JP4671751B2 - Manufacturing method of fixed carrier - Google Patents

Description

  The present invention relates to a method of manufacturing a fixed carrier that detachably holds a substrate typified by a semiconductor wafer or quartz glass, a printed wiring board, a chip component, or any other member that is difficult to handle by itself, or a member that has temporary fixing in the process. It is about.

In recent years, the diameter of a semiconductor wafer has been increased from 200 mm to 300 mm. This 300 mm type semiconductor wafer has a laminated structure package after a circuit is formed on the surface and a back grind tape is adhered to the circuit forming surface. In consideration of demands, the back side is thin and ground.
In this way, the semiconductor wafer to which the back grind tape is adhered is transported to another factory, converted into an IC chip, and subjected to processing such as bonding and sealing while mounted on a dedicated carrier (see Patent Document 1). .
JP 59-227195 A

Conventional processing of semiconductor wafers and chips is as described above, and back-ground semiconductor wafers are very easy to break and warp, making it extremely difficult to transport properly without damaging other factories. There's a problem. As a means for solving this problem, a method of using the above-described dedicated carrier can be considered, but this carrier is a dedicated product used for transportation in the factory to the last, taking into account harsh transportation conditions etc. It is not a thing. Therefore, it cannot be used for long-time transportation from factory to factory.

  Further, conventionally, if the back grind tape is adhered for a long time during transportation from factory to factory, there is a high possibility that the adhesive of the back grind tape is transferred to the bumps of the circuit.

  The present invention has been made in view of the above, and an object of the present invention is to provide a manufacturing method of an easily manufactured fixed carrier capable of appropriately transporting an article to be mounted that is easily damaged or a member that needs to be fixed.

To solve the above problems in the present invention, a deformable holding layer for removably adhesive holding the mounting article provided superposed on the base material, the base material, retaining layer provided with a plurality of projections And a method of manufacturing a fixed carrier provided with a supply / discharge hole connected to a partition space between the plurality of protrusions and the holding layer,
The uneven surface of the stamper is brought into contact with the thermoplastic resin sheet and heated and pressurized, and the thermoplastic resin sheet is cooled under pressure to integrally form the base material, the plurality of protrusions, and the supply / discharge holes. A thin film holding layer is adhered to the peripheral edge of the sheet to cover the tip surfaces of the plurality of protrusions, and a partition space is formed between the plurality of protrusions and the holding layer. The air is exhausted to the outside, the holding layer is deformed into irregularities according to the plurality of protrusions, and then the contact portion surface of the holding layer that contacts the tip surfaces of the plurality of protrusions is roughened and non-adhesive treatment is performed. Yes.

In addition, it is preferable to heat-press in the temperature range until it raises 50 degreeC from the glass transition temperature of a thermoplastic resin sheet, and to cool at the temperature which fell 20 degreeC or more from the glass transition temperature.
Moreover, it is preferable that each protrusion has a height of 0.05 mm or more.

  Here, the base material and the fixed carrier in the claims can be formed in a substantially circular plane, a substantially elliptical shape, a substantially rectangular shape, a substantially polygonal shape, etc., and may be stored in a storage container for a substrate. It does n’t have to be. The mounted article includes at least one precision substrate, liquid crystal glass, quartz glass, photomask, circuit board, chip component, inspection lead frame, various types of paper, thin electronic components, and the like. When the article to be mounted is a precision substrate, semiconductor wafers (Si wafer or GaP wafer) having a diameter of 300 mm, 400 mm, or 450 mm are included.

  For the holding layer, various elastomers and rubbers having flexibility can be used. Further, the protrusion can be formed in a columnar shape, a prismatic shape, a truncated cone shape, a truncated pyramid shape or the like, and is not particularly limited to a hollow shape or a solid shape. A single or a plurality of supply / discharge holes may be used. Furthermore, the fixed carrier according to the present invention can be used not only when transporting from a factory to another factory, but also when transporting an article to be mounted in the factory.

  According to the present invention, if the article to be mounted is mounted on the holding layer of the fixed carrier and pressed, the article to be mounted can be held on the holding layer on the substrate. At this time, since the article to be mounted is in close contact with the fixed carrier, even if it is thin, it is less likely to bend and warp downward.

