JP2010287587A - Support tool for semiconductor wafer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a support tool for a semiconductor wafer that reduces in weight and improve in productivity by sweeping away a risk of deformation of a holding frame when the holding frame is used for a heating process. <P>SOLUTION: The support tool detachably holds a peripheral edge of a heat-resisting elastomer layer 3 holding the semiconductor wafer W, between an inner holding frame 1 and an outer holding frame 2 engaging each other, and is used at least for the heating processing. In the support tool, the inner holding frame 1 and outer holding frame 2 are respectively injection-molded using resin-containing molded materials having a load bending temperature of ≥300°C in ASTM D648 of the ASTM standards and a bending strength of ≥120 MPa in ASTM D790. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a support jig for a semiconductor wafer that holds a semiconductor wafer and is used in at least various heating processes.

  Although not shown, a conventional support jig for a semiconductor wafer includes a grip ring that is injection-molded with a predetermined molding material, and a heat-resistant elastomer layer that covers the hollow is covered on the periphery of the grip ring. The semiconductor wafer is detachably adhered and held on the elastomer layer (see Patent Document 1).

  The predetermined molding material of the grip ring is prepared by mixing and dispersing glass fibers in polycarbonate or ABS resin by a chopped method or a milled method. The elastomer layer is formed into a flexible thin film using an elastomer such as silicone rubber or fluororubber so that it can withstand a heating temperature of about 250 ° C. in consideration of the heating temperature of a general heating process. .

  Such a support jig is used in various processes at room temperature with the semiconductor wafer detachably attached to the elastomer layer, or used in a heating process consisting of a process of curing a die attach material, a solder reflow process, etc. Alternatively, the elastomer layer is expanded by being set in an expanding apparatus.

JP 2001-118870 A

  Conventional support jigs for semiconductor wafers are configured as described above, and the grip ring is molded from a predetermined molding material containing resin, so there is no problem when used at room temperature, but solder reflow When used in a heating process such as a process, the grip ring is deformed. As a result, the elastomer layer may be detached from the grip ring or the semiconductor wafer may fall off.

  As a means for solving such a problem, there is a method of cutting the grip ring using a metal such as aluminum or stainless steel. In this method, the weight of the grip ring is increased. When the support jig is set on the belt conveyor of the reflow device, the belt conveyor stops due to the weight of the grip ring, or the conveyor speed of the belt conveyor decreases and the predetermined reflow conditions are not satisfied, resulting in a decrease in productivity. Will be newly generated.

  The present invention has been made in view of the above. A support jig for a semiconductor wafer that can eliminate the risk of deformation of a holding frame when used in a heating process and can reduce the weight to improve productivity. It is intended to provide.

In the present invention, in order to solve the above-mentioned problem, a heat-resistant elastomer layer for holding a semiconductor wafer is detachably sandwiched between an inner holding frame and an outer holding frame that are fitted to each other, and used at least in a heating process. Which is
The inner holding frame and the outer holding frame were molded using resin-containing molding materials having a load deflection temperature of about 300 ° C. or higher in ASTM standard ASTM D648 and a bending strength of 120 MPa or higher in ASTM D790, respectively. It is a feature.
In addition, the molding material of an inner holding frame and an outer holding frame can be prepared by mixing glass fiber with a liquid crystalline wholly aromatic polyester resin.

  Here, the inner holding frame and the outer holding frame in the claims can be a flat ring shape, a frame shape, or the like. The semiconductor wafer is not particularly limited to a φ200, 300, 450 mm type or the like, and is mainly a planar circle, but may be a rectangle or a polygon as long as it does not cause a problem such as dropping off of the elastomer layer. Furthermore, the elastomer layer may be transparent, opaque, or translucent.

  According to the present invention, when used in the heating process, there is an effect that the inner holding frame and the outer holding frame, which are holding frames, can be wiped out, the weight can be reduced, and productivity can be improved. .

