JP4573763B2 - Adsorption device - Google Patents

Description

  The present invention relates to a suction device used in a back grinding process or a dicing process of a semiconductor wafer.

  The semiconductor wafer is preferably thick so that it does not warp in the pre-process of semiconductor manufacturing, but the thickness as it is is not suitable for recent semiconductor packages that require thinning, miniaturization, and weight reduction. After the back surface is cut and thinned by a grinder device in a process called a process, the process is transferred to the next process (see Patent Document 1).

  When the semiconductor wafer is thinned in the back grinding process and transferred to the next process, first, the protective sheet 60 is adhered to the pattern forming surface of the semiconductor wafer W having a thickness of about 750 μm and cut into a preferable size (FIG. 15). Then, the semiconductor wafer W is stored in the substrate storage cassette 20A which is a stocker and transferred to the grinder device 61 shown in FIG.

  After the substrate storage cassette 20A is conveyed to the grinder device 61, the semiconductor wafer W is set on the chuck table 62 of the grinder device 61, and the chuck table 62 is rotated to perform rough grinding and finish grinding on the back surface of the semiconductor wafer W. Then, the semiconductor wafer W thinned to about 50 μm by back grinding is stored in the substrate storage cassette 20A or cleaned by the cleaning device 63.

Then, the thinned semiconductor wafer W is transported from the grinder device 61 to the stress relief device 64 inline downstream by a transport line, and the damaged layer on the back surface where the strength of the semiconductor wafer W is reduced is removed by an etching solution or polish. After the bending strength is improved, if the semiconductor wafer W is stored in the substrate storage cassette 20A, the thinned semiconductor wafer W can be transferred to the next process by the substrate storage cassette 20A (see Patent Document 2).
JP 2005-223359 A JP 2000-100924 A

  The conventional semiconductor wafer W is thinned as described above and simply stored in the substrate storage cassette 20A. However, the semiconductor wafer W is very thin (for example, 50 μm or less), is easy to bend, and is easily broken. There is a big problem that it easily breaks inside. In addition, there is a problem that it cannot be handled in the subsequent work because it often warps like a bow.

  The present invention has been made in view of the above, and an object of the present invention is to provide an adsorption device that can suppress easy breakage during handling even when the substrate is thin.

In the present invention, in order to solve the above-mentioned problem, an apparatus in which a suction jig for holding a substrate is removably supported on a suction pad ,
The suction jig is provided on the plate body having rigidity, a concave portion formed on the surface of the plate body, a deformable holding layer that covers the concave portion and detachably adheres and holds the substrate. An exhaust hole for exhausting the gas in the concave portion covered with the holding layer to the outside, and the concave portion is provided with a plurality of support protrusions for supporting the holding layer,
The suction pad includes a pad that overlaps the back surface of the suction jig plate and an arm that extends from the pad. The pad includes an opposing hole that faces the back surface of the suction jig and an exhaust hole of the suction jig. A communication hole that communicates with each other, and at least the arm of the pad and the arm is provided with a supply / discharge path that communicates with the opposing hole of the pad and a discharge path that communicates with the communication hole of the pad
It is characterized in that a part of the holding layer is deformed and attached to the concave portion of the suction jig, and a penetrating part communicating with the opposing hole of the suction pad is provided from the deformed part of the holding layer to the plate body .

The suction pad supply / discharge path can be connected to a supply / discharge device, and the suction pad discharge path can be connected to a negative pressure source.

In order to solve the above problems, the present invention comprises a substrate storage cassette and a suction jig configured to be stored in the substrate storage cassette, supported by a suction pad, and holding a substrate. There,
The substrate storage cassette has a shelf that is laid (bridged) between a plurality of opposing walls, a recess that is formed on the shelf, and a substrate or suction jig that can be attached to and detached from the recess. It may be characterized by comprising a flexible holding layer for holding adhesive and an exhaust passage for exhausting the gas in the recess covered by the holding layer to the outside.

A plurality of protrusions that support the holding layer can be arranged in the recesses of the shelf plate at intervals.
Further, the exhaust passage can be detachably connected to the negative pressure source, and the negative pressure source can be driven to deform the holding layer.

