JP2007194482A - Chuck device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chuck device which can attain the enhancement of working efficiency and the speeding up of work. <P>SOLUTION: The chuck device includes a device body 1 which is movable in the direction of three dimensions of XYZ and is installed rotatably, a plurality of depression holes 10 formed respectively in a plurality of planes of the device body 1, a plurality of holding layers 20 to tightly hold held articles detachably such as semiconductor wafers W etc. by covering the each depression holes 10, and a plurality of exhaust paths 30 to exhaust outside the air of the depression holes 10 covered by the each holding layer 20. Since the semiconductor wafers W can be held tightly not at one side but at both sides, the speeding up of work is expectable. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a chuck jig for detachably holding an article to be held made of a semiconductor wafer or the like.

  The semiconductor wafer is preferably thick so as not to warp in various processes of semiconductor manufacturing, but the thickness as it is is not suitable for recent semiconductor packages that require thinning, miniaturization, and weight reduction. After the back surface is cut and thinned in a process called a process, the process is transferred to the next process.

  When the semiconductor wafer is thinned in the back grinding process and transferred to the next process, it is not shown in the figure, but first, a protective sheet is attached to the pattern forming surface of the semiconductor wafer and cut into a preferred size, and the semiconductor wafer is attached with a vacuum pad. One by one is stored in the substrate storage cassette by the chuck jig and conveyed to the grinder device.

  When the substrate storage cassette is loaded into the grinder apparatus, the semiconductor wafer is set on the chuck table of the grinder apparatus, the chuck table is rotated, and rough grinding and finish grinding are sequentially performed on the back surface of the semiconductor wafer with a rotating grindstone, thereby approximately 750 μm. The semiconductor wafer thinned to about 50 μm from the thickness is cleaned with a cleaning device.

Then, the thinned semiconductor wafer is transported from the grinder device to a stress relief device inline downstream with a transport line, and the damaged layer on the back surface where the strength of the semiconductor wafer has been reduced is removed with an etching solution or polish to obtain a bending strength. After the semiconductor wafer is improved, if the semiconductor wafers are stored one by one in the substrate storage cassette by the vacuum pad, the semiconductor wafer can be transferred to the dicing process by the substrate storage cassette (see Patent Documents 1 and 2).
JP 2003-77982 A JP-A-2005-150528

  By the way, the conventional chuck jig has a single-sided structure in which only one side can be vacuum-sucked. In the case of this single-sided chuck jig, the processing is performed by sucking and holding the semiconductor wafer of the loading cassette, moving it to the upper surface of the processing table, transferring the semiconductor wafer to the processing table, waiting for the semiconductor wafer to be ground, and processing table. A series of operations includes suction gripping of the upper semiconductor wafer, movement to the loading cassette, and storage in the loading cassette.

  While the chuck jig is operating the semiconductor wafer, the apparatus main body is in a standby state without processing, and while the apparatus main body is processing the semiconductor wafer, the chuck jig is in a standby state. is there. Such a single-sided chuck jig has a problem that the operation cannot be speeded up.

  The present invention has been made in view of the above, and an object of the present invention is to provide a chuck jig capable of improving work efficiency and speeding up work.

In the present invention, in order to solve the above problems, a chuck jig for holding an article to be held,
A jig body that is movable and rotatable in a three-dimensional direction, a plurality of recesses formed on a plurality of surfaces of the jig body, and covering each recess to detachably hold an article to be held. It is characterized by comprising a plurality of holding layers and a plurality of exhaust passages for exhausting the gas in the recesses covered with each holding layer to the outside.

It is preferable to include a negative pressure source that is connected to the exhaust path and deforms the holding layer by setting the concave portion to a negative pressure.
Further, the jig body can be formed in a substantially plate shape, and concave portions can be formed on both sides thereof.
Moreover, a recessed part can be formed in the several surface as a jig body as a polyhedron.
Furthermore, it is preferable to provide a plurality of support protrusions for supporting the holding layer in the recess.

  Here, the article to be held in the claims includes at least a back-ground thin semiconductor wafer having a thickness of 300 μm or less (for example, a silicon wafer having a diameter of 200 mm or 300 mm), a thick semiconductor wafer, and a thickness of 1 mm or less. Includes required glass substrates, flexible high-density flexible wiring boards that require a thickness of 100 μm or less, printed wiring boards, liquid crystal cells, optical films, ceramic capacitors and their materials, and various electronic components. .

  The jig body can be configured as a polyhedron such as a flat plate or a cross section having a triangular shape, hexagonal shape, octagonal shape, or the like. Further, the number of the concave portions, the holding layers, and the exhaust passages is not particularly limited as long as it is plural. The recess and the holding layer can be formed in an elliptical shape, a rectangular shape, a polygonal shape, or the like in plan view. As long as the holding layer has a size corresponding to the size of the article to be held, it may be made of a single elastomer, or may be a plurality of laminated elastomers having different properties (material, hardness, elasticity, etc.). it can. The negative pressure source is composed of various vacuum pumps, for example, and does not particularly ask whether or not the ejector is attached.

