be reduced. Further, since the surface protective film 3 has a certain degree of elasticity, even if the surface protective film 3 is bent, wrinkles or the like do not occur in the exposed portion of the surface protective film 3.

  Moreover, since the surface protection film 3 is hold | gripped between the 1st cylinder member 31 and the 2nd cylinder member 32, if the surface protection film 3 is a single-sided adhesive film, it is enough. That is, in the present invention, it is not necessary to use the double-sided adhesive surface protective film 3, and therefore the manufacturing cost can be suppressed. In addition, when the adhesive force of the adhesive surface 3a of the surface protective film 3 is strong, you may exclude the 1st cylinder member 31 located inside. Even in such a case, the wafer 20 is integrated with the second cylindrical member 32 via the surface protective film 3, and therefore the same effect as described above can be obtained.

  FIGS. 3A to 3E are other views for explaining the wafer support process in the wafer support unit. As shown in these drawings, the wafer 20 may be supported by a wafer support 30.

  First, in FIG. 3A, the adhesive surface 3 a of the surface protective film 3 is pasted to one end of the second cylindrical member 32 using the pasting roll 5. Next, as shown in FIG. 3B, the first cylinder member 31 is placed on the non-adhesive surface 3 b of the surface protective film 3 so as to be concentric with the second cylinder member 32. Thereafter, in FIG. 3C, the surface protection film 3 extending from the upper ends of the first cylinder member 31 and the second cylinder member 32 is cut by the cutter 19. As a result, the entire adhesive surface 3 a of the surface protective film 3 is exposed at the one end side of the second cylindrical member 32.

  Next, the wafer 20 is attached to the adhesive surface 3 a of the surface protective film 3. As shown in FIG. 3 (d), the gas is supplied from the non-adhesive surface 3 b side of the surface protective film 3 using the gas supply means 40 to expand the surface protective film 3. Then, the wafer 20 is moved toward the first cylindrical member 31 while the surface protection film 3 is in contact with the surface 21 of the wafer 20, thereby attaching the wafer 20 to the surface protection film 3. Thereby, as shown in FIG. 3E, the surface protective film 3 can be attached to the entire wafer 20. Even in the case shown in FIGS. 3A to 3E, it will be understood that the same effect as described above can be obtained.

  2A to FIG. 2E and FIG. 3A to FIG. 3E, the lowering action of the first cylinder member 31, the raising action of the second cylinder member 32, and the surface protective film 3 The order of the cutting action may be changed as appropriate. Such a case is also included in the scope of the present invention.

  4 (a) to 4 (c) are partial cross-sectional views of a wafer support according to another embodiment. In the embodiment described with reference to FIG. 2, the heights of the first cylinder member 31 and the second cylinder member 32 of the wafer support 30 are equal to each other. However, as shown in FIG. The height of the member 31 may be smaller than the height of the second cylindrical member 32. Alternatively, the height of the first cylinder member 31 may be larger than the height of the second cylinder member 32.

  Further, in FIG. 4B, through holes 31 a and 32 a are formed on the peripheral surfaces of the first cylinder member 31 and the second cylinder member 32, respectively. Then, the surface protection film 3 is perforated by passing the pin 39 through the through holes 31a and 32a. Thereby, it will be understood that the surface protective film 3 can be held more firmly between the first cylinder member 31 and the second cylinder member 32. Moreover, the pin 39 may be inserted in each of the plurality of through holes 31a and 32a formed on the peripheral surfaces of the first cylinder member 31 and the second cylinder member 32, and the surface protection film 3 may be held more firmly. .

  Furthermore, in the embodiment shown in FIG. 4C, the second cylindrical member 32 has a flange 33 a extending radially inward from the lower end of the second cylindrical member 32, and upward from the inner end of the flange 33 a. And an extending portion 33b. In this case, as can be seen from FIG. 4C, one end of the first cylinder member 31 is inserted between the second cylinder member 32 and the extension portion 33b. In the embodiment shown in FIG. 4C, since the flange 33a exists, the first cylinder member 31 does not fall out. Therefore, the stability of the wafer support 30 can be improved.

