JP2006319012A - Stationary carrier and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an easily manufacturable stationary carrier, for example, capable of easily transporting a fragile article to be mounted, and to provide a method for manufacturing the stationary carrier. <P>SOLUTION: There are a base 1, and a holding layer 10 that is laminated and applied on the surface 3 of the base 1, holds a semiconductor wafer 20 detachably and adhesively, and can be deformed. A plurality of projections 4 project from the surface 3 except a periphery 2 of the base 1 to allow the tip surface to come into contact with the rear 11 of the holding layer. A supply/discharge hole 6 communicating with partition space 5 between the plurality of projections 4 and the holding layer 10 is drilled in the base 1. Non-adhesive treatment is performed onto the rear 11 of the holding layer 10 in contact with the plurality of projections 4. The rear 11 of the holding layer 10 is a non-adhesive surface having no adhesion properties, thus preventing the deformed holding layer 10 from adhering onto the recessed surface 3 of the base 1 and the circumferential face of the projection 4, restoring the deformed holding layer 10 to its original state easily, and using the stationary carrier repeatedly for a long time. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a fixed carrier for detachably holding a substrate represented by a semiconductor wafer or quartz glass, a printed wiring board, a chip component, a member that is difficult to handle by itself, a member that requires temporary fixing in the process, and the like. It is about the method.

In recent years, the diameter of a semiconductor wafer has been increased from 200 mm to 300 mm. This 300 mm type semiconductor wafer has a laminated structure after a circuit is formed on the surface and a back grind tape is attached to the circuit forming surface. In view of package requirements, the back side is thin and back-ground.
In this way, the semiconductor wafer to which the back grind tape is adhered is transported to another factory, converted into an IC chip, and subjected to processing such as bonding and sealing while mounted on a dedicated carrier (see Patent Document 1). .
JP 59-227195 A

The conventional processing of semiconductor wafers and chips is as described above, and the back-ground semiconductor wafers are very easy to break and warp, so it is very difficult to transport them properly without damaging other factories. There's a problem. As a means for solving this problem, a method of using the above-described dedicated carrier can be considered, but this carrier is a dedicated product used for transportation in the factory to the last, taking into account harsh transportation conditions etc. It is not a thing. Therefore, it cannot be used for long-time transportation from factory to factory.

  Further, conventionally, if the back grind tape is adhered for a long time during transportation from factory to factory, there is a high possibility that the adhesive of the back grind tape is transferred to the bumps of the circuit.

  The present invention has been made in view of the above, and an object of the present invention is to provide an easily manufactured fixed carrier capable of appropriately transporting an article to be mounted that is easily damaged or a member that needs to be fixed, and a manufacturing method thereof.

In the present invention, in order to solve the above-described problem, the substrate includes a base material and a deformable holding layer that is provided on the base material so as to detachably hold the article to be mounted.
The substrate is provided with a plurality of protrusions and the tip thereof is brought into contact with the holding layer, and a supply / discharge hole connected to the partition space between the plurality of protrusions and the holding layer is provided, and the holding layer is in contact with the plurality of protrusions. The contact surface is subjected to non-adhesive treatment.

Further, in order to solve the above-described problems, the present invention includes a base material and a deformable holding layer that is provided on the base material so as to detachably hold an article to be mounted, and the base material has a plurality of protrusions. Is a manufacturing method of the one provided with a supply / discharge hole connected to a partition space between the plurality of protrusions and the holding layer,
A non-adhesive treatment is performed on the contact surface of the holding layer that comes into contact with the plurality of protrusions.

  Here, the base material and the fixed carrier in the claims can be formed in a substantially circular plane, a substantially elliptical shape, a substantially rectangular shape, a substantially polygonal shape, etc., and may be stored in a storage container for a substrate. It does n’t have to be. The mounted article includes at least one precision substrate, liquid crystal glass, quartz glass, photomask, circuit board, chip component, inspection lead frame, various types of paper, thin electronic components, and the like. When the article to be mounted is a precision substrate, semiconductor wafers (Si wafer or GaP wafer) having a diameter of 300 mm, 400 mm, or 450 mm are included.

  For the holding layer, various elastomers and rubbers having flexibility can be used. Further, the protrusion can be formed in a columnar shape, a prismatic shape, a truncated cone shape, a truncated pyramid shape or the like, and is not particularly limited to a hollow shape or a solid shape. A single or a plurality of supply / discharge holes may be used. Furthermore, the fixed carrier according to the present invention can be used not only when transporting from a factory to another factory, but also when transporting an article to be mounted in the factory.