According to the present invention, it is possible to appropriately move, transport, transport, transport, etc., an article to be mounted that is easily damaged. Also, rather than forming a plurality of protrusions on the surface of the base material by sandblasting or the like over time, the base material and the plurality of protrusions are integrally formed, so that productivity and mass productivity can be improved. In addition, the heights of the protrusions can be aligned with high accuracy. Also, the surface of the contact portion of the holding layer that comes into contact with the plurality of protrusions is not made non-adhesive by coating or UV treatment, but the surface of the contact portion of the holding layer is roughened to make a non-adhesive surface. Can be reduced, mask positioning work can be omitted, and any pattern of protrusions can be handled.
In addition, when the mounted article is a back-ground semiconductor wafer, high-precision flatness is required for the holding layer of the fixed carrier, but the contact portion surface of the holding layer is increased by using a high-precision grindstone roller or the like. If processed with high accuracy, it becomes possible to impart high-precision flatness to the holding layer while maintaining durability.
Furthermore, if heating and pressurization is performed within a temperature range from the glass transition temperature of the thermoplastic resin sheet to 50 ° C. and cooling at a temperature lower by 20 ° C. or more from the glass transition temperature, defects are generated and thickness varies. Therefore, good molding can be expected.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 15, a fixed carrier in the present embodiment is a planar circular base material 1 having rigidity, and this base material. 1 and a holding layer 10 that is elastically deformable into irregularities for detachably sticking and holding a thin semiconductor wafer 20 having a diameter of 300 mm (12 inches), and is stored in a substrate storage container 30 for semiconductor wafers. Is done.

  The total thickness of the fixed carrier is in the range of 0.3 to 2.5 mm, preferably in the range of 0.5 to 1.2 mm. As long as the thickness of the fixed carrier falls within the range, sufficient reinforcement can be secured with respect to the semiconductor wafer 20, and when stored in the substrate storage container 30 or taken out, the fork of a dedicated robot (not shown) can be used. This is because a sufficient insertion interval can be secured. In addition, it is possible to reduce the weight of the fixed carrier.

  As shown in FIGS. 1 to 4, the base material 1 is molded into a rigid thin plate by a stamper 60 using a thermoplastic performance resin sheet 2 so that it can be securely stored in a substrate storage container 30. The disk has the same size as the wafer 20 or a slightly enlarged disk. Although it does not specifically limit as the thermoplastic performance resin sheet 2 used as the material of the base material 1, For example, the flexible polycarbonate, polypropylene, polyethylene, acrylic resin, vinyl chloride, etc. which are excellent in heat resistance, impact resistance, and transparency A sheet consisting of

  The surface excluding the peripheral edge portion 3 of the substrate 1 is formed to be shallow and recessed, and a plurality of protrusions 4 protrude upwardly from the recessed surface so that the flat front end surface is in contact with the back surface of the holding layer 10. A partition space 5 for air flow is formed between the plurality of protrusions 4 and the back surface of the holding layer 10 (see FIG. 3). The plurality of protrusions 4 are aligned to a height of 0.05 mm or more, which is substantially the same as the peripheral edge portion 3 of the substrate 1, and each protrusion 4 is formed in a rigid columnar shape or a truncated cone shape. Support indirectly through 10. The height of the projection 4 is 0.05 mm or more. However, when the height is less than 0.05 mm, the sufficient partition space 5 cannot be formed, which hinders the deformation of the holding layer 10. Because there is a risk of coming.

  In the thickness direction of the substrate 1, a supply / discharge hole 6 for removing the semiconductor wafer 20 communicating with the partition space 5 is integrally drilled, and the supply / discharge hole 6 positioned between the plurality of protrusions 4 includes 3 and the vacuum device 7 shown in FIG. 4 are detachably connected. Then, the vacuum device 7 operates, and the holding layer 10 is deformed according to the pattern of the plurality of protrusions 4, and a gap for air inflow is generated between the uneven holding layer 10 and the semiconductor wafer 20. As a result, the semiconductor wafer 20 adhered and held on the holding layer 10 can be removed (see FIG. 4).