  Further, as can be seen from FIG. 4C, the extension portion 33b may be curved outward in the radial direction, and the lower end of the first cylindrical member 31 may be curved inward in the radial direction corresponding to the extension portion 33b. In this case, when the second cylinder member 32 is moved toward the first cylinder member 31, the extension portion 33 b of the second cylinder member 32 and one end of the first cylinder member 31 are snap-engaged. Therefore, the surface protection film 3 can be held more firmly between the first cylinder member 31 and the second cylinder member 32.

  FIG. 5A to FIG. 5C are partial cross-sectional views of a wafer support according to still another embodiment. In Fig.5 (a), each axial direction cross section of the 1st cylinder member 31 and the 2nd cylinder member 32 is curving so that a C-shape may be made toward a radial direction outer side. Furthermore, in the embodiment shown in FIG. 5B, the axial section of the first cylindrical member 31 is S-shaped, and the axial section of the second cylindrical member 32 is C-shaped toward the inside. Is so curved.

  5A and 5B, the axial section of the second cylindrical member 32 is curved so as to correspond to at least a part of the axial section of the first cylindrical member 31. Even in such a case, when the second cylinder member 32 is moved toward the first cylinder member 31, the second cylinder member 32 snap-engages with the first cylinder member 31, and the same effect as described above. Is obtained.

  Furthermore, in the embodiment shown in FIG. 5C, the axial section of the first cylindrical member 31 is curved so as to form a C shape toward the inside in the radial direction. Further, the surface protection film 3 is sandwiched between the rubber band 32 ′ and the curved portion of the first cylindrical member 31 by the rubber band 32 ′. In such a case, it will be understood that the second cylindrical member 32 can be eliminated, and thus the surface protective film 3 can be firmly held with a relatively simple configuration.

  6A is a perspective view of a second cylindrical member according to still another embodiment, and FIG. 6B is a top view of the wafer support according to the embodiment shown in FIG. 6A. is there. In FIG. 6A, a substantially L-shaped groove 34 is formed on the inner peripheral surface of the second cylindrical member 32. The groove 34 includes an axial groove 34a partially extending in the axial direction from the end surface of the second cylindrical member 32, and a circumferential groove 34b connected to the axial groove 34a and partially extending in the circumferential direction. . It is preferable that at least two such grooves 34 formed on the inner peripheral surface of the second cylindrical member 32 are formed at equal intervals in the circumferential direction (in FIG. 6B, two grooves 34 are formed. Have been).

  On the other hand, as shown in FIG. 6B, a protrusion 35 that can be engaged with the groove 34 is formed on the outer peripheral surface of the first cylindrical member 31. In the embodiment shown in FIG. 6A and FIG. 6B, when the second cylinder member 32 is moved toward the first cylinder member 31, the protruding portion 35 of the first cylinder member 31 has the groove 34. Enter the axial groove 34a. And when the projection part 35 reaches | attains the edge part of the axial direction groove | channel 34a, the 2nd cylinder member 32 will rotate in the arrow direction of FIG.6 (b), and the projection part 35 of the 1st cylinder member 31 will become the circumferential direction groove | channel 34b. It comes to slide.

  Thereby, it will be understood that the surface protection film 3 can be held more firmly between the first cylinder member 31 and the second cylinder member 32. In other words, the protrusion 35 of the first cylinder member 31 and the groove 34 of the second cylinder member 32 serve as engaging portions. As a matter of course, the groove 34 may be formed in the first cylinder member 31, and the protrusion 35 may be provided in the second cylinder member 32.

  FIG. 7A is a partial top view of a wafer support according to yet another embodiment. In FIG. 7A, a plurality of convex portions 37 are formed on the outer peripheral surface of the first cylindrical member 31 in the circumferential direction. Furthermore, a plurality of concave portions 38 corresponding to the convex portions 37 are formed on the inner peripheral surface of the second cylindrical member 32 in the circumferential direction. The convex portion 37 and the concave portion 38 are part of the first cylindrical member 31 and the second cylindrical member 32, respectively.

  In this case, when the second cylindrical member 32 is moved toward the first cylindrical member 31, each of the concave portions 38 is engaged with each of the convex portions 37 via the surface protective film 3. For this reason, it will be understood that the surface protective film 3 can be more firmly held in the embodiment shown in FIG.