  According to the present invention, if the article to be mounted is mounted on the holding layer of the fixed carrier and pressed, the article to be mounted can be held on the holding layer on the substrate. At this time, since the article to be mounted is in close contact with the fixed carrier, even if it is thin, it is less likely to bend and warp downward.

  According to the present invention, there is an effect that an article to be mounted that is easily damaged can be appropriately moved, transported, transported, transported, and the like. In addition, if non-adhesive treatment is applied to the contact surface of the holding layer that comes into contact with the plurality of protrusions, the contact surface of the deformed holding layer is prevented from sticking to the surface of the substrate or the peripheral surface of the protrusion, and the deformed holding layer Can be restored relatively easily and used repeatedly.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 14, a fixed carrier in the present embodiment includes a planar circular base material 1 having rigidity, and the base material. And a holding layer 10 which is elastically deformed into irregularities for detachably sticking and holding a 300 mm (12 inch) type thin semiconductor wafer 20 that is laminated and coated on the surface 3 of the substrate 1. Stored.

  The total thickness of the fixed carrier is in the range of 0.3 to 2.5 mm, preferably in the range of 0.5 to 1.2 mm. As long as the thickness of the fixed carrier falls within the range, sufficient reinforcement can be secured with respect to the semiconductor wafer 20, and when stored in the substrate storage container 30 or taken out, the fork of a dedicated robot (not shown) can be used. This is because a sufficient insertion interval can be secured. In addition, it is possible to reduce the weight of the fixed carrier.

  As shown in FIGS. 1 to 4, the substrate 1 is formed into a thin plate having rigidity using a predetermined material so that the substrate 1 can be securely stored in the substrate storage container 30, and has the same size as the semiconductor wafer 20. On the other hand, it is a slightly enlarged disk. The material of the substrate 1 is not particularly limited. For example, flexible polycarbonate, polypropylene, polyethylene, acrylic resin, polyvinyl chloride, aluminum alloy, magnesium alloy, stainless steel having excellent heat resistance, impact resistance, and transparency. Etc.

  The surface 3 excluding the peripheral edge 2 of the substrate 1 is formed to be shallow and recessed, and a plurality of projections 4 protrude upwardly from the recessed surface 3 so that the flat front end surface is brought into contact with the back surface 11 of the holding layer 10. A partition space 5 for air flow is formed between the plurality of protrusions 4 and the back surface 11 of the holding layer 10 (see FIGS. 4 and 6). The plurality of protrusions 4 are aligned to a height of 0.05 mm or more, which is substantially the same as the peripheral edge 2 of the substrate 1, and each protrusion 4 is formed in a rigid columnar shape or a truncated cone shape. Support indirectly through 10.

  The height of the projection 4 is 0.05 mm or more. However, when the height is less than 0.05 mm, the sufficient partition space 5 cannot be formed, which hinders the deformation of the holding layer 10. Because there is a risk of coming.

  In the thickness direction of the substrate 1, a supply / discharge hole 6 for detaching the semiconductor wafer 20 communicating with the partition space 5 is drilled, and the supply / discharge hole 6 positioned between the plurality of protrusions 4 includes 6 is detachably connected. Then, the vacuum device 7 is operated, and the holding layer 10 is deformed according to the pattern of the plurality of protrusions 4, and a gap for inflow of air is generated between the uneven holding layer 10 and the semiconductor wafer 20. As a result, the semiconductor wafer 20 adhered and held on the holding layer 10 can be removed (see FIG. 6).

  The holding layer 10 is formed into a planar circle having the same diameter as that of the substrate 1 by using, for example, a urethane-based, fluorine-based, or silicone-based thin elastomer having excellent flexibility, flexibility, heat resistance, elasticity, adhesiveness, and the like. At least most of the back surface 11 is made a non-adhesive surface by non-adhesive treatment, and is attached to the peripheral edge 2 of the front surface 3 of the base material 1 with an adhesive, and the back surface of the semiconductor wafer 20 is attached and detached. Freely hold adhesive. A method for producing the holding layer 10 is not particularly limited, and examples thereof include a method in which a thin film is formed by a calendering method, a pressing method, or the like, and this thin film is adhered to the peripheral portion 2 of the substrate 1. It is done.

