JP2015122461A - Film fixed type carrier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier having an outer frame and an inner frame holding an adhesive film in a state in which the adhesive film is stuck thereto which facilitates mutual attachment/detachment of the outer frame and the inner frame and attachment/detachment of the adhesive film, and facilitates installation of the adhesive film and surely holds and sticks the adhesive film even when a thickness of the adhesive film changes.SOLUTION: There is provided a film fixed type carrier in which an inner frame 8 is freely fitted into an opening 22 formed on an outer frame 2, and a spring part 91 pressing an adhesive film 10 against the outer frame 2 is provided on an outside part 81 of the inner frame 8.

Description

  The present invention is a carrier having an outer frame and an inner frame, the outer frame and the inner frame are fitted, the adhesive film is sandwiched between the outer frame and the inner frame, the adhesive film is fixed, and the adhesive film is placed on the adhesive film. The present invention relates to a carrier for holding a bonded silicon wafer, IC chip or the like.

  Conventionally, an adhesive film and a grip ring have been used to hold a silicon wafer or an IC chip in a process of transporting, storing, or manufacturing a silicon wafer or an IC chip (see, for example, Patent Document 1). This adhesive film is a stretchable film made of elastomer or synthetic resin, has an adhesive layer on one side, and can hold and hold a silicon wafer or IC chip on the adhesive layer.

  The grip ring has a double ring structure composed of an outer ring and an inner ring. Each of the outer ring and the inner ring is a ring-shaped member having a rectangular cross section. The diameters are substantially equal. And the state where the film was stretched by making the outer surface of the inner ring face the inner surface of the outer ring, fitting the inner ring to the outer ring, and sandwiching a stretchable film between the inner ring and the outer ring It can be held by.

  Then, the adhesive film is held in a state of being stretched with a grip ring, and a silicon wafer or IC chip is stuck on the adhesive film to hold the silicon wafer or IC chip. Further, since the silicon wafer is held by the grip ring and used for the manufacturing process of the IC chip, the grip ring is fitted into the holding frame and used.

JP 2010-34435 A

  However, the conventional synthetic resin grip ring has an inner ring and an outer ring to hold the film stretched between the inner ring and the outer ring without using other members. The ring is formed in a fitting shape, and no gap is formed between the inner ring and the outer ring. In addition, the grip ring and the plate-like holding frame that holds the grip ring are also fixed to each other without using other members, and a gap is formed between the outer ring of the grip ring and the holding frame. It has not been.

  And because of the shape and structure in which there is no play in the places where they fit, the outer ring and inner ring, the grip ring and the holding frame of the grip ring are not easily attached to and detached from each other and the adhesive film. In addition, there is a problem that it is easily damaged when attaching and detaching the adhesive film.

  Also, for the same reason, it is not possible to cope with the change in the thickness of the adhesive film that is sandwiched and held, and when the thickness of the adhesive film changes thinly, the adhesive film cannot be securely held and tensioned, When the thickness of the pressure-sensitive adhesive film is changed, it is difficult to install the pressure-sensitive adhesive film, and the outer ring and the inner ring are easily damaged.

  Further, the grip ring holding the silicon wafer or the IC chip is exposed to a high temperature in the manufacturing process of the IC chip, for example, the soldering process of the electrode, and the inner ring expands by heating, and a tensile force is applied to the outer ring. The ring could break. And since the outer ring is damaged in this way, it is impossible to hold an object to be held such as a silicon wafer or an IC chip.

  Accordingly, an object of the present invention is to facilitate the mutual attachment and detachment of the outer frame and the inner frame and the attachment and detachment of the adhesive film in the carrier that is held in a state where the adhesive film is held between the outer frame and the inner frame.

  It is another object of the present invention to prevent the outer frame and the inner frame from being damaged when they are attached to and detached from each other, when the adhesive film is attached and detached, and during other uses.

  Furthermore, it can respond to changes in the thickness of the pressure-sensitive adhesive film that is sandwiched and held, and even when the thickness of the pressure-sensitive adhesive film changes, it is easy to install the pressure-sensitive adhesive film and securely hold and tension the pressure-sensitive adhesive film. For the purpose.