It is explanatory drawing which shows typically the solder reflow apparatus etc. in embodiment of the support jig for semiconductor wafers concerning this invention. It is a section explanatory view showing typically an embodiment of a support jig for semiconductor wafers concerning the present invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. A support jig for a semiconductor wafer in the present embodiment is an internal holding which is a holding frame that fits together as shown in FIG. 1 and FIG. A frame 1 and an outer holding frame 2 are provided, and a heat-resistant elastomer layer 3 holding a thin semiconductor wafer W is sandwiched between the inner holding frame 1 and the outer holding frame 2 in a tension state, and at least a solder reflow apparatus 10 is used in the heating step.

  The inner holding frame 1 and the outer holding frame 2 have an ASTM (American Society for Testing and Materials) standard ASTM D648 load bending temperature of 300 ° C. or higher, and a bending strength of ASTM D790 of 120 MPa or higher. Each resin-containing molding material is injection-molded into a flat ring shape, and the outer holding frame 2 is detachably fitted to the outer side of the inner holding frame 1.

  The specific molding material for the inner holding frame 1 and the outer holding frame 2 is such that glass fibers are mixed and dispersed in, for example, molten liquid crystalline wholly aromatic polyester resin so that excellent heat resistance and light weight can be obtained. To prepare a compound and fill the molding machine (not shown) for injection molding the inner holding frame 1 or the outer holding frame 2.

  The semiconductor wafer W is not particularly limited. For example, the semiconductor wafer W is made of a φ300 mm type silicon wafer, a circuit pattern is formed on the front surface, the back surface is back-ground, a step of curing the die attach material, solder paste After printing, the solder paste is subjected to a solder reflow process or the like for melting and re-solidifying the fine solder particles of the solder paste into a solder lump.

  The elastomer layer 3 is formed into a flexible round thin film using an elastomer such as silicone rubber or fluorine rubber that can withstand a heating temperature of about 250 ° C., and a peripheral edge between the inner holding frame 1 and the outer holding frame 2. The part is detachably held, and the back surface of the thin and easily bent semiconductor wafer W is adhered and held.

  In the above configuration, when the semiconductor wafer W is held by the support jig and set in the solder reflow apparatus 10, the elastomer layer 3 holding the semiconductor wafer W is interposed between the inner holding frame 1 and the outer holding frame 2. If the excess portion that is pinched in a tension state and cut off is cut, the semiconductor wafer W can be held on the support jig, and various processes can be performed on the semiconductor wafer W at room temperature.

  Further, if a support jig is set on the belt conveyor of the solder reflow apparatus 10, the support jig is conveyed to a heating furnace heated at about 250 ° C. by the belt conveyor and printed on the surface of the semiconductor wafer W. The fine solder particles of the solder paste are melted and re-solidified into a solder lump.

  According to the above configuration, the inner holding frame 1 and the outer holding frame 2 of the support jig are molded with a molding material having a load deflection temperature in ASTM D648 of 300 ° C. or higher and a bending strength in ASTM D790 of 120 MPa or higher. Excellent heat resistance and strength can be obtained, and the inner holding frame 1 and the outer holding frame 2 are not deformed even when used in a heating process such as a solder reflow process. Therefore, there is no possibility that the elastomer layer 3 comes off from the inner holding frame 1 and the outer holding frame 2 or the semiconductor wafer W falls off.

  Moreover, since it is not necessary to process the inner holding frame 1 and the outer holding frame 2 with metal, it is possible to effectively suppress an increase in weight of the inner holding frame 1 and the outer holding frame 2 and to reduce manufacturing costs. . Therefore, even if the support jig is set on the belt conveyor of the solder reflow apparatus 10, there is no possibility that the belt conveyor stops or is delayed by the weight of the support jig. Further, it is possible to prevent the productivity of the belt conveyor from being lowered because the conveying speed of the belt conveyor is lowered and the predetermined reflow condition is not satisfied.

  Next, an example of a support jig for a semiconductor wafer according to the present invention will be described together with a comparative example.

  First, in order to form the inner holding frame and the outer holding frame of the support jig, glass fiber is mixed and dispersed in the molten liquid crystalline wholly aromatic polyester resin, so that the load deflection temperature in ASTM D648 is 338 ° C. and ASTM A compound A having a bending strength of 126 MPa at D790 was prepared, and the inner holding frame and the outer holding frame were each injection-molded with this compound A.