  The holding layer 10 is formed, for example, into a planar circle having the same diameter as that of the substrate 1 using a fluorine-based or silicone-based thin elastomer having excellent flexibility, flexibility, heat resistance, elasticity, adhesiveness, and the like. Adhered to the peripheral edge 3 of the surface of the material 1 via an adhesive, the back surface of the semiconductor wafer 20 is detachably adhered and held. A reinforcing filler, hydrophobic silica, or the like is added to the elastomer of the holding layer 10 as necessary at the time of molding.

  The contact portion surface 11 that comes into contact with the front end surface of each protrusion 4 of the holding layer 10 can be physically roughened by a grindstone roller or the like to be a non-adhesive surface, and is a surface defined in JIS B0601-2001. The arithmetic average roughness Ra is 1.6a or more, preferably 1.6 to 12.5a. Arithmetic average roughness Ra of contact part surface 11 is 1.6a or more, preferably in the range of 1.6 to 12.5a, if the roughening in this range, without causing deterioration of holding layer 10, This is because non-adhesion can be achieved and the removal of the semiconductor wafer 20 can be facilitated.

  As shown in FIGS. 5 and 6, the semiconductor wafer 20 is basically composed of a round silicon wafer, a circuit is formed on the mirror surface, and the back surface is thinly back-ground via a back-grind tape. As a result, the surface of the holding layer 10 is adhesively held. As shown in FIG. 5, an orientation flat 21 and a notch 22 for discriminating and aligning the crystal orientation are appropriately formed on the peripheral edge of the semiconductor wafer 20.

  As shown in FIGS. 8 to 15, the substrate storage container 30 is a front open box type including a container main body 31 for storing a fixed carrier and a detachable lid 50 for opening and closing the front surface of the container main body 31. Configured. The container body 31 is formed into a transparent front open box using a predetermined resin made of polycarbonate or the like, and functions to store a plurality of (25 or 26) fixed carriers in a line in the vertical direction.

  As shown in FIGS. 8 to 10, the open front of the container body 31 is bent outwardly in a substantially L-shaped cross section to form a horizontally long rim portion 32, and the upper and lower sides of the inner peripheral surface of the rim portion 32. On both sides, a locking hole 33 for locking the lid is formed in a recess. A plurality of rear retainers 34 that hold the rear periphery of the base material 1 via a holding groove are juxtaposed in the vertical direction on the inner surface of the back wall of the container body 31 at predetermined intervals. Teeth 35 for horizontally supporting the base material 1 are formed so as to protrude from the inner surface of each of the two teeth, and the pair of left and right teeth 35 are arranged in parallel in the vertical direction at a predetermined interval.

  As shown in FIG. 12 and the like, each of the teeth 35 is formed in a substantially plane shape or a semicircular arc shape, and is integrally formed on a flat plate 36 along the peripheral edge of the base 1 and on the inner side of the front portion of the flat plate 36. The substantially flat front middle region 37 that supports the base material 1 and the front outer side of the flat plate 36 are formed integrally with the outer side of the front middle region 37, in other words, closer to the side wall of the container body 31. A front thick region 38, a rear middle region 39 that is formed in the rear portion of the flat plate 36 and supports the base material 1, and a rear portion that is formed in the rear portion of the flat plate 36 and is located in front of the rear thick portion region 39. It is formed with a flat rear thick region 40 located in a small area near the side wall of the main body 31.

  Between the front middle thickness region 37 and the front thick region 38 of the tooth 35, a vertical step 41 that contacts the side edge of the substrate 1 is slightly formed. The front thick region 38 is formed to a height obtained by adding the thickness of the semiconductor wafer 20 to the thickness of the fixed carrier, specifically, a height of about 0.3 to 2.5 mm. Sometimes it functions as a stopper to prevent the base material 1 from jumping forward from the container body 31. Further, a slightly recessed thin region is formed between the front middle region 37 and the rear middle region 39, and this thin region is opposed to the peripheral edge of the side of the substrate 1 with a slight gap. . The teeth 35 having such a configuration horizontally support the side periphery of the back surface of the base material on the flat front middle region 37 and rear middle region 39 while maintaining high accuracy.