  The present invention as means for solving the above-mentioned problems is a film-fixed carrier that holds an adhesive film between an outer frame and an inner frame, and holds the inner frame in an opening formed in the outer frame. Is a film-fixed carrier characterized in that it is configured to be fitted, and is provided with a spring portion on the outer side of the inner frame or / and on the inner peripheral surface of the outer frame.

  In the film fixed carrier, the spring portion is compressed at least when the adhesive film is placed between the outer frame and the inner frame.

  In addition, in the film fixed carrier, when the spring portion is flat when the inner frame is fitted into the outer frame without installing an adhesive film, the outer frame and / or the inner frame facing the spring portion A film-fixed type carrier characterized by being formed so as to be in contact with each other or to be positioned at an interval less than the thickness of the adhesive film and the outer frame or / and the inner frame facing the spring portion. It is.

  Further, in the film fixed carrier, the spring portion includes a plurality of vertical grooves formed on the lower surface of the inner frame and extending around the inner frame, and a plurality of springs reaching the vertical groove from the outer surface and the lower surface of the inner frame. A plurality of lateral grooves are formed on the outer side of the inner frame.

  In the film-fixed carrier, the spring portion includes a plurality of vertical grooves formed on the upper surface of the inner frame and extending around the inner frame, and a plurality of springs reaching the vertical groove from the outer surface and the upper surface of the inner frame. A plurality of lateral grooves are formed on the outer side of the inner frame.

  In the above-mentioned film fixed type carrier, the spring portion is formed only by a plurality of lateral grooves formed in the diameter direction of the inner frame from the outer surface.

  In the film fixed carrier, the spring portion is formed by a plurality of lateral grooves formed in a direction intersecting with the diameter direction of the inner frame from the outer surface. .

  In the above-mentioned film fixed type carrier, the spring portion is formed by a longitudinal groove formed around the inner frame from the upper surface to the lower surface of the inner frame or from the lower surface to the upper surface. A film-fixed carrier characterized by the following.

  Further, in the above-mentioned film fixed type carrier, the lateral groove is formed at equal intervals in the circumferential direction of the inner frame.

  Further, in the film fixed carrier, a concave portion is formed on the inner peripheral surface of the outer frame, and a convex portion protruding outward is formed on the outer surface of the inner frame. The outer frame and the inner frame At the time of fitting, the concave portion of the outer frame and the convex portion of the inner frame are not fitted, and the adhesive film to be held is held at two points in a longitudinal sectional view of the convex portion and the upper and lower ends of the concave portion, The convex portion is a film-fixed type carrier formed on the spring portion.

  According to the present invention as described above, in the carrier that is held between the outer frame and the inner frame and the adhesive film is stretched, the outer frame and the inner frame can be easily attached to and detached from each other and the adhesive film can be easily attached and detached. It has become possible.

  In addition, it is possible to make it difficult to break when the outer frame and the inner frame are attached to and detached from each other, when the adhesive film is attached and detached, and when used.

  Also, it can cope with changes in the thickness of the pressure-sensitive adhesive film that is sandwiched and held, and even when the thickness of the pressure-sensitive adhesive film changes, the pressure-sensitive adhesive film can be easily installed and securely held and tensioned. It became possible.

The perspective view of one Example of this invention carrier Usage plan view of an embodiment of the carrier of the present invention The exploded perspective view of one example of the career of the present invention Bottom view of one embodiment of inner frame 2A-A sectional view Partially enlarged sectional view of FIG. Second embodiment of the carrier of the present invention partially enlarged sectional view Usage plan of the third embodiment of the carrier of the present invention 8B-B sectional view Usage plan view of the fourth embodiment of the carrier of the present invention 10C-C sectional view Top view of the inner frame example 12D-D sectional view Top view of the inner frame example 14E-E sectional view Top view of the inner frame example 16F-F sectional view Top view of the inner frame example 18G-G sectional view Top view of the inner frame example Sectional view of the fifth embodiment of the carrier of the present invention in use

  Embodiments of the present invention will be described below with reference to the drawings. The present invention is a film-fixed type carrier that maintains an adhesive film in a stretched state and holds an object to be held on the adhesive film and holds the inner frame in an opening formed in the outer frame. It is comprised and is provided with the spring part in the outer peripheral part of the inner frame or / and the inner peripheral surface part of the outer frame. Hereinafter, an embodiment in which a spring portion is formed on the outer side of the inner frame will be described as an example.