Furthermore, in order to solve the above-described problems, the present invention includes a substrate storage cassette and a suction jig configured to be stored in the substrate storage cassette and supported by the suction pad and holding the substrate. There,
The substrate storage cassette is constructed between a plurality of opposing walls and mounted with a shelf plate on which a substrate or suction jig is mounted, a recess formed on the shelf plate and covered with the substrate or suction jig, and a negative pressure source. And an exhaust passage for exhausting gas from the covered recess to the outside based on the driving, and the recess may be provided with a plurality of protrusions for supporting the substrate or the suction jig.

  Here, the substrate in the claims is mainly a back-ground thin semiconductor wafer having a thickness of 300 μm or less (for example, a silicon wafer having a diameter of 200 mm or 300 mm), but is not limited thereto. . For example, it may be a thick semiconductor wafer, a glass substrate that requires a thickness of 1 mm or less, a flexible high-density flexible wiring board that requires a thickness of 100 μm or less, a liquid crystal cell, or a printed wiring board. .

  The suction jig or the pad of the suction pad is preferably formed to have substantially the same size as the substrate, slightly larger than the substrate, or slightly smaller than the substrate. The plate body and the concave portion of the suction jig can be formed in a circular shape or a polygonal shape in a plan view. The holding layer may be made of a single elastomer, or may be a plurality of laminated elastomers having different properties (material, hardness, elasticity, viscosity, etc.).

  The plurality of support protrusions may be regularly arranged in the recesses, or may be irregularly arranged, and may be provided as an integral structure or separate from the recesses. Each support protrusion can be formed in a truncated cone shape, a prism shape, a truncated pyramid shape, or the like, and may or may not be adhered to the holding layer.

  The counter hole and the communication hole are not particularly limited to a single hole, but a round hole, an elliptical hole, an arc-shaped hole, a rectangular hole, and a plurality of straight grooves are arranged in a line, or in an X shape. An arrayed slot or the like may be used. The supply / discharge device includes at least a negative pressure source, a compressor, a fan, and the like. Further, the negative pressure source includes, for example, various vacuum pumps, vacuum blowers and the like, and does not particularly ask whether or not the ejector is attached.

According to the present invention, when the substrate is held by the suction device, if the holding layer of the suction jig supported by the suction pad is brought into contact with the suction surface of the substrate, the substrate is brought into contact with the adhesive force of the holding layer. Can be held substantially flat.
When it is desired to remove the substrate from the holding layer of the suction jig, the gas in the recess may be exhausted out of the recess through the exhaust hole. Then, as the gas is exhausted, the holding layer is deformed in the bottom direction of the recess to form a gap between the substrate and the contact portion between the holding layer and the substrate is reduced.

  According to the present invention, even if a substrate such as a semiconductor wafer is thin, it is possible to provide an adsorption device that is not easily damaged during handling or the like. In addition, since the suction jig of the suction device can be removed from the suction pad, the substrate, the suction jig, or the suction jig with the substrate mounted thereon can be appropriately stored in a substrate storage cassette, container, jig, or the like. This makes it possible to facilitate the transportation, handling, storage, etc. of the substrate.

In addition, a part of the holding layer is deformed and attached to the concave portion of the suction jig, and a penetrating part communicating with the opposing hole of the suction pad is provided from the deformed part of the holding layer to the plate body. Gas can be supplied to and discharged from the gap between the deformed part and the holding force and the releasing force with respect to the substrate can be increased, thereby making it easy to attach and detach the substrate.

  Moreover, if the suction pad supply / discharge path is connected to the supply / discharge device, the suction jig can be vacuum-sucked to or removed from the suction pad. Furthermore, if the suction path of the suction pad is connected to a negative pressure source, the gas in the recess can be exhausted to deform the holding layer, and the substrate adhered to the holding layer can be removed.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 16, the adsorption apparatus in this embodiment is an adsorption treatment for a semiconductor wafer W thinned by back grinding. The tool 1 is detachably supported by the suction pad 10, and the suction jig 1 is moved from the grinder device 61, which is a semiconductor manufacturing apparatus, to the substrate storage cassette 20, the cleaning device 63, or the next process such as a dicing process. To be transported as appropriate.

  As shown in FIGS. 1, 2, 6, 7, and 10, the semiconductor wafer W is made of, for example, a silicon wafer having a diameter of 300 mm, and the peripheral portion has a notch that makes it easy to determine and align the crystal direction. Cut out into a semi-elliptical shape.