  The plurality of support protrusions may be regularly arranged in the recesses, or may be irregularly arranged, and may be provided as an integral structure or separate from the recesses. Each support protrusion can be formed in a truncated cone shape, a prism shape, a truncated pyramid shape, or the like, and may or may not be adhered to the holding layer. Furthermore, the chuck jig according to the present invention can be used as a jig for holding an article to be held by being installed in various semiconductor manufacturing apparatuses or robots, and also as a holding table for holding the article to be held in the air. It can also be used as a transport device that holds and transports articles to be held.

  According to the present invention, when the article to be held is to be held by the chuck jig, the article to be held is in close contact with the holding layer when the article to be held is brought into strong contact with the holding layer. be able to. Then, after holding the article to be held on the holding layer, when holding another article to be held by the same chuck jig, the chuck jig is rotated and another article to be held is not yet used. If the holding layer on the surface is in strong contact, the article to be held can be tightly supported as described above.

  In order to remove the article to be held in close contact with the holding layer, the negative pressure source may be driven. Then, the gas in the concave portion is exhausted out of the concave portion by the exhaust passage, and the holding layer is deformed in the bottom direction of the concave portion to form a gap between the holding article and the held article that is in close contact with the holding layer. Can be removed.

According to the present invention, since a plurality of holding layers are provided on a rotatable jig body, there are effects that work efficiency can be improved and work can be speeded up.
Also, if a negative pressure source is used that is connected to the exhaust passage and deforms the holding layer with negative pressure in the recess, gas flows between the deformed holding layer and the article to be held. The non-contact portion of the article is increased and removal is facilitated.

Further, if the jig body is formed in a substantially plate shape and the concave portions are formed on both sides thereof, the articles to be held can be closely adhered to the front and back surfaces of the jig body via the holding layer.
Further, if the jig body is a polyhedron and concave portions are formed on a plurality of surfaces thereof, the articles to be held can be closely adhered to the plurality of planes of the jig body via the holding layer, so that the articles to be held that can be handled at one time. Can be expected to increase.
Furthermore, if a plurality of support protrusions for supporting the holding layer are provided in the recess, the holding layer can be prevented from being excessively deformed, and the position and posture of the article to be held can be stabilized.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. The chuck jig of the embodiment shown in FIG. 1 and FIG. 2 is a flat and circular jig main body 1 having a rigid flat plate, two recessed holes 10 formed on two upper and lower surfaces of the jig main body 1, The two holding layers 20 that detachably adhere to and hold the semiconductor wafer W thinned by the back grind by covering the respective recessed holes 10 and the air in the recessed holes 10 covered by the respective holding layers 20 are exhausted to the outside. And two rows of exhaust passages 30 functioning as a handling device for a grinder device.

  The jig body 1 is formed in a disk having a size capable of holding the semiconductor wafer W by using a predetermined material, and a linear arm 2 is horizontally connected to the rear part. The arm 2 is a grinder. The apparatus is supported so as to be movable in the three-dimensional directions of XYZ and to be rotatable (including rotation, inversion, and swinging).

  The material of the jig body 1 is not particularly limited. For example, polyether sulfone, polyamide imide, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyether imide, polyether ether ketone, polyphenylene sulfide, poly Examples thereof include resin molding materials such as arylate, metal materials such as aluminum, magnesium, copper, stainless steel and nickel, glass and ceramics.

  The semiconductor wafer W is made of, for example, a silicon wafer having a diameter of 300 mm, and a notch n for facilitating discrimination and alignment of the crystal direction is cut out in a substantially semicircular plane on the periphery.

  The two recessed holes 10 are formed to be shallowly recessed at most of the jig body 1 except for the peripheral portions on both the front and back surfaces, and are formed in a planar circle that is wider than or slightly smaller than the semiconductor wafer W. A plurality of support protrusions 11 supporting the holding layer 20 from below are regularly arranged in parallel on the bottom surface of each recess hole 10, and each support protrusion 11 has substantially the same length and height as the depth of the recess hole 10. It is formed in a cylindrical shape. The plurality of support protrusions 11 are integrally formed on the bottom surface of the recessed hole 10 by a molding method, a sandblast method, an etching method, or the like, for example.

  The two holding layers 20 are formed into a flat circular and flexible thin film larger than the semiconductor wafer W using flexible, adhesive, and elastic materials, and are laminated on both the front and back surfaces of the jig body 1. In addition to being bonded, it is bonded to the surface of each support protrusion 11, covers the recessed hole 10, and divides a space for air circulation between the bottom surface. The material of the holding layer 20 is not particularly limited. For example, a silicone-based, urethane-based, olefin-based, or fluorine-based elastomer having excellent heat resistance, weather resistance, water resistance, peelability, stability over time, and the like. Is used.