  As shown in FIGS. 1 to 3, the carrier 1 includes an outer frame 2 and an inner frame 8, and an opening 22 formed in the outer frame 2 with an adhesive film 10 sandwiched between the outer frame 2 and the inner frame 8. The inner frame 8 includes a spring portion 91 that is compressed when the adhesive film 10 is placed at least between the outer frame 2 and the inner frame 8.

The range of use of the carrier 1 is not particularly limited. The manufacturing process of the IC chip, the storage and transportation of electronic components, the inspection of various components including electronic components, the investigation of living things, the counting of dust, the observation of bacteria, the bacterial culture Observation, evaluation of pollen and dust, storage of micromachines, etc. Accordingly, the object to be held held by the carrier 1 will be described by taking a silicon wafer as an example in the following embodiments, but is not particularly limited. In addition to the silicon wafer, an IC chip, an electronic component, other components, a living thing, Other items are included.

  The material of the outer frame 2 and the inner frame 8 is not particularly limited, but synthetic resin is preferably used, and particularly when the carrier 1 is used in the IC chip manufacturing process, the IC chip manufacturing process, for example, soldering of electrodes In the process, a synthetic resin having a required heat-resistant temperature is preferable. As a specific example, when heat resistance is not required, PPS or the like having low bending resistance but high bending strength may be used. When heat resistance is required, 150 ° C. or more, preferably 200 ° C. A synthetic resin having the above heat resistance is desirable. For example, LCP may be used.

  The outer frame 2 is provided with a side wall 4 extending upward from the outer peripheral end of the upper surface 31 of the flat base 3 having a square shape in plan view. Further, a leg portion 5 is provided extending downward and outward from the lower outer peripheral end of the outer surface 34 of the base portion 3 over the outer periphery. The base 3 is formed with a circular opening 22 in a plan view through which the inner frame 8 is fitted so as to penetrate the base 3. A protrusion 61 extending inward of the opening 22 is formed at the upper end of the inner peripheral surface 6 of the outer frame 2 formed by the opening 22 so as to extend around the periphery of the opening 22. A concave portion 63 having a rectangular vertical cross section is formed in the middle portion over the periphery of the opening 22.

  As shown in FIGS. 1 to 5, the inner frame 8 is an annular body having a circular inner side and outer side in a plan view, and has a size and shape that can be fitted into the opening 22 formed in the outer frame 2. Is formed. Further, the inner frame 8 is configured by including a spring portion 91 on the outer side portion 81. The spring portion 91 is formed so as to be movable inward and outward of the inner frame 8, and is compressed when the adhesive film 10 is placed between the outer frame 2 and the inner frame 8, so that the outer frame 2 and the inner frame 8 are compressed. It has the effect | action which presses the adhesive film 10 pinched | interposed on the outer frame 2. FIG.

When the inner frame 8 is flat without the adhesive film 10 being installed, the inner peripheral surface 6 of the outer frame 2 and the outer surface 89 of the inner frame 8 are opposed to each other. The thickness of the pressure-sensitive adhesive film 10 so that at least one part is in contact with the inner peripheral surface 6 of the outer frame 2 facing the spring portion 91, or at least one part of the spring portion 91 is sandwiched between the inner peripheral surface 6 of the outer frame 2. It is formed so as to be positioned with an interval of less than that.

That is, the diameter of the spring portion of the outer surface 89 of the inner frame 8 is longer than the diameter of the inner peripheral surface 6 of the outer frame 2 or shorter than the diameter of the inner peripheral surface 6 of the outer frame 2. Thus, the length is less than twice the thickness of the film sandwiched between the differences.