  As shown in FIGS. 1 and 2, the suction jig 1 includes a thin plate 2 having rigidity, a recessed hole 3 formed in the plate 2, and a semiconductor wafer W that covers the recessed hole 3. An elastically deformable holding layer 5 that is detachably adhered and held, and an exhaust hole 6 that exhausts the air in the recessed hole 3 covered with the holding layer 5, and the holding layer 5 is supported in the recessed hole 3. A plurality of supporting protrusions 4 are arranged side by side.

  The plate body 2 is formed in a disk shape that is substantially the same as or slightly larger than the semiconductor wafer W using a predetermined material, and the substrate storage cassette 20 is in a state where the semiconductor wafer W is adhesively held or not adhesively held. Stored horizontally. The material of the plate 2 is not particularly limited. For example, PC, PP, PE, acrylic resin that can suppress the amount of bending when the semiconductor wafer W is mounted on the plate 2 to 5 mm or less, Examples include vinyl chloride resin, aluminum alloy, magnesium alloy, glass, and stainless steel.

  As shown in FIG. 1 to FIG. 5 and the like, the recessed hole 3 is formed to be shallowly recessed at most of the surface of the plate body 2 except the peripheral edge, and is formed in a circular shape slightly smaller than the semiconductor wafer W. A plurality of support protrusions 4 for adhering and supporting the holding layer 5 are regularly arranged on the bottom surface of the recess hole 3 with a gap, and each support protrusion 4 has substantially the same length and height as the depth of the recess hole 3. It is formed in a cylindrical shape. The plurality of support protrusions 4 are integrally formed on the bottom surface of the recessed hole 3 by a molding method, a sandblast method, an etching method, or the like, for example.

  As shown in FIGS. 1 and 2, the holding layer 5 is formed into a flat thin circular film that is substantially the same as or slightly larger than the semiconductor wafer W by using a flexible, adhesive, and elastic material. In addition to being laminated and adhered to the peripheral edge of the surface of the plate body 2, it is adhered to the flat surface of each support projection 4, and the air circulation space is provided between the bottom surface of the recess 3 by covering the recess 3. Partition.

  The material of the holding layer 5 is not particularly limited, and examples thereof include silicone-based, urethane-based, olefin-based, and fluorine-based elastomers that are excellent in heat resistance, weather resistance, water resistance, peelability, stability over time, and the like. used. The holding layer 5 selectively holds the protective sheet surface side or the back surface side of the semiconductor wafer W.

  As shown in the figure, the exhaust hole 6 is rounded in the outer thickness direction of the plate body 2 and exhausts the air in the recessed hole 3 covered with the holding layer 5 and is flattened by the exhaust of this air. The holding layer 5 is deformed in the direction of the bottom surface of the recessed hole 3 to form a gap for inflow of air at the interface between the holding layer 5 and the semiconductor wafer W so as to facilitate the peeling of the adhered semiconductor wafer W.

  As shown in the figure, the suction pad 10 includes a pad 11 that is slidably stacked on the back surface of the suction jig 1 and a long plate-like arm 14 that linearly extends rearward from the rear portion of the pad 11. The pad 11 and the arm 14 are integrally formed of a predetermined molding material in a transparent manner, and the arm 14 is supported by a robot (not shown) so as to be movable in the XYZ directions and rotatably.

  The pad 11 is formed in a disk shape slightly smaller than the semiconductor wafer W or the suction jig 1, and the center of the front surface of the suction jig 1 that overlaps the rear surface of the suction jig 1 is centered on the rear surface of the suction jig 1. A large-diameter counter-slot 12 facing the part is perforated shallowly, and a communication slot 13 communicating with the exhaust hole 6 of the suction jig 1 is deeply perforated at the peripheral edge of the surface.

  From the pad 11 to the rear side of the arm 14, there are a supply / discharge passage 15 whose upstream end communicates with the opposing groove 12 of the pad 11 and a discharge passage 16 whose upstream end communicates with the communication groove 13 of the pad 11. The downstream end portion of the supply / discharge passage 15 that is provided side by side so as not to cross each other and is exposed from the rear rear surface of the arm 14 is connected to the supply / discharge device 17 that is a vacuum pump, and the discharge passage that is exposed from the rear rear surface of the arm 14 The downstream end of 16 is connected to a negative pressure source 18 comprising a vacuum pump.