  As shown in FIG. 14, a positioning tool 42 that fits a positioning pin of a processing apparatus on which the substrate storage container 30 is mounted is disposed on the front side and the rear center of the bottom surface of the container body 31. A substantially Y-shaped bottom plate 43 is detachably attached to the substantially central portion of the, and an identification body detachably fitted to the rear portion of the bottom plate 43 is detected by a sensor of the processing apparatus. Thus, the type of the substrate storage container 30 and the number of the semiconductor wafers 20 are grasped.

  A flat rectangular robotic flange 44 gripped by the automatic transfer machine is detachably attached to the center of the ceiling of the container main body 31, and thick cylindrical or substantially flat outer surfaces on both side walls of the container main body 31. U-shaped handles 45 are detachably mounted, and the substrate storage container 30 is transported when the pair of handles 45 are gripped by an operator.

  As shown in FIGS. 8, 9, and 15, the lid 50 has a substantially dish-shaped casing 51 that is detachably fitted to the rim portion 32 of the container body 31, and a surface of the casing 51. A cover 52 having a substantially rectangular front surface and a pair of left and right locking mechanisms 53 that are interposed between the casing 51 and the cover 52 and lock the lid 50 fitted to the front surface of the container body 31 are provided. Composed.

  The casing 51 is formed into a substantially rectangular front surface with four corners chamfered, and an elastic front retainer that sandwiches the front peripheral edge of the base material 1 via a sandwiching groove is arranged in the vertical direction at the center of the back surface. The An endless seal gasket that is pressed against the rim portion 32 of the container main body 31 is deformably fitted to the peripheral wall of the casing 51, and the locking holes 33 of the container main body 31 are provided on both upper and lower sides of the peripheral wall. Corresponding through holes are respectively drilled.

  As shown in FIG. 15, each locking mechanism 53 is supported by, for example, the surface side portion of the housing 51 and is rotated by an operation key that penetrates the cover 52 of the lid opening / closing device of the processing apparatus, A pair of advancing / retracting plates 55 inserted into a pair of slots drilled on the outer periphery of the rotating plate 54 and sliding linearly in the up / down direction of the lid 50 as the rotating plate 54 rotates, and each advancing / retracting plate And a locking claw 56 that is connected to and supported by the distal end portion of the 55 and that fits and locks into the locking hole 33 of the container body 31 by protruding from the through hole of the lid 50 as the rotating plate 54 rotates. The

  In the above, when manufacturing a fixed carrier, first, the uneven surface 61 of the stamper 60 is pressed against the prepared thermoplastic resin sheet 2 and heated and pressurized (see FIG. 7), and the thermoplastic resin sheet 2 is pressurized. By cooling under conditions, the base material 1, the plurality of protrusions 4 having a height of 0.05 mm or more, and the supply / discharge holes 6 are integrally formed as shown in FIG. Remove. On the stamper 60 that functions as a mold, an uneven surface 61 for forming the substrate 1, the plurality of protrusions 4 and the supply / discharge holes 6 at one time, in other words, a cavity surface is formed in advance.

  In the molding operation, it is preferable to heat and press in the glass transition temperature Tg to Tg + 50 ° C. range of the thermoplastic resin sheet 2 and to cool the glass transition temperature Tg to Tg−20 ° C. or less. This is because the resin of the thermoplastic resin sheet 2 is completely melted and lost to air pressure unless it is heated and pressurized in such a range, or the substrate 1 and the protrusions 4 are damaged by entraining air. This is because the thickness of the material 1 and the protrusion 4 varies.

  Next, a thin film holding layer 10 is adhered to at least the peripheral edge 3 of the surface of the substrate 1 to cover the tip surfaces of the plurality of protrusions 4, and a partition space 5 is formed between the plurality of protrusions 4 and the holding layer 10. To do. The method for producing the holding layer 10 is not particularly limited, but a layer is formed by, for example, a calendar method, a press method, a coating method, a printing method, etc., and this layer is adhered to the peripheral portion 3 of the substrate 1. And the production method.