  In the embodiment shown in FIGS. 3 to 6, the inner frame 8 is formed such that the diameter of the outer surface 89 is longer than the diameter of the inner peripheral surface 6 of the outer frame 2. A part of the outer portion 81 of the inner frame 8 is divided into a plurality of portions in the circumferential direction by the lateral grooves 85, and a plurality of spring portions 91 that can move inward and outward of the inner frame 8 are formed. Specifically, the spring portion 91 includes an annular vertical groove 84 formed from the lower surface 87 of the main body 80 of the inner frame 8 toward the upper surface 83 and around the inner frame 8, and a vertical groove formed from the outer surface 89 and the lower surface 87. A plurality of transverse grooves 85 formed in the diameter direction of the inner frame 8 reaching 84 are formed on the outer portion 81 of the inner frame 8.

The lateral grooves 85 are preferably formed at equal intervals in the circumferential direction. This is because, by adopting such a configuration, the inner frame 8 can be uniformly contracted and expanded in the circumferential direction, and the adhesive film 10 can be uniformly stretched and held. Further, the number of spring portions 91 formed is not particularly limited, and may be formed so as to have a predetermined flexibility and repulsive force depending on the size and material of the inner frame 8. A configuration in which only one lateral groove 85 is formed on the circumference and only one spring portion is formed may be employed.

Further, the height P of the longitudinal groove 84 is not particularly limited, but it is preferable to set the height to 1/2 or more of the height of the inner frame 8 so that the spring portion is easily bent. Moreover, the height R1 of the horizontal groove 85 is formed to be the same as the height P of the vertical groove 84, but the height of the horizontal groove 85 is not limited to the same as the height P of the vertical groove 84, as shown in FIG. The height of the equal horizontal groove 85 and the height of the vertical groove 84 may be different from each other so that the height R <b> 2 of the horizontal groove 85 is the same as the height of the inner frame 8.

  A stepped portion 88 is formed over the outer periphery of the outer portion 81 of the inner frame 8, and corresponds to the concave portion 63 of the outer frame 2 on the spring portion 91, which is an intermediate portion of the outer portion 81. A convex portion 82 having an arcuate longitudinal section projecting outward at a position is formed around the inner frame 8. The convex portion 82 is the outermost surface of the inner frame 8, and the diameter of the convex portion 82 is the diameter of the outer surface 89 of the inner frame 8. Further, the height L of the convex portion 82 is formed to be not less than the height H of the concave portion 63 of the outer frame 2.

With such a configuration, when the inner film 8 is fitted into the outer frame 2 with the adhesive film 10 sandwiched therebetween, the convex portion 82 abuts on the inner peripheral surface 6 of the outer frame 2 and the spring portion 91 is 8 is moved inward and partly enters the longitudinal groove 84 and is compressed, and when the outer frame 2 and the inner frame 8 are fitted, the spring portion 91 moves outward of the inner frame 8 by a repulsive force. 8 is inserted into the recess 63 of the outer frame 2, and the recess 63 of the outer frame 2 and the protrusion 82 of the inner frame 8 do not completely fit together. 82 and the upper end 631 and the lower end 632 of the recess 63 are pressed at two points in a longitudinal sectional view, and are sandwiched and held between the outer frame 2 and the inner frame 8.

  Thus, since the adhesive film 10 is pressed and fixed to the outer frame 2 by the spring portion 91, it is possible to cope with the difference in thickness of the adhesive film 10 to be sandwiched, and to securely hold the adhesive film 10. ing. In addition, the outer frame 2 and the inner frame 8 can be easily attached to and detached from each other and the adhesive film 10 can be easily attached and detached, and the carrier 1 can be prevented from being damaged.

  Further, by pressing the adhesive film 10 to the carrier 1 at two points in the longitudinal section in the spring portion 91 and fixing it, the displacement of the adhesive film 10 and the method of fixing at one point, three points or more, or the surface are reduced. The loosening can be suppressed and the carrier 1 can be firmly fixed. At the same time, a part of the convex portion 82 of the inner frame 8 is inserted into the concave portion 63 of the outer frame 2 so that the coupling strength between the outer frame 2 and the inner frame 8 can be increased. In order to prevent damage to the adhesive film 10, it is preferable to chamfer the corners of the upper end 631 and the lower end 632 of the recess 63 of the outer frame 2.