  The supply / discharge device 17 functions to evacuate the air in the facing slot 12 and vacuum-suck the back surface of the suction jig 1 into the pad 11 and the facing slot 12. The negative pressure source 18 is driven in accordance with the attachment / detachment of the semiconductor wafer W, exhausts the air in the space of the recessed hole 3 to the outside through the exhaust hole 6 and the communication groove hole 13, thereby removing the holding layer 5 from the recessed hole 3. Deformation of the semiconductor wafer W is facilitated by forming a gap for air inflow at the interface between the holding layer 5 and the semiconductor wafer W by deforming it into irregularities in the bottom direction.

  The substrate storage cassette 20 covers a plurality of shelf plates 31 that are built in and arranged in a front open box type cassette case 21, a recess hole 32 that is a recess formed in each shelf plate 31, and the recess hole 32. An elastically deformable close contact holding layer 34 for holding the semiconductor wafer W or the suction jig 1 in an attachable / detachable manner, and a plurality of exhaust passages 35 for exhausting the air in the recessed holes 32 covered by the close contact holding layer 34. It is positioned and mounted on a semiconductor manufacturing apparatus including the grinder device 61 and the like used from the back grinding process to the subsequent processes and the opener 50 thereof.

  As shown in FIG. 6 to FIG. 9, the cassette case 21 includes a pair of left and right side walls 22 facing each other with a gap sufficient to accommodate the semiconductor wafer W or the suction jig 1, and the lower portions of the pair of side walls 22. A bottom plate 23 is horizontally installed between the top plates 24, and a top plate 24 is horizontally installed between the upper ends. A vertically long back wall 25 is attached to the opened back surface, and the front surface is opened and thinned. It functions as a loading / unloading port for the semiconductor wafer W and the suction jig 1.

  The side wall 22, the bottom plate 23, the top plate 24, and the back wall 25 of the cassette case 21 are separately molded using a molding material such as transparent PC or PEEK, which is excellent in impact resistance, heat resistance, water resistance, and the like. It is assembled through screws and nuts.

  The side wall 22 of the cassette case 21 is formed as a vertically long plate extending in the vertical direction, and a plurality of positioning tools 26 are arranged on the front side and the rear center of the bottom plate 23 so as to draw a triangle in a bottom view. . Each positioning tool 26 is formed in a substantially flat track-shaped block, and a V-groove 27 slidably contacting the positioning pin 51 protruding from the stage of the opener 50 is cut out in the longitudinal direction, and the V-groove 27 is formed in the opener 50. By fitting to the positioning pins 51 from above, the substrate storage cassette 20 functions to position with high accuracy.

  An IC tag 28 for constructing an RFID system is affixed to the top plate 24 of the cassette case 21 and a handle 29 for gripping is detachably attached to the back wall 25. A vertically long observation window 30 that enables the viewing of 34 is selectively formed.

  As shown in FIGS. 6 and 7, the plurality of shelf boards 31 are arranged at a predetermined pitch in the vertical direction inside the cassette case 21, and between the shelf boards 31 and 31, the semiconductor wafer W and the suction are arranged. A space that does not hinder the loading and unloading of the jig 1 is secured. Each shelf board 31 is formed in a planar rectangle larger than the semiconductor wafer W, the suction jig 1 and the adhesion holding layer 34 using a predetermined material, and is horizontally placed between both side walls of the cassette case 21 via screws, nuts, or the like. It will be erected.

  The material of the shelf board 31 is not particularly limited. For example, PES, PAI, PET, PBT, PEN, PEI, PEEK, PPS, polyarylate, aluminum, magnesium, copper, nickel, glass, ceramics, etc. can give.

  As shown in FIGS. 7 and 10, the recessed hole 32 is formed in a shallow recess on the surface of each shelf plate 31, and has a planar rectangle larger than the semiconductor wafer W and the suction jig 1. A plurality of protrusions 33 that support the adhesion holding layer 34 from below are regularly arranged in parallel on the bottom surface of the recess hole 32, and each protrusion 33 has substantially the same length and height as the depth of the recess hole 32. It is formed in a cylindrical shape.