  The two rows of exhaust passages 30 are juxtaposed so as not to cross from the jig main body 1 to the inner longitudinal direction of the arm 2, the upstream end portion communicates with the bottom of the recessed hole 10, and the downstream end portion is the vacuum pump 31. Is connected via a switching valve 32. The vacuum pump 31 is built in, for example, a grinder device, and exhausts the air in the recessed hole 10 (see the arrow in FIG. 1) to the outside through the exhaust passage 30 to cause the holding layer 20 to be recessed toward the bottom surface of the recessed hole 10. A large number of air inflow gaps are formed between the wafer W and the holding layer 20 so as to facilitate the separation of the semiconductor wafer W.

  In the above, when the semiconductor wafer W thinned by the back grind is held by the chuck jig, one holding layer 20 of the chuck jig is slightly placed on the entire surface of the semiconductor wafer W to be attracted. It is only necessary to press and stack with great force. Then, the semiconductor wafer W adheres in a stable flat posture without warping due to the adhesion force of the one holding layer 20.

  After holding the semiconductor wafer W on one holding layer 20, when it is desired to hold another semiconductor wafer W that has been cut into pieces by the same chuck jig, the chuck jig is not returned to the original reference position, The other holding layer 20 may be reversed by 180 ° so that the other holding layer 20 faces another semiconductor wafer W, and the other holding layer 20 may be pressed and overlapped on the entire surface of the other semiconductor wafer W with a slight force. Then, the semiconductor wafer W adheres in a stable posture without warping in the same manner as described above, so that a plurality of semiconductor wafers W can be transported at once, selectively attracted to the chuck table of the apparatus, or stored in the substrate. Can be sequentially stored in a cassette.

  In order to remove the semiconductor wafer W adhered to the holding layer 20, the vacuum pump 31 may be driven. Then, the air in the recessed hole 10 is exhausted to the outside of the recessed hole 10 via the exhaust path 30, and the holding layer 20 is bent along the plurality of support protrusions 11 to form a gap with the semiconductor wafer W. Therefore, the semiconductor wafer W that has been in close contact with the holding layer 20 can be easily removed.

  According to the above configuration, the semiconductor wafer W can be held in close contact with both sides instead of being held on one side, so that the operation can be significantly speeded up. Therefore, even when the semiconductor wafer W is transported from a plurality of transport lines or when the semiconductor wafers W are three-dimensionally stacked, the number of operations and the number of inversions of the chuck jig can be reduced. It is possible to greatly improve and prevent the delay of the cycle time from being suppressed.

  In addition, since the semiconductor wafer W adheres in a stable posture without bowing due to the adhesion force of the holding layer 20, the semiconductor wafer W can be reliably prevented from being cracked or deformed. Further, when fixing the semiconductor wafer W, no processing, power, and energy are required except that the holding layer 20 is brought into close contact, so that it can be held, transported, stored, and the like as it is.

  Further, since the semiconductor wafer W can be supported in close contact with the holding layer 20 only for a long time, a dedicated vacuum device or the like for holding the semiconductor wafer W flat can be omitted. Significant cost savings can be expected. Further, since the warpage of the thinned semiconductor wafer W can be corrected, the peripheral edge of the semiconductor wafer W can be prevented from interfering with the surroundings, and the semiconductor wafer W can be smoothly and reliably placed in the substrate storage cassette. It can be housed, the handling property in the subsequent work can be remarkably improved, and the handling safety between processes can be contributed.

  In addition, since a plurality of support protrusions 11 that adhere and support the holding layer 20 are arranged on the bottom surface of the recessed hole 10, the holding layer 20 is excessively recessed over a wide range, or the posture of the semiconductor wafer W of the holding layer 20 is It is possible to reliably prevent the tilting and breaking, or the position shifting and falling off. In addition, the chuck jig holding layer 20 is not simply overlapped and adhered to the central portion of the semiconductor wafer W, but the chuck jig holding layer 20 is overlapped and adhered to all the attracted surfaces of the semiconductor wafer W. The peripheral edge portion of the thinned semiconductor wafer W is not bent and cracked downward.

  Next, FIG. 3 shows a second embodiment of the present invention. In this case, the rotating jig body 1 is not a flat plate but a prismatic polyhedron, and the jig body 1 has a plurality of pieces. A concave hole 10, a holding layer 20, and an exhaust path 30 are provided on the surface, respectively, and the glass substrate G is detachably attached to and supported by an arbitrary holding layer 20. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected, and the jig body 1 is rotated at a predetermined rotation angle so that the plurality of holding layers 20 are sequentially opposed to the glass substrate G, and a plurality of glass sheets are formed. Since the substrate G can be held, it is obvious that an increase in the amount of processing that can be performed at a time can be greatly expected.