  Thus, the inner diameter of the opening 22 formed in the outer frame 2 and the outer diameter of the inner frame 8 are substantially equal, and the inner frame 8 is fitted inside the outer frame 2 via the adhesive film 10 and fixed integrally. Carrier 1 is formed. As a specific example of the usage mode of the carrier 1, as shown in FIGS. 2, 3, and 5, an inner frame 8 is fitted into the outer frame 2, and an adhesive layer is provided on the upper surface between the outer frame 2 and the inner frame 8. By holding the adhesive film 10 having elasticity while holding it, the adhesive film 10 is held in a stretched state, and a silicon wafer 11 as an example of an object to be held attached on the adhesive film 10 is held.

  As shown in the cross-sectional views of FIGS. 5 and 6, when the adhesive film 10 is installed on the carrier 1, the adhesive film 10 is positioned between the outer frame 2 and the inner frame 8 as shown in FIG. The frame 8 is inserted into the opening 22 of the outer frame 2, and when the outer frame 2 and the inner frame 8 are fitted, the protrusion 61 of the outer frame 2 is inserted and positioned in the step portion 88 of the inner frame 8, and adhesive The film 10 can be stretched without loosening by being sandwiched between the protrusion 61 of the outer frame 2 and the step portion 88 of the inner frame 8. For the reason that the inner frame 8 can be inserted into the opening 22 from the upper side of the outer frame 2, the protrusion of the opening 22 of the outer frame 2 and the step of the inner frame 8 may not be formed. Good.

  A plurality of carriers 1 can also be used for storage, transportation, etc. by stacking a plurality of carriers 1 in the vertical direction. When overlapping in the vertical direction, the upper end 41 of the side wall 4 of the lower outer frame 2 abuts on the lower surface 33 of the upper outer frame 2 to support the upper outer frame 2. At the same time, the side wall portion 4 of the lower outer frame 2 is inserted inside the leg portion 5 of the upper outer frame 2, and the outer surface 42 of the lower side wall portion 4 faces the inner side surface 51 of the upper leg portion 5, The lower side wall part 4 and the upper leg part 5 restrict the movement in the lateral direction, so that the lower outer frame 2 and the upper outer frame 2 do not deviate from each other.

  The manufacturing method of the outer frame 2 and the inner frame 8 is not particularly limited, but when molding with a synthetic resin, a method of molding a molded product by flowing molten resin, such as injection molding or transfer molding, can be used. That's fine.

  Moreover, the shape of the convex part 82 and the recessed part 63 is not limited to the said shape, What is necessary is just a shape which can pinch | attach the adhesive film 10 on two points, and can also fix it to the outer frame 2, and a recessed part to the inner frame 8 The structure which forms may be sufficient.

  Moreover, as described above, the adhesive film 10 is not limited to the configuration in which the adhesive film 10 is fixed to the carrier 1 at two points in a longitudinal sectional view, and may be a method of fixing at one point, three points or more or a surface. Even in such a configuration, the adhesive film 10 can be reliably fixed by the spring portion that is compressed when the outer frame 2 and the inner frame 8 are fitted and presses the adhesive film 10 against the outer frame 2 by a repulsive force. is there. For example, as shown in FIG. 9, the inner frame 18 may not have a convex portion and the outer frame 12 may not have a concave portion.

Further, as shown in FIGS. 8 and 9, the carrier 100 has a so-called grip ring shape, the outer frame 12 and the inner frame 18 are circular annular bodies in plan view, and the cross section is a quadrangle. The outer frame 12 and the inner frame 18 are formed to have substantially the same width and the same height, and as shown in FIGS. 10 and 11, the outer frame 102 and the inner frame 108 are annular thin plates having a predetermined width. The inner frame 108 has a circular annular body and a quadrangular section in plan view, and the outer frame 102 is formed in a circular shape on the inner periphery, while the outer shape is formed by cutting out the outer part of the circular shape to form a linear end portion. 71 may be formed, and the corner portion 72 may be formed in a substantially square shape having a substantially arc shape.