  As shown in FIGS. 6, 7, and 10, the adhesion holding layer 34 is a flat, rectangular, and flexible thin film that is larger than the semiconductor wafer W and the suction jig 1 using a flexible, adhesive, and elastic material. And is laminated and adhered to the surface of each shelf plate 31 and is adhered to the surface of each projection 33, covering the hollow 32 and partitioning the space for air circulation between the bottom surface thereof. To do. The material of the adhesion holding layer 34 is not particularly limited, but examples thereof include silicone, urethane, olefin, and fluorine resins that are excellent in heat resistance, weather resistance, water resistance, peelability, stability over time, and the like. An elastomer is used.

  As shown in the figure, the plurality of exhaust passages 35 are formed in the interior of the substrate storage cassette 20 at intervals according to the number of the shelf boards 31 and the adhesion holding layers 34, and the substrate storage cassette 20 is connected to the opener 50. By being positioned and mounted with high accuracy, it is automatically connected to the vacuum unit 38 built in the opener 50.

  Each exhaust passage 35 is formed in the inside of the shelf 31 and is formed in the first vertical passage 36 in which the upstream end communicates with the recessed hole 32 from below, and is formed in the vertical direction inside the one side wall 22. And a second passage 37 communicating with the downstream end portion opened on the side surface of the shelf plate of the passage 36, and the downstream end portion of the second passage 37 opens on the bottom surface of the side wall 22 to connect to the connection nozzle 39 of the vacuum unit 38. Are detachably connected to each other through an O-ring or the like.

  As shown in FIG. 7, the vacuum unit 38 includes, for example, a vacuum pump 40 in which the connection nozzle 39 is exposed in a standing state on the stage of the opener 50, an attached tank, and the like, and is driven according to the suction of the suction pad 10. The air in the space of the recessed hole 32 is exhausted to the outside so that the flat contact holding layer 34 is deformed in a concave-convex shape toward the bottom surface of the recessed hole 32, and an air inflow gap is formed at the interface between the contact holding layer 34 and the semiconductor wafer W or the like. The semiconductor wafer W and the adhering jig 1 adhered to each other are easily peeled off. The other parts are the same as those in the conventional example, so the description thereof is omitted.

  In the above, when the semiconductor wafer W that has been back-ground and thinned by the grinder device 61 is transferred to the shelf plate 31 of the substrate storage cassette 20, first, the substrate consisting of the back surface of the semiconductor wafer W adsorbed to the chuck table 62 is used. The suction jig 1 of the suction device is opposed to substantially all of the suction surface from above, and the suction jig 1 is pressed down to hold the semiconductor wafer W on the holding layer 5 (see FIGS. 1, 3, and 4). Then, the chucking of the chuck table 62 is released and the semiconductor wafer W is transferred to the substrate storage cassette 20 by the chucking device (see FIGS. 5 and 6).

  After the semiconductor wafer W is transported to the substrate storage cassette 20, the semiconductor wafer W is pressed onto the surface of the adhesion holding layer 34 with a slight force and stacked, and the semiconductor wafer W is stabilized and flat by the adhesive force of the adhesion holding layer 34. Then, the negative pressure source 18 of the adsorption device is driven. Then, the air in the space of the recessed hole 3 is exhausted to the outside, the flat holding layer 5 is deformed into irregularities along the plurality of support protrusions 4, and an air inflow gap is formed at the interface between the holding layer 5 and the semiconductor wafer W. A large number of semiconductor wafers W can be removed from the suction jig 1 (see FIGS. 2 and 7).

  According to the above configuration, since the semiconductor wafer W can be closely and closely supported without gaps by the adhesive force of the holding layer 5 of the suction jig 1, the semiconductor wafer W is thinned to 50 μm or less by back grinding, Even if it is fragile, it is not easily damaged during transportation or handling.

  Further, it is possible to prevent the peripheral edge of the thinned semiconductor wafer W from flapping and deforming like a bow, or the peripheral edge of the curved semiconductor wafer W from interfering with the surroundings. The wafer W can be smoothly and reliably stored, the handling property in the subsequent work can be remarkably improved, and the handling safety between processes can be greatly contributed. In addition, since the semiconductor wafer W can be closely adhered and supported only by the adhesive force of the holding layer 5, a dedicated vacuum device or the like for holding the semiconductor wafer W flat can be omitted, and the apparatus can be simplified. Significant cost reduction can be achieved.