A reinforcing filler, hydrophobic silica, or the like is added to the elastomer of the holding layer 10 as necessary at the time of molding. Further, examples of the non-adhesion treatment for the back surface 11 of the holding layer 10 include UV treatment, roughening treatment, lamination of non-adhesive rubber, coating of an adhesive having non-adhesiveness, and the like. Among these, when the back surface 11 of the holding layer 10 is coated with a non-tacky adhesive and brought into contact with the plurality of protrusions 4, the thickness of the adhesive is about 1/5 of the height of the protrusions 4. The elastic modulus of the adhesive is preferably 50 N / mm ² or less.

  As shown in FIGS. 4 and 5, the semiconductor wafer 20 is basically made of a round silicon wafer, a circuit is formed on the mirror surface, and the back surface is thinly back-ground via a back-grind tape. As a result, the surface of the holding layer 10 is adhesively held. As shown in FIG. 5, an orientation flat 21 and a notch 22 for discriminating and aligning the crystal orientation are appropriately formed on the peripheral edge of the semiconductor wafer 20.

  As shown in FIGS. 7 to 14, the substrate storage container 30 is a front open box type including a container main body 31 for storing a fixed carrier and a detachable lid 50 for opening and closing the front surface of the container main body 31. Composed. The container body 31 is formed into a transparent front open box using a predetermined resin made of polycarbonate or the like, and functions to store a plurality of (25 or 26) fixed carriers in a line in the vertical direction.

  As shown in FIGS. 7 to 9, the opened front surface of the container body 31 is bent outwardly in a substantially L-shaped cross section to form a horizontally long rim portion 32, and the upper and lower sides of the inner peripheral surface of the rim portion 32. On both sides, a locking hole 33 for locking the lid is formed in a recess. A plurality of rear retainers 34 that hold the rear periphery of the base material 1 via a holding groove are juxtaposed in the vertical direction on the inner surface of the back wall of the container body 31 at predetermined intervals. Teeth 35 for horizontally supporting the base material 1 are formed so as to protrude from the inner surface of each of the two teeth, and the pair of left and right teeth 35 are arranged in parallel in the vertical direction at a predetermined interval.

  As shown in FIG. 12 and the like, each of the teeth 35 is formed in a substantially plane shape or a semicircular arc shape, and is integrally formed on a flat plate 36 along the peripheral edge of the base 1 and on the inner side of the front portion of the flat plate 36. The substantially flat front middle region 37 that supports the base material 1 and the front outer side of the flat plate 36 are formed integrally with the outer side of the front middle region 37, in other words, closer to the side wall of the container body 31. A front thick region 38, a rear middle region 39 that is formed in the rear portion of the flat plate 36 and supports the base material 1, and a rear portion that is formed in the rear portion of the flat plate 36 and is located in front of the rear thick portion region 39. It is formed with a flat rear thick region 40 located in a small area near the side wall of the main body 31.

  Between the front middle thickness region 37 and the front thick region 38 of the tooth 35, a vertical step 41 that contacts the side edge of the substrate 1 is slightly formed. The front thick region 38 is formed to a height obtained by adding the thickness of the semiconductor wafer 20 to the thickness of the fixed carrier, specifically, a height of about 0.3 to 2.5 mm + α. It functions to prevent the base material 1 from protruding forward from the container body 31 as a stopper.

  A slightly recessed thin region is formed between the front middle region 37 and the rear middle region 39, and this thin region is opposed to the peripheral edge of the side of the substrate 1 with a slight gap. The teeth 35 having such a configuration horizontally support the side periphery of the back surface of the base material on the flat front middle region 37 and rear middle region 39 while maintaining high accuracy.

  As shown in FIG. 13, positioning tools 42 that fit the positioning pins of the processing apparatus on which the substrate storage container 30 is mounted are disposed on the front side and the rear center of the bottom surface of the container body 31. A substantially Y-shaped bottom plate 43 is detachably attached to the substantially central portion of the, and an identification body detachably fitted to the rear portion of the bottom plate 43 is detected by a sensor of the processing apparatus. Thus, the type of the substrate storage container 30 and the number of the semiconductor wafers 20 are grasped.

  A flat rectangular robotic flange 44 gripped by the automatic transfer machine is detachably attached to the center of the ceiling of the container main body 31, and thick cylindrical or substantially flat outer surfaces on both side walls of the container main body 31. U-shaped handles 45 are detachably mounted, and the substrate storage container 30 is transported when the pair of handles 45 are gripped by an operator.