  Further, the spring portion 91 is not limited to the above-described configuration, and as shown in FIGS. 12 and 13, instead of the vertical groove 84 having the above-described configuration, the inner frame 8 is directed from the upper surface 83 to the lower surface 87. In addition, the vertical grooves 804 formed around the inner frame 8 and a plurality of horizontal grooves 85 reaching the vertical grooves 804 from the outer surface 89 and the upper surface 83 may be formed.

  Further, as shown in FIGS. 14 and 15, the spring portion 901 has only a vertical groove 804 formed in the direction of the upper surface 83 from the lower surface 87 of the inner frame 8 over the entire circumference of the inner frame 8 without forming a horizontal groove. Only one of them may be formed in a ring shape, or, as shown in FIGS. 16 and 17, the spring portion 902 does not form a lateral groove, and the entire length of the inner frame 8 is not increased. You may form only the vertical groove 805 formed from the upper surface 83 to the lower surface 87 direction.

As shown in FIGS. 18 and 19, the spring portion 911 may be formed by only a plurality of lateral grooves 85 formed from the outer surface 89 in the diameter direction of the inner frame 8. In the case of such a configuration, the spring portion 911 can be compressed and act as a spring by being crushed in the diameter direction of the inner frame 8 or moving into the lateral groove 85. The spring portion 911 is preferably formed with a large number of lateral grooves 85 as compared to the above-described embodiment in which the vertical grooves are formed. Further, the lateral groove 85 of this configuration may reach the other surface from one surface of the lower surface 87 and the upper surface 83 of the inner frame 8, but it does not have to.

Further, in the case where the spring portion is formed only by the transverse groove and the spring portion is formed by the transverse groove and the longitudinal groove, the transverse groove is not limited to the configuration formed in the diameter direction of the inner frame 8, and as shown in FIG. The oblique lateral groove 850 can be formed so as to be formed in a direction crossing the diameter direction of the frame 8. The side surfaces of the oblique lateral grooves 850 are curved and the opposite side surfaces are reduced in diameter to form a half crescent shape, but may be formed linearly as in other embodiments. In the case where the spring portion 912 is formed only by the oblique lateral groove 850, the spring portion 912 can act as a spring by being moved and compressed in the oblique lateral groove 850, that is, inward of the inner frame 8.

  In the embodiment shown in FIGS. 1 to 3, the inner frame 8 is an annular body, and the inner shape and the outer shape are circular in plan view, but the inner shape of the inner frame 8 is limited to a circle in plan view. Alternatively, other shapes such as a polygon or an ellipse may be used.

  Although not shown, if the outer frame and the inner frame can be fitted to each other, the outer shape of the opening of the outer frame and the outer shape of the inner frame are not limited to a circle in a plan view, and the carrier is an opening of the outer frame. The outer shape of the part and the inner frame may be formed in other polygons, ellipses, etc., such as a square shape in plan view.

  Further, as shown in FIG. 21, the carrier 111 does not provide a spring portion on the inner frame 800, and sandwiches the adhesive film 10 at least between the outer frame 200 and the inner frame 800 on the inner side surface portion 231 of the outer frame 200. It is good also as a structure which formed the spring part 900 compressed when installing. At this time, the structure of the spring portion 900 and the inner side surface portion 231 can be formed as the same structure as the spring portion 91 and the outer portion 81 of the inner frame 8 as described above.

  Further, although not shown, the carrier may have a structure in which spring portions are formed on both the inner side surface portion of the outer frame and the outer portion of the inner frame. And the spring parts formed in each of the inner side surface part of the outer frame and the outer side part of the inner frame may or may not face each other. Further, the spring portion may be formed over the entire circumference of the outer portion 81 of the inner frame 8, but may be formed only in a part.

Further, the concave portion 63 of the outer frame 2 and the convex portion 82 of the inner frame 8 may be formed over the entire circumference of the inner peripheral surface 6 of the outer frame 2 and the outer peripheral surface 89 of the inner frame 8, respectively. You may form only in. In the case where the concave portion 63 of the outer frame 2 is formed only in part, the convex portion 82 of the inner frame 8 is formed only at a location corresponding to the concave portion 63. Although not shown, a convex portion may be formed on the inner peripheral surface 6 of the outer frame 2, and a concave portion may be provided on the outer portion 81 of the inner frame 8. In this case, it is preferable to provide a convex part or a concave part in the spring part.