  In addition, since the plurality of support protrusions 4 that adhere and support the holding layer 5 are arranged on the bottom surface of the recessed hole 3, the holding layer 5 is excessively recessed over a wide range, or the posture of the semiconductor wafer W of the holding layer 5 is It is possible to reliably prevent collapse and tilting, or positional displacement and dropout. Further, since the suction jig 1 and the suction pad 10 are not fixed and can be removed by vacuum suction, the suction jig 1 and the semiconductor wafer in addition to the semiconductor wafer W can be added to the substrate storage cassette 20 and the conventional substrate storage cassette 20A. The suction jig 1 on which W is mounted can be accommodated as appropriate, thereby greatly enhancing the convenience of transporting, handling, or storing the semiconductor wafer W.

  In addition, since the semiconductor wafer W can be adhered and supported substantially flat without gaps by the adhesive force of the adhesion holding layer 34 of the substrate storage cassette 20, even if the semiconductor wafer W is thinned to 50 μm or less by the back grind and is brittle. It is possible to prevent damage during transportation or handling.

  Further, according to the substrate storage cassette 20, it is possible to prevent the peripheral portion of the thinned semiconductor wafer W from flapping and deforming into a bow shape, or preventing the peripheral portion of the curved semiconductor wafer W from interfering with the surroundings. Therefore, the semiconductor wafer W can be smoothly and reliably stored in the substrate storage cassette 20, the handling property in the subsequent work can be improved, and the handling safety between processes can be contributed.

  In addition, since the semiconductor wafer W can be adhered and supported for a long time only by the adhesive force of the adhesion holding layer 34 of the substrate storage cassette 20, a dedicated vacuum apparatus or the like for holding the semiconductor wafer W can be omitted, and the apparatus can be simplified. And cost reduction. In addition, since the plurality of protrusions 33 for adhering and supporting the adhesion holding layer 34 are arranged on the bottom surface of the recessed hole 32, the adhesion holding layer 34 is greatly recessed over a wide range, or the posture of the semiconductor wafer W of the adhesion holding layer 34 is It is possible to prevent collapse or displacement due to displacement.

  Further, since the IC tag 28 is attached to the cassette case 21, it is possible to clearly identify the semiconductor wafer W and the substrate storage cassette 20 without contact, and between the IC tag 28 and the reader / writer of the RFID system. Even if obstacles other than metal (for example, water, synthetic resin, etc.) intervene, reliable communication can be expected.

  Next, FIGS. 11 and 12 show a second embodiment of the present invention. In this case, the central portion of the holding layer 5 is formed in a substantially funnel cross section at the central portion of the recessed hole 3 of the suction jig 1. A round through hole 41 communicating with the opposing groove hole 12 of the suction pad 10 is drilled from the recessed central portion of the holding layer 5 to the central portion thickness direction of the plate body 2, and the supply / discharge passage 15 is formed. The downstream end is connected to a supply / discharge device 17 comprising a vacuum pump and a blower to evacuate or pump air.

  In the above, when the semiconductor wafer W that has been back-ground and thinned by the grinder device 61 is transferred to the shelf plate 31 of the substrate storage cassette 20, first, the substrate consisting of the back surface of the semiconductor wafer W adsorbed to the chuck table 62 is used. The suction jig 1 of the suction device is pressed from above on almost all of the suction surfaces to hold the semiconductor wafer W by adhesion, and the supply / discharge device 17 is driven to air from between the central portion of the semiconductor wafer W and the holding layer 5. The semiconductor wafer W is sucked and held by evacuating to the outside through the through hole 41, the opposing groove hole 12, and the supply / discharge path 15, the suction of the chuck table 62 is released, and the semiconductor wafer W is transported to the substrate storage cassette 20. (See FIG. 11).