  As shown in FIGS. 7, 8, and 14, the lid 50 has a substantially dish-shaped casing 51 that is detachably fitted to the rim portion 32 of the container body 31, and a surface of the casing 51. A cover 52 having a substantially rectangular front surface and a pair of left and right locking mechanisms 53 that are interposed between the casing 51 and the cover 52 and lock the lid 50 fitted to the front surface of the container body 31 are provided. Composed.

  The casing 51 is formed into a substantially rectangular front surface with four corners chamfered, and an elastic front retainer that sandwiches the front peripheral edge of the base material 1 via a clamping groove is arranged in parallel in the vertical direction at the center of the back surface. The An endless seal gasket that is pressed against the rim portion 32 of the container main body 31 is deformably fitted to the peripheral wall of the casing 51, and the locking holes 33 of the container main body 31 are provided on both upper and lower sides of the peripheral wall. Corresponding through holes are respectively drilled.

  As shown in FIG. 14, each locking mechanism 53 is supported by, for example, a surface side portion of a housing 51 and is rotated by an operation key that passes through a cover 52 of a lid opening / closing device of the processing apparatus, A pair of advancing / retracting plates 55 inserted into a pair of slots drilled on the outer periphery of the rotating plate 54 and sliding linearly in the up / down direction of the lid 50 as the rotating plate 54 rotates, and each advancing / retracting plate And a locking claw 56 that is connected to and supported by the distal end portion of the 55 and that fits and locks into the locking hole 33 of the container body 31 by protruding from the through hole of the lid 50 as the rotating plate 54 rotates. The

  In the above, when manufacturing a fixed carrier, a plurality of projections 4 and supply / discharge holes 6 are integrally formed on the base material 1 by molding a thermoplastic resin sheet, for example, and at least the peripheral edge of the surface 3 of the base material 1 A thin carrier holding layer 10 is adhered to the portion 2 to cover the flat front end surface of each projection 4, and a partition space 5 is formed between the plurality of projections 4 and the holding layer 10, thereby manufacturing a fixed carrier. be able to. During this manufacturing operation, the back surface 11 of the holding layer 10 is subjected to a non-adhesion process in advance, and is a non-adhesive surface that does not adhere to the recessed surface 3 of the substrate 1 or the peripheral surface of the protrusion 4.

  In the above, when the back-ground semiconductor wafer 20 is transported to another factory, first, the semiconductor wafer 20 is pressed and held in contact with the holding layer 10 of the fixed carrier by a robot, and the fixed carrier is held in the substrate storage container. 30 is accommodated in a container body 31 via a robot, and a lid 50 is fitted to the front surface of the container body 31, and then the locking mechanism 53 is operated to lock the lid 50. 20 can be transported to other factories.

  At the time of storage, the semiconductor wafer 20 is mounted in close contact with the fixed carrier without gaps, so that even if it is thin, the semiconductor wafer 20 does not bend and warp downward, and is securely stored in the container body 31 of the substrate storage container 30. The

  Next, when it is desired to take out the transported semiconductor wafer 20 and perform bonding or sealing processing, first, the locking mechanism 53 of the lid 50 is unlocked to remove the lid 50 from the container main body 31. After the fixed carrier is taken out from the container body 31 via a robot, if the vacuum device 7 is connected to the supply / discharge hole 6 of the fixed carrier and a suction operation is performed, the semiconductor wafer 20 is removed from the holding layer 10 deformed by the fixed carrier by the robot. Can be easily adsorbed and removed.

  According to the above configuration, the fragile semiconductor wafer 20 that is easily cracked, warped, and fragile is not directly stored in the container body 31 but is indirectly stored by being held by a fixed carrier, so that it can be safely and appropriately stored in other factories. Can be transported. In particular, the fixed carrier has excellent strength and rigidity, and can withstand severe transportation conditions such as atmospheric pressure changes, so it can be transported safely even if it takes a long time to transport from factory to factory. it can.

  Further, since the adhesion time of the back grind tape can be shortened or omitted, there is very little possibility that the adhesive of the back grind tape is transferred to the bumps of the circuit. Further, since the back surface 11 of the holding layer 10 is a non-adhesive surface having no adhesiveness, even if the adhesiveness of the holding layer 10 is high, the holding layer is deformed to the concave surface 3 of the base material 1 or the peripheral surface of the protrusion 4. It is possible to effectively prevent 10 from sticking or taking a long time to restore the original state. Therefore, the deformed holding layer 10 can be easily restored to the original state, and the fixed carrier can be used repeatedly over a long period of time.