  Further, as shown in FIG. 7B, which is a view similar to FIG. 7A, protective films 37a and 38a are respectively provided on the outer peripheral surface of the first cylindrical member 31 and the inner peripheral surface of the second cylindrical member 32. It may be attached. When the second cylindrical member 32 is moved toward the first cylindrical member 31, the convex portion 37 and the concave portion 38 are not in direct contact with each other, and therefore, the convex portion 37 and the concave portion 38 can be prevented from being worn. As a result, in the embodiment shown in FIG. 7B, it is possible to prevent the wear pieces from adhering to the surface protective film 3.

  By the way, the wafer 20 integrated with the wafer support 30 in the wafer support unit 110 is transferred to the back grinding unit 120 (see FIG. 1). FIG. 8A is a cross-sectional view of the chuck table in the back grinding unit. As shown in FIG. 8A, the chuck table 50 mainly includes a frame 53 having a recess and a suction pad 51 that is fitted and supported in the recess of the frame 53. The suction pad 51 is made of a porous material such as porous alumina. The frame 53 is made of a solid material such as dense alumina.

  Further, as shown in FIG. 8A, a gap 55 is formed between the lower surface of the suction pad 51 and the frame body 53. Further, the central passage 56 extends from the center of the frame body 53 to the gap 55. The central passage 56 is connected to the vacuum means 60. When the vacuum means 60 is activated, a vacuum is applied to the upper surface of the suction pad 51.

  Further, as can be seen from FIG. 8A, an annular groove 59 is formed around the suction pad 51 on the upper surface of the frame 53. The width of the annular groove 59 is larger than the total thickness of the first cylinder member 31 and the second cylinder member 32 that hold the surface protective film 3. Further, the depth of the annular groove 59 is substantially equal to the height of the first cylinder member 31 and the second cylinder member 32. Further, the inner diameter of the annular groove 59 is slightly smaller than the inner diameter of the first cylindrical member 31.

  8B, when the wafer support 30 is inserted into the annular groove 59, the wafer 20 is placed on the suction pad 51 with the surface protective film 3 interposed therebetween. Become. When the vacuum means 60 is activated, a vacuum action acts on the surface protection film 3 through the central passage 56 and the suction pad 51, and the wafer 20 can be sucked and held.

  Next, the grinding wheel 41 is brought into contact with the wafer 20 while the grinding wheel 41 and the chuck table 50 are rotated in opposite directions, and the back surface 22 of the wafer 20 is ground. As can be seen from FIG. 8B, in the present invention, since the wafer support 30 is inserted into the annular groove 59, the wafer support 30 itself is always located below the wafer 20. For this reason, even when the thickness of the wafer 20 is reduced by the back surface grinding, the grinding wheel 41 does not interfere with the wafer support 30 and smooth back surface grinding can be performed. Furthermore, in the present invention, since the exposed portion of the surface protective film 3 may be relatively small, even if sludge is generated during back grinding, the sludge hardly adheres to the exposed portion of the film.

  When the back grinding process is completed, the wafer 20 is transferred from the back grinding unit 120 to the etching unit 130. In the etching unit 130, the wafer 20 is subjected to a dry plasma etching process together with the wafer support 30. Since the dry plasma etching process is performed under vacuum, outgas is generated from the exposed portion of the surface protective film 3.

  However, in the present invention, since the exposed portion of the surface protective film 3 is small, it is possible to suppress the amount of outgas generation. Finally, when the processing in the etching unit 130 is completed, the wafer 20 is transferred from the wafer processing apparatus 100 to a dicing unit (not shown), diced by a known method, and each chip is picked up from the surface protection film 3. become.

  As described above, according to the wafer support 30 of the present invention, the exposed portion of the surface protection film 3 can be reduced. As a result, the amount of film used can be reduced, and sludge generated during backside grinding is exposed to the exposed portion of the film. In addition, it is possible to prevent a large amount of outgas from being generated from the film during etching.