  When the inner holding frame and the outer holding frame are injection molded in this way, the elastomer layer is sandwiched between the inner holding frame and the outer holding frame in a tension state, and the protruding excess portion is cut off at 250 ° C. The samples were left in a heat-resistant environment for 10 minutes to observe deformation and dropping off of the elastomer layer.

  First, in order to mold the inner holding frame and the outer holding frame of the support jig, glass fiber is mixed and dispersed in the molten liquid crystalline wholly aromatic polyester resin, whereby the load deflection temperature in ASTM D648 is 312 ° C. and ASTM Compound B having a bending strength of 138 MPa at D790 was prepared, and the inner holding frame and the outer holding frame were each injection-molded with this compound B.

  When the inner holding frame and the outer holding frame are injection molded in this way, the elastomer layer is sandwiched between the inner holding frame and the outer holding frame in a tension state, and the protruding excess portion is cut off at 250 ° C. The samples were left in a heat-resistant environment for 10 minutes to observe deformation and dropping off of the elastomer layer.

Comparative Example 1

  First, in order to mold the inner holding frame and the outer holding frame of the support jig, glass fiber is mixed and dispersed in the molten liquid crystalline wholly aromatic polyester resin, so that the load deflection temperature in ASTM D648 is 275 ° C. and ASTM Compound C having a bending strength of 140 MPa at D790 was prepared, and the inner holding frame and the outer holding frame were each injection-molded by this compound C.

  When the inner holding frame and the outer holding frame are injection-molded, the elastomer layer is sandwiched between the inner holding frame and the outer holding frame in a tensioned state, and the excess portion that protrudes is cut, and the heat resistance at 250 ° C. The samples were left in the environment for 10 minutes to observe deformation and dropping of the elastomer layer. The results are summarized in Table 1.

Comparative Example 2

  Load molding in ASTM D648 by mixing and dispersing glass fiber in nylon 9T resin prepared with nonanediamine (diamine having 9 carbon atoms) and terephthalic acid to form the inner holding frame and the outer holding frame of the support jig. A compound D having a temperature of 290 ° C. and a bending strength of 210 MPa according to ASTM D790 was prepared, and the inner holding frame and the outer holding frame were respectively injection molded by this compound D. The other parts were the same as in Comparative Example 1, and the results are shown in Table 1.

Comparative Example 3

  In order to mold the inner holding frame and the outer holding frame of the support jig, glass load is mixed and dispersed in the molten liquid crystalline wholly aromatic polyester resin so that the load deflection temperature in ASTM D648 is 350 ° C. and in ASTM D790. A compound E having a bending strength of 93 MPa was prepared, and the inner holding frame and the outer holding frame were each injection-molded with the compound E. The other parts were the same as in Comparative Example 1, and the results are shown in Table 1.

As is clear from Table 1, in the case of Examples 1 and 2, the inner holding frame and the outer holding frame were appropriately fitted without deformation, and the elastomer layer did not fall off.
On the other hand, in Comparative Examples 1, 2, and 3, the inner holding frame and the outer holding frame were deformed, or the elastomer layer was loosened and dropped off.

DESCRIPTION OF SYMBOLS 1 Inner holding frame 2 Outer holding frame 3 Elastomer layer 10 Solder reflow apparatus W Semiconductor wafer

Claims (2)

A heat-resistant elastomer layer for holding a semiconductor wafer is detachably sandwiched between an inner holding frame and an outer holding frame that are fitted to each other. And
The inner holding frame and the outer holding frame were molded using resin-containing molding materials having a load deflection temperature of about 300 ° C. or higher in ASTM standard ASTM D648 and a bending strength of 120 MPa or higher in ASTM D790, respectively. A support jig for semiconductor wafers.   The support jig for a semiconductor wafer according to claim 1, wherein the molding material for the inner holding frame and the outer holding frame is prepared by mixing glass fiber with liquid crystalline wholly aromatic polyester resin.

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