  An operation capable of shortening the processing time using the chuck jig of the present embodiment will be described. First, the chuck jig moves to the pre-processing wafer cassette that stores the pre-processing semiconductor wafer W, and the pre-processing semiconductor wafer W is held in close contact with the holding layer 20 on the lower surface side. When the semiconductor wafer W is held in close contact in this way, the semiconductor wafer W is transferred to the processing table, and the semiconductor wafer W before processing is transferred onto the processing table.

  While the processing apparatus is processing the semiconductor wafer W, the chuck jig does not stand by, and the semiconductor wafer W for moving to the pre-processing wafer cassette and performing the next processing is adhered to the holding layer 20 on the lower surface side. Hold. Subsequently, the chuck jig moves to the vicinity of the processing table, rotates 180 °, and the surface holding the semiconductor wafer W before processing is used as the upper surface, and the surface not holding the semiconductor wafer W is used as the lower surface side. In this state, the process waits until the processing of the semiconductor wafer W on the processing table is completed.

  After the processing of the semiconductor wafer W is completed, the chuck jig holds the upper surface of the semiconductor wafer W on the processing table in close contact with the holding layer 20 on the lower surface thereof, and is lifted and sufficiently separated from the processing table, and then rotated by 180 °. The processed semiconductor wafer W held in this way is set as the upper surface, and the unprocessed semiconductor wafer W is set as the lower surface. When the processed semiconductor wafer W is disposed on the upper surface and the unprocessed semiconductor wafer W is disposed on the lower surface, the chuck jig is lowered to transfer the unprocessed semiconductor wafer W onto the processing table.

  Subsequently, the chuck jig moves to a processed cassette for storing processed semiconductor wafers W, and rotates 180 ° to place the processed semiconductor wafers W on the lower surface onto a shelf in the processed cassette. A processed semiconductor wafer W is stored. Further, the chuck jig moves to the pre-processing wafer cassette to receive the semiconductor wafer W for the next processing.

  As described above, according to the chuck jig of the present invention, it is possible to carry out the time for carrying out and storing the semiconductor wafer W from the cassette in the time during which the processing apparatus main body processes the semiconductor wafer W, thereby improving the work efficiency. It will be. Further, an operation for keeping the semiconductor wafer W in close contact is unnecessary, and the vacuum pump 31 only needs to be driven only when the semiconductor wafer W is peeled off, so that a large structure for maintaining the vacuum is also unnecessary. For this reason, a relatively light material can be used as the chuck jig, and there is an advantage that it is easy to cope with a semiconductor wafer W having a large area.

  In the above-described embodiment, the semiconductor wafer W is simply adhered and supported on the holding layer 20, but the protective sheet surface side of the semiconductor wafer W may be adhered, or the back surface side of the semiconductor wafer W may be adhered. Alternatively, the peripheral portion of the holding layer 20 may be bonded and supported on the peripheral surface of the recessed hole 10, and a space may be defined between the bottom surface of the recessed hole 10 and the holding layer 20. Further, if the holding of the semiconductor wafer W and the deformation of the holding layer 20 are not particularly hindered, the support protrusion 11 is omitted, and the holding layer 20 is formed by laminating a mesh body having a certain degree of strength and an elastomer. It is also possible to cover the recessed hole 10 with this holding layer 20.

It is a section explanatory view showing typically an embodiment of a chuck jig concerning the present invention. It is a perspective explanatory view showing typically an embodiment of a chuck jig concerning the present invention. It is a perspective explanatory view showing typically a 2nd embodiment of the chuck jig concerning the present invention.

Explanation of symbols

1 Jig body 10 Recess hole (recess)
11 Support projection 20 Retaining layer 30 Exhaust passage 31 Vacuum pump (negative pressure source)
G glass substrate (held article)
W Semiconductor wafer (held article)

Claims (5)

  A chuck jig for holding an article to be held, which is a jig body that is movable and rotatable in a three-dimensional direction, a plurality of recesses formed on a plurality of surfaces of the jig body, and each recess A chuck comprising: a plurality of holding layers that cover and hold the article to be held in a detachable manner; and a plurality of exhaust passages that exhaust the gas in the recesses covered by each holding layer to the outside. jig.   The chuck jig according to claim 1, further comprising a negative pressure source connected to the exhaust path and deforming the holding layer by setting the concave portion to a negative pressure.   The chuck jig according to claim 1 or 2, wherein the jig main body is formed in a substantially plate shape and concave portions are formed on both sides thereof.   The chuck jig according to claim 1, wherein the jig main body is a polyhedron and concave portions are formed on a plurality of surfaces thereof.   The chuck jig according to claim 1, wherein a plurality of support protrusions for supporting the holding layer are provided in the recess.

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