  When the partition space 5 is formed between the plurality of protrusions 4 and the holding layer 10, the suction device 6 is connected to the supply / discharge hole 6 of the base material 1 to perform a suction operation, and the holding layer 10 is uneven according to the plurality of protrusions 4. If the contact portion surface 11 of the deformed holding layer 10 in contact with the tip surface of each protrusion 4 is roughened by a grindstone roller or the like and subjected to non-adhesion processing, the fixed carrier can be manufactured.

  In the above, when the back-ground semiconductor wafer 20 is transported to another factory, first, the semiconductor wafer 20 is pressed and held in contact with the holding layer 10 of the fixed carrier by a robot, and the fixed carrier is held in the substrate storage container. 30 is accommodated in a container body 31 via a robot, and a lid 50 is fitted to the front surface of the container body 31, and then the locking mechanism 53 is operated to lock the lid 50. 20 can be transported to other factories.

  At the time of storage, the semiconductor wafer 20 is mounted in close contact with the fixed carrier without gaps, so that even if it is thin, the semiconductor wafer 20 does not bend and warp downward, and is securely stored in the container body 31 of the substrate storage container 30. The

  Next, when it is desired to take out the transported semiconductor wafer 20 and perform bonding or sealing processing, first, the locking mechanism 53 of the lid 50 is unlocked to remove the lid 50 from the container main body 31. After the fixed carrier is taken out from the container body 31 via a robot, if the vacuum device 7 is connected to the supply / discharge hole 6 of the fixed carrier and a suction operation is performed, the semiconductor wafer 20 is removed from the holding layer 10 deformed by the fixed carrier by the robot. Can be easily adsorbed and removed.

  According to the above configuration, the fragile semiconductor wafer 20 that is easily cracked, warped, and fragile is not directly stored in the container body 31 but is indirectly stored by being held by a fixed carrier, so that it can be safely and appropriately stored in other factories. Can be transported. In particular, the fixed carrier has excellent strength and rigidity, and can withstand severe transportation conditions such as atmospheric pressure changes, so it can be transported safely even if it takes a long time to transport from factory to factory. it can.

  Further, since the adhesive time of the back grind tape can be shortened or omitted, there is very little possibility that the adhesive of the back grind tape is transferred to the bumps of the circuit. In addition, since the plurality of protrusions 4 are not formed on the surface of the base material 1 by sandblasting or the like over time, the base material 1 and the plurality of protrusions 4 are integrally formed, so that productivity and mass productivity are remarkably improved. In addition, the height of the protrusions 4 can be aligned with high accuracy.

  Further, when the contact portion surface 11 of the holding layer 10 that is in contact with the plurality of protrusions 4 is made a non-adhesive surface by coating or UV treatment, the number of protrusions (for example, the number of protrusions in the case of the semiconductor wafer 20 having a diameter of 300 mm). However, according to the present embodiment, the contact portion surface 11 of the holding layer 10 is roughened. However, according to the present embodiment, the mask manufacturing cost is improved and the positioning of the mask is extremely difficult. Since the non-adhesive surface is used, the mask manufacturing cost can be reduced and the mask positioning operation can be omitted, and the pattern of all the protrusions 4 can be handled.

  Further, when a fixed carrier is used for the back-ground semiconductor wafer 20, high-precision flatness is required for the holding layer 10 of the fixed carrier. However, a high-precision flat surface is required due to variations in the thickness of the holding layer itself and the adhesive. It is extremely difficult to maintain sex. In order to ensure this flatness, the holding layer 10 may be thinned. However, when this is done, the durability of the holding layer 10 is significantly reduced or the holding layer 10 is bonded to the peripheral edge 3 of the substrate 1. There will be a new major problem that workability and workability are greatly deteriorated.

  On the other hand, according to this embodiment, since the contact portion surface 11 of the holding layer 10 can be processed with high accuracy using a high-precision grindstone roller or the like, the holding layer 10 is maintained while maintaining durability. It becomes possible to easily provide high-precision flatness. In addition, since the side edge of the back surface of the fixed carrier is horizontally supported while maintaining high accuracy in the front middle region 37 and the rear middle region 39 of the teeth 35, the fixed carrier tilts in the vertical direction and the robot It becomes possible to prevent the fork from being taken in and out.