It is a figure which shows the flow of a process in a wafer processing apparatus. (A)-(e) It is a figure for demonstrating the support process of the wafer in a wafer support unit. (A)-(e) It is another figure for demonstrating the support process of the wafer in a wafer support unit. (A)-(c) It is a fragmentary sectional view of the wafer support based on other embodiment. (A)-(c) It is a fragmentary sectional view of the wafer support based on other embodiment. (A) It is a perspective view of the 2nd cylinder member based on other embodiment. (B) It is a top view of the wafer support based on embodiment shown by Fig.6 (a). (A) It is a partial top view of the wafer support based on another embodiment. (B) It is another partial top view of the wafer support based on embodiment shown by Fig.7 (a). (A) It is sectional drawing of the chuck table in a back surface grinding unit. (B) It is sectional drawing of the chuck table at the time of back surface grinding. It is a top view of the wafer before back surface grinding.

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Surface protective film 3a Adhesive surface 3b Non-adhesive surface 5 Sticking roll 10 Table 11 Top surface 12 Protrusion part 15 Annular groove part 19 Cutter 20 Wafer 21 Front surface 22 Back surface 30 Wafer support 31 First cylinder member 31a, 32a Through-hole 32 Second Cylindrical member 32 'Rubber band 33a Flange (supporting member)
33b Extension (support member)
34 Groove (engagement part)
34a Axial direction groove 34b Circumferential direction groove 35 Projection (engagement part)
36 Mount frame 37 Convex part (engagement part)
37a, 38a Protective film 38 Recess (engagement part)
39 pin (fixed part)
DESCRIPTION OF SYMBOLS 40 Gas supply means 41 Grinding wheel 50 Chuck table 51 Suction pad 53 Frame 55 Gap 56 Center passage 59 Annular groove 60 Vacuum means 100 Wafer processing apparatus 110 Wafer support unit 120 Back surface grinding unit 130 Etching unit

Claims (10)

In a wafer support that supports a wafer having a film attached to one side,
A first cylindrical member disposed around the wafer;
A second cylinder member disposed around the first cylinder member,
A wafer support that supports the wafer by bending the film around the first cylinder member toward the first member and holding the film between the first cylinder member and the second cylinder member.   The wafer support according to claim 1, wherein an inner diameter of the first cylindrical member is larger than an outer diameter of the wafer.   Furthermore, the wafer support tool of Claim 1 or 2 which comprises the fixing | fixed part which fixes said 1st cylinder member and said 2nd cylinder member.   At least a portion of the axial cross section of the first cylindrical member includes a first curved portion, and the axial cross section of the second cylindrical member is a second curved portion corresponding to the first curved portion of the first cylindrical member. The wafer support according to any one of claims 1 to 3, comprising:   4. The wafer support according to claim 1, wherein the second cylinder member includes a support member that extends radially inward and supports an end portion of the first cylinder member. 5.   4. The wafer support according to claim 1, wherein an engaging portion that engages with each other is provided on an outer peripheral surface of the first cylindrical member and an inner peripheral surface of the second cylindrical member. 5. In a wafer support method for supporting a wafer,
Paste the adhesive side of the film on one side of the wafer,
The first cylindrical member is arranged around the wafer on the non-adhesive surface opposite to the adhesive surface,
A second cylinder member is arranged around the first cylinder member on the adhesive surface of the film,
Moving the second cylinder member toward the first cylinder member while bending the film around the first cylinder member toward the first cylinder member;
A wafer support method for holding the film between the first cylinder member and the second cylinder member, thereby supporting the wafer. In a wafer support method for supporting a wafer,
Pasting the non-adhesive surface of the film to one end of the first cylinder member having an inner diameter larger than the outer diameter of the wafer,
The second cylinder member is arranged around the first cylinder member on the adhesive surface opposite to the non-adhesive surface of the film,
Moving the second cylinder member toward the first cylinder member while bending the film around the first cylinder member toward the first cylinder member;
Holding the film between the first cylinder member and the second cylinder member;
A wafer support method, wherein the wafer is attached to the adhesive surface of the film in the first cylindrical member, thereby supporting the wafer.   The wafer support method according to claim 7 or 8, wherein an inner diameter of the first cylindrical member is larger than an outer diameter of the wafer.   Furthermore, the wafer support method as described in any one of Claim 7 to 9 including fixing said 1st cylinder member and said 2nd cylinder member.

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