  After the semiconductor wafer W is transported to the substrate storage cassette 20, the semiconductor wafer W is pressed onto the surface of the adhesion holding layer 34 with a slight force and stacked, and the semiconductor wafer W is stabilized and flat by the adhesive force of the adhesion holding layer 34. Are brought into close contact with each other, and the supply / discharge device 17 and the negative pressure source 18 of the adsorption device are respectively driven. Then, air is supplied from the supply / discharge device 17 between the semiconductor wafer W and the central portion of the holding layer 5 through the supply / discharge path 15, the counter groove 12, and the through hole 41 in order, and air flows between them. Thus, the semiconductor wafer W can be quickly removed from the suction jig 1 (see FIG. 12).

  Further, the air in the space of the recessed hole 3 is exhausted to the outside, the flat holding layer 5 is deformed into irregularities along the plurality of support protrusions 4, and an air inflow gap is formed at the interface between the holding layer 5 and the semiconductor wafer W. Once formed, the semiconductor wafer W can be removed from the suction jig 1. In these cases, if the air supply force of the supply / exhaust device 17 is larger than the air exhaust force of the negative pressure source 18, it is difficult to vacuum-suck the suction jig 1 to the suction pad 10. The air supply force is preferably less than the air exhaust force of the negative pressure source 18. That is, it is preferable that the surface area of the exhaust hole 6 × the vacuum pressure of the discharge path 16> the surface area of the opposed slot 12 × the air pressure of the supply / discharge path 15. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected, and air is sucked or supplied between the semiconductor wafer W and the central portion of the holding layer 5 which is greatly recessed. Clearly, desorption can be further facilitated.

Next, FIG. 13 shows a third embodiment of the present invention. In this case, the back wall 25 is omitted from the cassette case 21 of the substrate storage cassette 20, and the adhesion holding layer 34 is omitted. The protrusion 33 directly supports the semiconductor wafer W and the suction jig 1.
In this case, another negative pressure source such as a vacuum pump connected to the downstream end of the exhaust passage 35 is attached to the cassette case 21, and the semiconductor wafer W and the suction jig 1 are evacuated based on the driving of the negative pressure source. You may make it adsorb | suck. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effect as the above embodiment can be expected, and besides the diversification of the configuration of the substrate storage cassette 20, the back wall 25 and the adhesion holding layer 34 can be omitted, so that the number of parts can be greatly reduced. It is clear that this can be achieved.

Next, FIG. 14 shows a fourth embodiment of the present invention. In this case, the first passage 36 communicating with the peripheral surface of the recessed hole 32 is formed in a substantially groove shape on the surface of the shelf plate 31. A close contact holding layer in which the first passage 36 extends to the side surface of the shelf 31 and can be connected to the upstream end portion of the second passage 37 formed in the side wall 22 and the first passage 36 is enlarged. 34 is covered. The other parts are the same as those in the above embodiment, and the description thereof is omitted.
In the present embodiment, it is obvious that the same operational effects as those of the above-described embodiment can be expected, and the configuration of the exhaust passage 35 can be diversified.

  In the above embodiment, the suction pad 10 is formed to be transparent. However, the present invention is not limited to this. For example, the suction pad 10 may be formed to be opaque or semi-transparent, or the pad 11 may be formed to have a substantially planar polygon. A shaped plate may be attached, and this plate may be stacked on the back surface of the plate body 2 to stabilize the posture. In addition, a detachable lid and a door that can be opened and closed may be provided on the front surface of the cassette case of the substrate storage cassette 20, and handles and flanges for the operator to hold on both side walls of the cassette case 21. You may wear it.

  Further, the cassette case 21 has a well-known configuration in which shelves 31 are arranged, or a plurality of a pair of left and right teeth supporting the semiconductor wafer W are provided on the inner surfaces of both side walls of the cassette case 21 so that the shelf plate 31 is omitted. You may do it. Alternatively, the peripheral edge of the adhesion holding layer 34 can be bonded and supported on the peripheral surface of the depression hole 32, and a space can be defined between the bottom surface of the depression hole 32 and the adhesion holding layer 34. In addition, an exhaust passage 35 is formed inside the shelf plate 31 and communicates with the recessed hole 32, and is formed inside the side wall 22 and the bottom plate 23 and at the downstream end of the first passage 36. It is also possible to form a second passage 37 that communicates, and to open the downstream end of the second passage 37 on the back surface of the bottom plate 23.