  Furthermore, since the fixed carrier and its base material 1 are approximately the same size and thin as the semiconductor wafer 20, the dimensions, shape, etc. of the existing substrate storage container 30 on the premise of storing the semiconductor wafer 20 not back-ground are particularly changed. It can be automatically stored and taken out without having to.

In addition, you may adhere | attach the retention layer 10 on the peripheral part 3 of the base material 1 of the said embodiment, and the front end surface of each protrusion 4. FIG. Moreover, the base material 1 and the holding layer 10 may have the same diameter or not. Further, the holding layer 10 may or may not be slightly tacky.

It is a plane explanatory view showing a fixed carrier in an embodiment of a manufacturing method of a fixed carrier concerning the present invention. It is a fragmentary sectional view showing a fixed carrier in an embodiment of a manufacturing method of a fixed carrier concerning the present invention. It is a fragmentary sectional view which shows the use condition of the fixed carrier in embodiment of the manufacturing method of the fixed carrier which concerns on this invention. It is a section explanatory view showing the deformation state of the retention layer of the fixed carrier in the embodiment of the manufacturing method of the fixed carrier concerning the present invention. It is a plane explanatory view showing a semiconductor wafer in an embodiment of a manufacturing method of a fixed career concerning the present invention. FIG. 2 is an explanatory plan view showing a state in which a semiconductor wafer is adhered and held on the fixed carrier of FIG. 1. It is a section explanatory view showing typically an embodiment of a manufacturing method of a fixed carrier concerning the present invention. It is a whole perspective view which shows the substrate storage container in embodiment of the manufacturing method of the fixed carrier which concerns on this invention. It is front explanatory drawing which shows the substrate storage container in embodiment of the manufacturing method of the fixed carrier which concerns on this invention. It is a cross-sectional side view which shows the container main body of the substrate storage container in embodiment of the manufacturing method of the fixed carrier which concerns on this invention. It is sectional explanatory drawing which shows the state which accommodated the fixed carrier in the container main body of the substrate storage container in embodiment of the manufacturing method of the fixed carrier which concerns on this invention. It is sectional explanatory drawing which shows the container main body of the substrate storage container in embodiment of the manufacturing method of the fixed carrier which concerns on this invention. It is a perspective explanatory view showing teeth of a substrate storage container in an embodiment of a manufacturing method of a fixed carrier concerning the present invention. It is bottom explanatory drawing which shows the container main body of the substrate storage container in embodiment of the manufacturing method of the fixed carrier which concerns on this invention. It is explanatory drawing which shows the locking mechanism of the substrate storage container in embodiment of the manufacturing method of the fixed carrier which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base material 2 Thermoplastic resin sheet 3 Peripheral part 4 Protrusion 5 Compartment space 6 Supply / discharge hole 10 Holding layer 20 Semiconductor wafer (article to be mounted)
30 Substrate storage container 31 Container body 50 Lid 60 Stamper 61 Uneven surface

Claims (3)

A substrate having rigidity, and a deformable holding layer for removably adhesive holding the mounting article provided superimposed on the substrate, the substrate, with contacting the retaining layer provided with a plurality of projections A method for manufacturing a fixed carrier provided with supply / discharge holes connected to a partition space between a plurality of protrusions and a holding layer,
The uneven surface of the stamper is brought into contact with the thermoplastic resin sheet and heated and pressurized, and the thermoplastic resin sheet is cooled under pressure to integrally form the base material, the plurality of protrusions, and the supply / discharge holes. A thin film holding layer is adhered to the peripheral edge of the sheet to cover the tip surfaces of the plurality of protrusions, and a partition space is formed between the plurality of protrusions and the holding layer. The air is exhausted to the outside, the holding layer is deformed into irregularities according to the plurality of protrusions, and then the contact portion surface of the holding layer that contacts the tip surfaces of the plurality of protrusions is roughened and non-adhesive treatment is performed. A manufacturing method of a fixed carrier.   The manufacturing method of the fixed carrier of Claim 1 which heats and pressurizes in the temperature range until it raises by 50 degreeC from the glass transition temperature of a thermoplastic resin sheet, and cools at the temperature which reduced 20 degreeC or more from the glass transition temperature.   The method for manufacturing a fixed carrier according to claim 1, wherein each protrusion has a height of 0.05 mm or more.

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