  In addition, since the wide back surface 11 of the holding layer 10 is not adhesively treated instead of the tip surfaces of the fine projections 4 one by one, the processing operation can be significantly smoothed, speeded up, and facilitated. Is possible. In addition, since the side edge of the back surface of the fixed carrier is horizontally supported while maintaining high accuracy in the front middle region 37 and the rear middle region 39 of the teeth 35, the fixed carrier tilts in the vertical direction and the robot It becomes possible to prevent the fork from being taken in and out.

  Furthermore, since the fixed carrier and its base material 1 are approximately the same size and thin as the semiconductor wafer 20, the dimensions, shape, etc. of the existing substrate storage container 30 on the premise of storing the semiconductor wafer 20 not back-ground are particularly changed. It is possible to automatically store and take out without doing so.

  In the above embodiment, the base material 1, the plurality of protrusions 4, and the supply / discharge holes 6 are integrally formed. However, the present invention is not limited to this. For example, the peripheral edge 2 and the plurality of protrusions 4 can be formed by laminating a photoresist layer on the substrate 1 and etching. Further, after the base material 1 and the plurality of protrusions 4 are integrated, the supply / discharge hole 6 can be drilled with a drill or the like. In addition, the holding layer 10 may be bonded to the peripheral edge 2 of the substrate 1, but the back surface 11 of the holding layer 10 may be bonded to the peripheral edge 2 of the substrate 1 and the tip surface of each protrusion 4. Furthermore, the base material 1 and the holding layer 10 may or may not have the same diameter.

It is a plane explanatory view showing an embodiment of a fixed carrier concerning the present invention. It is plane explanatory drawing which shows the adhesion holding state of the semiconductor wafer in embodiment of the fixed carrier which concerns on this invention, and its manufacturing method. It is a fragmentary sectional view which shows the base material etc. in embodiment of the fixed carrier which concerns on this invention, and its manufacturing method. It is a partial section explanatory view showing the adhesion maintenance state of the semiconductor wafer in the embodiment of the fixed carrier concerning the present invention and its manufacturing method. It is a plane explanatory view showing a semiconductor wafer in an embodiment of a fixed carrier concerning the present invention. It is a section explanatory view showing the deformation state of the maintenance layer in the embodiment of the fixed carrier concerning the present invention. It is a whole perspective explanatory view showing a substrate storage container in an embodiment of a fixed carrier concerning the present invention, and its manufacturing method. It is front explanatory drawing which shows the board | substrate storage container in embodiment of the fixed carrier which concerns on this invention, and its manufacturing method. It is a cross-sectional side view which shows the container main body of the board | substrate storage container in embodiment of the fixed carrier which concerns on this invention, and its manufacturing method. It is sectional explanatory drawing which shows the state which accommodated the semiconductor wafer in the container main body in embodiment of the fixed carrier which concerns on this invention, and its manufacturing method. It is sectional explanatory drawing which shows the container main body of the substrate storage container in embodiment of the fixed carrier which concerns on this invention, and its manufacturing method. It is an isometric view explanatory drawing which shows the teeth of the board | substrate storage container in embodiment of the fixed carrier which concerns on this invention, and its manufacturing method. It is bottom explanatory drawing which shows the container main body of the substrate storage container in embodiment of the fixed carrier which concerns on this invention, and its manufacturing method. It is plane explanatory drawing which shows the locking mechanism of the board | substrate storage container in embodiment of the fixed carrier which concerns on this invention, and its manufacturing method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base material 2 Peripheral part 3 Surface 4 Protrusion 5 Compartment space 6 Supply / discharge hole 10 Holding layer 11 Back surface (contact surface)
20 Semiconductor wafer (mounted article)
30 Substrate storage container 31 Container body 50 Lid

Claims (2)

A fixed carrier comprising a base material and a deformable holding layer that is provided on the base material and is detachably held to hold the mounted article,
The substrate is provided with a plurality of protrusions and the tip thereof is brought into contact with the holding layer, and a supply / discharge hole connected to the partition space between the plurality of protrusions and the holding layer is provided, and the holding layer is in contact with the plurality of protrusions. A fixed carrier characterized in that a non-adhesive treatment is applied to the contact surface. A base material, and a deformable holding layer that is provided on the base material so as to detachably hold the article to be mounted, and the base material is provided with a plurality of protrusions and its tip is brought into contact with the holding layer. A method for manufacturing a fixed carrier provided with supply / discharge holes connected to a partition space between a plurality of protrusions and a holding layer,
A method for producing a fixed carrier, characterized in that a non-adhesive treatment is applied to a contact surface of a holding layer that contacts a plurality of protrusions.

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