  In addition, the connection nozzle 39 with the seal of the vacuum pump 40 is moved up and down with respect to the stage of the opener 50 by an actuator such as an air cylinder, and the vacuum pump 40 is connected to the downstream end of the exhaust passage 35 of the positioned substrate storage cassette 20. You can also Further, the substrate storage cassette 20 may be used only immediately after the back grinding operation in the back grinding process.

  Further, when the back grinding process includes an operation of attaching the UV tape necessary for the dicing process to the back surface of the semiconductor wafer W and an operation of peeling the protective sheet 60 from the pattern forming surface of the semiconductor wafer W, May be used for

It is a section explanatory view showing typically the adhesion maintenance state of a semiconductor wafer in the embodiment of the adsorption device concerning the present invention. It is sectional explanatory drawing which shows typically the removal state of the semiconductor wafer in embodiment of the adsorption | suction apparatus which concerns on this invention. It is explanatory drawing which shows typically the state which made the adsorption jig of the adsorption device oppose on the semiconductor wafer in embodiment of the adsorption device which concerns on this invention. It is explanatory drawing which shows typically the state which closely_contact | adhered the holding layer of the adsorption jig to the semiconductor wafer of FIG. FIG. 5 is an explanatory view schematically showing a state in which the chucking of FIG. 4 is released and a semiconductor wafer is transferred. FIG. 3 is a partially exploded perspective view schematically showing a substrate storage cassette and the like in the embodiment of the suction device according to the present invention. It is a section explanatory view showing typically the substrate storage cassette in the embodiment of the adsorption device concerning the present invention. It is a bottom view of the substrate storage cassette of FIG. FIG. 8 is a rear view of the substrate storage cassette of FIG. 7. It is a section explanatory view showing typically a shelf board, a maintenance layer, etc. of a substrate storage cassette in an embodiment of an adsorption device concerning the present invention. It is sectional explanatory drawing which shows typically the adhesion holding | maintenance state of the semiconductor wafer in 2nd Embodiment of the adsorption | suction apparatus based on this invention. It is sectional explanatory drawing which shows typically the removal state of the semiconductor wafer in 2nd Embodiment of the adsorption | suction apparatus based on this invention. It is sectional explanatory drawing which shows typically the board | substrate storage cassette in 3rd Embodiment of the adsorption | suction apparatus based on this invention. It is a section explanatory view showing typically a shelf board, a maintenance layer, etc. of a substrate storage cassette in a 4th embodiment of an adsorption device concerning the present invention. It is explanatory drawing which shows the state which adhere | attaches and cuts a protection sheet on the pattern formation surface of a semiconductor wafer. It is plane explanatory drawing which shows a grinder apparatus etc.

Explanation of symbols

1 Suction jig 2 Plate 3 Recessed hole (recessed part)
4 Support protrusion 5 Holding layer 6 Exhaust hole 10 Suction pad 11 Pad 12 Opposite groove (opposite hole)
13 Communication groove (Communication hole)
14 Arm 15 Supply / exhaust path 16 Discharge path 17 Supply / exhaust device 18 Negative pressure source 20 Substrate storage cassette 21 Cassette case 41 Through hole (through part)
61 Grinder device 62 Chuck table W Semiconductor wafer (substrate)

Claims (2)

A suction device in which a suction jig for holding a substrate is removably supported by a suction pad,
The suction jig is provided on the plate body having rigidity, a concave portion formed on the surface of the plate body, a deformable holding layer that covers the concave portion and detachably adheres and holds the substrate. An exhaust hole for exhausting the gas in the concave portion covered with the holding layer to the outside, and the concave portion is provided with a plurality of support protrusions for supporting the holding layer,
The suction pad includes a pad that overlaps the back surface of the suction jig plate and an arm that extends from the pad. The pad includes an opposing hole that faces the back surface of the suction jig and an exhaust hole of the suction jig. A communication hole that communicates with each other, and at least the arm of the pad and the arm is provided with a supply / discharge path that communicates with the opposing hole of the pad, and a discharge path that communicates with the communication hole of the pad,
A suction device characterized in that a part of the holding layer is deformed and attached to the recess of the suction jig, and a penetrating part communicating with the opposing hole of the suction pad is provided from the deformed part of the holding layer to the plate . The suction device according to claim 1 , wherein the suction pad supply / discharge path is connected to a supply / discharge device, and the suction pad discharge path is connected to a negative pressure source.

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