  In addition, this invention is not limited to the said embodiment, What also comprised what combined said embodiment suitably is included.

  The present invention as described above can be suitably used in the manufacturing process of IC chips, and particularly has high heat resistance, so that the same holding container can be used consistently from storage and transportation of silicon wafers to the manufacturing process of IC chips. Since it can hold | maintain, it can be used conveniently. Further, the object to be held is not limited, and it can hold not only electronic parts but also organisms and microorganisms, and can be used in the field of physics and chemistry.

DESCRIPTION OF SYMBOLS 1 Carrier 10 Adhesive film 11 Silicon wafer 2 Outer frame 22 Opening part 3 Base part 31 Upper surface 34 Outer side surface 4 Side wall part 41 Upper end 42 Outer side surface 5 Leg part 51 Inner side surface 6 Inner peripheral surface 61 Protrusion 63 Recessed part 631 Upper end of a recessed part 632 Recessed part of recessed part Lower end 8 Inner frame 80 Main body 81 Outer portion 82 Convex portion 83 Upper surface 84 Vertical groove 85 Horizontal groove 850 Diagonal horizontal groove 87 Lower surface 88 Step portion 89 Outer side surface 91 Spring portion 901 Spring portion 902 Spring portion 911 Spring portion 912 Spring portion

Claims (10)

  A film-fixed carrier that holds an adhesive film between an outer frame and an inner frame, and is configured such that the inner frame can be fitted into an opening formed in the outer frame, and an outer portion of the inner frame or / And the film fixed type | mold carrier characterized by comprising a spring part in the inner peripheral surface part of the said outer frame.   The film fixing type carrier according to claim 1, wherein the spring portion is compressed at least when the adhesive film is placed between the outer frame and the inner frame.   When the spring part is flat when the inner frame is fitted into the outer frame without installing an adhesive film, the spring part is in contact with the outer frame or / and the inner frame facing the spring part, or the spring The film-fixed carrier according to claim 1 or 2, wherein the film-fixed carrier is formed so as to be positioned at an interval less than the thickness of the adhesive film and the outer frame or / and the inner frame facing the portion.   The spring portion is formed on a lower surface of the inner frame by a vertical groove formed around the inner frame and a plurality of horizontal grooves reaching the vertical groove from an outer surface and a lower surface of the inner frame. The film fixed type carrier according to any one of claims 1 to 3, wherein a plurality of the portions are formed in the part.   The spring portion is formed on the upper surface of the inner frame by a vertical groove formed around the inner frame, and a plurality of horizontal grooves reaching the vertical groove from the outer surface and the upper surface of the inner frame. The film fixed type carrier according to any one of claims 1 to 3, wherein a plurality of the portions are formed in the part.   The film fixed carrier according to any one of claims 1 to 3, wherein the spring portion is formed of only a plurality of lateral grooves formed in the diameter direction of the inner frame from the outer surface. .   The film according to any one of claims 1 to 3, wherein the spring portion is formed by a plurality of lateral grooves formed in a direction intersecting with a diameter direction of the inner frame from the outer surface. Fixed carrier.   The said spring part is formed by the vertical groove formed over the circumference | surroundings of the said inner frame from the upper surface of the said inner frame to the lower surface direction, or from the lower surface to the upper surface direction. The film fixed type carrier according to any one of the above.   The film fixing type carrier according to any one of claims 4 to 7, wherein the lateral grooves are formed at equal intervals in a circumferential direction of the inner frame.   A concave portion is formed on the inner peripheral surface of the outer frame, and a convex portion protruding outward is formed on the outer surface of the inner frame, and when the outer frame and the inner frame are fitted, the outer frame The concave portion and the convex portion of the inner frame do not fit together, and the adhesive film to be held is held at two points in the longitudinal sectional view of the convex portion and the upper and lower ends of the concave portion, and the convex portion is formed on the spring portion The film fixed type carrier according to any one of claims 1 to 9, wherein the film fixed type carrier is used.

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